Układ zastosowany na płytce klawiatury ma wbudowaną pamięć oraz kwarc a wiec można go programować. Dołączam notki oraz pinout mikrokontrolera. Jednak tzw. same wciskanie sie klawiszy dotykowych bardzo często spowodowane jest przerwą pomiędzy tym właśnie mikrokontrolerem a D2000 poprzez załamanie sie taśmy płytki klawiatury.
PSoC® Mixed-Signal Array
Final Data Sheet
CY8C20234
CY8C20334 and CY8C20434
Features
■ Low Power CapSense Block
❐ Configurable Capacitive Sensing Elements
❐ Supports Combination of CapSense Buttons,
Sliders, Touchpads and Proximity Sensors
■ Powerful Harvard Architecture Processor
❐
❐
❐
❐
M8C Processor Speeds Running up to 12 MHz
Low Power at High Speed
2.4V to 5.25V Operating Voltage
Industrial Temperature Range:
-40°C to +85°C
■ Flexible On-Chip Memory
❐ 8K Flash Program Storage
50,000 Erase/Write Cycles
❐ 512 Bytes SRAM Data Storage
❐ Partial Flash Updates
❐ Flexible Protection Modes
❐ Interrupt Controller
❐ In-System Serial Programming (ISSP)
■ Complete Development Tools
❐ Free Development Tool (PSoC Designer™)
❐ Full-Featured, In-Circuit Emulator and
Programmer
❐ Full Speed Emulation
❐ Complex Breakpoint Structure
❐ 128K Trace Memory
■ Precision, Programmable Clocking
❐ Internal ±5.0% 6/12 MHz Main Oscillator
❐ Internal Low Speed Oscillator at 32 kHz for
Watchdog and Sleep
■ Programmable Pin Configurations
❐ Pull Up, High Z, Open Drain, CMOS Drive
Modes on All GPIO
❐ Up to 28 Analog Inputs on GPIO
❐ Configurable Inputs on All GPIO
❐ Selectable, Regulated Digital IO on Port 1
-- 3.0V, 20 mA Total Port 1 Source Current
-- 5 mA Strong Drive Mode on Port 1
■ Versatile Analog Mux
❐
❐
❐
❐
Common Internal Analog Bus
Simultaneous Connection of IO Combinations
Comparator Noise Immunity
Low-Dropout Voltage Regulator for the Analog
Array
■ Additional System Resources
❐ Configurable Communication Speeds
-- I2C: Selectable to 50 kHz, 100 kHz or
400 kHz
-- SPI : Configurable between 46.9 kHz and
3 MHz
❐
❐
❐
❐
❐
I2C™ Slave
SPI Master and SPI Slave
Watchdog and Sleep Timers
Internal Voltage Reference
Integrated Supervisory Circuit
PSoC® Functional Overview
The PSoC family consists of many Mixed-Signal Array with OnChip Controller devices. These devices are designed to replace
multiple traditional MCU-based system components with one,
low cost single-chip programmable component. A PSoC device
includes configurable analog and digital blocks, as well as programmable interconnect. This architecture allows the user to
create customized peripheral configurations, to match the
requirements of each individual application. Additionally, a fast
CPU, Flash program memory, SRAM data memory, and configurable IO are included in a range of convenient pinouts.
The PSoC architecture for this device family, as illustrated on
the left, is comprised of three main areas: the Core, the System
Resources, and the CapSense Analog System. A common, versatile bus allows connection between IO and the analog system. Each CY8C20x34 PSoC device includes a dedicated
CapSense block that provides sensing and scanning control circuitry for capacitive sensing applications. Depending on the
PSoC package, up to 28 general purpose IO (GPIO) are also
included. The GPIO provide access to the MCU and analog
mux.
September 18, 2006 © Cypress Semiconductor Corp. 2005-2006 — Document No. 001-05356 Rev. *B
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PSoC® Overview
The PSoC Core
The Analog Multiplexer System
The PSoC Core is a powerful engine that supports a rich
instruction set. It encompasses SRAM for data storage, an
interrupt controller, sleep and watchdog timers, and IMO (internal main oscillator) and ILO (internal low speed oscillator). The
CPU core, called the M8C, is a powerful processor with speeds
up to 12 MHz. The M8C is a two-MIPS, 8-bit Harvard architecture microprocessor.
The Analog Mux Bus can connect to every GPIO pin. Pins can
be connected to the bus individually or in any combination. The
bus also connects to the analog system for analysis with the
CapSense block comparator.
System Resources provide additional capability, such as a configurable I2C slave/SPI master-slave communication interface
and various system resets supported by the M8C.
Switch control logic enables selected pins to precharge continuously under hardware control. This enables capacitive measurement for applications such as touch sensing. Other
multiplexer applications include:
■
Complex capacitive sensing interfaces, such as sliders and
touchpads.
The Analog System is composed of the CapSense PSoC block
and an internal 1.8V analog reference, which together support
capacitive sensing of up to 28 inputs.
■
Chip-wide mux that allows analog input from any IO pin.
■
Crosspoint connection between any IO pin combinations.
The CapSense Analog System
Additional System Resources
The Analog System contains the capacitive sensing hardware.
Several hardware algorithms are supported. This hardware performs capacitive sensing and scanning without requiring external components. Capacitive sensing is configurable on each
GPIO pin. Scanning of enabled CapSense pins can be completed quickly and easily across multiple ports.
System Resources, some of which have been previously listed,
provide additional capability useful to complete systems. Additional resources include low voltage detection and power on
reset. Brief statements describing the merits of each system
resource are presented below.
■
The I2C slave/SPI master-slave module provides 50/100/400
kHz communication over two wires. SPI communication over
3 or 4 wires runs at speeds of 46.9 kHz to 3 MHz (lower for a
slower system clock).
■
Low Voltage Detection (LVD) interrupts can signal the application of falling voltage levels, while the advanced POR
(Power On Reset) circuit eliminates the need for a system
supervisor.
■
An internal 1.8V reference provides an absolute reference for
capacitive sensing.
■
The 5V maximum input, 3V fixed output, low-dropout regulator (LDO) provides regulation for IOs. A register-controlled
bypass mode allows the user to disable the LDO.
Analog Global Bus
IDAC
Vr
Reference
Buffer
Cinternal
Comparator
Mux
Mux
Refs
Cap Sense Counters
CSCLK
IMO
CapSense
Clock Select
Relaxation
Oscillator
(RO)
Analog System Block Diagram
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CY8C20234, CY8C20334, CY8C20434 Final Data Sheet
PSoC® Overview
Getting Started
Development Tools
The quickest path to understanding the PSoC silicon is by reading this data sheet and using the PSoC Designer Integrated
Development Environment (IDE). This data sheet is an overview of the PSoC integrated circuit and presents specific pin,
register, and electrical specifications. For in-depth information,
along with detailed programming information, reference the
PSoC Mixed-Signal Array Technical Reference Manual, which
can be found on http://www.cypress.com/psoc.
PSoC Designer is a Microsoft® Windows-based, integrated
development environment for the Programmable System-onChip (PSoC) devices. The PSoC Designer IDE and application
runs on Windows NT 4.0, Windows 2000, Windows Millennium
(Me), or Windows XP. (Reference the PSoC Designer Functional Flow diagram below.)
Development Kits
PSoC Designer also supports a high-level C language compiler
developed specifically for the devices in the family.
Technical Training
Free PSoC technical training is available for beginners and is
taught by a marketing or application engineer over the phone.
PSoC training classes cover designing, debugging, advanced
analog, as well as application-specific classes covering topics
such as PSoC and the LIN bus. Go to http://www.cypress.com,
click on Design Support located on the left side of the web
page, and select Technical Training for more details.
Consultants
Certified PSoC Consultants offer everything from technical
assistance to completed PSoC designs. To contact or become a
PSoC Consultant go to http://www.cypress.com, click on Design
Support located on the left side of the web page, and select
CYPros Consultants.
Context
Sensitive
Help
Graphical Designer
Interface
PSoC
Designer
Results
Development Kits are available from the following distributors:
Digi-Key, Avnet, Arrow, and Future. The Cypress Online Store
contains development kits, C compilers, and all accessories for
PSoC development. Go to the Cypress Online Store web site at
http://www.cypress.com, click the Online Store shopping cart
icon at the bottom of the web page, and click PSoC (Programmable System-on-Chip) to view a current list of available items.
Commands
For up-to-date Ordering, Packaging, and Electrical Specification
information, reference the latest PSoC device data sheets on
the web at http://www.cypress.com.
PSoC Designer helps the customer to select an operating configuration for the PSoC, write application code that uses the
PSoC, and debug the application. This system provides design
database management by project, an integrated debugger with
In-Circuit Emulator, in-system programming support, and the
CYASM macro assembler for the CPUs.
Importable
Design
Database
Device
Database
PSoC
Configuration
Sheet
PSoC
Designer
Core
Engine
Application
Database
Manufacturing
Information
File
Project
Database
User
Modules
Library
Technical Support
PSoC application engineers take pride in fast and accurate
response. They can be reached with a 4-hour guaranteed
response at http://www.cypress.com/support/login.cfm.
Emulation
Pod
In-Circuit
Emulator
Device
Programmer
PSoC Designer Subsystems
Application Notes
A long list of application notes will assist you in every aspect of
your design effort. To view the PSoC application notes, go to
the http://www.cypress.com web site and select Application
Notes under the Design Resources list located in the center of
the web page. Application notes are sorted by date by default.
September 18, 2006
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PSoC® Overview
PSoC Designer Software Subsystems
Device Editor
Debugger
The device editor subsystem allows the user to select different
onboard analog and digital components called user modules
using the PSoC blocks. Examples of user modules are ADCs,
DACs, Amplifiers, and Filters.
The PSoC Designer Debugger subsystem provides hardware
in-circuit emulation, allowing the designer to test the program in
a physical system while providing an internal view of the PSoC
device. Debugger commands allow the designer to read the
program and read and write data memory, read and write IO
registers, read and write CPU registers, set and clear breakpoints, and provide program run, halt, and step control. The
debugger also allows the designer to create a trace buffer of
registers and memory locations of interest.
The device editor also supports easy development of multiple
configurations and dynamic reconfiguration. Dynamic reconfiguration allows for changing configurations at run time.
PSoC Designer sets up power-on initialization tables for
selected PSoC block configurations and creates source code
for an application framework. The framework contains software
to operate the selected components and, if the project uses
more than one operating configuration, contains routines to
switch between different sets of PSoC block configurations at
run time. PSoC Designer can print out a configuration sheet for
a given project configuration for use during application programming in conjunction with the Device Data Sheet. Once the
framework is generated, the user can add application-specific
code to flesh out the framework. It’s also possible to change the
selected components and regenerate the framework.
Online Help System
The online help system displays online, context-sensitive help
for the user. Designed for procedural and quick reference, each
functional subsystem has its own context-sensitive help. This
system also provides tutorials and links to FAQs and an Online
Support Forum to aid the designer in getting started.
Hardware Tools
In-Circuit Emulator
Application Editor
In the Application Editor you can edit your C language and
Assembly language source code. You can also assemble, compile, link, and build.
Assembler. The macro assembler allows the assembly code
to be merged seamlessly with C code. The link libraries automatically use absolute addressing or can be compiled in relative
mode, and linked with other software modules to get absolute
addressing.
A low cost, high functionality ICE (In-Circuit Emulator) is available for development support. This hardware has the capability
to program single devices.
The emulator consists of a base unit that connects to the PC by
way of a USB port. The base unit is universal and will operate
with all PSoC devices. Emulation pods for each device family
are available separately. The emulation pod takes the place of
the PSoC device in the target board and performs full speed (24
MHz) operation.
C Language Compiler. A C language compiler is available
that supports the PSoC family of devices. Even if you have
never worked in the C language before, the product quickly
allows you to create complete C programs for the PSoC family
devices.
The embedded, optimizing C compiler provides all the features
of C tailored to the PSoC architecture. It comes complete with
embedded libraries providing port and bus operations, standard
keypad and display support, and extended math functionality.
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PSoC® Overview
Designing with User Modules
The development process for the PSoC device differs from that
of a traditional fixed function microprocessor. The configurable
analog and digital hardware blocks give the PSoC architecture
a unique flexibility that pays dividends in managing specification
change during development and by lowering inventory costs.
These configurable resources, called PSoC Blocks, have the
ability to implement a wide variety of user-selectable functions.
Each block has several registers that determine its function and
connectivity to other blocks, multiplexers, buses and to the IO
pins. Iterative development cycles permit you to adapt the hardware as well as the software. This substantially lowers the risk
of having to select a different part to meet the final design
requirements.
Device Editor
User
Module
Selection
The API functions are documented in user module data sheets
that are viewed directly in the PSoC Designer IDE. These data
sheets explain the internal operation of the user module and
provide performance specifications. Each data sheet describes
the use of each user module parameter and documents the setting of each register controlled by the user module.
The development process starts when you open a new project
and bring up the Device Editor, a graphical user interface (GUI)
for configuring the hardware. You pick the user modules you
need for your project and map them onto the PSoC blocks with
point-and-click simplicity. Next, you build signal chains by interconnecting user modules to each other and the IO pins. At this
stage, you also configure the clock source connections and
enter parameter values directly or by selecting values from
drop-down menus. When you are ready to test the hardware
configuration or move on to developing code for the project, you
perform the “Generate Application” step. This causes PSoC
Designer to generate source code that automatically configures
the device to your specification and provides the high-level user
module API functions.
September 18, 2006
Source
Code
Generator
Generate
Application
Application Editor
Project
Manager
To speed the development process, the PSoC Designer Integrated Development Environment (IDE) provides a library of
pre-built, pre-tested hardware peripheral functions, called “User
Modules.” User modules make selecting and implementing
peripheral devices simple, and come in analog, digital, and
mixed signal varieties.
Each user module establishes the basic register settings that
implement the selected function. It also provides parameters
that allow you to tailor its precise configuration to your particular
application. For example, a Pulse Width Modulator User Module configures one or more digital PSoC blocks, one for each 8
bits of resolution. The user module parameters permit you to
establish the pulse width and duty cycle. User modules also
provide tested software to cut your development time. The user
module application programming interface (API) provides highlevel functions to control and respond to hardware events at run
time. The API also provides optional interrupt service routines
that you can adapt as needed.
Placement
and
Parameter
-ization
Source
Code
Editor
Build
Manager
Build
All
Debugger
Interface
to ICE
Storage
Inspector
Event &
Breakpoint
Manager
User Module and Source Code Development Flows
The next step is to write your main program, and any sub-routines using PSoC Designer’s Application Editor subsystem.
The Application Editor includes a Project Manager that allows
you to open the project source code files (including all generated code files) from a hierarchal view. The source code editor
provides syntax coloring and advanced edit features for both C
and assembly language. File search capabilities include simple
string searches and recursive “grep-style” patterns. A single
mouse click invokes the Build Manager. It employs a professional-strength “makefile” system to automatically analyze all
file dependencies and run the compiler and assembler as necessary. Project-level options control optimization strategies
used by the compiler and linker. Syntax errors are displayed in
a console window. Double clicking the error message takes you
directly to the offending line of source code. When all is correct,
the linker builds a HEX file image suitable for programming.
The last step in the development process takes place inside the
PSoC Designer’s Debugger subsystem. The Debugger downloads the HEX image to the In-Circuit Emulator (ICE) where it
runs at full speed. Debugger capabilities rival those of systems
costing many times more. In addition to traditional single-step,
run-to-breakpoint and watch-variable features, the Debugger
provides a large trace buffer and allows you define complex
breakpoint events that include monitoring address and data bus
values, memory locations and external signals.
Document No. 001-05356 Rev. *B
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PSoC® Overview
Document Conventions
Table of Contents
Acronyms Used
For an in depth discussion and more information on your PSoC
device, obtain the PSoC Mixed-Signal Array Technical Reference Manual on http://www.cypress.com. This document is
organized into the following chapters and sections.
The following table lists the acronyms that are used in this document.
Acronym
Description
AC
API
application programming interface
CPU
central processing unit
DC
direct current
GPIO
general purpose IO
GUI
graphical user interface
ICE
in-circuit emulator
ILO
internal low speed oscillator
IMO
internal main oscillator
IO
input/output
LSb
least-significant bit
LVD
low voltage detect
MSb
most-significant bit
POR
power on reset
PPOR
precision power on reset
PSoC®
Programmable System-on-Chip™
SLIMO
slow IMO
SRAM
1.
alternating current
static random access memory
Pin Information ..........................................................................7
1.1
Pinouts ..............................................................................7
1.1.1 16-Pin Part Pinout ...............................................7
1.1.2 24-Pin Part Pinout ...............................................8
1.1.3 32-Pin Part Pinout ...............................................9
1.1.4 48-Pin OCD Part Pinout .....................................10
2.
3.
Packaging Information ...........................................................23
3.1 Packaging Dimensions ....................................................23
3.2 Thermal Impedances ......................................................27
3.3 Solder Reflow Peak Temperature ...................................27
4.
Development Tool Selection ..................................................28
4.1 Software ..........................................................................28
4.1.1 PSoC Designer ...................................................28
4.1.2 PSoC Express ....................................................28
4.1.3 PSoC Programmer .............................................28
4.1.4 CY3202-C iMAGEcraft C Compiler ....................28
4.2 Development Kits ............................................................28
4.2.1 CY3215-DK Basic Development Kit ...................28
4.2.2 CY3210-ExpressDK Development Kit ................29
4.3 Evaluation Tools ..............................................................29
4.3.1 CY3210-MiniProg1 .............................................29
4.3.2 CY3210-PSoCEval1 ...........................................29
4.3.3 CY3214-PSoCEvalUSB .....................................29
4.4 Device Programmers .......................................................29
4.4.1 CY3216 Modular Programmer ...........................29
4.4.2 CY3207ISSP In-System Programmer ...............29
4.5 Accessories (Emulation and Programming) ....................30
4.6 3rd-Party Tools ................................................................30
4.7 Build a PSoC Emulator into Your Board ..........................30
5.
Ordering Information ..............................................................31
5.1 Ordering Code Definitions ...............................................31
6.
Units of Measure
Electrical Specifications .........................................................11
2.1 Absolute Maximum Ratings .............................................12
2.2 Operating Temperature ...................................................12
2.3 DC Electrical Characteristics ...........................................12
2.3.1 DC Chip-Level Specifications .............................12
2.3.2 DC General Purpose IO Specifications ..............13
2.3.3 DC Analog Mux Bus Specifications ....................14
2.3.4 DC POR and LVD Specifications .......................14
2.3.5 DC Programming Specifications ........................15
2.4 AC Electrical Characteristics ...........................................16
2.4.1 AC Chip-Level Specifications .............................16
2.4.2 AC General Purpose IO Specifications ..............17
2.4.3 AC Comparator Amplifier Specifications ............18
2.4.4 AC Analog Mux Bus Specifications ....................18
2.4.5 AC External Clock Specifications .......................19
2.4.6 AC Programming Specifications .........................20
2.4.7 AC SPI Specifications ........................................21
2.4.8 AC I2C Specifications .........................................22
Sales and Service Information ...............................................32
6.1 Revision History ..............................................................32
6.2 Copyrights and Code Protection .....................................32
A units of measure table is located in the Electrical Specifications section. Table 2-1 on page 11 lists all the abbreviations
used to measure the PSoC devices.
Numeric Naming
Hexidecimal numbers are represented with all letters in uppercase with an appended lowercase ‘h’ (for example, ‘14h’ or
‘3Ah’). Hexidecimal numbers may also be represented by a ‘0x’
prefix, the C coding convention. Binary numbers have an
appended lowercase ‘b’ (e.g., 01010100b’ or ‘01000011b’).
Numbers not indicated by an ‘h’, ‘b’, or 0x are decimal.
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1. Pin Information
This chapter describes, lists, and illustrates the CY8C20234, CY8C20334 and CY8C20434 PSoC device pins and pinout configurations.
1.1
Pinouts
The CY8C20x34 PSoC device is available in a variety of packages which are listed and illustrated in the following tables. Every port
pin (labeled with a “P”) is capable of Digital IO and connection to the common analog bus. However, Vss, Vdd, and XRES are not
capable of Digital IO.
1.1.1
16-Pin Part Pinout
Table 1-1. 16-Pin Part Pinout (QFN**)
Type
CY8C20234 16-Pin PSoC Device
1
IO
I
P2[5]
2
IO
I
P2[1]
3
IOH
I
P1[7]
I2C SCL, SPI SS.
4
IOH
I
P1[5]
I2C SDA, SPI MISO.
5
IOH
I
P1[3]
SPI CLK.
AI, P2[5]
6
IOH
I
P1[1]
CLK*, I2C SCL, SPI MOSI.
AI, P2[1]
1
2
AI, I2C SCL, SPI SS, P1[7]
AI, I2C SDA, SPI MISO, P1[5]
3
4
I
P1[0]
DATA*, I2C SDA.
9
IOH
I
P1[2]
10
IOH
I
P1[4]
Optional external clock input (EXTCLK).
XRES
Active high external reset with internal
pull down.
11
12
Input
IO
13
I
Power
P0[4]
Vdd
14
IO
I
15
IO
I
P0[3]
16
IO
I
Supply voltage.
P0[7]
P0[1]
CP
Power
Vss
Integrating input.
Center pad must be connected to
ground.
16
15
P0[1], AI
Ground connection.
IOH
5
6
Vss
8
12
QFN
(Top View) 11
10
CP
AI, SPI CLK, P1[3]
Power
Description
9
P0[4], AI
XRES
P1[4], AI, EXTCLK
P1[2], AI
CLK, I2C SCL, SPI MOSI P1[1]
Vss
AI, DATA, I2C SDA, P1[0]
7
Name
14
13
Analog
7
8
Digital
P0[3], AI
P0[7], AI
Vdd
Pin
No.
LEGEND A = Analog, I = Input, O = Output, OH = 5 mA High Output Drive.
* These are the ISSP pins, which are not High Z at POR (Power On Reset).
** The center pad (CP) on the QFN package should be connected to ground (Vss) for best mechanical, thermal, and electrical performance. If not connected to ground,
it should be electrically floated and not connected to any other signal.
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CY8C20234, CY8C20334, CY8C20434 Final Data Sheet
1.1.2
1. Pin Information
24-Pin Part Pinout
Table 1-2. 24-Pin Part Pinout (QFN**)
Type
Pin
No.
Digital
Analog
1
IO
I
IO
I
P2[3]
3
IO
I
P2[1]
4
IOH
I
P1[7]
I2C SCL, SPI SS.
5
IOH
I
P1[5]
I2C SDA, SPI MISO.
6
IOH
I
P1[3]
SPI CLK.
7
IOH
I
P1[1]
CLK*, I2C SCL, SPI MOSI.
NC
No connection.
Vss
Ground connection.
DATA*, I2C SDA.
CY8C20334 24-Pin PSoC Device
P2[5]
2
9
Power
10
IOH
I
P1[0]
11
IOH
I
IOH
I
P1[4]
13
IOH
I
P0[1],AI
P0[3],AI
P0[5],AI
P0[7],AI
Vdd
P0[6],AI
24
23
22
21
20
19
AI,P2[5]
AI,P2[3]
AI,P2[1]
AI, I2C SCL, SPI SS, P1[7]
AI, I2C SDA, SPI MISO, P1[5]
AI, SPI CLK, P1[3]
P1[2]
12
Description
P1[6]
14
Input
XRES
Optional external clock input (EXTCLK).
Active high external reset with internal
pull down.
15
IO
I
P2[0]
16
IO
I
P0[0]
17
IO
I
P0[2]
18
IO
I
P0[4]
19
IO
I
P0[6]
18
17
QFN
16
(Top View ) 15
14
13
P0[4],AI
P0[2],AI
P0[0],AI
P2[0],AI
XRES
P1[6],AI
Analog bypass.
Vdd
1
2
3
4
5
6
AI, CLK*, I2C SCL
SPIMOSI,P1[1]
7
8
NC
9
Vss
AI, DATA*, I2C SDA, P1[0] 10
AI,P1[2] 11
AI,EXTCLK,P1[4] 12
8
Name
Supply voltage.
20
Power
21
IO
I
P0[7]
22
IO
I
P0[5]
23
IO
I
P0[3]
24
IO
I
P0[1]
CP
Power
Vss
Integrating input.
Center pad must be connected to
ground.
LEGEND A = Analog, I = Input, O = Output, OH = 5 mA High Output Drive.
* These are the ISSP pins, which are not High Z at POR (Power On Reset). See the PSoC Mixed-Signal Array Technical Reference Manual for details.
** The center pad on the QFN package should be connected to ground (Vss) for best mechanical, thermal, and electrical performance. If not connected to ground, it
should be electrically floated and not connected to any other signal.
September 18, 2006
Document No. 001-05356 Rev. *B
8
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CY8C20234, CY8C20334, CY8C20434 Final Data Sheet
1.1.3
1. Pin Information
32-Pin Part Pinout
Table 1-3. 32-Pin Part Pinout (QFN**)
Type
Pin
No.
Digital
Analog
1
IO
I
IO
I
P2[7]
3
IO
I
P2[5]
4
IO
I
P2[3]
5
IO
I
P2[1]
6
IO
I
P3[3]
7
IO
I
P3[1]
8
IOH
I
P1[7]
I2C SCL, SPI SS.
9
IOH
I
P1[5]
I2C SDA, SPI MISO.
10
IOH
I
P1[3]
SPI CLK.
11
IOH
I
P1[1]
CLK*, I2C SCL, SPI MOSI.
Vss
Ground connection.
DATA*, I2C SDA.
CY8C20434 32-Pin PSoC Device
P0[1]
2
13
IOH
I
P1[0]
14
IOH
I
IOH
I
P1[4]
16
IOH
I
P1[6]
17
Input
XRES
Optional external clock input (EXTCLK).
Active high external reset with internal
pull down.
18
IO
I
P3[0]
19
IO
I
P3[2]
20
IO
I
P2[0]
21
IO
I
P2[2]
22
IO
I
P2[4]
23
IO
I
P2[6]
24
IO
I
P0[0]
25
IO
I
IO
I
IO
I
P0[6]
Analog bypass.
Vdd
P0[0],AI
P2[6],AI
P2[4],AI
P2[2],AI
P2[0],AI
P3[2],AI
P3[0],AI
XRES
P0[4]
27
QFN
(Top View )
24
23
22
21
20
19
18
17
P0[2]
26
1
2
3
4
5
6
7
8
32
31
30
29
28
27
26
25
Vss
P0[3],AI
P0[5],AI
P0[7],AI
Vdd
P0[6],AI
P0[4],AI
P0[2],AI
AI, I2C SCL
P1[2]
15
AI,P0[1]
AI,P2[7]
AI,P2[5]
AI,P2[3]
AI,P2[1]
AI,P3[3]
AI,P3[1]
SPISS,P1[7]
9
10
11
12
13
14
15
16
Power
Description
AI, I2C SDA, SPI MISO, P1[5]
AI, SPI CLK, P1[3]
AI, CLK*, I2C SCL, SPI MOSI, P1[1]
Vss
AI, DATA*, I2C SDA, P1[0]
AI,P1[2]
AI,EXTCLK,P1[4]
AI,P1[6]
12
Name
Supply voltage.
28
Power
29
IO
I
P0[7]
30
IO
I
P0[5]
31
IO
I
P0[3]
Integrating input.
32
Power
Vss
Ground connection.
CP
Power
Vss
Center pad must be connected to
ground.
LEGEND A = Analog, I = Input, O = Output, OH = 5 mA High Output Drive.
* These are the ISSP pins, which are not High Z at POR (Power On Reset). See the PSoC Mixed-Signal Array Technical Reference Manual for details.
** The center pad on the QFN package should be connected to ground (Vss) for best mechanical, thermal, and electrical performance. If not connected to ground, it
should be electrically floated and not connected to any other signal.
September 18, 2006
Document No. 001-05356 Rev. *B
9
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CY8C20234, CY8C20334, CY8C20434 Final Data Sheet
1.1.4
1. Pin Information
48-Pin OCD Part Pinout
The 48-pin QFN part table and drawing below is for the CY8C20000 On-Chip Debug (OCD) PSoC device.
Note This part is only used for in-circuit debugging. It is NOT available for production
Table 1-4. 48-Pin OCD Part Pinout (QFN**)
Digital
Analog
CY8C20000 OCD PSoC Device
2
IO
I
P0[1]
3
IO
I
P2[7]
4
IO
I
P2[5]
5
IO
I
P2[3]
6
IO
I
P2[1]
7
IO
I
P3[3]
8
IO
I
P3[1]
9
IOH
I
P1[7]
I2C SCL, SPI SS.
10
IOH
I
NC
No connection.
14
NC
No connection.
15
IOH
I
P1[3]
SPI CLK.
16
IOH
I
P1[1]
CLK*, I2C SCL, SPI MOSI.
17
Power
Vss
19
Ground connection.
CCLK
18
OCD CPU clock output.
HCLK
OCD high speed clock output.
20
IOH
I
P1[0]
DATA*, I2C SDA.
21
IOH
I
NC
NC
39
38
37
OCDO
Vdd
P0[6],AI
NC
42
41
40
(Top V ie w )
22
23
24
No connection.
13
36
35
34
33
32
31
30
29
28
27
26
25
P0[4], AI
P0[2], AI
P0[0], AI
P2[6], AI
P2[4], AI
P2[2], AI
P2[0], AI
P3[2], AI
P3[0], AI
XRES
P1[6], AI
P1[4], EXT CLK, AI
Vss
CCLK
HCLK
AI,DATA*,I2CSDA,P1[0]
AI,P1[2]
NC
NC
NC
NC
OCD QFN
7
8
9
10
11
12
15
16
17
18
19
No connection.
12
3
4
5
6
AI,SPICLK,P1[3]
AI,CLK*, I2CSCL, SPIMOSI,P1[1]
I2C SDA, SPI MISO.
NC
1
2
NC
NC
P1[5]
11
NC
AI, P0[1]
AI, P2[7]
AI, P2[5]
AI, P2[3]
AI, P2[1]
AI, P3[3]
AI, P3[1]
AI, I2C SCL, SPI SS, P1[7]
AI, I2C SDA, SPI M ISO, P1[5]
NC
NC
20
21
No connection.
P0[5],AI
P0[7],AI
OCDE
NC
Vss
P0[3],AI
NC
Description
48
47
46
45
44
43
1
Name
13
14
Pin
No.
P1[2]
22
NC
No connection.
23
NC
No connection.
24
NC
No connection.
Optional external clock input (EXTCLK).
25
IOH
I
P1[4]
26
IOH
I
Not for Production
P1[6]
27
Input
XRES
I
P3[0]
IO
I
P3[2]
30
IO
I
P2[0]
31
IO
I
P2[2]
32
IO
I
P2[4]
Pin
No.
Analog
IO
29
Digital
28
Active high external reset with internal
pull down.
Power
Name
Description
33
IO
I
P2[6]
41
Vdd
Supply voltage.
34
IO
I
P0[0]
42
OCDO
OCD even data IO.
35
IO
I
P0[2]
43
OCDE
OCD odd data output.
36
IO
I
P0[4]
44
IO
I
P0[7]
37
NC
No connection.
45
IO
I
P0[5]
38
NC
No connection.
46
IO
I
P0[3]
39
NC
No connection.
47
P0[6]
Analog bypass.
48
40
IO
I
CP
Power
Integrating input.
Ground connection.
NC
Power
Vss
No connection.
Vss
Center pad must be connected to ground.
LEGEND A = Analog, I = Input, O = Output, NC = No Connection H = 5 mA High Output Drive.
* ISSP pin which is not HighZ at POR. See the PSoC Mixed-Signal Array Technical Reference Manual for details.
** The center pad on the QFN package should be connected to ground (Vss) for best mechanical, thermal, and electrical performance. If not connected to ground, it
should be electrically floated and not connected to any other signal.
September 18, 2006
Document No. 001-05356 Rev. *B
10
[+] Feedback
2. Electrical Specifications
This chapter presents the DC and AC electrical specifications of the CY8C20234, CY8C20334 and CY8C20434 PSoC devices. For
the most up to date electrical specifications, confirm that you have the most recent data sheet by going to the web at http://
www.cypress.com/psoc.
Specifications are valid for -40oC ≤ TA ≤ 85oC and TJ ≤ 100oC as specified, except where noted.
Refer to Table 2-10 for the electrical specifications on the internal main oscillator (IMO) using SLIMO mode.
5.25
5.25
SLIMO SLIMO SLIMO
Mode=1 Mode=1 Mode=0
4.75
Vdd Voltage
Vdd Voltage
lid g
Va ratin n
pe io
O Reg
4.75
3.00
3.60
SLIMO SLIMO
Mode=1 Mode=0
3.00
SLIMO
Mode=1
2.70
2.40
SLIMO
Mode=0
2.40
750 kHz
3 MHz
750 kHz
12 MHz
3 MHz
6 MHz
12 MHz
IMOFrequency
CPU Frequency
Figure 2-1a. Voltage versus CPU Frequency
Figure 2-1b. IMO Frequency Trim Options
The following table lists the units of measure that are used in this chapter.
Table 2-1: Units of Measure
Symbol
Unit of Measure
Symbol
Unit of Measure
oC
degree Celsius
µW
microwatts
dB
decibels
mA
milli-ampere
fF
femto farad
ms
milli-second
Hz
hertz
mV
milli-volts
KB
1024 bytes
nA
nanoampere
Kbit
1024 bits
ns
nanosecond
kHz
kilohertz
nV
nanovolts
kΩ
kilohm
Ω
ohm
MHz
megahertz
pA
picoampere
MΩ
megaohm
pF
picofarad
µA
microampere
pp
peak-to-peak
µF
microfarad
ppm
µH
microhenry
ps
picosecond
µs
microsecond
sps
samples per second
µV
microvolts
σ
sigma: one standard deviation
microvolts root-mean-square
V
volts
µVrms
September 18, 2006
parts per million
Document No. 001-05356 Rev. *B
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CY8C20234, CY8C20334, CY8C20434 Final Data Sheet
2.1
2. Electrical Specifications
Absolute Maximum Ratings
Table 2-2. Absolute Maximum Ratings
Symbol
Description
Min
Typ
Max
Units
TSTG
Storage Temperature
-55
25
+100
oC
TA
Ambient Temperature with Power Applied
-40
–
+85
oC
Vdd
Supply Voltage on Vdd Relative to Vss
-0.5
–
+6.0
V
VIO
DC Input Voltage
Vss - 0.5
–
Vdd + 0.5 V
VIOZ
DC Voltage Applied to Tri-state
Vss - 0.5
–
Vdd + 0.5 V
IMIO
Maximum Current into any Port Pin
-25
–
+50
mA
ESD
Electro Static Discharge Voltage
2000
–
–
V
LU
Latch-up Current
–
–
200
Notes
mA
2.2
Higher storage temperatures will reduce data
retention time. Recommended storage temperature is +25oC ± 25oC. Extended duration storage temperatures above 65oC will degrade
reliability.
Human Body Model ESD.
Operating Temperature
Table 2-3. Operating Temperature
Symbol
Description
Min
Typ
Max
Units
TA
Ambient Temperature
-40
–
+85
TJ
Junction Temperature
-40
–
+100
oC
Notes
oC
2.3
2.3.1
The temperature rise from ambient to junction is
package specific. See “Thermal Impedances”
on page 27. The user must limit the power consumption to comply with this requirement.
DC Electrical Characteristics
DC Chip-Level Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, or 2.4V to 3.0V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters
apply to 5V, 3.3V, or 2.7V at 25°C and are for design guidance only.
Table 2-4. DC Chip-Level Specifications
Symbol
Description
Min
Typ
Max
Units
Notes
Vdd
Supply Voltage
2.40
–
5.25
V
See table titled “DC POR and LVD Specifications” on page 14.
IDD12
Supply Current, IMO = 12 MHz
–
1.5
2.5
mA
Conditions are Vdd = 3.0V, TA = 25oC, CPU = 12
MHz.
IDD6
Supply Current, IMO = 6 MHz
–
1
1.5
mA
Conditions are Vdd = 3.0V, TA = 25oC, CPU = 6
MHz.
ISB27
Sleep (Mode) Current with POR, LVD, Sleep Timer, WDT,
and internal slow oscillator active. Mid temperature range.
–
2.6
4.
µA
Vdd = 2.55V, 0oC ≤ TA ≤ 40oC.
ISB
Sleep (Mode) Current with POR, LVD, Sleep Timer, WDT,
and internal slow oscillator active.
–
2.8
5
µA
Vdd = 3.3V, -40oC ≤ TA ≤ 85oC.
September 18, 2006
Document No. 001-05356 Rev. *B
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CY8C20234, CY8C20334, CY8C20434 Final Data Sheet
2.3.2
2. Electrical Specifications
DC General Purpose IO Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, or 2.4V to 3.0V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters
apply to 5V, 3.3V, and 2.7V at 25°C and are for design guidance only.
Table 2-5. 5V and 3.3V DC GPIO Specifications
Symbol
Description
Min
Typ
Max
Units
Notes
RPU
Pull-up Resistor
4
5.6
8
kΩ
VOH1
High Output Voltage
Port 0, 2, or 3 Pins
Vdd - 0.2
–
–
V
IOH & lt; 10 µA, Vdd & gt; 3.0V, maximum of 10 mA
source current in all IOs.
VOH2
High Output Voltage
Port 0, 2, or 3 Pins
Vdd - 0.9
–
–
V
IOH = 1 mA, Vdd & gt; 3.0V, maximum of 20 mA
source current in all IOs.
VOH3
High Output Voltage
Port 1 Pins with LDO Regulator Disabled
Vdd - 0.2
–
–
V
IOH & lt; 10 µA, Vdd & gt; 3.0V, maximum of 10 mA
source current in all IOs.
VOH4
High Output Voltage
Port 1 Pins with LDO Regulator Disabled
Vdd - 0.9
–
–
V
IOH = 5 mA, Vdd & gt; 3.0V, maximum of 20 mA
source current in all IOs.
VOH5
High Output Voltage
Port 1 Pins with LDO Regulator Enabled
2.75
3.0
3.2
V
IOH & lt; 10 µA, Vdd & gt; 3.1V, maximum of 4 IOs all
sourcing 5 mA.
VOH6
High Output Voltage
Port 1 Pins with LDO Regulator Enabled
2.2
–
–
V
IOH = 5 mA, Vdd & gt; 3.1V, maximum of 20 mA
source current in all IOs.
VOL
Low Output Voltage
–
–
0.75
V
IOL = 20 mA, Vdd & gt; 3V, maximum of 60 mA sink
current on even port pins (for example, P0[2]
and P1[4]) and 60 mA sink current on odd port
pins (for example, P0[3] and P1[5]).
0.8
V
Vdd = 3.0 to 5.25.
V
Vdd = 3.0 to 5.25.
VIL
Input Low Voltage
–
–
VIH
Input High Voltage
2.0
–
VH
Input Hysteresis Voltage
–
140
–
mV
IIL
Input Leakage (Absolute Value)
–
1
–
nA
Gross tested to 1 µA.
CIN
Capacitive Load on Pins as Input
0.5
1.7
5
pF
Package and pin dependent. Temp = 25oC.
COUT
Capacitive Load on Pins as Output
0.5
1.7
5
pF
Package and pin dependent. Temp = 25oC.
Table 2-6. 2.7V DC GPIO Specifications
Symbol
Description
Min
Typ
Max
Units
Notes
RPU
Pull-up Resistor
4
5.6
8
kΩ
VOH1
High Output Voltage
Port 0, 2, or 3 Pins
Vdd - 0.2
–
–
V
IOH & lt; 10 µA, maximum of 10 mA source current
in all IOs.
VOH2
High Output Voltage
Port 0, 2, or 3 Pins
Vdd - 0.5
–
–
V
IOH = 0.2 mA, maximum of 10 mA source current in all IOs.
VOH3
High Output Voltage
Port 1 Pins with LDO Regulator Disabled
Vdd - 0.2
–
–
V
IOH & lt; 10 µA, maximum of 10 mA source current
in all IOs.
VOH4
High Output Voltage
Port 1 Pins with LDO Regulator Disabled
Vdd - 0.5
–
–
V
IOH = 2 mA, maximum of 10 mA source current
in all IOs.
VOL
Low Output Voltage
–
–
0.75
V
IOL = 10 mA, maximum of 30 mA sink current
on even port pins (for example, P0[2] and P1[4])
and 30 mA sink current on odd port pins (for
example, P0[3] and P1[5]).
0.8
V
Vdd = 2.4 to 3.0V.
V
Vdd = 2.4 to 3.0V.
VIL
Input Low Voltage
–
–
VIH
Input High Voltage
2.0
–
VH
Input Hysteresis Voltage
–
60
–
mV
IIL
Input Leakage (Absolute Value)
–
1
–
nA
Gross tested to 1 µA.
CIN
Capacitive Load on Pins as Input
0.5
1.7
5
pF
Package and pin dependent. Temp = 25oC.
COUT
Capacitive Load on Pins as Output
0.5
1.7
5
pF
Package and pin dependent. Temp = 25oC.
September 18, 2006
Document No. 001-05356 Rev. *B
13
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CY8C20234, CY8C20334, CY8C20434 Final Data Sheet
2.3.3
2. Electrical Specifications
DC Analog Mux Bus Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, or 2.4V to 3.0V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters
apply to 5V, 3.3V, or 2.7V at 25°C and are for design guidance only.
Table 2-7. DC Analog Mux Bus Specifications
Symbol
RSW
2.3.4
Description
Min
Switch Resistance to Common Analog Bus
–
Typ
–
Max
400
800
Units
Ω
Ω
Notes
Vdd ≥ 2.7V
2.4V ≤ Vdd ≤ 2.7V
DC POR and LVD Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, or 2.4V to 3.0V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters
apply to 5V, 3.3V, or 2.7V at 25°C and are for design guidance only.
Table 2-8. DC POR and LVD Specifications
Symbol
Description
Min
Typ
Max
Units
Vdd Value for PPOR Trip
VPPOR0
PORLEV[1:0] = 00b
VPPOR1
PORLEV[1:0] = 01b
VPPOR2
PORLEV[1:0] = 10b
2.36
2.40
V
2.60
2.65
V
2.82
–
2.95
Notes
Vdd must be greater than or equal to 2.5V
during startup, reset from the XRES pin, or
reset from Watchdog.
V
Vdd Value for LVD Trip
VLVD0
VM[2:0] = 000b
2.39
2.45
2.51a
V
VLVD1
VM[2:0] = 001b
2.54
2.71
2.78b
V
VLVD2
VM[2:0] = 010b
2.75
2.92
2.99c
V
VLVD3
VM[2:0] = 011b
2.85
3.02
3.09
V
VLVD4
VM[2:0] = 100b
2.96
3.13
3.20
V
VLVD5
VM[2:0] = 101b
–
–
–
V
VLVD6
VM[2:0] = 110b
–
–
–
V
VLVD7
VM[2:0] = 111b
4.52
4.73
4.83
V
a. Always greater than 50 mV above VPPOR (PORLEV = 00) for falling supply.
b. Always greater than 50 mV above VPPOR (PORLEV = 01) for falling supply.
c. Always greater than 50 mV above VPPOR (PORLEV = 10) for falling supply.
September 18, 2006
Document No. 001-05356 Rev. *B
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CY8C20234, CY8C20334, CY8C20434 Final Data Sheet
2.3.5
2. Electrical Specifications
DC Programming Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, or 2.4V to 3.0V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters
apply to 5V, 3.3V, or 2.7V at 25°C and are for design guidance only.
Table 2-9. DC Programming Specifications
Symbol
Description
Min
Typ
Max
Units
Notes
VddIWRITE
Supply Voltage for Flash Write Operations
2.70
–
–
V
IDDP
Supply Current During Programming or Verify
–
5
25
mA
VILP
Input Low Voltage During Programming or Verify
–
–
0.8
V
VIHP
Input High Voltage During Programming or Verify
2.2
–
–
V
IILP
Input Current when Applying Vilp to P1[0] or P1[1] During
Programming or Verify
–
–
0.2
mA
Driving internal pull-down resistor.
IIHP
Input Current when Applying Vihp to P1[0] or P1[1] During
Programming or Verify
–
–
1.5
mA
Driving internal pull-down resistor.
VOLV
Output Low Voltage During Programming or Verify
–
–
Vss + 0.75 V
VOHV
Output High Voltage During Programming or Verify
Vdd - 1.0
–
Vdd
V
FlashENPB
Flash Endurance (per block)
50,000
–
–
–
Erase/write cycles per block.
FlashENT
Flash Endurance (total)a
1,800,000
–
–
–
Erase/write cycles.
FlashDR
Flash Data Retention
10
–
–
Years
a. A maximum of 36 x 50,000 block endurance cycles is allowed. This may be balanced between operations on 36x1 blocks of 50,000 maximum cycles each, 36x2 blocks of
25,000 maximum cycles each, or 36x4 blocks of 12,500 maximum cycles each (to limit the total number of cycles to 36x50,000 and that no single block ever sees more than
50,000 cycles).
September 18, 2006
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CY8C20234, CY8C20334, CY8C20434 Final Data Sheet
2.4
2.4.1
2. Electrical Specifications
AC Electrical Characteristics
AC Chip-Level Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, or 2.4V to 3.0V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters
apply to 5V, 3.3V, or 2.7V at 25°C and are for design guidance only.
Table 2-10. 5V and 3.3V AC Chip-Level Specifications
Symbol
Description
Min
Typ
Max
Units
Notes
FCPU1
CPU Frequency (3.3V Nominal)
0.75
–
12.6
MHz
12 MHz only for SLIMO Mode = 0.
F32K1
Internal Low Speed Oscillator Frequency
15
32
64
kHz
FIMO12
Internal Main Oscillator Stability for 12 MHz
(Commercial Temperature)a
11.4
12
12.6
MHz
Trimmed for 3.3V operation using factory
trim values.
See Figure 2-1b, SLIMO Mode = 0.
FIMO6
Internal Main Oscillator Stability for 6 MHz
(Commercial Temperature)
5.70
6.0
6.30
MHz
Trimmed for 3.3V operation using factory
trim values.
See Figure 2-1b, SLIMO Mode = 1.
DCIMO
Duty Cycle of IMO
40
50
60
%
TRAMP
Supply Ramp Time
0
–
–
µs
a. 0 to 70 °C ambient, Vdd = 3.3 V.
Table 2-11. 2.7V AC Chip-Level Specifications
Symbol
Description
Min
Typ
Max
Units
Notes
FCPU1
CPU Frequency (2.7V Nominal)
0.75
–
3.25
MHz
F32K1
Internal Low Speed Oscillator Frequency
8
32
96
kHz
FIMO12
Internal Main Oscillator Stability for 12 MHz
(Commercial Temperature)a
11.0
12
12.9
MHz
Trimmed for 2.7V operation using factory
trim values.
See Figure 2-1b, SLIMO Mode = 0.
FIMO6
Internal Main Oscillator Stability for 6 MHz
(Commercial Temperature)
5.60
6.0
6.40
MHz
Trimmed for 2.7V operation using factory
trim values.
See Figure 2-1b, SLIMO Mode = 1.
DCIMO
Duty Cycle of IMO
40
50
60
%
TRAMP
Supply Ramp Time
0
–
–
µs
a. 0 to 70 °C ambient, Vdd = 3.3 V.
September 18, 2006
Document No. 001-05356 Rev. *B
16
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CY8C20234, CY8C20334, CY8C20434 Final Data Sheet
2.4.2
2. Electrical Specifications
AC General Purpose IO Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, or 2.4V to 3.0V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters
apply to 5V, 3.3V, or 2.7V at 25°C and are for design guidance only.
Table 2-12. 5V and 3.3V AC GPIO Specifications
Symbol
Description
Min
Typ
Max
Units
Notes
FGPIO
GPIO Operating Frequency
0
–
6
MHz
Normal Strong Mode, Port 1.
TRise023
Rise Time, Strong Mode, Cload = 50 pF
Ports 0, 2, 3
15
–
80
ns
Vdd = 3.0 to 3.6V and 4.75V to 5.25V, 10% 90%
TRise1
Rise Time, Strong Mode, Cload = 50 pF
Port 1
10
–
50
ns
Vdd = 3.0 to 3.6V, 10% - 90%
TFall
Fall Time, Strong Mode, Cload = 50 pF
All Ports
10
–
50
ns
Vdd = 3.0 to 3.6V and 4.75V to 5.25V, 10% 90%
Table 2-13. 2.7V AC GPIO Specifications
Symbol
Description
Min
Typ
Max
Units
Notes
FGPIO
GPIO Operating Frequency
0
–
1.5
MHz
Normal Strong Mode, Port 1.
TRise023
Rise Time, Strong Mode, Cload = 50 pF
Ports 0, 2, 3
15
–
100
ns
Vdd = 2.4 to 3.0V, 10% - 90%
TRise1
Rise Time, Strong Mode, Cload = 50 pF
Port 1
10
–
70
ns
Vdd = 2.4 to 3.0V, 10% - 90%
TFall
Fall Time, Strong Mode, Cload = 50 pF
All Ports
10
–
70
ns
Vdd = 2.4 to 3.0V, 10% - 90%
90%
GPIO
Pin
Output
Voltage
10%
TRise023
TRise1
TFall
Figure 2-2. GPIO Timing Diagram
September 18, 2006
Document No. 001-05356 Rev. *B
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2.4.3
2. Electrical Specifications
AC Comparator Amplifier Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, or 2.4V to 3.0V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters
apply to 5V, 3.3V, or 2.7V at 25°C and are for design guidance only.
Table 2-14. AC Operational Amplifier Specifications
Symbol
TCOMP
2.4.4
Description
Min
Typ
Comparator Response Time, 50 mV Overdrive
Max
100
200
Units
ns
ns
Notes
Vdd ≥ 3.0V.
2.4V & lt; Vcc & lt; 3.0V.
AC Analog Mux Bus Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, or 2.4V to 3.0V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters
apply to 5V, 3.3V, or 2.7V at 25°C and are for design guidance only.
Table 2-15. AC Analog Mux Bus Specifications
Symbol
FSW
Description
Switch Rate
September 18, 2006
Min
–
Typ
–
Max
3.17
Document No. 001-05356 Rev. *B
Units
Notes
MHz
18
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CY8C20234, CY8C20334, CY8C20434 Final Data Sheet
2.4.5
2. Electrical Specifications
AC External Clock Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, or 2.4V to 3.0V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters
apply to 5V, 3.3V, or 2.7V at 25°C and are for design guidance only.
Table 2-16. 5V AC External Clock Specifications
Symbol
Description
FOSCEXT
Min
Frequency
Typ
Max
Units
0.750
–
12.6
Notes
MHz
–
High Period
38
–
5300
ns
–
Low Period
38
–
–
ns
–
Power Up IMO to Switch
150
–
–
µs
Table 2-17. 3.3V AC External Clock Specifications
Symbol
Description
FOSCEXT
–
–
–
Min
Frequency with CPU Clock divide by 1
Typ
Max
Units
0.750
–
12.6
MHz
High Period with CPU Clock divide by 1
41.7
–
5300
ns
Low Period with CPU Clock divide by 1
41.7
–
–
ns
Power Up IMO to Switch
150
–
–
Notes
Maximum CPU frequency is 12 MHz at 3.3V.
With the CPU clock divider set to 1, the external
clock must adhere to the maximum frequency
and duty cycle requirements.
µs
Table 2-18. 2.7V AC External Clock Specifications
Symbol
Description
Min
Typ
Max
Units
Notes
FOSCEXT
Frequency with CPU Clock divide by 1
0.750
–
3.080
MHz
Maximum CPU frequency is 3 MHz at 2.7V.
With the CPU clock divider set to 1, the external
clock must adhere to the maximum frequency
and duty cycle requirements.
FOSCEXT
Frequency with CPU Clock divide by 2 or greater
0.15
–
6.35
MHz
If the frequency of the external clock is greater
than 3 MHz, the CPU clock divider must be set
to 2 or greater. In this case, the CPU clock
divider will ensure that the fifty percent duty
cycle requirement is met.
–
High Period with CPU Clock divide by 1
160
–
5300
ns
–
Low Period with CPU Clock divide by 1
160
–
–
ns
–
Power Up IMO to Switch
150
–
–
µs
September 18, 2006
Document No. 001-05356 Rev. *B
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2.4.6
2. Electrical Specifications
AC Programming Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, or 2.4V to 3.0V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters
apply to 5V, 3.3V, or 2.7V at 25°C and are for design guidance only.
Table 2-19. AC Programming Specifications
Symbol
Description
Min
Typ
Max
Units
Notes
TRSCLK
Rise Time of SCLK
1
–
20
ns
TFSCLK
Fall Time of SCLK
1
–
20
ns
TSSCLK
Data Set up Time to Falling Edge of SCLK
40
–
–
ns
THSCLK
Data Hold Time from Falling Edge of SCLK
40
–
–
ns
FSCLK
Frequency of SCLK
0
–
8
MHz
TERASEB
Flash Erase Time (Block)
–
15
–
ms
TWRITE
Flash Block Write Time
–
30
–
ms
TDSCLK
Data Out Delay from Falling Edge of SCLK
–
–
45
ns
3.6 & lt; Vdd
TDSCLK3
Data Out Delay from Falling Edge of SCLK
–
–
50
ns
3.0 ≤ Vdd ≤ 3.6
TDSCLK2
Data Out Delay from Falling Edge of SCLK
–
–
70
ns
2.4 ≤ Vdd ≤ 3.0
September 18, 2006
Document No. 001-05356 Rev. *B
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CY8C20234, CY8C20334, CY8C20434 Final Data Sheet
2.4.7
2. Electrical Specifications
AC SPI Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, or 2.4V to 3.0V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters
apply to 5V, 3.3V, or 2.7V at 25°C and are for design guidance only.
Table 2-20. 5V and 3.3V AC SPI Specifications
Symbol
Description
Min
Typ
Max
Units
FSPIM
Maximum Input Clock Frequency Selection, Master
–
–
6.3
MHz
FSPIS
Maximum Input Clock Frequency Selection, Slave
–
–
2.05
MHz
TSS
Width of SS_ Negated Between Transmissions
50
–
–
Notes
Output clock frequency is half of input clock
rate.
ns
Table 2-21. 2.7V AC SPI Specifications
Symbol
Description
Min
Typ
Max
Units
FSPIM
Maximum Input Clock Frequency Selection, Master
–
–
3.15
MHz
FSPIS
Maximum Input Clock Frequency Selection, Slave
–
–
1.025
MHz
TSS
Width of SS_ Negated Between Transmissions
50
–
–
Notes
ns
September 18, 2006
Document No. 001-05356 Rev. *B
Output clock frequency is half of input clock
rate.
21
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CY8C20234, CY8C20334, CY8C20434 Final Data Sheet
2.4.8
2. Electrical Specifications
AC I2C Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, or 2.4V to 3.0V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters
apply to 5V, 3.3V, or 2.7V at 25°C and are for design guidance only.
Table 2-22. AC Characteristics of the I2C SDA and SCL Pins for Vdd ≥ 3.0V
Standard Mode
Symbol
Description
Min
Fast Mode
Max
Min
Max
Units
FSCLI2C
SCL Clock Frequency
0
100
0
400
THDSTAI2C
Hold Time (repeated) START Condition. After this
period, the first clock pulse is generated.
4.0
–
0.6
–
µs
TLOWI2C
LOW Period of the SCL Clock
4.7
–
1.3
–
µs
THIGHI2C
HIGH Period of the SCL Clock
4.0
–
0.6
–
µs
TSUSTAI2C
Set-up Time for a Repeated START Condition
4.7
–
0.6
–
µs
THDDATI2C
Data Hold Time
0
–
0
–
µs
TSUDATI2C
Data Set-up Time
250
–
100a
–
ns
TSUSTOI2C
Set-up Time for STOP Condition
4.0
–
0.6
–
µs
TBUFI2C
Bus Free Time Between a STOP and START Condition 4.7
–
1.3
–
µs
TSPI2C
Pulse Width of spikes are suppressed by the input filter.
–
0
50
Notes
kHz
ns
–
a. A Fast-Mode I2C-bus device can be used in a Standard-Mode I2C-bus system, but the requirement tSU;DAT ≥ 250 ns must then be met. This will automatically be
the case if the device does not stretch the LOW period of the SCL signal. If such device does stretch the LOW period of the SCL signal, it must output the next data
bit to the SDA line trmax + tSU;DAT = 1000 + 250 = 1250 ns (according to the Standard-Mode I2C-bus specification) before the SCL line is released.
Table 2-23. 2.7V AC Characteristics of the I2C SDA and SCL Pins (Fast Mode not Supported)
Standard Mode
Symbol
Description
Min
Fast Mode
Max
Min
Max
Units
FSCLI2C
SCL Clock Frequency
0
100
–
–
THDSTAI2C
Hold Time (repeated) START Condition. After this
period, the first clock pulse is generated.
4.0
–
–
–
µs
TLOWI2C
LOW Period of the SCL Clock
4.7
–
–
–
µs
THIGHI2C
HIGH Period of the SCL Clock
4.0
–
–
–
µs
TSUSTAI2C
Set-up Time for a Repeated START Condition
4.7
–
–
–
µs
THDDATI2C
Data Hold Time
0
–
–
–
µs
TSUDATI2C
Data Set-up Time
250
–
–
–
ns
TSUSTOI2C
Set-up Time for STOP Condition
4.0
–
–
–
µs
TBUFI2C
Bus Free Time Between a STOP and START Condition 4.7
–
–
–
µs
TSPI2C
Pulse Width of spikes are suppressed by the input filter.
–
–
–
Notes
kHz
ns
–
SDA
TLOWI2C
TSUDATI2C
THDSTAI2C
TSPI2C
TBUFI2C
SCL
S THDSTAI2C THDDATI2C THIGHI2C
TSUSTAI2C
Sr
TSUSTOI2C
P
S
Figure 2-3. Definition for Timing for Fast/Standard Mode on the I2C Bus
September 18, 2006
Document No. 001-05356 Rev. *B
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3. Packaging Information
This chapter illustrates the packaging specifications for the CY8C20x34 PSoC device, along with the thermal impedances for each
package.
Important Note Emulation tools may require a larger area on the target PCB than the chip’s footprint. For a detailed description of
the emulation tools’ dimensions, refer to the document titled PSoC Emulator Pod Dimensions at
http://www.cypress.com/design/MR10161.
3.1
Packaging Dimensions
001-09116 **
Figure 3-1. 16-Lead (3x3 mm x 0.6 MAX) QFN -- Preliminary
September 18, 2006
Document No. 001-05356 Rev. *B
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CY8C20234, CY8C20334, CY8C20434 Final Data Sheet
3. Packaging Information
001-09049 **
Figure 3-2. 24-Lead (4x4 x 0.6 mm) QFN -- Preliminary
September 18, 2006
Document No. 001-05356 Rev. *B
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CY8C20234, CY8C20334, CY8C20434 Final Data Sheet
3. Packaging Information
001-06392 **
Figure 3-3. 32-Lead (5x5 mm 0.60 MAX) QFN
September 18, 2006
Document No. 001-05356 Rev. *B
25
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CY8C20234, CY8C20334, CY8C20434 Final Data Sheet
3. Packaging Information
51-85152 *B
Figure 3-4. 48-Lead (7x7 mm) QFN
Important Note For information on the preferred dimensions for mounting QFN packages, see the following Application Note at
http://www.amkor.com/products/notes_papers/MLFAppNote.pdf.
September 18, 2006
Document No. 001-05356 Rev. *B
26
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CY8C20234, CY8C20334, CY8C20434 Final Data Sheet
3.2
3. Packaging Information
Thermal Impedances
Table 3-1. Thermal Impedances per Package
Package
Typical
θJA *
16 QFN**
46 oC/W
24 QFN**
40 oC/W
32 QFN**
27 oC/W
48 QFN**
28 oC/W
* TJ = TA + Power x θJA
** To achieve the thermal impedance specified for the ** package, the center
thermal pad should be soldered to the PCB ground plane.
3.3
Solder Reflow Peak Temperature
Following is the minimum solder reflow peak temperature to achieve good solderability.
Table 3-2. Solder Reflow Peak Temperature
Package
Minimum Peak Temperature*
Maximum Peak Temperature
16 QFN
240 C
260oC
24 QFN
240oC
260oC
32 QFN
240oC
260oC
48 QFN
240oC
260oC
o
*Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5oC
with Sn-Pb or 245 ± 5oC with Sn-Ag-Cu paste. Refer to the solder manufacturer specifications.
September 18, 2006
Document No. 001-05356 Rev. *B
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4. Development Tool Selection
This chapter presents the development tools available for all current PSoC device families including the CY8C20x34 family.
4.1
4.1.1
Software
4.2
All development kits can be purchased from the Cypress Online
Store.
PSoC Designer™
At the core of the PSoC development software suite is PSoC
Designer. Utilized by thousands of PSoC developers, this
robust software has been facilitating PSoC designs for half a
decade. PSoC Designer is available free of charge at http://
www.cypress.com under DESIGN RESOURCES & gt; & gt; Software
and Drivers.
4.1.2
Development Kits
PSoC Express™
As the newest addition to the PSoC development software
suite, PSoC Express is the first visual embedded system design
tool that allows a user to create an entire PSoC project and
generate a schematic, BOM, and data sheet without writing a
single line of code. Users work directly with application objects
such as LEDs, switches, sensors, and fans. PSoC Express is
available free of charge at http://www.cypress.com/psocexpress.
4.2.1
CY3215-DK Basic Development Kit
The CY3215-DK is for prototyping and development with PSoC
Designer. This kit supports in-circuit emulation and the software
interface allows users to run, halt, and single step the processor
and view the content of specific memory locations. Advance
emulation features also supported through PSoC Designer. The
kit includes:
■ PSoC Designer Software CD
■ ICE-Cube In-Circuit Emulator
■ ICE Flex-Pod for CY8C29x66 Family
■ Cat-5 Adapter
■ Mini-Eval Programming Board
■ 110 ~ 240V Power Supply, Euro-Plug Adapter
■ iMAGEcraft C Compiler (Registration Required)
■ ISSP Cable
4.1.3
PSoC Programmer
■ USB 2.0 Cable and Blue Cat-5 Cable
Flexible enough to be used on the bench in development, yet
suitable for factory programming, PSoC Programmer works
either as a standalone programming application or it can operate directly from PSoC Designer or PSoC Express. PSoC Programmer software is compatible with both PSoC ICE-Cube InCircuit Emulator and PSoC MiniProg. PSoC programmer is
available free ofcharge at http://www.cypress.com/psocprogrammer.
4.1.4
■ 2 CY8C29466-24PXI 28-PDIP Chip Samples
CY3202-C iMAGEcraft C Compiler
CY3202 is the optional upgrade to PSoC Designer that enables
the iMAGEcraft C compiler. It can be purchased from the
Cypress Online Store. At http://www.cypress.com, click the
Online Store shopping cart icon at the bottom of the web page,
and click PSoC (Programmable System-on-Chip) to view a current list of available items..
September 18, 2006
Document No. 001-05356 Rev. *B
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CY8C20234, CY8C20334, CY8C20434 Final Data Sheet
4.2.2
CY3210-ExpressDK PSoC Express
Development Kit
The CY3210-ExpressDK is for advanced prototyping and development with PSoC Express (may be used with ICE-Cube In-Circuit Emulator). It provides access to I2C buses, voltage
reference, switches, upgradeable modules and more. The kit
includes:
■ PSoC Express Software CD
4. Development Tool Selection
4.3.3
CY3214-PSoCEvalUSB
The CY3214-PSoCEvalUSB evaluation kit features a development board for the CY8C24794-24LFXI PSoC device. Special
features of the board include both USB and capacitive sensing
development and debugging support. This evaluation board
also includes an LCD module, potentiometer, LEDs, an enunciator and plenty of bread boarding space to meet all of your evaluation needs. The kit includes:
■ PSoCEvalUSB Board
■ Express Development Board
■ LCD Module
■ 4 Fan Modules
■ MIniProg Programming Unit
■ 2 Proto Modules
■ Mini USB Cable
■ MiniProg In-System Serial Programmer
■ PSoC Designer and Example Projects CD
■ MiniEval PCB Evaluation Board
■ Getting Started Guide
■ Jumper Wire Kit
■ Wire Pack
■ USB 2.0 Cable
■ Serial Cable (DB9)
4.4
■ 110 ~ 240V Power Supply, Euro-Plug Adapter
■ 2 CY8C24423A-24PXI 28-PDIP Chip Samples
Device Programmers
All device programmers can be purchased from the Cypress
Online Store.
■ 2 CY8C27443-24PXI 28-PDIP Chip Samples
■ 2 CY8C29466-24PXI 28-PDIP Chip Samples
4.4.1
4.3
Evaluation Tools
All evaluation tools can be purchased from the Cypress Online
Store.
4.3.1
The CY3216 Modular Programmer kit features a modular programmer and the MiniProg1 programming unit. The modular
programmer includes three programming module cards and
supports multiple Cypress products. The kit includes:
■ Modular Programmer Base
CY3210-MiniProg1
■ 3 Programming Module Cards
The CY3210-MiniProg1 kit allows a user to program PSoC
devices via the MiniProg1 programming unit. The MiniProg is a
small, compact prototyping programmer that connects to the PC
via a provided USB 2.0 cable. The kit includes:
■ MiniProg Programming Unit
■ MiniEval Socket Programming and Evaluation Board
■ 28-Pin CY8C29466-24PXI PDIP PSoC Device Sample
■ 28-Pin CY8C27443-24PXI PDIP PSoC Device Sample
■ MiniProg Programming Unit
■ PSoC Designer Software CD
■ Getting Started Guide
■ USB 2.0 Cable
4.4.2
CY3207ISSP In-System Serial
Programmer (ISSP)
The CY3207ISSP is a production programmer. It includes protection circuitry and an industrial case that is more robust than
the MiniProg in a production-programming environment.
Note CY3207ISSP needs special software and is not compatible with PSoC Programmer. The kit includes:
■ PSoC Designer Software CD
■ Getting Started Guide
■ USB 2.0 Cable
4.3.2
CY3216 Modular Programmer
CY3210-PSoCEval1
■ CY3207 Programmer Unit
The CY3210-PSoCEval1 kit features an evaluation board and
the MiniProg1 programming unit. The evaluation board includes
an LCD module, potentiometer, LEDs, and plenty of breadboarding space to meet all of your evaluation needs. The kit
includes:
■ PSoC ISSP Software CD
■ 110 ~ 240V Power Supply, Euro-Plug Adapter
■ USB 2.0 Cable
■ Evaluation Board with LCD Module
■ MiniProg Programming Unit
■ 28-Pin CY8C29466-24PXI PDIP PSoC Device Sample (2)
■ PSoC Designer Software CD
■ Getting Started Guide
■ USB 2.0 Cable
September 18, 2006
Document No. 001-05356 Rev. *B
29
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CY8C20234, CY8C20334, CY8C20434 Final Data Sheet
4.5
4. Development Tool Selection
Accessories (Emulation and
Programming)
Table 4-1. Emulation and Programming Accessories
Part #
Pin
Package
Flex-Pod
Kita
Foot Kitb
Prototyping
Module
Adapterc
CY8C20334
-12LFXI
24 QFN
CY325020334QFN
CY325024QFN-FK
CY32100X34
AS-24-2801ML-6
CY8C20434
-12LKXI
32 QFN
CY325020434QFN
CY325032QFN-FK
CY32100X34
AS-32-2803ML-6
a. Flex-Pod kit includes a practice flex-pod and a practice PCB, in addition to two
flex-pods.
b. Foot kit includes surface mount feet that can be soldered to the target PCB.
c. Programming adapter converts non-DIP package to DIP footprint. Specific
details and ordering information for each of the adapters can be found at
http://www.emulation.com.
4.6
3rd-Party Tools
Several tools have been specially designed by the following
3rd-party vendors to accompany PSoC devices during development and production. Specific details for each of these tools can
be found at http://www.cypress.com under DESIGN
RESOURCES & gt; & gt; Evaluation Boards.
4.7
Build a PSoC Emulator into
Your Board
For details on how to emulate your circuit before going to volume production using an on-chip debug (OCD) non-production
PSoC device, see Application Note “Debugging - Build a PSoC
Emulator into Your Board - AN2323” at http://www.cypress.com/
design/AN2323.
September 18, 2006
Document No. 001-05356 Rev. *B
30
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5. Ordering Information
The following table lists the CY8C20234, CY8C20334 and CY8C20434 PSoC device’s key package features and ordering codes.
CapSense
Blocks
Digital IO
Pins
Analog
Outputs
XRES Pin
512
0
1
13
13a
0
Yes
16 Pin (3x3 mm 0.60 MAX) QFN
(Tape and Reel)
CY8C20234-12LKXIT
8K
512
0
1
13
13a
0
Yes
24 Pin (4x4 mm 0.60 MAX) QFN
CY8C20334-12LKXI
8K
512
0
1
20
20a
0
Yes
24 Pin (4x4 mm 0.60 MAX) QFN
(Tape and Reel)
CY8C20334-12LKXIT
8K
512
0
1
20
20a
0
Yes
32 Pin (5x5 mm 0.60 MAX) QFN
CY8C20434-12LKXI
8K
512
0
1
28
28a
0
Yes
32 Pin (5x5 mm 0.60 MAX) QFN
(Tape and Reel)
CY8C20434-12LKXIT
8K
512
0
1
28
28a
0
Yes
48 Pin OCD QFN
CY8C20000-12LFXI
8K
512
0
1
28
28a
0
Yes
Analog
Digital
Blocks
8K
Inputs a
SRAM
(Bytes)
CY8C20234-12LKXI
Ordering
Code
16 Pin (3x3 mm 0.60 MAX) QFN
Package
Flash
(Bytes)
Table 5-1. PSoC Device Key Features and Ordering Information
a. Dual-function Digital IO Pins also connect to the common analog mux.
5.1
Ordering Code Definitions
CY 8 C 20 xxx-12xx
Package Type:
PX = PDIP Pb-Free
SX = SOIC Pb-Free
PVX = SSOP Pb-Free
LFX = QFN Pb-Free
LKX = QFN Pb-Free
AX = TQFP Pb-Free
Thermal Rating:
C = Commercial
I = Industrial
E = Extended
Speed: 12 MHz
Part Number
Family Code
Technology Code: C = CMOS
Marketing Code: 8 = Cypress PSoC
Company ID: CY = Cypress
September 18, 2006
Document No. 001-05356 Rev. *B
31
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6. Sales and Service Information
To obtain information about Cypress Semiconductor or PSoC sales and technical support, reference the following information.
Cypress Semiconductor
198 Champion Court
San Jose, CA 95134
408.943.2600
Web Links:
6.1
Company Information – http://www.cypress.com
Sales – http://www.cypress.com/aboutus/sales_locations.cfm
Technical Support – http://www.cypress.com/support/login.cfm
Revision History
Document Title:
CY8C20234, CY8C20334, CY8C20434 PSoC® Mixed-Signal Array Final Data Sheet
Document Number: 001-05356
Revision
ECN # Issue Date
Origin of Change
Description of Change
**
404571
See ECN
HMT
New silicon and document (Revision **).
*A
418513
See ECN
HMT
Update Electrical Specs., including Storage Temperature and Maximum Input
Clock Frequency. Update Features and Analog System Overview. Modify 32-pin
QFN E-PAD dimensions. Add new 32-pin QFN. Add High Output Drive indicator to
all P1[x] pinouts. Update trademarks.
*B
490071
See ECN
HMT
Make data sheet “Final.” Add new Dev. Tool section. Add OCD pinout and package
diagram. Add 16-pin QFN. Update 24- and 32-pin QFN package diagrams to 0.60
MAX thickness. Change from commercial to industrial temperature range. Update
Storage Temperature specification and notes. Update thermal resistance data. Add
dev. tool kit part numbers. Finetune features and electrical specs.
Distribution: External/Public
6.2
Posting: None
Copyrights and Code Protection
Copyrights
© Cypress Semiconductor Corp. 2005-2006. All rights reserved. PSoC Designer™, Programmable System-on-Chip™, and PSoC Express are trademarks and PSoC® is
a registered trademark of Cypress Semiconductor Corp. All other trademarks or registered trademarks referenced herein are property of the respective corporations.
The information contained herein is subject to change without notice. Cypress Semiconductor assumes no responsibility for the use of any circuitry other than circuitry
embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize its products
for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of
Cypress Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress
Semiconductor against all charges. Cypress Semiconductor products are not warranted nor intended to be used for medical, life-support, life-saving, critical control or safety
applications, unless pursuant to an express written agreement with Cypress Semiconductor.
Flash Code Protection
Note the following details of the Flash code protection features on Cypress Semiconductor PSoC devices.
Cypress Semiconductor products meet the specifications contained in their particular data sheets. Cypress Semiconductor believes that its family of products is one of the
most secure families of its kind on the market today, regardless of how they are used. There may be methods, unknown to Cypress Semiconductor, that can breach the
code protection features. Any of these methods, to our knowledge, would be dishonest and possibly illegal. Neither Cypress Semiconductor nor any other semiconductor
manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as " unbreakable. "
Cypress Semiconductor is willing to work with the customer who is concerned about the integrity of their code. Code protection is constantly evolving. We at Cypress
Semiconductor are committed to continuously improving the code protection features of our products.
September 18, 2006 © Cypress Semiconductor Corp. 2005-2006 — Document No. 001-05356 Rev. *B
32
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