Czy ten układy mc14541 to wzmacniacz? Jest to generator . Chodziło o to żeby za pomocą potencjometrów zmieniać częstotliwość mrugania. Jeden układ owszem, ale mikrokontrolera. A dwie sztuki MC14541? Dla mnie zastosowanie zewnętrznych timerów to taki sam pomysł jak zastosowanie migających LED jeśli nie umiemy uzyskać migania programowo. Albo całość należy zrobić na mikrokontrolerze albo (wcale nie mniej ambitnie) na trzech prostych scalakach. Ze schematu wynika, że ustawianie poszczególnych trybów odbywa się za pomocą przełączania zworek. Procesor mruga diodami i się nie przemęcza. Dla mnie konstrukcja pod względem zastosowania mikrokontrolera jest bardzo mierna. Jeżeli potrafisz zrobić sterowanie za pomocą mikrokontrolera to wrzuć schemat. Schemat był zrobiony w programie DipTrace
MC14541B
Programmable Timer
The MC14541B programmable timer consists of a 16–stage binary
counter, an integrated oscillator for use with an external capacitor and
two resistors, an automatic power–on reset circuit, and output control
logic.
Timing is initialized by turning on power, whereupon the power–on
reset is enabled and initializes the counter, within the specified VDD
range. With the power already on, an external reset pulse can be
applied. Upon release of the initial reset command, the oscillator will
oscillate with a frequency determined by the external RC network. The
16–stage counter divides the oscillator frequency (fosc) with the nth
stage frequency being fosc/2n.
• Available Outputs 28, 210, 213 or 216
• Increments on Positive Edge Clock Transitions
• Built–in Low Power RC Oscillator (± 2% accuracy over temperature
range and ± 20% supply and ± 3% over processing at & lt; 10 kHz)
• Oscillator May Be Bypassed if External Clock Is Available (Apply
external clock to Pin 3)
• External Master Reset Totally Independent of Automatic Reset
Operation
• Operates as 2n Frequency Divider or Single Transition Timer
• Q/Q Select Provides Output Logic Level Flexibility
• Reset (auto or master) Disables Oscillator During Resetting to
Provide No Active Power Dissipation
• Clock Conditioning Circuit Permits Operation with Very Slow Clock
Rise and Fall Times
• Automatic Reset Initializes All Counters On Power Up
• Supply Voltage Range = 3.0 Vdc to 18 Vdc with Auto Reset
Supply Voltage Range = Disabled (Pin 5 = VDD)
Supply Voltage Range = 8.5 Vdc to 18 Vdc with Auto Reset
Supply Voltage Range = Enabled (Pin 5 = VSS)
14
MC14541BCP
AWLYYWW
1
14
SOIC–14
D SUFFIX
CASE 751A
14541B
AWLYWW
1
14
TSSOP–14
DT SUFFIX
CASE 948G
14
541B
ALYW
14
SOEIAJ–14
F SUFFIX
CASE 965
1
MC14541B
AWLYWW
1
A
= Assembly Location
WL or L = Wafer Lot
YY or Y = Year
WW or W = Work Week
ORDERING INFORMATION
Parameter
Unit
– 0.5 to +18.0
– 0.5 to VDD + 0.5
Device
MC14541BCP
PDIP–14
2000/Box
MC14541BD
SOIC–14
55/Rail
SOIC–14
2500/Tape & Reel
MC14541BDT
TSSOP–14
96/Rail
TSSOP–14 2500/Tape & Reel
SOEIAJ–14
See Note 1.
SOEIAJ–14
See Note 1.
V
Input or Output Voltage Range
(DC or Transient)
Shipping
MC14541BF
Value
Package
MC14541BDTR2
Symbol
Vin, Vout
PDIP–14
P SUFFIX
CASE 646
MARKING
DIAGRAMS
MC14541BDR2
MAXIMUM RATINGS (Voltages Referenced to VSS) (Note 2.)
VDD
http://onsemi.com
V
DC Supply Voltage Range
Iin
Input Current (DC or Transient)
± 10 (per Pin)
mA
MC14541BFEL
Iout
Output Current (DC or Transient)
± 45 (per Pin)
mA
PD
Power Dissipation,
per Package (Note 3.)
500
mW
1. For ordering information on the EIAJ version of
the SOIC packages, please contact your local
ON Semiconductor representative.
TA
Ambient Temperature Range
– 55 to +125
°C
Tstg
Storage Temperature Range
– 65 to +150
°C
TL
Lead Temperature
(8–Second Soldering)
260
°C
2. Maximum Ratings are those values beyond which damage to the device
may occur.
3. Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C
© Semiconductor Components Industries, LLC, 2000
March, 2000 – Rev. 6
1
This device contains protection circuitry to guard
against damage due to high static voltages or electric
fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated
voltages to this high–impedance circuit. For proper
operation, Vin and Vout should be constrained to the
range VSS
(Vin or Vout)
VDD.
Unused inputs must always be tied to an appropriate
logic voltage level (e.g., either VSS or VDD). Unused outputs must be left open.
v
v
Publication Order Number:
MC14541B/D
MC14541B
PIN ASSIGNMENT
Rtc
1
14
VDD
Ctc
2
13
B
RS
3
12
A
NC
4
11
NC
AR
5
10
MODE
MR
6
9
Q/Q SEL
VSS
7
8
Q
NC = NO CONNECTION
ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
– 55_C
VDD
25_C
125_C
Symbol
Vdc
Min
Max
Min
Typ (4.)
Max
Min
Max
Unit
“0” Level
VOL
5.0
10
15
—
—
—
0.05
0.05
0.05
—
—
—
0
0
0
0.05
0.05
0.05
—
—
—
0.05
0.05
0.05
Vdc
“1” Level
VOH
5.0
10
15
4.95
9.95
14.95
—
—
—
4.95
9.95
14.95
5.0
10
15
—
—
—
4.95
9.95
14.95
—
—
—
Vdc
Input Voltage
“0” Level
(VO = 4.5 or 0.5 Vdc)
(VO = 9.0 or 1.0 Vdc)
(VO = 13.5 or 1.5 Vdc)
VIL
5.0
10
15
—
—
—
1.5
3.0
4.0
—
—
—
2.25
4.50
6.75
1.5
3.0
4.0
—
—
—
1.5
3.0
4.0
“1” Level
VIH
5.0
10
15
3.5
7.0
11
—
—
—
3.5
7.0
11
2.75
5.50
8.25
—
—
—
3.5
7.0
11
—
—
—
5.0
10
15
– 7.96
– 4.19
– 16.3
—
—
—
– 6.42
– 3.38
– 13.2
– 12.83
– 6.75
– 26.33
—
—
—
– 4.49
– 2.37
– 9.24
—
—
—
IOL
5.0
10
15
1.93
4.96
19.3
—
—
—
1.56
4.0
15.6
3.12
8.0
31.2
—
—
—
1.09
2.8
10.9
—
—
—
mAdc
Input Current
Iin
15
—
± 0.1
—
± 0.00001
± 0.1
—
± 1.0
µAdc
Input Capacitance
(Vin = 0)
Cin
—
—
—
—
5.0
7.5
—
—
pF
Quiescent Current
(Pin 5 is High)
Auto Reset Disabled
IDD
5.0
10
15
—
—
—
5.0
10
20
—
—
—
0.005
0.010
0.015
5.0
10
20
—
—
—
150
300
600
µAdc
Auto Reset Quiescent Current
(Pin 5 is low)
IDDR
10
15
—
—
250
500
—
—
30
82
250
500
—
—
1500
2000
µAdc
Supply Current (5.) (6.)
(Dynamic plus Quiescent)
ID
5.0
10
15
Characteristic
Output Voltage
Vin = VDD or 0
Vin = 0 or VDD
(VO = 0.5 or 4.5 Vdc)
(VO = 1.0 or 9.0 Vdc)
(VO = 1.5 or 13.5 Vdc)
Output Drive Current
(VOH = 2.5 Vdc)
(VOH = 9.5 Vdc)
(VOH = 13.5 Vdc)
Vdc
Vdc
IOH
Source
(VOL = 0.4 Vdc)
(VOL = 0.5 Vdc)
(VOL = 1.5 Vdc)
Sink
mAdc
ID = (0.4 µA/kHz) f + IDD
ID = (0.8 µA/kHz) f + IDD
ID = (1.2 µA/kHz) f + IDD
µAdc
4. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
5. The formulas given are for the typical characteristics only at 25_C.
6. When using the on chip oscillator the total supply current (in µAdc) becomes: IT = ID + 2 Ctc VDD f x 10–3 where ID is in µA, Ctc is in pF,
VDD in Volts DC, and f in kHz. (see Fig. 3) Dissipation during power–on with automatic reset enabled is typically 50 µA @ VDD = 10 Vdc.
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2
MC14541B
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
SWITCHING CHARACTERISTICS (7.) (CL = 50 pF, TA = 25_C)
VDD
Min
Typ (8.)
Max
5.0
10
15
—
—
—
100
50
40
200
100
80
5.0
10
15
—
—
—
3.5
1.25
0.9
10.5
3.8
2.9
5.0
10
15
—
—
—
6.0
3.5
2.5
18
10
7.5
tWH(cl)
5.0
10
15
900
300
225
300
100
85
—
—
—
ns
fcl
5.0
10
15
—
—
—
1.5
4.0
6.0
0.75
2.0
3.0
MHz
tWH(R)
5.0
10
15
900
300
225
300
100
85
—
—
—
ns
trem
Characteristic
5.0
10
15
420
200
200
210
100
100
—
—
—
ns
Symbol
Output Rise and Fall Time
tTLH, tTHL = (1.5 ns/pF) CL + 25 ns
tTLH, tTHL = (0.75 ns/pF) CL + 12.5 ns
tTLH, tTHL = (0.55 ns/pF) CL + 9.5 ns
tTLH,
tTHL
Propagation Delay, Clock to Q (28 Output)
tPLH, tPHL = (1.7 ns/pF) CL + 3415 ns
tPLH, tPHL = (0.66 ns/pF) CL + 1217 ns
tPLH, tPHL = (0.5 ns/pF) CL + 875 ns
tPLH
tPHL
Propagation Delay, Clock to Q (216 Output)
tPHL, tPLH = (1.7 ns/pF) CL + 5915 ns
tPHL, tPLH = (0.66 ns/pF) CL + 3467 ns
tPHL, tPLH = (0.5 ns/pF) CL + 2475 ns
tPHL
tPLH
Clock Pulse Width
Clock Pulse Frequency (50% Duty Cycle)
MR Pulse Width
Master Reset Removal Time
Unit
ns
µs
µs
7. The formulas given are for the typical characteristics only at 25_C.
8. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
VDD
PULSE
GENERATOR
VDD
PULSE
GENERATOR
RS
AR
Q/Q SELECT
MODE
RS
AR
Q/Q SELECT
MODE
A
B
MR
Q
A
B
MR
CL
VSS
CL
VSS
20 ns
(Rtc AND Ctc OUTPUTS ARE LEFT OPEN)
20 ns
Q
RS
20 ns
90% 50%
10%
50%
DUTY CYCLE
20 ns
90% 50%
10%
tPLH
tPHL
50%
Q
tTLH
Figure 1. Power Dissipation Test Circuit
and Waveform
50%
90%
10%
50%
tTHL
Figure 2. Switching Time Test Circuit
and Waveforms
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3
MC14541B
EXPANDED BLOCK DIAGRAM
A 12
B 13
1 OF 4
MUX
8 Q
Rtc 1
Ctc 2
OSC
RS 3
RESET
AUTO RESET
5
210 213 216
C 8–STAGE
COUNTER
RESET
8–STAGE 8
2
C
COUNTER
RESET
POWER–ON
RESET
6
MASTER RESET
10
MODE
9
Q/Q
SELECT
VDD = PIN 14
VSS = PIN 7
FREQUENCY SELECTION TABLE
A
B
Number of
Counter Stages
n
0
0
13
8192
0
1
10
1024
1
0
8
256
1
1
16
TRUTH TABLE
State
65536
Count
2n
Pin
Auto Reset,
0
5
1
Auto Reset
Operating
Auto Reset Disabled
Master Reset, 6
Timer Operational
Master Reset On
Q / Q,
9
Output Initially Low
After Reset
Output Initially High
After Reset
Mode,
10
Single Cycle Mode
Recycle Mode
3
TO CLOCK
CIRCUIT
INTERNAL
RESET
2
1
Ctc
RS
RTC
Figure 3. Oscillator Circuit Using RC Configuration
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4
MC14541B
TYPICAL RC OSCILLATOR CHARACTERISTICS
8.0
100
VDD = 15 V
f, OSCILLATOR FREQUENCY (kHz)
FREQUENCY DEVIATION (%)
0
10 V
– 4.0
– 8.0
5.0 V
– 12
RTC = 56 kΩ,
C = 1000 pF
– 16
– 55
– 25
VDD = 10 V
50
4.0
RS = 0, f = 10.15 kHz @ VDD = 10 V, TA = 25°C
RS = 120 kΩ, f = 7.8 kHz @ VDD = 10 V, TA = 25°C
0
25
50
75
TA, AMBIENT TEMPERATURE (°C)
100
f AS A FUNCTION
OF RTC
(C = 1000 pF)
(RS ≈ 2RTC)
20
10
5.0
2.0
1.0
f AS A FUNCTION
OF C
(RTC = 56 kΩ)
(RS = 120 kΩ)
0.5
0.2
0.1
1.0 k
125
10 k
100 k
RTC, RESISTANCE (OHMS)
0.001
0.01
C, CAPACITANCE (µF)
0.0001
Figure 4. RC Oscillator Stability
1.0 m
0.1
Figure 5. RC Oscillator Frequency as a
Function of Rtc and Ctc
OPERATING CHARACTERISTICS
With Auto Reset pin set to a “0” the counter circuit is
initialized by turning on power. Or with power already on,
the counter circuit is reset when the Master Reset pin is set
to a “1”. Both types of reset will result in synchronously
resetting all counter stages independent of counter state.
Auto Reset pin when set to a “1” provides a low power
operation.
The RC oscillator as shown in Figure 3 will oscillate with
a frequency determined by the external RC network i.e.,
f=
1
2.3 RtcCtc
and RS ≈ 2 Rtc
if (1 kHz
when B is “0”, normal counting is interrupted and the 9th
counter stage receives its clock directly from the oscillator
(i.e., effectively outputting 28).
The Q/Q select output control pin provides for a choice of
output level. When the counter is in a reset condition and
Q/Q select pin is set to a “0” the Q output is a “0”,
correspondingly when Q/Q select pin is set to a “1” the Q
output is a “1”.
When the mode control pin is set to a “1”, the selected
count is continually transmitted to the output. But, with
mode pin “0” and after a reset condition the RS flip–flop (see
Expanded Block Diagram) resets, counting commences,
and after 2n–1 counts the RS flip–flop sets which causes the
output to change state. Hence, after another 2n–1 counts the
output will not change. Thus, a Master Reset pulse must be
applied or a change in the mode pin level is required to reset
the single cycle operation.
v f v 100 kHz)
where RS ≥ 10 kΩ
The time select inputs (A and B) provide a two–bit address
to output any one of four counter stages (28, 210, 213 and
216). The 2n counts as shown in the Frequency Selection
Table represents the Q output of the Nth stage of the counter.
When A is “1”, 216 is selected for both states of B. However,
DIGITAL TIMER APPLICATION
When Master Reset (MR) receives a positive pulse, the
internal counters and latch are reset. The Q output goes high
and remains high until the selected (via A and B) number of
clock pulses are counted, the Q output then goes low and
remains low until another input pulse is received.
This “one shot” is fully retriggerable and as accurate as the
input frequency. An external clock can be used (pin 3 is the
clock input, pins 1 and 2 are outputs) if additional accuracy
is needed.
Notice that a setup time equal to the desired pulse width
output is required immediately following initial power up,
during which time Q output will be high.
Rtc
1
Ctc
NC
RS
AR
MR
INPUT
14
VDD
2
13
B
3
12
A
4
10
6
9
7
N.C.
11
5
8
MODE
Q/Q
VDD
OUTPUT
tMR
t + tMR
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5
MC14541B
PACKAGE DIMENSIONS
P SUFFIX
PLASTIC DIP PACKAGE
CASE 646–06
ISSUE M
14
8
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
7
B
A
F
DIM
A
B
C
D
F
G
H
J
K
L
M
N
L
N
C
–T–
SEATING
PLANE
J
K
H
D 14 PL
G
M
0.13 (0.005)
INCHES
MIN
MAX
0.715
0.770
0.240
0.260
0.145
0.185
0.015
0.021
0.040
0.070
0.100 BSC
0.052
0.095
0.008
0.015
0.115
0.135
0.290
0.310
–––
10_
0.015
0.039
MILLIMETERS
MIN
MAX
18.16
18.80
6.10
6.60
3.69
4.69
0.38
0.53
1.02
1.78
2.54 BSC
1.32
2.41
0.20
0.38
2.92
3.43
7.37
7.87
–––
10_
0.38
1.01
M
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751A–03
ISSUE F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
–A–
14
8
–B–
1
P 7 PL
0.25 (0.010)
7
G
B
M
M
R X 45 _
C
F
–T–
SEATING
PLANE
0.25 (0.010)
M
K
D 14 PL
M
T B
S
A
S
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6
J
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
8.55
8.75
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.337
0.344
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.228
0.244
0.010
0.019
MC14541B
PACKAGE DIMENSIONS
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948G–01
ISSUE O
14X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
V
S
S
S
N
2X
14
L/2
0.25 (0.010)
8
M
B
–U–
L
PIN 1
IDENT.
F
7
1
S
DETAIL E
K
A
–V–
K1
J J1
ÇÇÇ
ÉÉ
ÇÇÇ
ÉÉ
0.15 (0.006) T U
N
SECTION N–N
C
0.10 (0.004)
–T– SEATING
PLANE
D
G
H
DETAIL E
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7
–W–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS. MOLD
FLASH OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL NOT
EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE –W–.
MILLIMETERS
INCHES
DIM MIN
MAX
MIN
MAX
A
4.90
5.10
0.193
0.200
B
4.30
4.50
0.169
0.177
C
–––
1.20
–––
0.047
D
0.05
0.15
0.002
0.006
F
0.50
0.75
0.020
0.030
G
0.65 BSC
0.026 BSC
H
0.50
0.60
0.020
0.024
J
0.09
0.20
0.004
0.008
J1
0.09
0.16
0.004
0.006
K
0.19
0.30
0.007
0.012
K1
0.19
0.25
0.007
0.010
L
6.40 BSC
0.252 BSC
M
0_
8_
0_
8_
MC14541B
PACKAGE DIMENSIONS
F SUFFIX
PLASTIC EIAJ SOIC PACKAGE
CASE 965–01
ISSUE O
14
LE
8
Q1
E HE
M_
L
7
1
DETAIL P
Z
D
VIEW P
A
e
c
A1
b
0.13 (0.005)
M
0.10 (0.004)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
DIM
A
A1
b
c
D
E
e
HE
0.50
LE
M
Q1
Z
MILLIMETERS
MIN
MAX
–––
2.05
0.05
0.20
0.35
0.50
0.18
0.27
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 _
0_
0.70
0.90
–––
1.42
INCHES
MIN
MAX
–––
0.081
0.002
0.008
0.014
0.020
0.007
0.011
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
–––
0.056
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability,
including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.
SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or
death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold
SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable
attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
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Toll Free from Hong Kong & Singapore:
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Phone: 81–3–5740–2745
Email: r14525@onsemi.com
ON Semiconductor Website: http://onsemi.com
For additional information, please contact your local
Sales Representative.
http://onsemi.com
8
MC14541B/D