Układy produkuje chociażby Texas Instruments lub Cypress Semiconductor Corporation.Czy w Polsce jest jakiś importer musisz sam popytać np.TME Regulamin, pkt 3.1.11, 3.1.14. Proszę się powstrzymać od "niby"-porad, które nic nie wnoszą do tematu.
1CY74FCT16444T/2
H244T
Data sheet acquired from Cypress Semiconductor Corporation.
Data sheet modified to remove devices not offered.
CY74FCT16244T
CY74FCT162244T
CY74FCT162H244T
16-Bit Buffers/Line Drivers
SCCS028B - December 1987 - Revised September 2001
Features
Functional Description
• Ioff supports partial-power-down mode operation
• Edge-rate control circuitry for significantly improved
noise characteristics
• Typical output skew & lt; 250 ps
• ESD & gt; 2000V
• TSSOP (19.6-mil pitch) and SSOP (25-mil pitch)
packages
• Industrial temperature range of –40˚C to +85˚C
• VCC = 5V ± 10%
CY74FCT16244T Features:
• 64 mA sink current, 32 mA source current
• Typical VOLP (ground bounce)
& lt; 1.0V at VCC = 5V, TA = 25˚C
CY74FCT162244T Features:
• Balanced output drivers: 24 mA
• Reduced system switching noise
• Typical VOLP (ground bounce)
& lt; 0.6V at VCC = 5V, TA= 25˚C
CY74FCT162H244T Features:
• Bus hold on data inputs
• Eliminates the need for external pull-up or pull-down
resistors
These 16-bit buffers/line drivers are designed for use in
memory driver, clock driver, or other bus interface applications,
where high-speed and low power are required. With
flow-through pinout and small shrink packaging board layout
is simplified. The three-state controls are designed to allow
4-bit, 8-bit or combined 16-bit operation.
This device is fully specified for partial-power-down
applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device
when it is powered down.
The CY74FCT16244T is ideally suited for driving
high-capacitance loads and low-impedance backplanes.
The CY74FCT162244T has 24-mA balanced output drivers
with current limiting resistors in the outputs. This reduces the
need for external terminating resistors and provides for minimal undershoot and reduced ground bounce. The
CY74FCT162244T is ideal for driving transmission lines.
The CY74FCT162H244T is a 24-mA balanced output part that
has “bus hold” on the data inputs. The device retains the input’s last state whenever the input goes to high impedance.
This eliminates the need for pull-up/down resistors and prevents floating inputs.
Logic Block Diagrams CY74FCT16244T, CY74FCT162244T,
CY74FCT162H244T
1OE
3A1
SSOP/TSSOP
Top View
3OE
1A1
Pin Configuration
1OE
1A2
1Y2
3A2
3Y1
3Y2
48
2OE
2
47
1A1
1Y2
3
46
1A2
GND
1Y1
1
1Y1
4
45
GND
1Y3
1Y4
1A3
1Y3
3A3
3Y3
VCC
2Y1
2Y2
5 16244T 44
162244T
6 162H244T43
42
7
1A3
8
41
2A1
1A4
VCC
3A4
FCT16244–1
2A2
2Y1
4A1
2Y2
4A2
2Y3
4A3
4Y1
4Y2
2A2
39
GND
2Y3
11
38
2A3
2Y4
12
13
37
36
2A4
14
35
3A2
15
34
GND
3Y3
4OE
2OE
2A1
FCT16244–2
40
10
3Y2
3Y4
9
GND
1Y4
GND
3Y1
1A4
16
33
3A3
3Y4
17
32
3A4
VCC
4Y1
18
31
VCC
19
30
4A1
3A1
2A4
2Y4
FCT16244–3
4A4
4Y3
4Y4
FCT16244–4
Copyright
20
29
4A2
21
28
GND
4Y3
22
27
4A3
4Y4
2A3
4Y2
GND
23
26
4A4
4OE
24
25
3OE
FCT16244–5
© 2001, Texas Instruments Incorporated
CY74FCT16244T
CY74FCT162244T
CY74FCT162H244T
Maximum Ratings [3,4]
Pin Description
Name
(Above which the useful life may be impaired. For user
guidelines, not tested.)
Description
OE
Three-State Output Enable Inputs (Active LOW)
Storage Temperature ................................. –55°C to +125°C
A
Data Inputs[1]
Y
Three-State Outputs
Ambient Temperature with
Power Applied............................................. –55°C to +125°C
DC Input Voltage ........................................... –0.5V to +7.0V
DC Output Voltage......................................... –0.5V to +7.0V
[2]
DC Output Current
(Maximum Sink Current/Pin) ........................–60 to +120 mA
Function Table
Inputs
Outputs
OE
A
L
L
L
L
H
H
H
X
Power Dissipation .......................................................... 1.0W
Y
Z
Static Discharge Voltage............................................ & gt; 2001V
(per MIL-STD-883, Method 3015)
Ordering Range
Ambient
Temperature
VCC
– 40°C to +85°C
5V ± 10%
Range
Industrial
Notes:
1. On CY74FCT162H244T these pins have “bus hold.”
2. H = HIGH Voltage Level. L = LOW Voltage Level. X = Don’t Care. Z = High Importance.
3. Operation beyond the limits set forth may impair the useful life of the device. Unless otherwise noted, these limits are over the operating free-air temperature range.
4. Unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground.
Electrical Characteristics Over the Operating Range
Parameter
Description
VIH
Input HIGH Voltage
VIL
Input Hysteresis[6]
VIK
Input Clamp Diode Voltage
IIH
Input HIGH Current
Min.
Typ.[5]
Input LOW Voltage
VH
Test Conditions
2.0
0.8
100
VCC=Min., IIN=–18 mA
Standard
IIL
Input LOW Current
IBBH
IBBL
–0.7
Input[7]
High Impedance Output Current
(Three-State Output pins)
IOS
IOFF
µA
µA
±100
VCC=Min.
VI=2.0V
µA
µA
–50
VI=0.8V
IOZL
V
±1
VCC=Max., VI=GND
Bus Hold
IOZH
–1.2
±100
Bus Hold Sustain Current on Bus Hold Input[7]
Bus Hold Overdrive Current on Bus Hold
V
mV
±1
VCC=Max., VI=VCC
Standard
IBHHO
IBHLO
Unit
V
Bus Hold
IO
Max.
+50
TBD
mA
VCC=Max., VOUT=2.7V
±1
µA
High Impedance Output Current
(Three-State Output pins)
VCC=Max., VOUT=0.5V
±1
µA
Short Circuit Current[8]
VCC=Max., VOUT=GND
–80
–200
mA
Current[8]
VCC=Max., VOUT=2.5V
–50
–180
mA
±1
µA
Output Drive
Power-Off Disable
VCC=Max., VI=1.5V
VCC=0V, VOUT
2
≤4.5V[9]
–140
CY74FCT16244T
CY74FCT162244T
CY74FCT162H244T
Output Drive Characteristics for CY74FCT16244T
VOL
Typ.[5]
VCC=Min., IOH=–3 mA
2.5
3.5
V
2.4
3.5
V
VCC=Min., IOH=–32 mA
VOH
Description
Min.
VCC=Min., IOH=–15 mA
Parameter
2.0
3.0
V
Test Conditions
Output HIGH Voltage
Output LOW Voltage
VCC=Min., IOL=64 mA
0.2
Max.
Unit
0.55
V
Output Drive Characteristics for CY74FCT162244T, CY74FCT162H244T
Parameter
IODL
Description
[8]
Output LOW Current
Current[8]
Test Conditions
Min.
Typ.[5]
Max.
Unit
VCC=5V, VIN=VIH or VIL, VOUT=1.5V
60
115
150
mA
–150
mA
IODH
Output HIGH
VCC=5V, VIN=VIH or VIL, VOUT=1.5V
–60
–115
VOH
Output HIGH Voltage
VCC=Min., IOH=–24 mA
2.4
3.3
VOL
Output LOW Voltage
VCC=Min., IOL=24 mA
0.3
V
0.55
V
Notes:
5. Typical values are at VCC=5.0V, TA = +25˚C ambient.
6. This parameter is specified but not tested.
7. Pins with bus hold are described in Pin Description.
8. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample
and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting
of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter
tests, IOS tests should be performed last.
9. Tested at +25˚C.
3
CY74FCT16244T
CY74FCT162244T
CY74FCT162H244T
Capacitance[6](TA = +25˚C, f = 1.0 MHz)
Parameter
Description
Typ.[5]
Test Conditions
Max.
Unit
CIN
Input Capacitance
VIN = 0V
4.5
6.0
pF
COUT
Output Capacitance
VOUT = 0V
5.5
8.0
pF
Typ.[5]
Max.
Unit
5
500
µA
0.5
1.5
mA
Power Supply Characteristics
Parameter
Description
Test Conditions
ICC
Quiescent Power Supply Current VCC=Max.
VIN≤0.2V,
VIN≤VCC-0.2V
∆ICC
Quiescent Power Supply Current VCC=Max.
(TTL inputs HIGH)
VIN=3.4V[10]
ICCD
Dynamic Power Supply
Current[11]
VCC=Max., One Input Toggling, VIN=VCC or
50% Duty Cycle, Outputs
VIN=GND
Open, OE=GND
60
100
µA/MHz
IC
Total Power Supply Current[12]
VCC=Max., f1=10 MHz,
50% Duty Cycle, Outputs
Open, One Bit Toggling,
OE=GND
VIN=VCC or
VIN=GND
0.6
1.5
mA
VIN=3.4V or
VIN=GND
0.9
2.3
mA
VIN=VCC or
VIN=GND
2.4
4.5[13]
mA
VIN=3.4V or
VIN=GND
6.4
16.5[13]
mA
VCC=Max., f1=2.5 MHz, 50%
Duty Cycle, Outputs Open, Sixteen Bits Toggling,
OE=GND
Notes:
10. Per TTL driven input (VIN = 3.4V); all other inputs at VCC or GND.
11. This parameter is not directly testable, but is derived for use in Total Power Supply calculations.
12. IC=IQUIESCENT + IINPUTS + IDYNAMIC
IC
= ICC+∆ICCDHNT+ICCD(f0/2 + f1N1)
ICC = Quiescent Current with CMOS input levels
ICC = Power Supply Current for a TTL HIGH input (VIN=3.4V)
= Duty Cycle for TTL inputs HIGH
DH
= Number of TTL inputs at DH
NT
ICCD = Dynamic Current caused by an input transition pair (HLH or LHL)
= Clock frequency for registered devices, otherwise zero
f0
= Input signal frequency
f1
= Number of inputs changing at f1
N1
All currents are in milliamps and all frequencies are in megahertz.
13. Values for these conditions are examples of the ICC formula. These limits are specified but not tested.
4
CY74FCT16244T
CY74FCT162244T
CY74FCT162H244T
Switching Characteristics Over the Operating Range[14]
S
CY74FCT16244T
CY74FCT162244T
Parameter
CY74FCT16244AT
CY74FCT162244AT
CY74FCT162H244AT
Min.
Description
Max.
Min.
Max.
Unit
Fig. No.[15]
tPLH
tPHL
Propagation Delay Data to Output
1.5
6.5
1.5
4.8
ns
1, 3
tPZH
tPZL
Output Enable Time
1.5
8.0
1.5
6.2
ns
1, 7, 8
tPHZ
tPLZ
Output Disable Time
1.5
7.0
1.5
5.6
ns
1, 7, 8
tSK(O)
Output Skew[16]
0.5
ns
—
0.5
Switching Characteristics Over the Operating Range[14] (continued)
CY74FCT16244CT
CY74FCT162244CT
CY74FCT162H244CT
Parameter
Min.
Description
Max.
Unit
Fig. No.[15]
tPLH
tPHL
Propagation Delay Data to Output
1.5
4.1
ns
1, 3
tPZH
tPZL
Output Enable Time
1.5
5.8
ns
1, 7, 8
tPHZ
tPLZ
Output Disable Time
1.5
5.2
ns
1, 7, 8
tSK(O)
Output Skew[16]
0.5
ns
—
Notes:
14. Minimum limits are specified but not tested on Propagation Delays.
15. See “Parameter Measurement Information” in the General Information section.
16. Skew between any two outputs of the same package switching in the same direction. This parameter is ensured by design.
5
CY74FCT16244T
CY74FCT162244T
CY74FCT162H244T
Ordering Information CY74FCT16244
Speed
(ns)
4.1
Ordering Code
Package
Name
Package Type
48-Lead (240-Mil) TSSOP
O48
48-Lead (300-Mil) SSOP
CY74FCT16244ATPACT
Z48
48-Lead (240-Mil) TSSOP
CY74FCT16244ATPVC/PVCT
O48
48-Lead (300-Mil) SSOP
CY74FCT16244TPACT
Z48
48-Lead (240-Mil) TSSOP
CY74FCT16244TPVC/PVCT
6.5
Z48
CY74FCT16244CTPVC/PVCT
4.8
CY74FCT16244CTPACT
O48
Operating
Range
Industrial
48-Lead (300-Mil) SSOP
Industrial
Industrial
Ordering Information CY74FCT162244
Speed
(ns)
4.1
Ordering Code
Package
Name
Package Type
48-Lead (240-Mil) TSSOP
O48
48-Lead (300-Mil) SSOP
74FCT162244CTPVCT
O48
48-Lead (300-Mil) SSOP
74FCT162244ATPACT
Z48
48-Lead (240-Mil) TSSOP
CY74FCT162244ATPVC
O48
48-Lead (300-Mil) SSOP
74FCT162244ATPVCT
O48
48-Lead (300-Mil) SSOP
CY74FCT162244TPACT
Z48
48-Lead (240-Mil) TSSOP
CY74FCT162244TPVC/PVCT
6.5
Z48
CY74FCT162244CTPVC
4.8
74FCT162244CTPACT
O48
Operating
Range
Industrial
48-Lead (300-Mil) SSOP
Industrial
Industrial
Ordering Information CY74FCT162H244
Speed
(ns)
Ordering Code
Package
Name
Package Type
Operating
Range
4.1
74FCT162H244CTPVC/PVCT
O48
48-Lead (300-Mil) SSOP
Industrial
4.8
74FCT162H244ATPACT
Z48
48-Lead (240-Mil) TSSOP
Industrial
Document #: 38-00396-C
6
CY74FCT16244T
CY74FCT162244T
CY74FCT162H244T
Package Diagrams
48-Lead Shrunk Small Outline Package O48
48-Lead Thin Shrunk SmallOutline Package Z48
7
PACKAGE OPTION ADDENDUM
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24-Aug-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
74FCT162244ATPACT
ACTIVE
TSSOP
DGG
48
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
FCT162244A
74FCT162244ATPVCG4
ACTIVE
SSOP
DL
48
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
FCT162244A
74FCT162244ATPVCT
ACTIVE
SSOP
DL
48
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
FCT162244A
74FCT162244CTPACT
ACTIVE
TSSOP
DGG
48
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
FCT162244C
74FCT162244CTPVCG4
ACTIVE
SSOP
DL
48
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
FCT162244C
74FCT162244CTPVCT
ACTIVE
SSOP
DL
48
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
FCT162244C
74FCT162244ETPACT
OBSOLETE
TSSOP
DGG
48
TBD
Call TI
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-40 to 85
74FCT162244ETPVCT
OBSOLETE
SSOP
DL
48
TBD
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Call TI
-40 to 85
74FCT162244TPACTE4
ACTIVE
TSSOP
DGG
48
TBD
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-40 to 85
74FCT162244TPACTG4
ACTIVE
TSSOP
DGG
48
TBD
Call TI
Call TI
-40 to 85
74FCT162244TPVCG4
ACTIVE
SSOP
DL
48
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
74FCT162244TPVCTG4
ACTIVE
SSOP
DL
48
TBD
Call TI
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-40 to 85
74FCT16244ATPACTE4
ACTIVE
TSSOP
DGG
48
TBD
Call TI
Call TI
-40 to 85
74FCT16244ATPACTG4
ACTIVE
TSSOP
DGG
48
TBD
Call TI
Call TI
-40 to 85
74FCT16244ATPVCG4
ACTIVE
SSOP
DL
48
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
74FCT16244ATPVCTG4
ACTIVE
SSOP
DL
48
TBD
Call TI
Call TI
-40 to 85
74FCT16244CTPACTE4
ACTIVE
TSSOP
DGG
48
TBD
Call TI
Call TI
-40 to 85
74FCT16244CTPACTG4
ACTIVE
TSSOP
DGG
48
TBD
Call TI
Call TI
-40 to 85
74FCT16244CTPVCG4
ACTIVE
SSOP
DL
48
TBD
Call TI
Call TI
-40 to 85
25
25
Addendum-Page 1
FCT162244
FCT16244A
Samples
PACKAGE OPTION ADDENDUM
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Orderable Device
24-Aug-2014
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
TBD
Call TI
Call TI
-40 to 85
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
Device Marking
(4/5)
74FCT16244TPACTE4
ACTIVE
TSSOP
DGG
48
74FCT16244TPACTG4
ACTIVE
TSSOP
DGG
48
74FCT16244TPVCG4
ACTIVE
SSOP
DL
48
TBD
Call TI
Call TI
-40 to 85
74FCT16244TPVCTG4
ACTIVE
SSOP
DL
48
TBD
Call TI
Call TI
-40 to 85
74FCT162H244ATPACT
ACTIVE
TSSOP
DGG
48
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
FCT162H244A
74FCT162H244CTPVC
ACTIVE
SSOP
DL
48
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
FCT162H244C
74FCT162H244CTPVCT
OBSOLETE
SSOP
DL
48
TBD
Call TI
Call TI
-40 to 85
74FCT162H244ETPAC
OBSOLETE
TSSOP
DGG
48
TBD
Call TI
Call TI
-40 to 85
74FCT162H244ETPACT
OBSOLETE
TSSOP
DGG
48
TBD
Call TI
Call TI
-40 to 85
74FCT162H244ETPVC
OBSOLETE
SSOP
DL
48
TBD
Call TI
Call TI
-40 to 85
2000
FCT16244
74FCT162H244ETPVCT
OBSOLETE
SSOP
DL
48
TBD
Call TI
Call TI
-40 to 85
CY74FCT162244ATPVC
ACTIVE
SSOP
DL
48
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
FCT162244A
CY74FCT162244CTPVC
ACTIVE
SSOP
DL
48
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
FCT162244C
CY74FCT162244ETPAC
OBSOLETE
TSSOP
DGG
48
TBD
Call TI
Call TI
-40 to 85
CY74FCT162244ETPVC
OBSOLETE
SSOP
DL
48
TBD
Call TI
Call TI
-40 to 85
CY74FCT162244TPACT
ACTIVE
TSSOP
DGG
48
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
FCT162244
CY74FCT162244TPVC
ACTIVE
SSOP
DL
48
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
FCT162244
CY74FCT162244TPVCT
ACTIVE
SSOP
DL
48
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
FCT162244
CY74FCT16244ATPACT
ACTIVE
TSSOP
DGG
48
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
FCT16244A
CY74FCT16244ATPVC
ACTIVE
SSOP
DL
48
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
FCT16244A
CY74FCT16244CTPACT
ACTIVE
TSSOP
DGG
48
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
FCT16244C
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
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Orderable Device
24-Aug-2014
Status
(1)
Package Type Package Pins Package
Drawing
Qty
CY74FCT16244CTPVC
ACTIVE
SSOP
DL
48
25
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
Device Marking
(4/5)
FCT16244C
CY74FCT16244ETPAC
OBSOLETE
TSSOP
DGG
48
TBD
Call TI
Call TI
-40 to 85
CY74FCT16244ETPACT
OBSOLETE
TSSOP
DGG
48
TBD
Call TI
Call TI
-40 to 85
CY74FCT16244ETPVC
OBSOLETE
SSOP
DL
48
TBD
Call TI
Call TI
-40 to 85
CY74FCT16244ETPVCT
OBSOLETE
SSOP
DL
48
TBD
Call TI
Call TI
-40 to 85
CY74FCT16244TPACT
ACTIVE
TSSOP
DGG
48
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
FCT16244
CY74FCT16244TPVC
ACTIVE
SSOP
DL
48
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
FCT16244
CY74FCT16244TPVCT
ACTIVE
SSOP
DL
48
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
FCT16244
FCT162H244CTPVCTG4
ACTIVE
SSOP
DL
48
TBD
Call TI
Call TI
-40 to 85
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms " Lead-Free " or " Pb-Free " mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines " Green " to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Addendum-Page 3
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
24-Aug-2014
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a " ~ " will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
18-Aug-2014
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
74FCT162244ATPACT
Package Package Pins
Type Drawing
TSSOP
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
DGG
48
2000
330.0
24.4
8.6
15.8
1.8
12.0
24.0
Q1
74FCT162244ATPVCT
SSOP
DL
48
1000
330.0
32.4
11.35
16.2
3.1
16.0
32.0
Q1
74FCT162244CTPACT
TSSOP
DGG
48
2000
330.0
24.4
8.6
15.8
1.8
12.0
24.0
Q1
74FCT162244CTPVCT
SSOP
DL
48
1000
330.0
32.4
11.35
16.2
3.1
16.0
32.0
Q1
74FCT162H244ATPACT
TSSOP
DGG
48
2000
330.0
24.4
8.6
15.8
1.8
12.0
24.0
Q1
CY74FCT162244TPACT
TSSOP
DGG
48
2000
330.0
24.4
8.6
15.8
1.8
12.0
24.0
Q1
CY74FCT162244TPVCT
SSOP
DL
48
1000
330.0
32.4
11.35
16.2
3.1
16.0
32.0
Q1
CY74FCT16244ATPACT
TSSOP
DGG
48
2000
330.0
24.4
8.6
15.8
1.8
12.0
24.0
Q1
CY74FCT16244CTPACT
TSSOP
DGG
48
2000
330.0
24.4
8.6
15.8
1.8
12.0
24.0
Q1
CY74FCT16244TPACT
TSSOP
DGG
48
2000
330.0
24.4
8.6
15.8
1.8
12.0
24.0
Q1
CY74FCT16244TPVCT
SSOP
DL
48
1000
330.0
32.4
11.35
16.2
3.1
16.0
32.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
18-Aug-2014
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
74FCT162244ATPACT
TSSOP
DGG
48
2000
367.0
367.0
45.0
74FCT162244ATPVCT
SSOP
DL
48
1000
367.0
367.0
55.0
74FCT162244CTPACT
TSSOP
DGG
48
2000
367.0
367.0
45.0
74FCT162244CTPVCT
SSOP
DL
48
1000
367.0
367.0
55.0
74FCT162H244ATPACT
TSSOP
DGG
48
2000
367.0
367.0
45.0
CY74FCT162244TPACT
TSSOP
DGG
48
2000
367.0
367.0
45.0
CY74FCT162244TPVCT
SSOP
DL
48
1000
367.0
367.0
55.0
CY74FCT16244ATPACT
TSSOP
DGG
48
2000
367.0
367.0
45.0
CY74FCT16244CTPACT
TSSOP
DGG
48
2000
367.0
367.0
45.0
CY74FCT16244TPACT
TSSOP
DGG
48
2000
367.0
367.0
45.0
CY74FCT16244TPVCT
SSOP
DL
48
1000
367.0
367.0
55.0
Pack Materials-Page 2
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
0,50
48
0,08 M
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
1
0,25
24
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
48
56
64
A MAX
12,60
14,10
17,10
A MIN
12,40
13,90
16,90
DIM
4040078 / F 12/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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