NN-HBN2515S6R.pdf

Płyta msi z270 gaming m7 - Prośba o identyfikację elementów

Prześledziłem cały schemat płyty i znalazłem 3 rodzaje układów 6-nóżkowych, jednak analizując najbardziej pasujący jest element o nazwie NN-HBN2515S6R z dwóch powodów: zgodnie z schematem nóżka 1 jest zwarta z nóżką 4 do masy co zgadzało by się z pomiarami oraz na schemacie znajdują się 3 takie elementy co ma odzwierciedlenie na płycie, gdyż doszukałem się właśnie jedynie 2 + domniemany 3 którego brakuje. Analizując dalej schemat sprawdziłem, że owe NN-HBN2515S6R łączą się z złączami audio, a więc odpowiadają za dźwięk. Więc pytanie czy bez tego płyta wystartuje i jedynie porty audio nie będą działać poprawnie czy może to nieść jakieś konsekwencje ?


CYStech Electronics Corp.

Spec. No. : C223S6-A
Issued Date : 2007.07.18
Revised Date :2011.02.22
Page No. : 1/6

Low Vcesat NPN Epitaxial Planar Transistor

HBN2515S6R
(Dual Transistors)
Features
o Two BTD2515 chips in a SOT-363 package.
o Mounting possible with SOT-323 automatic mounting machines.
o Transistor elements are independent, eliminating interference.
o Mounting cost and area can be cut in half.
o Low VCE(sat), VCE(sat)=25mV (max), at IC / IB = 10mA / 0.5mA.
o Weight : 9.1mg, approximately.
o Pb-free package.

Equivalent Circuit

Outline

HBN2515S6R

Tr1

SOT-363

Tr2

The following characteristics apply to both Tr1 and Tr2
Absolute Maximum Ratings (Ta=25°C)
Parameter
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current (DC)
Collector Current (Pulse)
Power Dissipation
Junction Temperature
Storage Temperature

Symbol
VCBO
VCEO
VEBO
IC
ICP
Pd
Tj
Tstg

Limits
20
15
6
800
1.5 (Note 1)
200 (total) (Note 2)
150
-55~+150

Unit
V
V
V
mA
A
mW
°C
°C

Note : 1.Single pulse, Pw=10ms
2.150mW per element must not be exceeded.
HBN2515S6R

CYStek Product Specification

CYStech Electronics Corp.

Spec. No. : C223S6-A
Issued Date : 2007.07.18
Revised Date :2011.02.22
Page No. : 2/6

Characteristics (Ta=25°C)
Symbol
BVCBO
BVCEO
BVEBO
ICBO
IEBO
*VCE(sat)1
*VCE(sat)2
*VCE(sat)3
*RCE(sat)
*VBE(sat)
*VBE(on)
*hFE1
*hFE2
*hFE3
fT
Cob

Min.
20
15
6
160
180
150
100
-

Typ.
300
6.5

Max.
100
100
25
150
250
500
1.1
0.9
560
-

Unit
V
V
V
nA
nA
mV
mV
mV
m?
V
V
MHz
pF

Test Conditions
IC=100?A, IE=0
IC=2mA, IB=0
IE=100?A, IC=0
VCB=15V, IE=0
VEB=6V, IC=0
IC=10mA, IB=0.5mA
IC=200mA, IB=10mA
IC=500mA, IB=50mA
IC=500mA, IB=50mA
IC=500mA, IB=50mA
VCE=2V, IC=100mA
VCE=1V, IC=10mA
VCE=1V, IC=100mA
VCE=1V, IC=500mA
VCE=10V, IC=50mA, f=100MHz
VCB=10V, f=1MHz
*Pulse Test : Pulse Width <=380?s, Duty Cycle<=2%

Ordering Information
Device
HBN2515S6R

HBN2515S6R

Package
SOT-363
(Pb-free)

Shipping

Marking

3000 pcs / Tape &amp; Reel

BS

CYStek Product Specification

CYStech Electronics Corp.

Spec. No. : C223S6-A
Issued Date : 2007.07.18
Revised Date :2011.02.22
Page No. : 3/6

Characteristic Curves
Current Gain vs Collector Current

Saturation Voltage vs Collector Current
1000
Saturation Voltage---(mV)

Current Gain---HFE

1000
VCE=2V

100
VCE=1V

VCESAT@IC= 20 IB

100

VCESAT@IC=10IB

10

10
1

10

100

1000

1

Collector Current---IC(mA)

100

1000

Collector Current---IC(mA)

On Voltage vs Collector Current

Saturation Voltage vs Collector Current
1000

10000
VBESAT@IC= 10 IB

On Voltage---(mV)

Saturation Voltage---(mV)

10

1000

100

VBEON@VCE=2V

100

1

10
100
Collector Current---IC(mA)

1000

1

10
100
Collector Current---IC(mA)

1000

Power Derating Curve

Power Dissipation---PD(mW)

250
Dual

200

Single

150
100
50
0
0

HBN2515S6R

50
100
150
Ambient Temeprature---TA(?)

200

CYStek Product Specification

CYStech Electronics Corp.

Spec. No. : C223S6-A
Issued Date : 2007.07.18
Revised Date :2011.02.22
Page No. : 4/6

Reel Dimension

Carrier Tape Dimension

HBN2515S6R

CYStek Product Specification

CYStech Electronics Corp.

Spec. No. : C223S6-A
Issued Date : 2007.07.18
Revised Date :2011.02.22
Page No. : 5/6

Recommended wave soldering condition
Product
Pb-free devices

Peak Temperature
260 +0/-5 °C

Soldering Time
5 +1/-1 seconds

Recommended temperature profile for IR reflow

Profile feature
Average ramp-up rate
(Tsmax to Tp)
Preheat
-Temperature Min(TS min)
-Temperature Max(TS max)
-Time(ts min to ts max)
Time maintained above:
-Temperature (TL)
- Time (tL)
Peak Temperature(TP)
Time within 5°C of actual peak
temperature(tp)
Ramp down rate
Time 25 °C to peak temperature

Sn-Pb eutectic Assembly

Pb-free Assembly

3°C/second max.

3°C/second max.

100°C
150°C
60-120 seconds

150°C
200°C
60-180 seconds

183°C
60-150 seconds
240 +0/-5 °C

217°C
60-150 seconds
260 +0/-5 °C

10-30 seconds

20-40 seconds

6°C/second max.
6 minutes max.

6°C/second max.
8 minutes max.

Note : All temperatures refer to topside of the package, measured on the package body surface.

HBN2515S6R

CYStek Product Specification

CYStech Electronics Corp.

Spec. No. : C223S6-A
Issued Date : 2007.07.18
Revised Date :2011.02.22
Page No. : 6/6

SOT-363 Dimension
Marking:
Date Code:
Year + Month
Year : 6->2006,
7->2007,..., etc
Month : 1->Jan
2->Feb, ..., 9->
Sep, A->Oct, B
->Nov, C->Dec

BS
Device
Code

6-Lead SOT-363R Plastic
Surface Mounted Package
CYStek Package Code: S6R
Style:
Pin 1. Emitter1 (E1)
Pin 2. Base1 (B1)
Pin 3. Collector2 (C2)
Pin 4. Emitter2 (E2)
Pin 5. Base2 (B2)
Pin 6. Collector1 (C1)

Millimeters
Min.
Max.
0.900
1.100
0.000
0.100
0.900
1.000
0.150
0.350
0.080
0.150
2.000
2.200
1.150
1.350

DIM
A
A1
A2
b
c
D
E

Inches
Min.
Max.
0.035
0.043
0.000
0.004
0.035
0.039
0.006
0.014
0.003
0.006
0.079
0.087
0.045
0.053

DIM
E1
e
e1
L
L1
?

Millimeters
Min.
Max.
2.150
2.450
0.650 TYP
1.200
1.400
0.525 REF
0.260
0.460



Inches
Min.
Max.
0.085
0.096
0.026 TYP
0.047
0.055
0.021 REF
0.010
0.018



Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.

Material :
o Lead : Pure tin plated.
o Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0.

Important Notice:
o All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
o CYStek reserves the right to make changes to its products without notice.
o CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
o CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

HBN2515S6R

CYStek Product Specification


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