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INTEGRATED CIRCUITS

DATA SHEET

PCF8574
Remote 8-bit I/O expander for
I2C-bus
Product specification
Supersedes data of 2002 Jul 29

2002 Nov 22

Philips Semiconductors

Product specification

Remote 8-bit I/O expander for I2C-bus
CONTENTS
1

FEATURES

2

GENERAL DESCRIPTION

3

ORDERING INFORMATION

4

BLOCK DIAGRAM

5

PINNING

5.1
5.2

DIP16 and SO16 packages
SSOP20 package

6

CHARACTERISTICS OF THE I2C-BUS

6.1
6.2
6.3
6.4

Bit transfer
Start and stop conditions
System configuration
Acknowledge

7

FUNCTIONAL DESCRIPTION

7.1
7.2
7.3

Addressing
Interrupt output
Quasi-bidirectional I/Os

8

LIMITING VALUES

9

HANDLING

10

DC CHARACTERISTICS

11

I2C-BUS TIMING CHARACTERISTICS

12

PACKAGE OUTLINES

13

SOLDERING

13.1
13.2
13.2.1
13.2.2
13.3
13.3.1
13.3.2
13.3.3
13.4

Introduction
Through-hole mount packages
Soldering by dipping or by solder wave
Manual soldering
Surface mount packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of IC packages for wave, reflow and
dipping soldering methods

14

DATA SHEET STATUS

15

DEFINITIONS

16

DISCLAIMERS

17

PURCHASE OF PHILIPS I2C COMPONENTS

2002 Nov 22

2

PCF8574

Philips Semiconductors

Product specification

Remote 8-bit I/O expander for I2C-bus
1

PCF8574

FEATURES

o Operating supply voltage 2.5 to 6 V
o Low standby current consumption of 10 uA maximum
o I2C-bus to parallel port expander
o Open-drain interrupt output
The device consists of an 8-bit quasi-bidirectional port and
an I2C-bus interface. The PCF8574 has a low current
consumption and includes latched outputs with high
current drive capability for directly driving LEDs. It also
possesses an interrupt line (INT) which can be connected
to the interrupt logic of the microcontroller. By sending an
interrupt signal on this line, the remote I/O can inform the
microcontroller if there is incoming data on its ports without
having to communicate via the I2C-bus. This means that
the PCF8574 can remain a simple slave device.

o 8-bit remote I/O port for the I2C-bus
o Compatible with most microcontrollers
o Latched outputs with high current drive capability for
directly driving LEDs
o Address by 3 hardware address pins for use of up to
8 devices (up to 16 with PCF8574A)
o DIP16, or space-saving SO16 or SSOP20 packages.
2

GENERAL DESCRIPTION

The PCF8574 and PCF8574A versions differ only in their
slave address as shown in Fig.10.

The PCF8574 is a silicon CMOS circuit. It provides general
purpose remote I/O expansion for most microcontroller
families via the two-line bidirectional bus (I2C-bus).
3

ORDERING INFORMATION
PACKAGE

TYPE NUMBER
NAME

DESCRIPTION

VERSION

PCF8574P;
PCF8574AP

DIP16

plastic dual in-line package; 16 leads (300 mil)

SOT38-4

PCF8574T;
PCF8574AT

SO16

plastic small outline package; 16 leads; body width 7.5 mm

SOT162-1

plastic shrink small outline package; 20 leads; body width 4.4 mm

SOT266-1

PCF8574TS;
PCF8574ATS

2002 Nov 22

SSOP20

3

Philips Semiconductors

Product specification

Remote 8-bit I/O expander for I2C-bus
4

PCF8574

BLOCK DIAGRAM

handbook, full pagewidth

INT

13

INTERRUPT
LOGIC

PCF8574

1
A0
A1
A2
SCL
SDA

LP FILTER

2

4

3

5
6

14
15

INPUT
FILTER

I 2 C BUS
CONTROL

7
SHIFT
REGISTER

8 BIT

I/O
PORT

9
10
11
12

WRITE pulse
VDD
V SS

16
8

READ pulse
POWER-ON
RESET

MBD980

Fig.1 Block diagram (pin numbers apply to DIP16 and SO16 packages).

2002 Nov 22

4

P0
P1
P2
P3
P4
P5
P6
P7

Philips Semiconductors

Product specification

Remote 8-bit I/O expander for I2C-bus
5

PCF8574

PINNING

5.1

DIP16 and SO16 packages
SYMBOL

PIN

DESCRIPTION

A0

1

address input 0

A1

2

address input 1

A2

3

address input 2

P0

4

quasi-bidirectional I/O 0

P1

5

quasi-bidirectional I/O 1

P2

6

quasi-bidirectional I/O 2

P3

7

quasi-bidirectional I/O 3

VSS

8

supply ground

P4

9

quasi-bidirectional I/O 4

P5

10

quasi-bidirectional I/O 5

P6

11

quasi-bidirectional I/O 6

P7

12

quasi-bidirectional I/O 7

INT

13

interrupt output (active LOW)

SCL

14

serial clock line

SDA

15

serial data line

VDD

16

supply voltage

handbook, halfpage

A0 1

16 VDD

A1 2

15 SDA

A1

A2 3

14 SCL

handbook, halfpage

A0 1
2

15 SDA

A2 3

P0 4

16 VDD

14 SCL

PCF8574P 13 INT
PCF8574AP 12 P7
P1 5

P0

P2 6

11 P6

P2 6

11 P6

P3 7

10 P5

P3 7

10 P5

VSS

8

9

P1 5

VSS

P4

PCF8574T 13 INT
PCF8574AT 12 P7

8

9

P4

MCE001

MBD979

Fig.2 Pin configuration (DIP16).

2002 Nov 22

4

Fig.3 Pin configuration (SO16).

5

Philips Semiconductors

Product specification

Remote 8-bit I/O expander for I2C-bus
5.2

PCF8574

SSOP20 package
SYMBOL

PIN

DESCRIPTION

INT

1

interrupt output (active LOW)

SCL

2

serial clock line

n.c.

3

not connected

SDA

4

serial data line

VDD

5

supply voltage

A0

6

address input 0

A1

7

address input 1

n.c.

8

not connected

A2

9

address input 2

P0

10

quasi-bidirectional I/O 0

P1

11

quasi-bidirectional I/O 1

P2

12

quasi-bidirectional I/O 2

n.c.

13

not connected

P3

14

quasi-bidirectional I/O 3

VSS

15

supply ground

P4

16

quasi-bidirectional I/O 4

P5

17

quasi-bidirectional I/O 5

n.c.

18

not connected

P6

19

quasi-bidirectional I/O 6

P7

20

quasi-bidirectional I/O 7

handbook, halfpage

INT 1

20 P7

SCL 2

19 P6

n.c. 3

18 n.c.

SDA 4

17 P5

VDD 5

16 P4

A1 7

14 P3

n.c. 8

13 n.c.

PCF8574TS
A0 6 PCF8574ATS 15 VSS

A2

9

12 P2

P0 10

11 P1
MBD978

Fig.4 Pin configuration (SSOP20).

2002 Nov 22

6

Philips Semiconductors

Product specification

Remote 8-bit I/O expander for I2C-bus
6

PCF8574
6.2

CHARACTERISTICS OF THE I2C-BUS

Both data and clock lines remain HIGH when the bus is not
busy. A HIGH-to-LOW transition of the data line, while the
clock is HIGH is defined as the start condition (S).
A LOW-to-HIGH transition of the data line while the clock
is HIGH is defined as the stop condition (P) (see Fig.6).

The I2C-bus is for 2-way, 2-line communication between
different ICs or modules. The two lines are a serial data
line (SDA) and a serial clock line (SCL). Both lines must be
connected to a positive supply via a pull-up resistor when
connected to the output stages of a device. Data transfer
may be initiated only when the bus is not busy.

6.3
6.1

Start and stop conditions

Bit transfer

System configuration

A device generating a message is a 'transmitter', a device
receiving is the 'receiver'. The device that controls the
message is the 'master' and the devices which are
controlled by the master are the 'slaves' (see Fig.7).

One data bit is transferred during each clock pulse. The
data on the SDA line must remain stable during the HIGH
period of the clock pulse as changes in the data line at this
time will be interpreted as control signals (see Fig.5).

handbook, full pagewidth

SDA

SCL
data line
stable;
data valid

change
of data
allowed

MBC621

Fig.5 Bit transfer.

handbook, full pagewidth

SDA

SDA

SCL

SCL
S

P

START condition

STOP condition

MBC622

Fig.6 Definition of start and stop conditions.

SDA
SCL
MASTER
TRANSMITTER /
RECEIVER

SLAVE
RECEIVER

SLAVE
TRANSMITTER /
RECEIVER

MASTER
TRANSMITTER

MASTER
TRANSMITTER /
RECEIVER
MBA605

Fig.7 System configuration.

2002 Nov 22

7

Philips Semiconductors

Product specification

Remote 8-bit I/O expander for I2C-bus
6.4

Acknowledge

PCF8574
of each byte that has been clocked out of the slave
transmitter. The device that acknowledges has to pull
down the SDA line during the acknowledge clock pulse, so
that the SDA line is stable LOW during the HIGH period of
the acknowledge related clock pulse, set-up and hold
times must be taken into account.

The number of data bytes transferred between the start
and the stop conditions from transmitter to receiver is not
limited. Each byte of eight bits is followed by one
acknowledge bit (see Fig.8). The acknowledge bit is a
HIGH level put on the bus by the transmitter whereas the
master generates an extra acknowledge related clock
pulse.

A master receiver must signal an end of data to the
transmitter by not generating an acknowledge on the last
byte that has been clocked out of the slave. In this event
the transmitter must leave the data line HIGH to enable the
master to generate a stop condition.

A slave receiver which is addressed must generate an
acknowledge after the reception of each byte. Also a
master must generate an acknowledge after the reception

handbook, full pagewidth

DATA OUTPUT
BY TRANSMITTER
not acknowledge
DATA OUTPUT
BY RECEIVER
acknowledge
SCL FROM
MASTER

1

2

8

9

S
clock pulse for
acknowledgement

START
condition

MBC602

Fig.8 Acknowledgment on the I2C-bus.

2002 Nov 22

8

Philips Semiconductors

Product specification

Remote 8-bit I/O expander for I2C-bus
7

PCF8574

FUNCTIONAL DESCRIPTION

VDD

handbook, full pagewidth

write pulse
100
uA
data from
shift register

D

Q
FF
P0 to P7

CI
S
power-on
reset

V SS
D

Q
FF

CI

read pulse

S
to interrupt
logic

data to
shift register

MBD977

Fig.9 Simplified schematic diagram of each I/O.

7.1

Addressing

For addressing see Figs 10, 11 and 12.

slave address

handbook, full pagewidth

S

0

1

0

0

A2

slave address

A1

A0

0

A

S

0

1

1

1

A2

A1

A0

0

A
MBD973

a. PCF8574.

b. PCF8574A.

Fig.10 PCF8574 and PCF8574A slave addresses.

Each of the PCF8574's eight I/Os can be independently used as an input or output. Input data is transferred from the
port to the microcontroller by the READ mode (see Fig.12). Output data is transmitted to the port by the WRITE mode
(see Fig.11).

2002 Nov 22

9

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2

3

4

5

6

7

8

slave address (PCF8574)

SDA

S

0

1

10

start condition

0

0

A2

A1

data to port

A0

0

R/W

A

data to port

DATA 1

A

acknowledge
from slave

DATA 2

A

acknowledge
from slave

acknowledge
from slave

Philips Semiconductors

1

Remote 8-bit I/O expander for I2C-bus

andbook, full pagewidth

2002 Nov 22
SCL

WRITE TO
PORT

DATA OUT
FROM PORT

DATA 1 VALID
t pv

t pv

MBD974

Product specification

PCF8574

Fig.11 WRITE mode (output).

DATA 2 VALID

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S

0

1

start condition

0

0

A2

A1

A0

1

A

R/W

DATA 1

A

acknowledge
from slave

DATA 4

acknowledge
from slave

1

P

stop
condition

READ FROM
PORT

11
DATA INTO
PORT

DATA 2

DATA 3

t ph

Philips Semiconductors

SDA

data from port

Remote 8-bit I/O expander for I2C-bus

2002 Nov 22
data from port

slave address (PCF8574)

DATA 4
t ps

INT
t iv

t ir

t ir

MBD975

Product specification

Fig.12 READ mode (input).

PCF8574

htdiwegap lluf ,koobdnah

A LOW-to-HIGH transition of SDA, while SCL is HIGH is defined as the stop condition (P). Transfer of data can be stopped at any moment by a stop condition. When this occurs, data present
at the last acknowledge phase is valid (output mode). Input data is lost.

Philips Semiconductors

Product specification

Remote 8-bit I/O expander for I2C-bus
7.2

PCF8574
o Interrupts which occur during the acknowledge clock
pulse may be lost (or very short) due to the resetting of
the interrupt during this pulse.

Interrupt output

The PCF8574 provides an open-drain output (INT) which
can be fed to a corresponding input of the microcontroller
(see Figs 13 and 14). This gives these chips a type of
master function which can initiate an action elsewhere in
the system.

Each change of the I/Os after resetting will be detected
and, after the next rising clock edge, will be transmitted as
INT. Reading from or writing to another device does not
affect the interrupt circuit.

An interrupt is generated by any rising or falling edge of the
port inputs in the input mode. After time tiv the signal INT is
valid.

7.3

Quasi-bidirectional I/Os

A quasi-bidirectional I/O can be used as an input or output
without the use of a control signal for data direction
(see Fig.15). At power-on the I/Os are HIGH. In this mode
only a current source to VDD is active. An additional strong
pull-up to VDD allows fast rising edges into heavily loaded
outputs. These devices turn on when an output is written
HIGH, and are switched off by the negative edge of SCL.
The I/Os should be HIGH before being used as inputs.

Resetting and reactivating the interrupt circuit is achieved
when data on the port is changed to the original setting or
data is read from or written to the port which has generated
the interrupt.
Resetting occurs as follows:
o In the READ mode at the acknowledge bit after the rising
edge of the SCL signal
o In the WRITE mode at the acknowledge bit after the
HIGH-to-LOW transition of the SCL signal

PCF8574
(1)

V DD

PCF8574
(2)

PCF8574
(16)

INT

handbook, full pagewidth

INT

INT

MICROCONTROLLER
INT

MBD976

Fig.13 Application of multiple PCF8574s with interrupt.

slave address (PCF8574)

handbook, full pagewidth

SDA

S

0

1

0

0

A2

A1

data from port

A0

start condition

SCL

1

2

1

R/W

3

4

5

6

7

A

1

acknowledge P5
from slave

1

P

stop
condition

8

DATA INTO
P5

INT
t iv

t ir

Fig.14 Interrupt generated by a change of input to I/O P5.

2002 Nov 22

12

MBD972

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S

0

1

1

1

A2

A1

A0

start condition

1

2

R/W

3

4

5

6

7

A

1

A

P3

acknowledge
from slave

0

A

P3

8

P

P3
OUTPUT
VOLTAGE
P3
PULL-UP
OUTPUT
CURRENT

I OHt

I OH

Product specification

Fig.15 Transient pull-up current IOHt while P3 changes from LOW-to-HIGH and back to LOW.

MBD971

PCF8574

handbook, full pagewidth

13

SCL

0

data to port

Philips Semiconductors

SDA

data to port

Remote 8-bit I/O expander for I2C-bus

2002 Nov 22
slave address (PCF8574A)

Philips Semiconductors

Product specification

Remote 8-bit I/O expander for I2C-bus

PCF8574

8 LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL

PARAMETER

MIN.

MAX.

UNIT

VDD

supply voltage

-0.5

+7.0

V

VI

input voltage

VSS - 0.5

VDD + 0.5

V

II

DC input current

-

?20

mA

IO

DC output current

-

?25

mA

IDD

supply current

-

?100

mA

ISS

supply current

-

?100

mA

Ptot

total power dissipation

-

400

mW

PO

power dissipation per output

-

100

mW

Tstg

storage temperature

-65

+150

°C

Tamb

ambient temperature

-40

+85

°C

9

HANDLING

Inputs and outputs are protected against electrostatic discharge in normal handling. However it is good practice to take
normal precautions appropriate to handling MOS devices (see "Handling MOS devices" ).
10 DC CHARACTERISTICS
VDD = 2.5 to 6 V; VSS = 0 V; Tamb = -40 to +85 °C; unless otherwise specified.
SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Supply
VDD

supply voltage

-

6.0

V

IDD

supply current

operating mode; VDD = 6 V; -
no load; VI = VDD or VSS;
fSCL = 100 kHz

40

100

uA

Istb

standby current

standby mode; VDD = 6 V;
no load; VI = VDD or VSS

-

2.5

10

uA

VPOR

Power-on reset voltage

VDD = 6 V; no load;
VI = VDD or VSS; note 1

-

1.3

2.4

V

2.5

Input SCL; input/output SDA
VIL

LOW level input voltage

-0.5

-

+0.3VDD

V

VIH

HIGH level input voltage

0.7VDD

-

VDD + 0.5

V

IOL

LOW level output current

VOL = 0.4 V

3

-

-

mA

IL

leakage current

VI = VDD or VSS

-1

-

+1

uA

Ci

input capacitance

VI = VSS

-

-

7

pF

2002 Nov 22

14

Philips Semiconductors

Product specification

Remote 8-bit I/O expander for I2C-bus

SYMBOL

PARAMETER

PCF8574

CONDITIONS

MIN.

TYP.

MAX.

UNIT

I/Os
VIL

LOW level input voltage

-0.5

-

+0.3VDD

V

VIH

HIGH level input voltage

0.7VDD

-

VDD + 0.5

V

IIHL(max)

maximum allowed input
current through protection
diode

-

-

?400

uA

VI >= VDD or VI <= VSS

IOL

LOW level output current

VOL = 1 V; VDD = 5 V

10

25

-

mA

IOH

HIGH level output current

VOH = VSS

30

-

300

uA

IOHt

transient pull-up current

HIGH during acknowledge
(see Fig.15); VOH = VSS;
VDD = 2.5 V

-

-1

-

mA

Ci

input capacitance

-

-

10

pF

Co

output capacitance

-

-

10

pF

Port timing; CL <= 100 pF (see Figs 11 and 12)
tpv

output data valid

-

-

4

us

tsu

input data set-up time

0

-

-

us

th

input data hold time

4

-

-

us

Interrupt INT (see Fig.14)
IOL

LOW level output current

VOL = 0.4 V

1.6

-

-

mA

IL

leakage current

VI = VDD or VSS

-1

-

+1

uA

TIMING; CL <= 100 pF
tiv

input data valid time

-

-

4

us

tir

reset delay time

-

-

4

us

-0.5

-

+0.3VDD

V

0.7VDD

-

VDD + 0.5

V

-250

-

+250

nA

Select inputs A0 to A2
VIL

LOW level input voltage

VIH

HIGH level input voltage

ILI

input leakage current

pin at VDD or VSS

Note
1. The Power-on reset circuit resets the I2C-bus logic at VDD &amp; lt; VPOR and sets all I/Os to logic 1 (with current source to
VDD).

2002 Nov 22

15

Philips Semiconductors

Product specification

Remote 8-bit I/O expander for I2C-bus

PCF8574

11 I2C-BUS TIMING CHARACTERISTICS
SYMBOL

PARAMETER

MIN.

TYP.

MAX.

UNIT

I2C-bus timing (see Fig.16; note 1)
fSCL

SCL clock frequency

-

-

100

kHz

tSW

tolerable spike width on bus

-

-

100

ns

tBUF

bus free time

4.7

-

-

us

tSU;STA

START condition set-up time

4.7

-

-

us

tHD;STA

START condition hold time

4.0

-

-

us

tLOW

SCL LOW time

4.7

-

-

us

tHIGH

SCL HIGH time

4.0

-

-

us

tr

SCL and SDA rise time

-

-

1.0

us

tf

SCL and SDA fall time

-

-

0.3

us

tSU;DAT

data set-up time

250

-

-

ns

tHD;DAT

data hold time

0

-

-

ns

tVD;DAT

SCL LOW to data out valid

-

-

3.4

us

tSU;STO

STOP condition set-up time

4.0

-

-

us

Note
1. All the timing values are valid within the operating supply voltage and ambient temperature range and refer to VIL
and VIH with an input voltage swing of VSS to VDD.

handbook, full pagewidth

t SU;STA

BIT 6
(A6)

BIT 7
MSB
(A7)

START
CONDITION
(S)

PROTOCOL

t LOW

t HIGH

BIT 0
LSB
(R/W)

ACKNOWLEDGE
(A)

STOP
CONDITION
(P)

1 / f SCL

SCL

t

tf

tr

BUF

SDA

t HD;STA

t

SU;DAT

t

HD;DAT

Fig.16 I2C-bus timing diagram.

2002 Nov 22

16

t

VD;DAT

MBD820

t SU;STO

Philips Semiconductors

Product specification

Remote 8-bit I/O expander for I2C-bus

PCF8574

12 PACKAGE OUTLINES
DIP16: plastic dual in-line package; 16 leads (300 mil)

SOT38-4

ME

seating plane

D

A2

A

A1

L

c
e

Z

wM

b1

(e 1)

b

b2
MH

9

16

pin 1 index
E

1

8

0

5

10 mm

scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT

A
max.

A1
min.

A2
max.

b

b1

b2

c

D (1)

E (1)

e

e1

L

ME

MH

w

Z (1)
max.

mm

4.2

0.51

3.2

1.73
1.30

0.53
0.38

1.25
0.85

0.36
0.23

19.50
18.55

6.48
6.20

2.54

7.62

3.60
3.05

8.25
7.80

10.0
8.3

0.254

0.76

inches

0.17

0.020

0.13

0.068
0.051

0.021
0.015

0.049
0.033

0.014
0.009

0.77
0.73

0.26
0.24

0.10

0.30

0.14
0.12

0.32
0.31

0.39
0.33

0.01

0.030

Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION

REFERENCES
IEC

JEDEC

EIAJ

ISSUE DATE
92-11-17
95-01-14

SOT38-4

2002 Nov 22

EUROPEAN
PROJECTION

17

Philips Semiconductors

Product specification

Remote 8-bit I/O expander for I2C-bus

PCF8574

SO16: plastic small outline package; 16 leads; body width 7.5 mm

SOT162-1

D

E

A
X

c
HE

y

vMA

Z
9

16

Q
A2

A

(A 3)

A1
pin 1 index

?
Lp
L

1

8
e

detail X

wM

bp

0

5

10 mm

scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT

A
max.

A1

A2

A3

bp

c

D (1)

E (1)

e

HE

L

Lp

Q

v

w

y

mm

2.65

0.30
0.10

2.45
2.25

0.25

0.49
0.36

0.32
0.23

10.5
10.1

7.6
7.4

1.27

10.65
10.00

1.4

1.1
0.4

1.1
1.0

0.25

0.25

0.1

0.9
0.4

inches

0.10

0.012 0.096
0.004 0.089

0.01

0.019 0.013
0.014 0.009

0.41
0.40

0.30
0.29

0.050

0.419
0.043
0.055
0.394
0.016

0.043
0.039

0.01

0.01

0.004

0.035
0.016

Z

(1)

?

8o
0o

Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES

OUTLINE
VERSION

IEC

JEDEC

SOT162-1

075E03

MS-013

2002 Nov 22

EIAJ

EUROPEAN
PROJECTION

ISSUE DATE
97-05-22
99-12-27

18

Philips Semiconductors

Product specification

Remote 8-bit I/O expander for I2C-bus

PCF8574

SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm

D

SOT266-1

E

A
X

c
y

HE

vM A

Z

11

20

Q
A2

A

(A 3)

A1

pin 1 index

?
Lp
L

1

10
detail X
wM

bp

e

0

2.5

5 mm

scale
DIMENSIONS (mm are the original dimensions)
UNIT

A
max.

A1

A2

A3

bp

c

D (1)

E (1)

e

HE

L

Lp

Q

v

w

y

Z (1)

?

mm

1.5

0.15
0

1.4
1.2

0.25

0.32
0.20

0.20
0.13

6.6
6.4

4.5
4.3

0.65

6.6
6.2

1.0

0.75
0.45

0.65
0.45

0.2

0.13

0.1

0.48
0.18

10
0o

Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
OUTLINE
VERSION
SOT266-1

2002 Nov 22

REFERENCES
IEC

JEDEC

EIAJ

EUROPEAN
PROJECTION

ISSUE DATE
95-02-22
99-12-27

MO-152

19

o

Philips Semiconductors

Product specification

Remote 8-bit I/O expander for I2C-bus

Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 220 °C for
thick/large packages, and below 235 °C for small/thin
packages.

13 SOLDERING
13.1

Introduction

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our "Data Handbook IC26; Integrated Circuit Packages"
(document order number 9398 652 90011).

13.3.2

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mount components are mixed on
one printed-circuit board. Wave soldering can still be used
for certain surface mount ICs, but it is not suitable for fine
pitch SMDs. In these situations reflow soldering is
recommended.
13.2
13.2.1

To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:

Through-hole mount packages

o Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

SOLDERING BY DIPPING OR BY SOLDER WAVE

o For packages with leads on two sides and a pitch (e):
- larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

- smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
o For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

MANUAL SOLDERING

Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400 °C, contact may be up to 5 seconds.
13.3
13.3.1

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Surface mount packages

Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

REFLOW SOLDERING

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

13.3.3

MANUAL SOLDERING

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C. When using a dedicated tool, all other leads can
be soldered in one operation within 2 to 5 seconds
between 270 and 320 °C.

Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.

2002 Nov 22

WAVE SOLDERING

Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.

The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joints for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

13.2.2

PCF8574

20

Philips Semiconductors

Product specification

Remote 8-bit I/O expander for I2C-bus
13.4

PCF8574

Suitability of IC packages for wave, reflow and dipping soldering methods
MOUNTING

SOLDERING METHOD

PACKAGE(1)

WAVE
suitable(3)

Through-hole mount DBS, DIP, HDIP, SDIP, SIL

REFLOW(2) DIPPING
-

suitable

suitable

-

HBCC, HBGA, HLQFP, HSQFP, HSOP,
HTQFP, HTSSOP, HVQFN, HVSON, SMS

not suitable(4)

suitable

-

PLCC(5), SO, SOJ

Surface mount

suitable

suitable

-

suitable

-

suitable

-

BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA not suitable

recommended(5)(6)

LQFP, QFP, TQFP

not

SSOP, TSSOP, VSO

not recommended(7)

Notes
1. For more detailed information on the BGA packages refer to the "(LF)BGA Application Note" (AN01026); order a copy
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods".
3. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
5. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
6. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
7. Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

2002 Nov 22

21

Philips Semiconductors

Product specification

Remote 8-bit I/O expander for I2C-bus

PCF8574

14 DATA SHEET STATUS
LEVEL

DATA SHEET
STATUS(1)

PRODUCT
STATUS(2)(3)
Development

DEFINITION

I

Objective data

II

Preliminary data Qualification

This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.

III

Product data

This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).

Production

This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.

Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
15 DEFINITIONS

16 DISCLAIMERS

Short-form specification ? The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.

Life support applications ? These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Limiting values definition ? Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.

Right to make changes ? Philips Semiconductors
reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design
and/or performance. When the product is in full production
(status 'Production'), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.

Application information ? Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.

2002 Nov 22

22

Philips Semiconductors

Product specification

Remote 8-bit I/O expander for I2C-bus

PCF8574

17 PURCHASE OF PHILIPS I2C COMPONENTS

Purchase of Philips I2C components conveys a license under the Philips' I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.

2002 Nov 22

23

Philips Semiconductors - a worldwide company

Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.

SCA74

(C) Koninklijke Philips Electronics N.V. 2002

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Printed in The Netherlands

403512/04/pp24

Date of release: 2002

Nov 22

Document order number:

9397 750 10462


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