Witam Czy któryś z forumowiczow może posiada wiedze jak z wyświetlacza sharp LQ085Y3DG03A można by zrobić np prosty monitor np na vga, może coś w stylu konwertera/interfejsu vga to paralle 6 bit rgb, bo ten LCD ma taki interfejs, moze jakies gotowe rozwiazania niedrogie, gotowe uklady itp ? Lub moze da sie wykorzystac do tego celu STM32F4? Dodaje dokumentacje do troche innych lcd jakie udalo mi sie znalezc.
E_contents.fm Page 0 Friday, July 20, 2007 3:19 PM
CONTENTS
Advanced Measures for Environmental Conservation as
Management Policy...........................................................
PACKAGES
2
STN CSTN TFT CG Silicon
LCD Modules .......................................................................
CSP (Chip Size Package).....................................................
LGA (Land Grid Array Package) ...........................................
SiP (System in Package) ......................................................
SOF (System On Film) .........................................................
Package Lineup ....................................................................
55
56
57
59
60
8
EL
EL Display Modules.............................................................. 14
LSI REG
CMOS IMAGE SENSORS
CMOS Camera Modules ...................................................... 15
CCDs
Higher-resolution CCDs .......................................................
1/3-type CCDs......................................................................
1/3.8-type CCD ....................................................................
1/4-type CCDs......................................................................
1/3-type CCDs with Dual-power-supply (5 V/12 V)
Operation .............................................................................
CCD Peripheral ICs/LSIs......................................................
16
16
17
17
17
18
LSIs FOR LCDs/ANALOG ICs
For Notebook PCs, PC Monitors and LCD TVs....................
For Mobile Equipment ..........................................................
For Mobile Phones ...............................................................
Peripheral ICs for LSIs for LCDs ..........................................
25
26
27
29
SYSTEM LSIs
Special-function LSIs ........................................................... 31
IPs ........................................................................................ 32
SMART CARD SYSTEMS
Smart Cards/LSI Modules for Smart Cards ......................... 33
Reader/Writer for Smart Cards ............................................ 34
SDK (Software Development Kit) for Smart Cards............... 34
FLASH MEMORIES AND COMBINATION MEMORIES
FLASH MEMORIES .............................................................
SYSTEM-FLASH .................................................................
HIGHLY FUNCTIONAL FLASH MEMORIES
Boot Block Type 3 V Page Mode Flash Memories................
STANDARD FLASH MEMORIES
Boot Block Type 3 V Flash Memories...................................
SYSTEM-FLASH
Fast-Reprogramming System-Flash for Digital Equipment ..
System-Flash for Amusement Products...............................
System-Flash for Automotive Use ........................................
System-Flash for Network Equipment..................................
COMBINATION MEMORIES
Boot Block Type Flash Memory + Pseudo SRAM ................
35
36
38
38
39
39
40
40
41
POWER DEVICES/ANALOG ICs
Low Power-Loss Voltage Regulators....................................
Surface Mount Type Low Power-Loss Voltage Regulators ...
Surface Mount Type Chopper Regulators
(DC-DC Converters).............................................................
Chopper Regulators (DC-DC Converters) ...........................
Power Supply ICs for CCDs/CCD Camera Modules ............
Power Supply ICs for TFT-LCDs...........................................
Fail Safe IC...........................................................................
LED Drivers..........................................................................
Laser Diode Drivers .............................................................
ANALOG ICs
Video Interface ICs for TFT-LCDs.........................................
Power Amplifiers for Wireless LAN.......................................
ICs for Audio Equipment ......................................................
42
44
48
49
50
50
51
51
52
53
53
54
OPTO
OPTOELECTRONICS
Photocoupler Index Tree ....................................................
Photocouplers
Phototransistor Output.......................................................
OPIC Output ......................................................................
Phototriac Coupler Index Tree ...........................................
Phototriac Couplers ..............................................................
Solid State Relay Index Tree ..............................................
Solid State Relays ................................................................
Photointerrupter Index Tree ...............................................
Photointerrupters & lt; Transmissive type & gt; ................................
Single Phototransistor Output............................................
Darlinton Phototransistor Output .......................................
OPIC Output ......................................................................
Photointerrupters & lt; Reflective type & gt; .....................................
Single Phototransistor Output............................................
Darlinton Phototransistor Output .......................................
OPIC Output ......................................................................
Photointerrupters for Specific Applications ...........................
Transmissive Type..............................................................
Reflective Type...................................................................
Phototransistor Index Tree.................................................
Phototransistors....................................................................
Photodiodes/OPIC Light Detectors
PIN Photodiodes...................................................................
PSD (Position Sensitive Detector) ........................................
Blue Sensitive Photodiodes ..................................................
Laser Power Monitoring Photodiodes
for Optical Disc System ........................................................
RGB Color Sensor................................................................
Ambient Light Sensors .........................................................
Infrared Emitting Diode Index Tree....................................
Infrared Emitting Diodes .......................................................
Optical-Electric Sensor Index Tree ....................................
Distance Measuring Sensor Lineup......................................
Wide Angle Sensor Lineup ...................................................
High-Precision Displacement Sensor ...................................
Paper Size Sensor Lineup ....................................................
Dust Sensor Unit Lineup.......................................................
Color Toner Concentration (Deposition Amount) Sensor
Lineup...................................................................................
Distance Measuring Sensors................................................
Wide Angle Sensors .............................................................
Paper Size Sensors ..............................................................
High-Precision Displacement Sensor ...................................
Dust Sensor Units.................................................................
Color Toner Concentration (Deposition Amount) Sensors ....
Fiber Optics Index Tree ......................................................
Fiber Optics Lineup for Audio Equipment .............................
67
68
72
75
76
78
79
82
83
83
85
85
87
87
88
88
89
89
91
92
93
94
94
94
95
95
95
100
101
102
102
102
102
102
102
102
103
104
105
106
106
106
107
107
E_contents.fm Page 1 Friday, July 20, 2007 3:19 PM
Transmission/Reception Devices for MOST Compatible
Optical Fiber.........................................................................
Fiber Optic Transmitters .......................................................
Fiber Optic Receivers...........................................................
Optical Transmission Device ................................................
Optical Reception Device .....................................................
107
108
109
110
110
Two-In-One RF Units ............................................................
Analog Terrestrial RF Front-End Unit....................................
RF Front-End Units...............................................................
1-Segment Digital Terrestrial Module....................................
1-segment/3-segment Digital Terrestrial Module ..................
USB Interface Wireless LAN Module ....................................
127
128
128
129
129
130
LCD
LED
LED
IR DEVICE
131
132
133
134
135
IC
Infrared Data Communication Device Index Tree ............
Infrared Data Communication Devices .................................
Infrared Wireless Audio Transmission Device .......................
IR Detecting Unit for Remote Control Index Tree .............
IR Detecting Units for Remote Control .................................
POWER
LASER
LASER DIODE
Laser Diodes ........................................................................ 120
Switching Power Supplies (Custom)..................................... 137
Switching Power Supply with Integrated High/Low Voltage
Circuit (Custom).................................................................... 137
PCB
PRINTED CIRCUIT BOARD
Advanced Flex Printed Circuit Boards .................................. 138
Flexible Build-up Multilayer PCBs......................................... 139
Flexible Printed Circuit Boards ............................................. 140
RF
RF COMPONENTS
Low Noise Blockdown Converter
Europe: LNB for Broadcasting Satellite ................................
U.S.A.: LNB for FSS Broadcast/(Others: LNB for
Communication) ...................................................................
Japan/Asia/Australia: LNBs for CS Digital Satellite
Broadcast .............................................................................
Japan: LNBs for BS/CS 110° Satellite Broadcast.................
Digital DBS Front-End Units.................................................
QPSK Demodulator Circuit Built-in Type ..............................
8 PSK Demodulator Circuit Built-in Type..............................
Combination Front-End for Digital Terrestrial and Digital
Satellite Broadcasting ..........................................................
Digital Terrestrial Front-End Unit ..........................................
Front-End Units for ISDB-T/DVB-T.......................................
121
121
122
122
123
124
124
UNIT
PICKUP
Slim Combo Drive Pickup ..................................................... 141
Slim DVD-ROM Drive Pickup................................................ 141
DVD Pickup for Automotive Use ........................................... 141
125
126
126
INDEX ................................................................................ 142
Optoelectronics LED /
Laser Diode
119
119
IR
RF Component
IR Device
111
113
115
116
117
117
118
118
118
NOTICE .............................................................................. 143
Device for Optical Discs
High-Luminosity LED Lamps................................................
LED Lamps ..........................................................................
Dichromatic LED Lamps ......................................................
High-Luminosity Chip LEDs .................................................
Chip LEDs ............................................................................
High-Luminosity Dichromatic Type Chip LEDs.....................
Dichromatic Type Chip LEDs................................................
High-Luminosity White Type Chip LEDs...............................
Pastel Color Chip LEDs........................................................
High-Luminosity Dichromatic Type Chip LEDs
(RGB 3-color) .......................................................................
LEDs for Camera Data Back ................................................
Advanced Measures for Environmental Conservation
In accordance with environmental guidelines established under Sharp’s Basic Environmental Philosophy,
the Sharp Group Charter of Corporate Behavior, and the Sharp Code of Conduct, Sharp is pursuing
environmental conservation in all aspects of its business activities. Since fiscal 2004, when the mediumterm brand objective of becoming an environmentally advanced company was first set, Sharp has been
promoting the Super Green Strategy to achieve its corporate vision and to establish sustainable
manufacturing systems.
Basic Environmental Philosophy
Creating an Environmentally Conscious Company with Sincerity and Creativity
The Sharp Group Charter of Corporate Behavior
Contribution to Conservation of the Global Environment
The Sharp Group will fulfill our responsibility for environmental conservation by promoting the creation
of proprietary technologies that contribute to protection of the global environment, and by carrying out
our product development and business activities in an environmentally conscious manner.
The Sharp Code of Conduct
Contribution to Conservation of the Global Environment
1. To Conserve the Environment:
1 We will comply with all applicable environmental laws, regulations
and territorial agreements, and work to practice efficient use and
conservation of resources and energy voluntarily, in the
recognition that environmental conservation is an essential facet
of corporate and individual pursuits.
2 We will ensure proper use and control of chemical substances in
our business activities including research, development and
manufacturing, meeting or exceeding levels determined by laws
and regulations.
3 We will engage in the active acquisition, reporting and promotion
of environmental information at an international level, as the
Sharp Group companies promote communication with
shareholders and local residents.
4 We understand the importance of internal company systems and
related details in acquiring third-party certification and
recertification of our ISO environmental management systems,
and we will conduct our business operations in accordance with
relevant internal guidelines.
2. To Develop Environmentally Conscious
Products and Services, and Conduct Our
Business Operations in an Environmentally
Conscious Manner:
1 We will engage positively in the minimization of resource use,
reduction in the size and weight of products, use of recycled
materials, and the development of long-lasting, energy-saving,
energy-creating products.
2 We will work to compile information related to harmful substances
that might damage the environment or human health, and will not,
as a matter of principle, make use of these harmful substances in
our products, services and business activities.
3 We will use recyclable materials wherever possible, with product
development focused as a matter of policy on structures that are
detachable or capable of dismantling, and suited to recycling.
4 We will work aggressively to reduce greenhouse gas emissions in
the full range of our business activities, in order to contribute to the
prevention of global warming.
5 We will work to conduct our business in such a way to select and
purchase materials that are harmless to the global environment, and
to local residents and employees, for the resources needed for
business activities (equipment, raw materials, subsidiary materials,
tools, etc.).
6 We realize that waste material is a valuable resource, and we will
actively conduct our business operations in such a way as to
maximize the 3Rs (reduce, recycle and reuse) and will contribute to
minimizing the amount of waste sent for permanent landfill disposal.
* The Sharp Group Charter of Corporate Behavior and the Sharp Code of Conduct were instituted in May 2005 as a revised edition of the preceding Sharp
Charter of Conduct (instituted in 2003). The section above is an excerpt from descriptions of Sharp's environmental conservation efforts.
For more information: http://sharp-world.com/corporate/eco/report/index.html
2
as Management Policy
Corporate Vision of Achieving “Zero Global Warming Impact by 2010”
Sharp will limit to the greatest extent possible the amount of the greenhouse gas emissions resulting from its business activities around
the world, while at the same time, significantly help reduce greenhouse gas emissions based on the energy-creating effects of solar
cells and the energy-saving effects of products. The idea is for the amount of greenhouse gas emissions reduced to exceed the
amount emitted by fiscal 2010.
Sharp’s greenhouse gas emissions in fiscal 2006 were approximately 1.73 million t-CO2. At the same time, it is estimated that the solar
cells Sharp produced over the 20 years up to fiscal 2005 generated approximately 1,322 GWh*1 in fiscal 2006. This is equivalent to a
reduction in greenhouse gas emissions of approximately 0.56 million t-CO2*2
*1 Calculation based on 844 MW, Sharp's total solar cell
production over 20 years from 1986 to 2005.
*2 Calculated using a CO2 emission unit of 0.425 kg/kWh (fiscal
2005) at the receiving end, announced by the Federation of
Electric Power Companies of Japan.
Reduce greenhouse gas
emissions from
worldwide business
activities
Boost the level of
reductions in greenhouse
gas emissions from energy
created by solar cells
and energy saved
by products
Super Green Strategies to Become an Environmentally Advanced Company
SGP/D
Super Green Products and Devices
SGP/D
SGT
Super Green Technologies
Creating products and devices with high
environmental performance
Developing unique environmental technologies
that contribute to environmental conservation
SGT
SGR
Super Green Recycling
Recycling used products to promote
resource recycling
SGM
Super Green Management
Enhancing environmental sustainability management
SGR
SGF
SGF
Super Green Factories
Factories with high environmental consciousness
and trust from communities
SGM
3
Becoming an Environmentally Advanced Company—
Developing Super Green Technologies
To achieve Sharp’s corporate vision of becoming a company that has “zero global warming impact by 2010,” the development of
superior environmental technologies is an essential factor in the environmental performance of products and devices and the
reduction of environmental impact during production.
Sharp conducts research and development in four areas of environmental technology: reduction of CO2 emissions, effective use of
resources, elimination of use of harmful
One-of-a-Kind environmental technological development fields
substances, and promotion of health and
that give birth to Super Green Technologies
cleanliness.
Sharp recognizes the most important
e no i m p a c t o n g l o b
s that hav
al w a r
technologies in these areas as one-of-a kind
ologie
m in g
echn
T
environmental technologies-key technologies
CO2 emission reductions
(Energy creation, energy saving)
for achieving global environmental
conservation-and develops them under a
One-of-a-Kind
company-wide development strategy.
Environmental
These technologies enhance environmental
Technologies
Elimination of
performance of products and devices, reduce
Health, cleanliness
harmful substances
environmental impact at plants, and facilitate
Effective use of resources
recycling. Unique technologies, evolving from
(Reduce, reuse, recycle)
these developments, are what Sharp calls
T ec
n
h n ol
a ti o
o gie s
s erv
Super Green Technologies.
th a
t al c o n
n
t c o n t r i b u t e t o e n v ir o n m e
Development of Green Devices and Super Green Devices
Sharp calls its environmentally conscious devices “Green
Devices.” To define criteria for development and design
based on seven concepts such as low energy consumption
and recyclability, Sharp established the Green Device
Guidelines, which it began applying in fiscal 2004. In fiscal
2005, Sharp began certifying Green Devices that attain the
highest possible levels of environmental performance as
“Super Green Devices.”
The development of Green Devices begins at the planning
and designing stage, where every aspect of the product’s
environmental impact is discussed. Sharp then sets specific
objectives based on the Green Device Standard Sheet.
Finally, in the trial manufacture and mass production stages,
Sharp determines how well the actual product has met its
objectives.
In fiscal 2006, both Green Devices and Super Green
Devices exceeded their sales ratio targets. In the coming
years, Sharp plans to raise these figures even higher.
*1 Certification criteria for Green Devices and Super Green Devices in
fiscal 2006: Green Devices had to satisfy at least 90% or more of all
20 assessment items (9 of which are compulsory) listed in the
Environmental Performance Criteria. Super Green Devices will have
to satisfy at least 95% or more the 20 assessment items (10 of
which are compulsory) listed in the Environmental Performance
Criteria. At the same time, they must be either the industry's No.1,
or the industry's first devices in at least one item of the External
Environmental Claim Standards.
4
The Green Device concept
Energy
saving
Reduce total power consumption and reduce power consumed
in standby mode compared to previous models
Recyclability
Use standard plastic or materials that are easy to separate
and disassemble (target: LCD devices)
Resource
saving
Reduce weight or volume compared to previous models
Green
material
Control usage of chemical substances contained in parts and
materials and use no substances prohibited under Sharp standards
Long life
Extend the life of the product with exchangeable parts
and consumables (target: LCD devices)
Packaging
Reduce packaging materials
Information
disclosure
Provide information on chemical substances
Super Green Technologies, Devices and Factories
Achievement of a Super Green Factory
Sharp is systematically acting to enhance the
environmental consciousness of its production
sites worldwide. Sharp has established
proprietary assessment standards to rank
factories with high environmental
consciousness as Green Factories, and those
with extremely high environmental
consciousness as Super Green Factories,
Sharp is planning to convert all its production
sites around the world into Green Factories or
higher by fiscal 2007.
The Green Factory concept
Greenhouse
gases
Minimize emission of
greenhouse gases
Atmosphere,
water, soil
Minimize environmental
burden on the atmosphere,
water and soil
Energy
Minimize energy
consumption
Harmony
with nature
Endeavor to preserve nature
both on and off site
Waste
Minimize discharge of waste
Harmony with
the community
Encourage harmony
with the local community
Resources
Minimize resource
consumption
Environmental
consciousness
High environmental awareness
among employees
Chemical
substances
Minimize risk of environmental
pollution and accidents caused by
chemical substances
Information
disclosure
Disclose information on
the environment
Certification of Green Factories and Super Green Factories
Quantified environmental performance criteria
are used to assess and approve a plant for
certification. A plant must score 70 or more
points out of a possible 100 in the assessment
process to earn Green Factory certification,
while scoring 90 or more points will result in
Super Green Factory certification.
Plans call for turning all Sharp Corporation
production sites in Japan into Super Green
Factories and all production sites in the Sharp
Group to Green Factories or higher by the end
of fiscal 2007.
In fiscal 2006, three domestic bases and two
overseas bases achieved Super Green Factory
status, while a total of 10 bases in Japan and
overseas earned Green Factory certification.
Process required to achieve Super Green Factories
Existing factories
New factories
Green Factory Concept
Approach based on environmental
impact assessments
The plant's environmental performance is
assessed from an objective third-party point of
view and performance is defined for each item
based on the assessment results
Assessments based on 21 quantified environmental performance criteria
90 points or more
Super Green Factory
90 points or more
Super Green Factory
70 points or more
Green Factory
5
From “Green” Factories to “Super Green” Factories
Sharp’s First Super Green Factory Kameyama Plant
AVC Liquid Crystal Display Group (Kameyama, Mie Prefecture)
The Kameyama Plant is Sharp's first “Super Green Factory”, a compilation of the company's environmental protection technologies.
In preparing for construction, we gave a great deal of careful consideration to protecting the environment, beginning at the initial design stage. Working in consultation with
local governments and with nearby residents, we carefully selected the parameters that would be subject to environmental protection measures. We chose the standards that
would apply, and confirmed them through evaluation by independent experts.
Also, when building the Kameyama Plant No. 2, we took the opportunity to introduce the latest environmental technology to make it one of the world’s most advanced “Super
Green” factories.
The Kameyama Plant Receives Japan Sustainable Management Award
The Kameyama Plant in Japan was recognized for its outstanding environmental sustainability
management by being chosen from among 125 applicants for the highest honor, the
Sustainable Management Pearl Award, in the 2004 Japan Sustainable Management Awards*
(sponsored by the Japan Sustainable Management Awards Committee and Mie Prefecture).
This award shows the high esteem for the environmental measures—including 100% recycling
of manufacturing process wastewater, the introduction of an LNG cogeneration system and
the installation of a photovoltaic power system—taken by the Kameyama Plant, Sharp’s first
Super Green Factory.
The Kameyama Plant received the first Minister of Economy, Trade and Industry Award in the
8th Japan Water Prize (2006) and the Energy Saving Encouraging Prize in the 4th Excellent
Cogeneration System Commendation (FY 2005) sponsored by the Japan Cogeneration Center.
* The Japan Sustainable Management Awards honor all organizations across the nation, no matter
what their size or type of business—including private companies, NPOs and schools—that
demonstrate outstanding results of their environmental sustainability management efforts.
An Efficient and Environment-Friendly Integrated Production System
The entire process is carried out in a single plant—from fabricating the LCD panels to final
assembly. This system makes it possible to consolidate technical departments and
strengthen our development capabilities, as well as shorten the lead-time from order to
shipping. Eliminating the need to ship sub-assemblies between distant plants has also
enabled us to slash the amount of packaging materials required for shipping and reduce
emissions such as carbon dioxide (CO2).
Countering Global Warming by Unifying Diverse Power Sources Distributed over a Wide
Area
The Kameyama plant generates one-third of its annual electricity consumption and has
reduced CO2 emissions to about 40% lower than previous levels by means of a cogeneration
system* using liquefied natural gas (LNG) (approx. 26,400 kW), as well as one of the largest
fuel cell systems in Japan (approx. 1,000 kW), and one of the world’s largest photovoltaic
(PV) power generation systems (5,210 kW).
* Cogeneration system: A system designed to save energy by using city gas to generate
electricity. The waste heat generated is then used in applications such as air conditioning, hot
water supply and steam electricity generation.
Creating Energy at the Factory for Energy-Saving Products, Using One of the World’s
Largest* PV Power Generation Systems
In addition to the existing 60-kW photovoltaic (PV) power generation system, new PV power
generation systems, in a total area of approx. 47,000 m2 and with a total output of 5,150 kW,
have been installed. Located at the large-screen LCD TV factory, the distribution building,
and on the roof and curtain wall of the Kameyama Plant No. 2, these systems generate an
annual electricity output that would power 1,300 average Japanese households.
* As a building-installed system. Survey by Sharp.
Water Purifying System—100% Water Recycling in the Production Process
The plant collects all the wastewater from the production process of liquid crystal panels, etc.
(max. 28,300 tons a day) and recycles it 100% with water purification techniques using
microorganism treatment. Malodorous wastewater containing chemicals is deodorized using
peat moss* from Ishikari River, Hokkaido.
* Bog moss decomposed and piled up for several thousands of years.
Mie Plant Becomes First Existing Factory to Achieve Super Green Status
Mobile Liquid Crystal Display Groups
(Taki, Mie Prefecture)
The results described above are major efforts in upgrading to a Super Green Factory.
Fluoric Acid Effluent Recycling System Honored at 2004 WASTEC Award
The Mie Plant No. 3 uses fluoric acid in its continuous grain silicon production process.
The plant developed this system and has been using it since 2004 to recover and recycle
the fluoric acid effluent. This system was recognized for its excellence and won the
Business Activity Category Prize at the 2004 WASTEC (Waste Control and Recycling
Technology Exhibition) Awards in Japan in November 2004. Prior to the introduction of this
system, the fluoric acid from the effluent was used to make cement. Now it can be used
repeatedly at the production site, while the distilled water from the effluent can be used as
pure water.
Waste Reduction Efforts
In 2004, we achieved zero discharge to landfill, eliminating waste by recycling all possible
waste materials. Efforts are being made to further reduce emission of waste products by
expanding the sale of valuable materials for reuse.
Energy-Saving Efforts
Since its completion, the Mie Plant has been strongly focused on energy conservation. In
fiscal 2006 our efforts were recognized with an Agency for Natural Resources and Energy
Director-General Prize for energy-efficient plant management. In addition, three members of
the Mie Environmental Safety Promotion Center, who have been engaged in energy-saving
efforts for many years, received prizes in recognition of their achievements in energy
management. These awards are a testament to Sharp’s energy management and energysaving efforts.
CO2 Emissions Reduced through PV Power System Installation
The Mie Plant No. 3 installed a 180-kW photovoltaic power system on its south exterior
wall. The system began generating electricity in March 2005. Used mainly to provide
lighting for all non-manufacturing rooms, the system generated 141,000 kWh of power in
2006 and contributed to the reduction of about 60 tons of CO2 emissions.
6
Participation in Environmental Education Programs at Local Schools
As part of our community outreach program, we have been cooperating with eight local
schools in the town of Taki (one senior high, two junior high, and five elementary schools) on
various educational projects, including factory tours, classes taught by visiting lecturers, and
joint environmental activities.
Participation in Local Environmental Activities
The Mie Plant is actively involved in mitigating the impact of the plant on the surrounding
environment, and is also engaged in local environmental preservation activities focused on the
area’s mountains, rivers, and roads. We have received acclaim from local people for our
participation in these activities, including the upkeep of the local forest as a water source, the
maintenance of the neighboring forests and mountains, the cleaning of the Sanagawa River as
the plant’s effluent stream, and the planting of flowers on National Route 42.
Green Factory Activities at Key Electronic Device Factories
Advanced Development and Planning Center/
Corporate Research and Development Group
(Tenri, Nara Prefecture)
ISO 14001 certification: December 3, 1996
Adoption of a cogeneration system*
About 26% of facility power is provided through private power generation. Waste heat is
used for heating or cooling and also supplied to a steam generator for power generation.
This cuts facility CO2 emissions by about 13%.
Municipal gas is supplied by pipeline, so there is no discharge of CO2, nitrogen oxides or
other pollutants from truck transport.
* An energy saving system that generates power using municipal gas and uses the produced
waste heat for heating or cooling, hot water supply and steam electricity generation, etc.
Installation of a solar generation system
Installation of solar panels with a generating capacity of 40 kW.
Relations with the local community
As the only Sharp establishment that has an ancient burial mound on its grounds, the center’s
employees are actively involved in the maintenance of the mound. In August of each year, the
center invites employees and their families and local people to a “Sharp Festa.” An environmental
exhibition space is prepared to showcase the environmental activities of the center.
Waste fluid processing system based on natural purification*
Waste and the pollution load of released water are reduced by using a waste fluid treatment
system for waste water containing alcohol or other organic components.
After treatment, water is given further high-level treatment and used as intermediate factory
water, to ensure more effective use of water resources.
* A natural purification system based on micro-organisms, developed independently by Sharp.
(Patented)
Promotion of zero emissions*
Zero emissions were achieved in 2002 through reclamation of waste into useful resources
for other business fields. Efforts will continue to further reduce waste emissions.
LSI Group
(Fukuyama, Hiroshima
Prefecture)
ISO 14001 certification: September 24, 1996
Inauguration of a non-dilution nitrogen treatment plant
The Group built a new plant that uses the world’s first non-dilution treatment technology on
the nitrogen contained in semiconductor plant wastewater. The technology combines
“micro-nanobubble technology” with a unique microorganism treatment technology Sharp
developed in June 2005. Operation of the plant began in July 2006.
Promotion of zero emissions*
Zero emissions were achieved in 2001 through ongoing efforts such as in-house treatment
of developing fluid by means of our own micro-organism treatment technology, reduction of
the volume of process sludge produced, and recycling of waste into useful material.
Prevention of global warming
An energy conservation committee has been formed to promote energy conservation
efforts involving the entire Group. Efforts such as building a unique energy-saving outer air
treatment system have been highly regarded, and the Group received a “2005 Excellent
Energy Conservation Factory & Building (electricity category)” award from the Directorgeneral of the Agency for Natural Resources and Energy.
Relations with the local community
In August of each year, employees and their families and local people are invited to the
“Family Day in Sharp (Summer Festival).” At this festival, an environmental exhibition space is
prepared to provide an opportunity for people to experience nature and to introduce the
environmental protection efforts of the facility.
The plant also implemented the semiconductor industry's first full-scale risk communication
(July 2005), and in cooperation with the local community, jointly produced a large communication
panel (4 m x 6 m) called “Daimoncho—Yesterday and Today.” The panel is on display at our
premises and is being used to introduce our business and Daimoncho to visitors.
Communication activities such as these have been highly evaluated, and the Group received
the “2005 PRTR Prize” sponsored by the Center for Environmental Information Science.
Solar Systems Group
Electronic Components Group
(Katsuragi, Nara Prefecture)
ISO 14001 certification: June 25, 1996
Prevention of water pollution
All waste water from production processes and laboratories is purified at a waste
water treatment station within the factory. Water is released into the sewer only after
treatment based on voluntary standards stricter than environmental standards.
Prevention of air pollution
Waste gases from acids and organic solvents produced by production processes and
laboratories are purified with two types of waste gas treatment equipment, depending on
the properties of the chemical substances. Eight acid scrubbers and 11 solvent scrubbers
are installed on the roof of the Katsuragi Plant, and these keep atmospheric emissions of
chemical substances below 1/10th of regulatory levels.
Promotion of zero emissions*
In 2001, the factory achieved zero emissions through recycling of all materials. It is now
working to reduce waste volume with the goal of a final disposal rate of 0.2%.
Installation of solar generation system
In 2003, solar panels were installed at the solar park on the roof of the No. 3 Plant and
on the employee recreation building. At present the solar generation system has a
total capacity of 194.5 kW, and this electricity is used for tasks such as air
conditioning.
Relations with the local community
In October of each year, the factory holds a “Katsuragi Festa” to improve relations with the
local community and showcase the site's environmental activities.
From a Green Factory to a Super Green Factory
With the aim of becoming a Super Green Factory in 2007, the site is working to reduce
emissions of harmful chemical substances used in processes and to recycle cleaning
water used in production.
Electronic Components Group
Mihara Plant
(Mihara, Hiroshima Prefecture)
ISO 14001 certification: November 17, 2003
Prevention of global warming
The precise air-conditioning necessary for production activities is maintained by
operating coolers and boilers on municipal gas, which produces little CO2.
The turbo coolers provided in air-conditioning equipment use a waste heat recovery
system. A remover optimized for greenhouse gases is provided to suppress emission
of such gases and prevent global warming.
Promotion of zero emissions*
Zero waste emission has been achieved through active efforts to reduce and reclaim
waste, instituted from the beginning of the facility.
Efforts to prevent pollution
After treatment at an in-house facility, all process waste water is discharged into the
public sewer only after clearing voluntary standards stricter than waste water
standards. Sludge produced in waste water treatment is sorted by type and
reclaimed.
Measures are taken such as installing equipment indoors to prevent noise escaping
to the surrounding area from noisy equipment, such as large fans and large
compressors. Noise levels at the site boundary are within regulation values.
The plant is working to improve management of chemical substances, prevent
accidents and environmental disasters, and reduce environmental impact.
Efforts to contribute to the local community
Through efforts such as inviting local people to festivals and activities to protect forests, the
plant aims to deepen relations with people in the local area and protect the environment.
Efforts are being made to beautify the area by participating in greenification activities in the
Mihara Western Industrial District where this facility is located.
Efforts are being made to issue a pamphlet introducing the facility and to disclose
information. The pamphlet contains environmental activity records and other information.
* Sharp defines this as bringing the amount of buried waste (final disposal amount) as close to zero as to be negligible.
In figures, a final disposal rate of less than 0.5% (final disposal rate = buried amount / total discharged amount x 100) is taken to be zero emissions.
7
Device_E.book Page 8 Wednesday, July 18, 2007 1:03 PM
STN/CSTN/TFT/CG Silicon
LCD MODULES
✩New product/Under development
■ LCD Modules
& lt; For industrial appliances & gt; (1)
Display
size
Model No.
28.3′′
(72cm)
LQ283G1TW11
28.1′′
(71cm)
LQ281L1LW11
✩LQ281L1LW14
Number of
pixels (dot)
H×V
Pixel
pitch
(mm)
H×V
Display
colors
Power
LumiInput video connance
signal
sumption
(cd/m2)
(W)
2 560 × RGB 0.219 ×
× 2 048
0.219
16.77 M
225
4ch TMDS
2 048 × RGB 0.246 ×
× 2 048
0.246
16.77 M
225
4ch LVDS
1 600 × RGB 0.294 ×
0.294
× 1 200
16.77 M
103.2
96.0
TBD
Outline
dimensions
(mm)
W×H×D
Weight (g) Backlight
640.0 × 530.0
Max. 15 000 18CCFT Built-in inverter
× 60.0
594.0 × 594.0
× 83.0
15 000
18CCFT Built-in inverter
Built-in inverter
LQ231U1LW01
23.1′′
(59cm)
20.1′′
(51cm)
19.0′′
(48cm)
LQ231U1LW21
LQ201U1LW11Z
LQ201U1LW21
LQ190E1LW01
LQ190E1LW41
1 600 × XYZ
256 (gray
× 1 200
0.255 × scales)
1 600 × RGB 0.255
16.77 M
× 1 200
1 280 × RGB 0.294 ×
0.294
× 1 024
250
LDI
54.9
530.0 × 432.8
× 32.5
700
2ch LVDS
8 bit XYZ
32.9
436.0 × 335.0
× 27.5
Max. 3 800
250
2ch LVDS
8 bit RGB
33.8
432.0 × 331.5
× 25.0
3 200
25.5
404.2 × 330.0
× 20.0
Max. 2 800 4CCFT
38.3
404.2 × 330.0
× 22.0
Max. 3 200 6CCFT
331.6 × 254.76
× 12.5
300
16.77 M
450
2ch LVDS
8 bit RGB
LQ150X1LGB1
600
16.0
LQ150X1LGN2A
15.0′′
(38cm)
260
9.8
LQ150X1LGN2E
350
LQ150X1LW71N
1 024 × RGB 0.297 ×
× 768
0.297
16 M
250
LVDS 6 bit
+
2FRC RGB
10.4
18.1
LQ150X1LW72
350
✩LQ150X1LGB2
(200)
LQ121S1DG41
370
LQ121S1DG61
TFT
Remarks
450
TBD
6CCFT
1 200±50
4CCFT
Max. 1 100 2CCFT
Max. 1 300
4CCFT
Max. 1 350
Advanced Super View
LCD
(331.6 × 254.76
(Max. 1 400) 2CCFT VeilView
× 16.0)
Max. 660
370
LQ121S1LG61
331.6 × 254.76
× 12.5
Digital 6 bit
RGB
8.3
LQ121S1LG41
326.0 × 252.0
× 11.5
Max. 5 500 6CCFT Expanded backlight
brightness adjustment
area
276.0 × 209.0
× 11.0
450
Max. 800
Strong LCD2
Max. 660
2CCFT
12.1′′
(31cm)
800 × RGB 0.3075 ×
× 600
0.3075
Max. 800
260 k
(450)
LQ121S1LW01
250
✩LQ121S7LY01
(300)
LQ104S1DG31
✩LQ104S1DG61
LQ104S1LG21
800 × RGB
× 600
0.264 ×
0.264
(Max. 800) 2CCFT
Super Mobile LCD
420
276.0 × 216.0
× 16.0
246.5 × 179.4
× 15.5
Max. 620
6.6
243.0 × 183.8
× 11.5
Max. 600
(6.3)
Digital 6 bit
RGB
246.5 × 179.4
× 13.7
260 k
✩LQ104S1LG31
350
✩LQ104S1LG61
420
(Max. 900) 4CCFT
Strong LCD2
Max. 620
6.6
350
LVDS 6 bit
RGB
Advanced Super View
LCD
Max. 800
6.5
350
8
276.0 × 209.0
× 11.0
Low reflection LCD
module
(1 200)
15.5
LQ104S1DG21
10.4′′
(26cm)
276.0 × 209.0
× 14.5
(200)
✩LQ121S7LY11
LVDS 6 bit
RGB
(8.3)
8.5
✩LQ121S1LG64
Strong LCD2
246.5 × 179.4
× 15.5
(6.6)
243.0 × 183.8
× 11.5
(600)
(6.3)
246.5 × 179.4
× 13.7
Max. 620
2CCFT
Strong LCD2
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment
using any SHARP devices shown in catalogs, data books, etc. The models listed on this page are lead-free solder compatible. For details,
please inquire with SHARP. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Device_E.book Page 9 Wednesday, July 18, 2007 1:03 PM
LCD MODULES
✩New product/Under development
& lt; For industrial appliances & gt; (2)
Model No.
Number of
pixels (dot)
H×V
Pixel
pitch
(mm)
H×V
Display
colors
Power
LumiInput video connance
signal
sumption
(cd/m2)
(W)
LQ104V1DG21
350
LQ104V1DG51
TFT
10.4′′
(26cm)
LQ104V1DG61
✩LQ104V1DG64
Digital 6 bit
RGB
640 × RGB
× 480
0.330 ×
0.330
450
LVDS 6 bit
RGB
380
LQ104V1DW02
8.9′′
(22cm)
LM089HB1T04
✩LQ085Y3DG03
TFT
8.5′′
✩LQ085Y3DG04
(22cm)
640 × 240
800 × RGB
× 480
LM085YB1T01
8.4′′
TFT
(21cm)
800 × RGB
× 600
✩LQ084S3LG01
✩LQ084V3DG01
LQ084V1DG21
STN
0.231 ×
0.231
8.1′′
(21cm)
LM081HB1T01B
7.7′′
(20cm)
LM077VS1T01
7.5′′
✩LQ075V3DG01
(19cm)
800 × RGB
× 600
640 × RGB
× 480
260 k
TFT
LQ064V3DG04
✩LQ057V3DG01
5.7′′
(14cm)
LQ057Q3DC12
STN
TFT
LQ050Q5DR01
LM050QC1T01
4.6′′
(12cm)
LM046QB1S02
3.8′′
(10cm)
LQ038Q3DC01
3.5′′
✩LQ035Q3DG01
(9cm)
2.3
Digital 6 bit
RGB
TBD
Strong LCD2
Max. 620
0.270 ×
0.270
0.267 ×
0.270
Low reflection LCD
module
Advanced Super View
LCD
222.7 × 135.4
× 12.5
TBD
(212.0 × 134.0
× 12.5)
TBD
Wide
Wide
Wide
1CCFT
200
8 bit parallel
2.4
222.7 × 134.0
× 68.5
300
260 k
0.213 ×
0.213
2CCFT
320
350
Digital 6 bit
RGB
3.7
199.5 × 149.5
× 11.6
Max. 405
16 M
(400)
LVDS 6 bit
+
2FRC RGB
TBD
199.5 × 149.5
× 12.05
TBD
5.5
216.0 × 152.4
× 12.0
Max. 430
260
400
260 k
300
Digital 6 bit
RGB
1.6
249.0 × 99.4
× 8.5
0.246 ×
0.246
–
(C-STN)
150
8 bit parallel
2.5
195.2 × 137.5
× 8.0
0.237 ×
0.237
260 k
400
640 × RGB
× 480
0.204 ×
0.204
260 k
640 × RGB
× 480
0.180 ×
0.180
320 × RGB
× 240
0.360 ×
0.360
640 × RGB
× 480
Max. 620
258.8 × 109.8
× 10.0
4 bit parallel
2CCFT
Strong LCD2
1CCFT
2CCFT
TBD
Digital 6 bit
RGB
5.7
179.0 × 139.5
× 12.7
Digital 6 bit
RGB
4.7
161.3 × 117.0
× 12.0
Max. 280
TBD
144.0 × 104.6
× 12.3
TBD
3.9
144.0 × 104.6
× 13.0
Max. 240
4 bit parallel
1.2
166.0 × 109.0
× 7.5
160
1CCFT Strong LCD2
350
320 × 240
5.0′′
(13cm)
246.5 × 179.4
× 15.5
150
LM32019P
TFT
246.5 × 179.4
× 13.7
Remarks
Max. 700
(246.5 × 179.4
Max. 1 000
× 17.2)
0.300 × Black and
0.300
white
640 × 240
LM32019T
STN
(Min.
130)
(250)
LQ064V3DG01
6.4′′
(16cm)
8 bit parallel
6.3
Digital 6 bit
RGB
250
246.5 × 179.4
× 15.5
Weight (g) Backlight
Black and
white
800 × 480
✩LQ084S3DG01
STN
0.330 × Blue and
0.330
white
265.0 × 195.0
× 11.5
246.5 × 179.4
× 13.7
260 k
LQ104V1LG61
STN
6.4
Outline
dimensions
(mm)
W×H×D
LCD
Display
size
320 × RGB
× 240
320 × 240
290
(430)
260 k
500
Digital 6 bit
RGB
2CCFT Best viewing angle:
3 o’clock direction
Ideal for vertical use
Strong LCD2
Blue and
white
70
Black and
white
100
0.3165 ×
0.3115
260 k
380
Digital 6 bit
RGB
4.2
119.4 × 89.1
× 12.7
Max. 170
0.315 ×
0.315
–
(C-STN)
100
8 bit parallel
1.7
134.0 × 100.0
× 8.5
145
0.295 × Black and
0.295
white
100
4 bit parallel
0.9
134.0 × 100.0
× 8.5
140
1CCFT
0.7
90.6 × 79.9
× 9.9
Max. 105
LED
LED backlight
TBD
76.9 × 63.9
× TBD
TBD
LED
LED backlight
0.36 ×
0.36
0.240 ×
320 × RGB 0.240
× 240
0.2205 ×
0.2205
240
260 k
TBD
Digital 6 bit
RGB
1CCFT
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment
using any SHARP devices shown in catalogs, data books, etc. The models listed on this page are lead-free solder compatible. For details,
please inquire with SHARP. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
9
Device_E.book Page 10 Wednesday, July 18, 2007 1:03 PM
TFT
LCD MODULES
✩New product
★Under development
& lt; For Information display & gt;
Display
size
(cm)
[ ′′ ]
Model No.
Number
of
pixels*1
Dot format
H×V
(dot)
Outline
Active area Number
dimensions*2
Video interface
H×V
of colors
Backlight
(Input video signal)
W × H × D (TYP.)
(mm)
(color)
(mm)
LK645D3LZ2U
1 080 × 1 920 803.52 ×
× RGB
1 428.48
907.0 × 1 555.3
× 100.0
LK645D3LZ29
1 920 × RGB 1 428.48 ×
× 1 080
803.52
1 555.3 × 907.0
× 100.0
163.8
[65]
2 073 600
TFT
Built-in
16.77M
132.1
[52]
LK520D3LZ19
1 920 × RGB 1 152.0 ×
× 1 080
648.0
1 219.0 × 706.7
× 69.8
116.8
[46]
LK460D3LZ19
1 920 × RGB 1 018.0 ×
× 1 080
573.0
LVDS*3
(8-bit digital)
1 083.0 × 627.0
× 65.7
Remarks
Portrait
Advanced Super View LCD
High luminance: 450cd/m2
Wide viewing angle:
L/R 176°/ U/D 176°
High contrast: 2 000:1
High-speed response [G to G]:
6ms (Ave.)
Advanced Super View LCD
High luminance: 450cd/m2
Wide viewing angle:
L/R 176°/ U/D 176°
High contrast: 2 000:1
High-speed response [G to G]:
6ms (Ave.)
Advanced Super View LCD
High luminance: 450cd/m2
Wide viewing angle:
L/R 176°/ U/D 176°
High contrast: 1 800:1
High-speed response [G to G]:
6ms (Ave.)
Advanced Super View LCD
High luminance: 450cd/m2
Wide viewing angle:
L/R 176°/ U/D 176°
High contrast: 1 800:1
High-speed response [G to G]:
6ms (Ave.)
*1 Pixel means a set of each RGB dot.
*2 Excluding FPC for connection and other excessing parts.
*3 LVDS: Low Voltage Differential Signaling
(Note) Please note that the specifications are subject to change without prior notice for production improvement.
& lt; For LCD TV & gt;
Display
size
(cm)
[ ′′ ]
132.1
[52]
Model No.
LK520D3LZxx
Number
of
pixels*1
2 073 600
Dot format
H×V
(dot)
1 920 × RGB
× 1 080
Outline
Active area Number
dimensions*2
Video interface
H×V
of colors
Backlight
(Input video signal)
W × H × D (TYP.)
(mm)
(color)
(mm)
1 152 ×
648
(1 219 × 706.7
× 69.8)
Built-in
16.77M
TFT
116.8
[46]
LK460D3LZxx
2 073 600
1 920 × RGB
× 1 080
1 018 ×
573
(1 083 × 627
× 65.7)
LVDS*3
(8-bit digital)
Remarks
Advanced Super View LCD
High luminance: 450cd/m2
Wide viewing angle:
L/R 176°/ U/D 176°
High contrast: (1 500:1)
120Hz drive compatible
Advanced Super View LCD
High luminance: 500cd/m2
Wide viewing angle:
L/R 176°/ U/D 176°
High contrast: (1 500:1)
120Hz drive compatible
*1 Pixel means a set of each RGB dot.
*2 Excluding FPC for connection and other excessing parts.
*3 LVDS: Low Voltage Differential Signaling
(Note) Please note that the specifications are subject to change without prior notice for production improvement.
10
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment
using any SHARP devices shown in catalogs, data books, etc. The models listed on this page are lead-free solder compatible. For details,
please inquire with SHARP. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Device_E.book Page 11 Wednesday, July 18, 2007 1:03 PM
LCD MODULES
✩New product
★Under development
Display
size
(cm)
[ ′′ ]
Model No.
Dot format
H×V
(dot)
Pixel
pitch
H×V
(mm)
Active
Input
area
signal
H×V
system
(mm)
Input
video
signal
Power
Outline
LumiWeight
Back- nance consump- dimensions*10
(g)
2) tion (mW)
W×H×D
light (cd/m
(TYP.)
(TYP.)
(TYP.)
(mm) (TYP.)
7.8
[3.1]
LQ031B5DG01
270 × RGB 0.273 ×
× 96*1
0.273
73.7 ×
26.2
6-bit
digital
RGB
8.3
[3.3]
LQ033B5DG02
160 × RGB 0.351 ×
× 176*2
0.349
56.2 ×
61.4
6-bit
digital
RGB
6-bit
digital
Built-in
1CCFT
290
1 800
73 × 78.3
× 12.5
8.9
[3.5]
★LQ035Q5DG02
320 × RGB 0.222 ×
× 240*3
0.222
71.0 ×
53.3
6-bit
digital
RGB
6-bit
digital
Built-in
LED
500
TBD
86.4 × 84
× 6.7
15
[6.1]
✩LQ061T5GG01
500
3 200
149 × 82.9
× 7.2
400
3 300
155 × 89.2
× 8.8
TFT
16
[6.5]
6-bit
digital
Built-in
LED
350
700
85.4 × 38.8
× 8.65
TFT
480 × RGB 0.284 × 136.1 × NTSC/ specific Built-in
× 234*4
0.308
72.0 PAL*11 analog 1CCFT
RGB*12
TFT
400 × RGB 0.359 × 143.4 × NTSC/ specific Built-in
LQ065T5GG61
5
11 analog 1CCFT
× 234*
0.339
79.3 PAL*
RGB*12
6-bit
400 × RGB 0.359 × 143.4 ×
✩LQ065T5DG02
digital
× 240*6
0.331
79.3
RGB
6-bit
digital
Built-in
1CCFT
620
4 100
155 × 89.2
× 9.1
6-bit
400 × RGB 0.359 × 143.4 ×
digital
0.331
79.3
× 240*6
RGB
6-bit
digital
Built-in
1CCFT
250
5 200
155 × 89.2
× 12.5
✩LQ065T9DZ03
LCD
& lt; For automotive applications & gt; (1)
● LQ065T9DZ03/LQ088H9DZ03: operating temperature (panel surface temperature) –40 to +85°C /
storage temperature –40 to +95°C
● LQ070Y5DG06/LQ080Y5DG03: operating temperature (panel surface temperature) –30 to 85°C /
storage temperature –40 to 95°C
● Other models: operating temperature (panel surface temperature) –30 to 85°C / storage temperature –40 to +85°C
Remarks
" Compact LCD " suitable
for display in meter, Wide
screen (8 : 3), LED back44
light, 260K-color display,
Wide viewing angle,
RoHS compliant
" Compact LCD " suitable
for display in meter, Highspeed response (low tem90
perature), 260K-color display, Wide viewing angle,
RoHS compliant
" Compact LCD " suitable
for display in meter, LED
backlight, High luminance, Thin, High-speed
TBD
response (low temperature), 260K-color display,
Wide viewing angle,
RoHS compliant
Wide QVGA (17:9), Thin,
160 High luminance,
(Max.) Wide viewing angle,
RoHS compliant
Wide QVGA (16:9), Thin,
175
Wide viewing angle,
(Max.)
RoHS compliant
Wide QVGA (16:9), Digital
I/F, 260K-color display,
170 High luminance,
Wide viewing angle,
RoHS compliant
" Super Mobile LCD " with
high visibility under bright
ambient light, Wide QVGA
205
(16:9), Wide viewing
(Max.)
angle, Gray-scale inversion free, 260K-color display, RoHS compliant
*1 Number of pixels: 25 920
*2 Number of pixels: 28 160
*3 Number of pixels: 76 800
*4 Number of pixels: 112 320
*5 Number of pixels: 93 600
*6 Number of pixels: 96 000
*7 Number of pixels: 384 000
*8 Number of pixels: 115 200
*9 Number of pixels: 153 600
*10 Excluding FPC for connection and other protruding parts.
*11 MBK-PAL system is adopted as PAL. The LCD panel has 234 (240) scanning lines, and displays a picture of 273 (274) virtual scanning lines.
*12 Video interface: External (Device specific external video interface IC is available.)
(Note) Please refer to the latest relevant specificaiont sheets before using these devices.
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment
using any SHARP devices shown in catalogs, data books, etc. The models listed on this page are lead-free solder compatible. For details,
please inquire with SHARP. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
11
Device_E.book Page 12 Wednesday, July 18, 2007 1:03 PM
TFT
LCD MODULES
✩New product
★Under development
& lt; For automotive applications & gt; (2)
● LQ065T9DZ03/LQ088H9DZ03: operating temperature (panel surface temperature) –40 to +85°C /
storage temperature –40 to +95°C
● LQ070Y5DG06/LQ080Y5DG03: operating temperature (panel surface temperature) –30 to 85°C /
storage temperature –40 to 95°C
● Other models: operating temperature (panel surface temperature) –30 to 85°C / storage temperature –40 to +85°C
Display
size
(cm)
[ ′′ ]
Model No.
Dot format
H×V
(dot)
Pixel
pitch
H×V
(mm)
Active
Input
area
signal
H×V
system
(mm)
Input
video
signal
Power
Outline
LumiWeight
Back- nance consump- dimensions*10
(g)
2) tion (mW)
W×H×D
light (cd/m
(TYP.)
(TYP.)
(TYP.)
(mm) (TYP.)
TFT
specific Built-in
analog 1CCFT
RGB*12
LQ070T5GG21
480 × RGB 0.326 × 156.2 × NTSC/
0.352
82.4 PAL*11
× 234*4
★LQ070T5DR05
6-bit
480 × RGB 0.321 × 154.1 ×
digital
× 240*8
0.363
87.0
RGB
6-bit
digital
LQ070Y5DG05
6-bit
800 × RGB 0.195 × 156.0 ×
digital
× 480*7 0.1725
82.8
RGB
★LQ070Y5DG06
500
3 500
Built-in
2CCFT
400
5 100
6-bit
digital
Built-in
1CCFT
460
3 600
6-bit
800 × RGB 0.191 × 152.4 ×
digital
0.191
91.4
× 480*7
RGB
6-bit
digital
Built-in
LED
430*
TBD
LQ070Y5DE02
6-bit
800 × RGB 0.195 × 156.0 ×
digital
82.8
× 480*7 0.1725
RGB
6-bit
digital
Built-in
LED
320*
5 250
★LQ080Y5DG03
6-bit
800 × RGB 0.2175 × 174.0 ×
digital
× 480*7 0.2175 104.4
RGB
6-bit
digital
Built-in
LED
430*
TBD
✩LQ080Y5DG04
6-bit
800 × RGB 0.2175 × 174.0 ×
digital
× 480*7 0.2175 104.4
RGB
6-bit
digital
Built-in
2CCFT
625
5 900
★LQ080Y5CGXX
800 × RGB 0.222 × 177.6 ×
× 480*7
0.207
99.4
NTSC/
PAL/
Built-in
Composite
PAL
1CCFT
(60)
400
10 400
✩LQ088H9DZ03
6-bit
640 × RGB 0.327 × 209.3 ×
digital
× 240*9
0.327
78.5
RGB
250
7 100
18
[7]
TFT
20
[8]
22
[8.8]
6-bit
digital
Built-in
2CCFT
Remarks
Wide QVGA (17:9), Thin,
195 High luminance,
(Max.) Wide viewing angle,
RoHS compliant
Wide QVGA (16:9), Digital
170.1 × 103.4 280
I/F, 260K-color display,
× 14.2
(Max)
Wide viewing angle
High resolution (wide
VGA/17:9), Thin, W-QVGA
196 (GG21) vertical/horizontal
167 × 93
× 7.2
(Max.) compatible, 260K-color
display, Wide viewing
angle, RoHS compliant
High resolution (wide
VGA/15:9), High color
purity (65% of NTSC),
High-speed response (low
170 × 104
TBD temperature), LED back× 8.0
light, Thin, 260K-color display, Wide viewing angle,
RoHS compliant,
* Luminosity at eye point
Dual directional viewing
LCD, Wide screen (17:9),
LED backlight, Thin,
215
167.5 × 93.2
260K-color display,
× 6.5 to 9.0 (Max.)
Wide viewing angle,
RoHS compliant,
* DV luminosity at eye point
High resolution (wide
VGA/15:9), High color
purity (65% of NTSC),
High-speed response (low
190 × 120
TBD temperature), LED back× 8.0
light, Thin, 260K-color display, Wide viewing angle,
RoHS compliant,
* Luminosity at eye point
High resolution (wide
VGA/15:9), High-speed
190 × 120
response (low tempera392
× 13
ture), High luminosity,
260K-color display,
Wide viewing angle
High resolution (wide
VGA/16:9), All-in-one,
198 × 117
391
× 17.9
Wide viewing angle,
RoHS compliant
" Super Mobile LCD " with
high visibility under bright
ambient light, Wide screen
231.6 × 103.25 370
(8:3), Wide viewing angle,
× 14.4
(Max.)
Gray-scale inversion free,
260K-color display,
RoHS compliant
167 × 93
× 6.9
*1 Number of pixels: 25 920
*2 Number of pixels: 28 160
*3 Number of pixels: 76 800
*4 Number of pixels: 112 320
*5 Number of pixels: 93 600
*6 Number of pixels: 96 000
*7 Number of pixels: 384 000
*8 Number of pixels: 115 200
*9 Number of pixels: 153 600
*10 Excluding FPC for connection and other protruding parts.
*11 MBK-PAL system is adopted as PAL. The LCD panel has 234 (240) scanning lines, and displays a picture of 273 (274) virtual scanning lines.
*12 Video interface: External (Device specific external video interface IC is available.)
(Note) Please refer to the latest relevant specificaiont sheets before using these devices.
The Tenri site NF3 (JQA-AU0121-1) and plants No. 1 and No. 2 (JQA-AU0121-2) at the Mie site of the Mobile Liquid Crystal Display Group have been certified under the
ISO/TS 16949:2002 Quality Management System. [Certifying organization: Japan Quality Assurance Organization (JQA)]
12
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment
using any SHARP devices shown in catalogs, data books, etc. The models listed on this page are lead-free solder compatible. For details,
please inquire with SHARP. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Device_E.book Page 13 Wednesday, July 18, 2007 1:03 PM
LCD MODULES
✩New product
★Under development
& lt; For personal AV & gt;
Active
Dot
Pixel pitch
area
format
H×V
H×V
H×V
(mm)
(dot)
(mm)
Model No.
6.4
[2.5]
✩LS025A8DZ01
6.8
[2.7]
TFT
6.4
[2.5]
★LQ025A3DS01
Input
video
signal
Power
Outline
LumiWeight
Back- nance consump- dimensions*5
(g)
light (cd/m2) tion (mW) W × H × D
(TYP.)
(TYP.) (TYP.)
(mm) (TYP.)
0.052 ×
49.9 ×
0.156
37.4
(Dot pitch)
LS027T3DG01
960 ×
240*1
CG
Silicon
Input
signal
system
250
480 ×
RGB ×
240*2
59.49 ×
NTSC/
33.48
PAL*3
0.104 ×
0.156
49.87 ×
37.44
8-bit
digital
RGB
Built-in
LED
56.2 × 47.8
× 2.7
21
250
220
65 × 45
× 2.5
13
250
0.062 ×
0.139
230
180
60.0 × 44.3
× 2.7
14
Remarks
Super Mobile LCD with
high outdoor visibility
due to transflectivity,
Top/bottom and left/right
angle of view 160°,
Delta configuration,
High contrast,
Low power consumption
RGB delta configuration,
FPC side positioning,
RoHS compliant,
Lead-free solder
compatible
LCD
Display
size
(cm)
[ ′′ ]
*1 Number of Pixels: 230 400
*2 Number of Pixels: 115 200
*3 MBK-PAL system is adopted as PAL. The LCD panel has 234 (220) scanning lines, and displays a picture of 273 (256) virtual scanning lines.
*4 Video interface: Internal
*5 Excluding FPC for connection and other excessing parts.
* CG Silicon ... Continuous grain silicon technology developed jointly with Semiconductor Energy Laboratory Co. Ltd. is used.
(Note) Please refer to the latest relevant specification sheets before using these devices.
& lt; For mobile phones & gt;
Display
size
(cm)
[ ′′ ]
Model No.
★LS022Q8UX05
7.0
[2.75]
CG
Silicon
5.6
[2.2]
LS028B7UX01
Dot format
H×V
(dot)
Pixel
pitch
H×V
(mm)
Active
area
H×V
(mm)
240 × RGB 0.1395 ×
0.1395
× 320*1
33.48 ×
44.64
240 × RGB
× 400
36.0 ×
60.0
0.05 ×
0.15
Input
video
signal
Outline
Weight
Contrast ratio Luminance
dimensions*4
Back(g)
(Transmissive/ (cd/m2)
W×H×D
light
(TYP.)
(TYP.)
Reflective)
(mm) (TYP.)
400 : 1
16-bit
(Transmissive)/
parallel
10 : 1
CPU Built-in
(Reflective)
LED
CPU bus
400 : 1
300
250
Remarks
Super Mobile LCD with
high outdoor visibility
due to transflectivity,
Top/bottom and left/
39.2 × 58.35
T.B.D. right angle of view 160°
× 2.3
(CR75),
High contrast,
260k-color display,
RoHS compliant
Transmissive type,
41.8 × 70.5
10
260k-color display,
× 2.3
RoHS compliant
*1 Number of Pixels: 76 800
*2 Number of Pixels: 20 480
*3 Number of Pixels: 16 384
*4 Excluding FPC for connection and other excessing parts.
* CG Silicon ... Continuous grain silicon technology developed jointly with Semiconductor Energy Laboratory Co. Ltd. is used.
(Note) Please refer to the latest relevant specification sheets before using these devices.
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment
using any SHARP devices shown in catalogs, data books, etc. The models listed on this page are lead-free solder compatible. For details,
please inquire with SHARP. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
13
Device_E.book Page 14 Wednesday, July 18, 2007 1:03 PM
EL
EL DISPLAY MODULES
■ EL Display Modules
Display
size
(cm) [ ′′ ]
Model No.
LJ64H034
23 [8.9]
LJ089MB2S01
Areal
Power
Outline
Active area
Supply
Weight
Operating
luminance
consumption
dimensions*2
H×V
voltage
(g)
Remarks
temperature
2)
W×H×D
(cd/m
(W)
(mm)
(V)
(TYP.)
(°C)
(TYP.)
(mm) (TYP.)
(TYP.)
246.0 × 175.0
High luminance,
450
110*1
× 19.0
Wide viewing angle
191.9 ×
+5, +12
11
–5 to +55
640 × 400 0.30 × 0.30
119.9
246.0 × 158.0
60
390 Wide viewing angle
× 26.0
Dot format
H×V
(dot)
Dot pitch
H×V
(mm)
*1 In case of frame frequency = 120 Hz
*2 Excluding FPC for connection and other excessing parts.
(Note) Please refer to the latest relevant specification sheets before using these devices.
LJ089MB2S01
14
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment
using any SHARP devices shown in catalogs, data books, etc. The models listed on this page are lead-free solder compatible. For details,
please inquire with SHARP. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Device_E.book Page 15 Wednesday, July 18, 2007 1:03 PM
LSI
CMOS IMAGE SENSORS
★Under development
■ CMOS Camera Modules
Module configuration : CMOS image sensor, CDS/AGC/10-bit ADC, timing generator, DSP, lens (for UXGA/SXGA/VGA)
CMOS image sensor, CDS/AGC/8-bit ADC, timing generator, DSP, lens (for CIF)
Color filter
: R, G, B primary color mosaic filters
Operating temperature : –20 to 60°C
1/3.2
type
Optical
function
Model No.
LZ0P3955
Macro
function
LZ0P39AG
UXGA
LZ0P395V
–
Auto
focus
function
LZ0P39DS
Macro
function
1/4
type
LZ0P393D
SXGA
LZ0P393M
LZ0P394K
1/6
type
VGA
–
LZ0P399A
Features
• UXGA to SubQCIF
• 10 fps at UXGA/
30 fps at SVGA
• 5x electronic zoom
at QVGA size (MAX.)
• Image inversion function
(right and left)
• UXGA to SubQCIF
• 15 fps at UXGA/
30 fps at SVGA
• 5x electronic zoom
at QVGA size (MAX.)
• Image inversion function
(right and left)
Output
pixels
(H x V)
MAX.
Lens
F No.
Output
signal
Supply
voltage
(V)
F3.4
1 600
x
1 200
1 280
x
1 024
• VGA to SubQCIF
• 30 fps at VGA
• 2x electronic zoom
at QVGA size (MAX.)
• Image inversion function
(right and left)
Package*1
28LCC
type
240
(at 7.5 fps)
53
24LCC
type
F2.8
200
(at 15 fps)
3 pcs.
• SXGA to SubQCIF
• 15 fps at SXGA/
30 fps at 640 x 512
• 4.2x electronic zoom
at QVGA size (MAX.)
• Image inversion function
(right and left)
Power
consumption
(mW) TYP.
290
(at 7.5 fps)
Con- Horizontal
figuration viewing
angle (°)
2.8/1.8
(I/O : 1.8
or 2.8)
640
x
480
F3.2
56
30FPC
type*2
220
(at 15 fps)
UYVY
CMOS Image Sensors/
CCDs
Optical Image
format format
F3.4
54
110
(at 30 fps)
2 pcs.
24LCC
type
52
F2.8
LZ0P392N
1/7
type
CIF
LZ0P396K
• CIF/QCIF
• 30 fps at CIF
• Image inversion function
(right and left)
Single
352
x
288
58
2.5
35
(I/O : 2.8) (at 15 fps)
2 pcs.
52
*1 Contact a SHARP sales office regarding socket availability. *2 Contact a SHARP sales office regarding FPC type package.
● Outline Dimensions
LZ0P3955
LZ0P39AG
LZ0P395V
LZ0P39DS
LZ0P393D
LZ0P393M
LZ0P394K
LZ0P399A
LZ0P392N
LZ0P396K
Package*1
9.5 x 9.5 x (H) 7.0
8.0 x 8.0 x (H) 4.8
8.0 x 8.0 x (H) 4.4
8.5 x 8.5 x (H) 5.4
8.4 x 8.4 x (H) 5.3
8.0 x 8.0 x (H) 4.9
6.5 x 6.2 x (H) 4.3
5.8 x 5.8 x (H) 3.7
6.5 x 6.5 x (H) 4.5
6.0 x 6.0 x (H) 3.1
28LCC type
CMOS camera module
LZ0P395V
24LCC type
30FPC type*2
Lens
Model No.
● System Configuration Example
Outline dimensions
(mm) TYP.
24LCC type
CMOS
image
sensor
CDS/AGC/
10-bit ADC
Timing
generator
DSP with
camera system
controller
Digital output for
UYVY
I2C bus control
(H) : Module height
*1 Contact a SHARP sales office regarding socket availability.
*2 Contact a SHARP sales office regarding FPC type package.
15
Device_E.book Page 16 Wednesday, July 18, 2007 1:03 PM
LSI
CCDs
■ Higher-resolution CCDs
Optical Total
format pixels
Color filter
Model No.
RJ21W3BB0ET
1/1.7
type
10 540 k
RJ21W3BC0ET
Resolution
30 fps VGA
movie
Image pixels (H x V)
Pixel size
H x V (µm2)
᭺
3 704 x 2 784
2.05 x 2.05
1.88 x 1.88
(25 fps VGA movie)
Sensitivity Smear ratio
(mV) TYP. (dB) TYP.
Package
100
P-SOP032-0525
᭺
12 520 k
RJ21Y3BA0ET
(22 fps VGA movie)
4 040 x 3 032
8 500 k
RJ21V3BC0ET
᭺
3 320 x 2 496
RJ23S3BD0ET
᭺
RJ23S3CD0ET
–
1/1.8
type
105
2.2 x 2.2
5 190 k
2 600 x 1 944
RJ23S3BE0BT
RJ23S3CE0BT
RJ23T3BB0ET
᭺
RJ23T3CB0ET
–
᭺
RJ23T3CC0BT
–
RJ23U3BA0ET
᭺
RJ23U3CA0ET
–
RJ23U3BC0BT
᭺
RJ23U3CC0BT
–
RJ23V3BA0BT
᭺
RJ23V3CA0BT
–
6 360 k
2 872 x 2 160
1/2.5
type
–88
–
RJ23T3BC0BT
R,G,B
primary color
mosaic filters
130
᭺
2.05 x 2.05
100
P-SOP028-0400
95
105
7 400 k
3 096 x 2 328
8 500 k
3 320 x 2 496
–83
–88
100
–85
1.9 x 1.9
1.75 x 1.75
■ 1/3-type CCDs
Total
pixels
Standard
Resolution
Horizontal TV lines
Image pixels (H x V)
Pixel size
H x V ( µ m 2)
512 x 492
Model No.
9.6 x 7.5
1 300
2 000
–130
9.6 x 6.3
1 300
–120
9.6 x 6.34
2 000
–130
800
–105
1 500
NTSC
–120
6.5 x 6.3
750
–105
6.53 x 6.39
1 500
–120
RJ2311BA0PB
P-DIP016-0500C
330
RJ2321AA0PB
320 k
Package
–120
RJ2311AA0PB
270 k
Sensitivity Smear ratio
(mV) TYP. (dB) TYP.
512 x 582
PAL
RJ2321BA0PB
Color
RJ2351AA0BB
410 k
768 x 494
NTSC
6.4 x 7.5
RJ2351BA0AB
N-DIP016-0450
480
RJ2361AA0BB
470 k
752 x 582
PAL
RJ2361BA0AB
16
Device_E.book Page 17 Wednesday, July 18, 2007 1:03 PM
CCDs
★Under development
■ 1/3.8-type CCD
Total
pixels
290 k
Standard
Color
NTSC
Model No.
★RJ2311AA0PB*
Resolution
Horizontal TV lines
Image pixels (H x V)
Pixel size
H x V ( µ m 2)
330
532 x 512
7.2 x 5.6
Image pixels (H x V)
Pixel size
H x V (µm2)
Sensitivity Smear ratio
(mV) TYP. (dB) TYP.
1 200
–120
Package
P-DIP014-0400A
* Suitable for intense light exposure.
■ 1/4-type CCDs
Standard
Model No.
Resolution
Horizontal TV lines
Sensitivity Smear ratio
(mV) TYP. (dB) TYP.
Package
RJ2411AA0PB*
800
–105
1 200
–120
7.2 x 4.7
720
–105
7.2 x 4.73
1 100
–120
400
–90
600
–114
5.0 x 4.7
400
–90
5.0 x 4.77
600
–114
RJ2411AB0PB
270 k
NTSC
512 x 492
7.2 x 5.6
RJ2411BA0PB*
330
RJ2411BB0PB
RJ2421AB0PB
320 k
Color
PAL
P-DIP014-0400A
512 x 582
RJ2421BB0PB
RJ2451AA0PB
410 k
NTSC
768 x 494
CMOS Image Sensors/
CCDs
Total
pixels
4.9 x 5.6
RJ2451BA0PB
480
RJ2461AA0PB
PAL
470 k
752 x 582
RJ2461BA0PB
* Suitable for intense light exposure.
■ 1/3-type CCDs with Dual-power-supply (5 V/12 V) Operation*1
Total
pixels
Standard
270 k
EIA
Model No.
Image pixels (H x V)
Pixel size
H x V ( µ m 2)
512 x 492
LZ2316A3
B/W
320 k
Resolution
Horizontal TV lines
9.6 x 7.5
3 300*2
512 x 582
9.6 x 6.3
3 000*2
Sensitivity Smear ratio
(mV) TYP. (dB) TYP.
380
CCIR
*1 With mirror image function
LZ2326A3
–110
Package
N-DIP016-0500C
*2 When IR cut-off filter is not used.
17
Device_E.book Page 18 Wednesday, July 18, 2007 1:03 PM
LSI
CCDs
★Under development
■ CCD Peripheral ICs/LSIs
Description
Single-chip driver
Timing generator
Model No.
Features
Package
P-QFP048-0707
Vertical pulse driver for CCDs, 2-level output x 2, 3-level output x 4,
2-level output circuit for electronic shutter
P-SSOP024-0275
LR36687U/Y
Vertical pulse driver for CCDs, 2-level output x 10, 3-level output x 10,
2-level output circuit for electronic shutter
P-VQFN064-0808/
TFBGA068-0606
Vertical pulse driver for CCDs, 2-level output x 4, 3-level output x 8,
2-level output circuit for electronic shutter
P-VQFN036-0505
Low power consumption [80 mW (TYP.) ],
high-speed S/H circuit, high-gain PGA circuit, 10-bit ADC (18 MHz), 10-bit digital output
P-QFP048-0707/
P-VQFN052-0707
Low power consumption [80 mW (TYP.) ],
high-speed S/H circuit, high-gain PGA circuit, 10-bit ADC (18 MHz), 10-bit digital output
P-QFP048-0707
IR3Y60U6
Low power consumption [69 mW (TYP.) ],
high-speed S/H circuit, high-gain PGA circuit, 10-bit ADC (20 MHz), 10-bit digital output
P-VQFN032-0505
IR3Y50U6
V driver
Available for signal processing from CCD output to 75 Ω video output, for B/W CCDs,
comparator for electronic exposure, high-speed S/H circuit, H aperture, LPF, AGC
★IR3Y48B1
Signal processor
IR3Y30M2
IR3Y48A3/A5
Synchronous signal generator
)
For 270-k/320-kpixel CCDs
with dual-power-supply
operation (5 V/12 V)
LR36689U
+
LR385851
LR366851
(
Low power consumption [75 mW (TYP.) ],
high-speed S/H circuit, high-gain PGA circuit, 12-bit ADC (25 MHz), 12-bit digital output
P-VQFN036-0606
For 1/2.5-type 5 190-kpixel CCDs
& lt; Timing generator & gt;
with/without movie function
Monitoring mode/still mode
For 1/2.5-type 6 360-kpixel CCDs & lt; V driver & gt;
Vertical pulse driver for CCDs,
with/without movie function
2-level output x 10, 3-level output x 10,
For 1/2.5-type 7 400-kpixel CCDs 2-level output circuit for electronic shutter
& lt; CDS/PGA/ADC & gt;
with/without movie function
30 MHz (LR38667)/
36 MHz (LR38675/LR38678/LR38677),
For 1/1.8-type 8 500-kpixel,
high-speed S/H circuit, high-gain PGA circuit,
1/1.7-type 10 540-kpixel CCDs
12-bit ADC, 12-bit digital output
with movie function
LFBGA192-1010
& lt; Timing generator & gt;
For 1/2.5-type 5 190-kpixel,
Programmable timing generator
6 360-kpixel, 7 400-kpixel,
& lt; V driver & gt;
8 500-kpixel CCDs with/without
Vertical pulse driver for CCDs,
movie function,
2-level output x10, 3-level output x10
For 1/1.8-type 8 500-kpixel,
2-level output circuit for electronic shutter
1/1.7-type 10 540-kpixel,
& lt; CDS/PGA/ADC & gt;
12 520-kpixel CCDs with movie
40 MHz, high-speed S/H circuit, high-gain PGA circuit,
function
22-bit ADC, 16-bit digital output
LFBGA140-0909
CDS/PGA/ADC
LR38667
LR38675
LR38678
Timing generator
+
V driver
+
CDS/PGA/ADC
LR38677
★LR36B11
LR386431/33
V driver
+
CDS/PGA/ADC
+
DSP
For 270-k/320-k/410-k/
470-kpixel CCDs
LR38653
18
Electronic shutter, electronic exposure, mirror image function,
P-QFP048-0707
for B/W CCDs, level shifter, smooth shutter, line lock function
& lt; V driver & gt;
Vertical pulse driver for CCDs,
2-level output x 2, 3-level output x 2,
2-level output circuit for electronic shutter
& lt; CDS/PGA/ADC & gt;
18 MHz, high-speed S/H circuit,
high-gain PGA circuit, 10-bit ADC
& lt; DSP & gt;
9-bit DAC, synchronous signal generation circuit,
CCD drive timing generator, AE control function,
AWB control function, mirror image function,
YUV digital output, NTSC/PAL analog output
LFBGA168-1212/
LFBGA171-0811
& lt; V driver & gt;
Vertical pulse driver for CCDs,
2-level output x 2, 3-level output x 2,
2-level output circuit for electronic shutter
& lt; CDS/PGA/ADC & gt;
25 MHz, high-speed S/H circuit,
high-gain PGA circuit, 12-bit ADC
& lt; DSP & gt;
10-bit DAC, synchronous signal generation circuit,
CCD drive timing generator, AE control function,
AWB control function, lens shading correction function,
auto white blemish compensation function, mirror image
function, YUV digital output, NTSC/PAL analog output
LFBGA171-0811
Device_E.book Page 19 Wednesday, July 18, 2007 1:03 PM
CCDs
★Under development
■ CCD Peripheral ICs/LSIs (cont’d)
Model No.
Features
Package
9-bit DAC, synchronous signal generation circuit,
built-in CCD drive timing generator, AE control function,
AWB control function, mirror image function,
YUV digital output, NTSC/PAL analog output
P-LQFP080-1212
9-bit DAC, synchronous signal generation circuit,
built-in CCD drive timing generator, AE control function,
AWB control function, mirror image function,
YUV digital output, NTSC/PAL analog output,
Y/C separation analog output, line lock function
P-LQFP100-1414
10-bit DAC, synchronous signal generation circuit,
built-in CCD drive timing generator, AE control function,
AWB control function, lens shading correction function,
auto white blemish compensation function,
mirror image function, YUV digital output,
NTSC/PAL analog output
P-TQFP128-1414
For 5 190-kpixel to
12 520-kpixel CCDs
Input voltage range : 11.5 to 16 V,
Constant current range : 1 to 5.5 mA,
ON/OFF control for constant current
B-VQFN8
(1.50 mm x 1.50 mm)
Input voltage range : 4.5 to 16 V,
PWM control + charge pump system,
output voltage : three outputs (15 V/12 V, –8 V/–5 V, 3.3 V),
power sequencing circuit, overcurrent protection circuit
For 270-k/290-k/320-k/410-k/
470-kpixel CCDs
LR38654
LFBGA171-0811
For 270-k/320-kpixel CCDs
V driver
+
CDS/PGA/ADC
+
DSP
& lt; V driver & gt;
Vertical pulse driver for CCDs,
2-level output x 2, 3-level output x 2,
2-level output circuit for electronic shutter
& lt; CDS/PGA/ADC & gt;
25 MHz, high-speed S/H circuit,
high-gain PGA circuit, 12-bit ADC
& lt; DSP & gt;
10-bit DAC, synchronous signal generation circuit,
built-in CCD drive timing generator, AE control function,
AWB control function, lens shading correction function,
auto white blemish compensation function, mirror image
function, electronic optical axis adjustment function*1,
YUV digital output, NTSC/PAL analog output
Input voltage range : 4.5 to 10 V,
PWM control + charge pump system,
output voltage : four outputs (15 V, –8 V, 3.3 V, 1.8 V),
power sequencing circuit, overcurrent protection circuit
For 270-k/290-k/320-k/410-k/
470-kpixel CCDs
LR386032
DSP
LR386071
For 270-k/320-k/410-k/
470-kpixel CCDs
LR38627
Buffer IC
for CCD output
circuit
★IR3T47G
IR3M55U*2
Power supply IC for
CCDs and peripheral
ICs/LSIs
IR3M59U
CMOS Image Sensors/
CCDs
Description
P-VQFN032-0505
IR3M61U*2
IR3M63U
*1 Only support for 290-kpixel CCD.
*2 For in-vehicle use
19
Device_E.book Page 20 Wednesday, July 18, 2007 1:03 PM
LSI
CCDs
★Under development
● System Configuration Examples
• High-resolution Digital Camera System with Three-chip Configuration
Analog output for RGB/NTSC/PAL
Four-power-supply
CCD
Timing generator
+
V driver
+
CDS/PGA/ADC
Buffer IC for
CCD output circuit
★IR3T47G*
Digital LCD interface
Image processing LSI
for digital cameras
SDRAM
LCD panel
Interface
USB
Interface
CompactFlashTM
or
SmartMediaTM
or
SD memory card
Flash
memory
*Refers to the following table regarding adaptable CCDs with IR3T47G.
Four-power-supply CCDs and peripheral IC/LSIs
30 fps VGA
movie
CCD
RJ21W3BB0ET
10 540 k pixels
1/1.7 type
RJ21W3BC0ET
᭺ (25 fps VGA movie)
12 520 k pixels
᭺ (22 fps VGA movie)
8 500 k pixels
RJ21V3BC0ET
᭺
RJ23S3CD0ET
᭺
RJ23S3CE0BT
–
RJ23T3BB0ET
᭺
RJ23T3CB0ET
᭺
5 190 k pixels
6 360 k pixels
1/2.5 type
RJ23T3CC0BT
–
RJ23U3BA0ET
᭺
RJ23U3CA0ET
★IR3T47G
★ LR36B11
RJ23U3BC0BT
LR38677/★LR36B11
–
LR38667/★LR36B11
★IR3T47G
–
LR38675/★LR36B11
★IR3T47G
–
᭺
7 400 k pixels
RJ23U3CC0BT
–
RJ23V3BA0BT
᭺
RJ23V3CA0BT
–
8 500 k pixels
20
LR38677/★LR36B11
–
RJ23T3BC0BT
–
–
RJ23S3BE0BT
Timing generator + V driver
+ CDS/PGA/ADC
᭺
RJ23S3BD0ET
1/1.8 type
RJ21Y3BA0ET
Buffer IC for
CCD output circuit
–
LR38678/★LR36B11
★IR3T47G
★ LR36B11
Device_E.book Page 21 Wednesday, July 18, 2007 1:03 PM
CCDs
★Under development
• Color Security Camera System with Two-chip Configuration [Low Power Consumption Type]
Analog output for NTSC/PAL
V driver
+
CDS/PGA/12-bit ADC
+
DSP
Power
supply
voltage
–8 V
Input voltage
4.5 to 10 V
Power Power Power
supply supply supply
voltage voltage voltage
1.8 V 3.3 V 15 V
Power supply IC
IR3M63U
Digital output for YUV
E2PROM
DSP serial control
Four-power-supply CCDs and peripheral IC/LSIs
CCD
V driver + CDS/PGA/ADC + DSP
Power supply IC
RJ2311AA0PB
270 k pixels
CMOS Image Sensors/
CCDs
Four-power-supply
CCD
RJ2311BA0PB
—
RJ2321AA0PB
320 k pixels
RJ2321BA0PB
LR38653/LR38654
1/3 type
RJ2351AA0BB
410 k pixels
RJ2351BA0AB
IR3M63U
RJ2361AA0BB
—
470 k pixels
RJ2361BA0AB
1/3.8 type
290 k pixels
★RJ2411CA0PB
LR38654
RJ2411AA0PB
RJ2411AB0PB
IR3M63U
270 k pixels
RJ2411BA0PB
RJ2411BB0PB
RJ2421AB0PB
1/4 type
LR38653/LR38654
320 k pixels
RJ2421BB0PB
RJ2451AA0PB
—
RJ2451BA0PB
IR3M63U
410 k pixels
RJ2461AA0PB
—
RJ2461BA0PB
IR3M63U
470 k pixels
21
Device_E.book Page 22 Wednesday, July 18, 2007 1:03 PM
LSI
CCDs
• Color Security Camera System with Two-chip Configuration
Analog output for NTSC/PAL
Four-power-supply
CCD
V driver
+
CDS/PGA/10-bit ADC
+
DSP
Power Power Power
supply supply supply
voltage voltage voltage
–8 V 3.3 V 15 V
Input voltage
Power supply IC
4.5 to 16 V
IR3M59U
Digital output for YUV
E2PROM
DSP serial control
Four-power-supply CCDs and peripheral IC/LSIs
CCD
V driver + CDS/PGA/ADC + DSP
Power supply IC
RJ2311AA0PB
270 k pixels
RJ2311BA0PB
RJ2321AA0PB
320 k pixels
RJ2321BA0PB
—
1/3 type
RJ2351AA0BB
410 k pixels
RJ2351BA0AB
RJ2361AA0BB
470 k pixels
RJ2361BA0AB
RJ2411AA0PB
LR386431/LR386433
RJ2411AB0PB
270 k pixels
RJ2411BA0PB
IR3M59U
RJ2411BB0PB
RJ2421AB0PB
1/4 type
320 k pixels
RJ2421BB0PB
RJ2451AA0PB
410 k pixels
RJ2451BA0PB
—
RJ2461AA0PB
470 k pixels
RJ2461BA0PB
22
Device_E.book Page 23 Wednesday, July 18, 2007 1:03 PM
CCDs
★Under development
• Color Security Camera System with Four-chip Configuration
Analog output for NTSC/PAL
Four-power-supply
CCD
CDS/PGA/ADC
Digital output for YUV
DSP
V driver
LR366851
Power supply IC
DSP serial control
Four-power-supply CCDs and peripheral ICs/LSIs (1)
V driver
CCD
CDS/PGA/ADC
DSP
Power supply IC
RJ2311AA0PB
270 k pixels
RJ2311BA0PB
CMOS Image Sensors/
CCDs
E2PROM
RJ2321AA0PB
320 k pixels
RJ2321BA0PB
1/3 type
—
RJ2351AA0BB
410 k pixels
RJ2351BA0AB
RJ2361AA0BB
470 k pixels
RJ2361BA0AB
LR366851
RJ2411AB0PB
IR3Y60U6
IR3Y48A3/A5/B1★
IR3Y48A3/A5/B1★
+
+
+
LR386071,
LR386032,
LR386071
270 k pixels
RJ2411BB0PB
IR3M59U
RJ2421AB0PB
320 k pixels
RJ2421BB0PB
1/4 type
RJ2451AA0PB
410 k pixels
RJ2451BA0PB
—
RJ2461AA0PB
470 k pixels
RJ2461BA0PB
23
Device_E.book Page 24 Wednesday, July 18, 2007 1:03 PM
LSI
CCDs
Four-power-supply CCDs and peripheral ICs/LSIs (2)
V driver
CCD
CDS/PGA/ADC
DSP
Power supply IC
RJ2311AA0PB
270 k pixels
RJ2311BA0PB
—
RJ2321AA0PB
320 k pixels
RJ2321BA0PB
1/3 type
RJ2351AA0BB
410 k pixels
RJ2351BA0AB
IR3M63U
RJ2361AA0BB
—
470 k pixels
RJ2361BA0AB
LR366851
IR3Y50U6
LR38627
RJ2411AB0PB
270 k pixels
IR3M63U
RJ2411BB0PB
RJ2421AB0PB
320 k pixels
RJ2421BB0PB
1/4 type
RJ2451AA0PB
—
RJ2451BA0PB
IR3M63U
410 k pixels
RJ2461AA0PB
—
RJ2461BA0PB
IR3M63U
470 k pixels
• B/W Security Camera System
Dual-power-supply
CCD
Analog output for EIA/CCIR
Analog signal processor
IR3Y30M2
Single-chip driver with level shifter
LR385851
Power supply
voltage 12 V
Power supply
voltage 5 V
Dual-power-supply CCDs and peripheral IC/LSI for analog interface
Single-chip driver
(Timing generator + Synchronous signal generator)
270 k pixels
LZ2326A3
1/3 type
24
IR3Y30M2
LZ2316A3
320 k pixels
Signal processor
LR385851
CCD
Device_E.book Page 25 Wednesday, July 18, 2007 1:03 PM
LSIs FOR LCDs
■ For Notebook PCs, PC Monitors and LCD TVs
● TFT-LCD Drivers
Model No.
Gray
scale
No. of
Display
Clock
LCD drive voltage
frequency
outputs (V) MAX. (MHz) MAX.
Supply
voltage
(V)
LH16AM
384
402/414
420/432
2.3 to 3.6
LH16AD
64 levels
480/504/
516/528
13.5
LH16B5
LH16B9
684/690/
702/720
384
15
LH16BP
384/402/
408/414/
420
16.5
LH16AW
384/414/
420
16
LH16AF
480
15
LH1691
240
2.7 to 3.6
630/642
LH16AE
Source
driver
Dot
inversion
drive
33
2.3 to 3.6
256 levels
85
LH1694
-
LH169J
Low EMI*1 driver using RSDSTM*2
interface, built-in reference voltage
generation circuit, R-DAC system
SOF
2.7 to 3.6
0.1
Gate driver
Package
2.7 to 3.6
LH16B6
Description
256
42
200/240/
256/263/
270
45
0.2
Selectable 1-pulse (normal) or 2-pulse
(continuous/jumping) scanning,
3.0 to 5.5 usable with both positive/negative
power supplies
Output signal masking function, usable
2.7 to 3.6 with both positive/negative power
supplies, enables chain connection
2.4 to 4.2
Output signal masking function, enable
constructing the module without substrate
CMOS Image Sensors/
CCDs
Drive function
TCP/SOF/
COG
TCP/SOF
SOF
*1 EMI : Electro-Magnetic Interference
*2 RSDSTM : Reduced Swing Differential Signaling
25
Device_E.book Page 26 Wednesday, July 18, 2007 1:03 PM
LSI
LSIs FOR LCDs
■ For Mobile Equipment
● TFT-LCD Drivers
Drive function
Dot
inversion
drive
No. of
Display
Supply
Clock
LCD drive voltage frequency voltage
outputs (V) MAX. (MHz) MAX.
(V)
402/480/
516
LH16AV
LH168Y
Source
driver
Gray
scale
Model No.
64 levels
13.5
65
240
35
Line
inversion
drive
LH16AR
LH1687
480
Analog
LH1691
12.5
33
240/244/
258
Built-in reference voltage generation circuit,
R-DAC system, power saving function
Built-in reference voltage generation circuit,
2.5 to 5.5 R-DAC system, power saving function,
polarity inversion of input data
COG
40
0.1
Selectable three-point simultaneous or normal
sampling (Sampling frequency : 25 MHz),
power saving function, 3 V drive (MIN.),
3.0 to 5.5 prechargeless output
Selectable 1-pulse (normal) or 2-pulse
(continuous/jumping) scanning, usable with
both positive/negative power supplies
TCP/SOF/COG
2.5 to 3.6 Output signal masking function,
enables chain connection
240
–
LH169H
Package
Built-in R-DAC system, power saving function,
2.5 to 3.6 polarity inversion of input data
5.5
240
Gate driver
2.7 to 3.6
Description
COG
● STN-LCD Drivers
Drive
technology
Drive
function
Model No.
LH1583
No. of
LCD drive
outputs
Duty ratio
160
to 1/240
Data input
4/8-bit parallel
+5.5
Segment
LH1580
240
to 1/480
LH1537
New drive
technology*1
Display
voltage
(V) MAX.
200/240
1/200,1/240
8/12-bit parallel
+45
–
Common
LH1538
120/128
to 1/480
+80
LH1542
80
to 1/240
+30
4-bit parallel
Clock frequency
(MHz) MAX.
12 (at 2.4 V) /
20 (at 5 V)
30 (at 2.5 V) /
55 (at 5 V)
3 (at 2.4 V) /
4 (at 5 V)
3 (at 2.5 V) /
4 (at 5 V)
Supply
voltage
(V)
Package
2.4 to 5.5
2.5 to 5.5
2.4 to 5.5
8
12 (at 2.5 V) /
LH1549
Segment
160
4/8-bit parallel
20 (at 5 V)
to 1/480
+42
12 (at 2.5 V) /
LH1548
240
TCP/SOF
8/12-bit parallel
25 (at 5 V)
3 (at 2.5 V) /
to 1/480
LH1530
Common
+42
120
–
4 (at 5 V)
Conventional
2.5 to 5.5
[Segment mode] 8
to 1/240
drive
LH1565
+30
[Common mode] 4
technology*2
[Segment mode]
160
8 (at 2.5 V) /
Segment
LH1560
14 (at 5 V)
or
4/8-bit parallel
Common
(at segment drive) [Common mode] 4
to 1/480
+42
[Segment mode]
(Pin-selectable)
12 (at 2.5 V) /
LH1562
240
20 (at 5 V)
[Common mode] 4
*1 New drive technology : A drive technology which drives LCDs with low voltage of 5 V on segment side and drives LCDs with high voltage on common side.
Driving with low voltage on segment side enables LCDs to reduce power consumption and shadowing.
*2 Conventional drive technology : A drive technology which drives LCDs with high voltage on both segment and common sides.
● Power Supply IC for STN-LCD Drivers
Model No.
Description
Supply voltage
(V)
Package
DC-DC converter for LCD drive power supply,
2.4 to 3.3 (VDD, VP)
P-QFP072-1010
built-in bias voltage generation circuit for LCD drive,
electronic volume control circuit
* New drive technology : A drive technology which drives LCDs with low voltage of 5 V on segment side and drives LCDs with high voltage on common side.
Driving with low voltage on segment side enables LCDs to reduce power consumption and shadowing.
LR3697A
26
For STN LCD drivers with
new drive technology*
Device_E.book Page 27 Wednesday, July 18, 2007 1:03 PM
LSIs FOR LCDs
■ For Mobile Phones
● TFT-LCD Controller/Driver with Two-chip Configuration (LR38825 + LH169C)
LR38825
No. of LCD Display Display RAM
drive outputs
colors
capacity a-Si
Source Gate
MAX.
(bit)
528
240 x 176 x 18 ᭺
–
262 144
colors
LH169C
–
–
240
᭺
Function
• Versatile graphic functions
• Window display function
• Write mask function
• Bit built function
• Built-in gray-scale
control circuit
• Built-in timing generator
• Built-in DC-DC converter,
VCOM generation circuit
CPU
interface
External
image
interface
Supply voltage (V)
Package
Core
Host I/F
Display
80-family
RGB :
(8/16/18-bit
respective 1.65 to 1.95 1.65 to 3.6 4.75 to 5.25
parallel,
6-bit parallel
serial)
COG
–
–
CPU
interface
External
image
interface
26.5
(MAX.)
2.75 to 3.3
LSIs for LCDs
Model No.
● Single-chip TFT-LCD Controller/Driver
Model No.
LR38826
No. of LCD Display Display RAM
drive outputs
capacity a-Si
colors
Source Gate
(bit)
MAX.
396
176
262 144
176 x 132 x 18 ᭺
colors
Function
• Versatile graphic functions
• Window display function
• Write mask function
• Bit built function
• Built-in gray-scale
control circuit
• Built-in timing generator,
DC-DC converter,
VCOM generation circuit
Supply voltage (V)
Package
Core
Host I/F
80-family
RGB :
(8/16/18-bit respective
1.65 to 1.95 1.65 to 3.6
parallel, 6-bit parallel,
serial)
YUV format
Display
2.75 to 3.3
Using built-in
power supply
COG
·Source :
4.0 to 5.5
·Gate :
20 to 27.5
● TFT-LCD Controllers
Model No.
LR38822A
LCD
Display Display RAM
a-Si
interface
capacity
colors
(pixel) MAX. MAX.
(bit)
176 x 240
• Built-in timing generator,
65 536
176 x 240 x 16 clock generator
colors
LR388D1
262 144 240 x 400 x 18
colors
LR38869A
• MDDI* compliant
• Built-in IrSimple™ and
IrDA functions
• Main/sub LCD controller
• Graphic processing
• MDDI* compliant
• Main/sub LCD controller
• Graphic processing
• Parallel bus host interface
240 x 400
16 770k
colors
LR388D0
Function
–
• DAC type LCD controller
• Built-in voltage generation
circuit for LCD
• Built-in common drive circuit
• Built-in level shifter for
panel control
• Built-in timing generator
External
image
interface
CPU
interface
Supply voltage (V)
Package
Core
Host I/F
80-family
RGB :
(8/16-bit
respective 2.25 to 2.75 3.0 to 3.6 TFBGA112-1010
parallel, serial) 6-bit parallel
VFBGA144-0808
MDDI* for
MSM series/
80-family
(8/9/16/
18-bit parallel)
–
1.65 to 1.95 1.65 to 3.6 TFBGA176-0909
–
RGB :
respective
8-bit parallel
VFBGA144-0808
* MDDI (Mobile Display Digital Interface) : The serial interface standard developed by QUALCOMM.
● TFT-LCD Driver
Model No.
No. of LCD
drive outputs
LTPS*
Function
Source
LH16AP
240
᭺
• Built-in timing generator,
DC-DC converter,
VCOM generation circuit
External image
interface
RGB : respective
6-bit parallel
Supply voltage (V)
Display
MAX.
2.2 to 3.6
5.5
Package
COG/SOF
* LTPS : Low Temperature Poly-Silicon
27
Device_E.book Page 28 Wednesday, July 18, 2007 1:03 PM
LSI
LSIs FOR LCDs
● Color STN-LCD Controllers/Drivers
Display colors
MAX.
Drive
function
Model No
256
colors
LH15H1
4 096
colors
No. of LCD
drive outputs
65 536
colors
262 144
colors
LH15KA
LH15LA
Duty ratio
Display
voltage
(V) MAX.
Data input
66
96 x 66 x 8
1/10, 1/18,
1/26, 1/34,
1/42, 1/50,
1/58, 1/66
+13.2
8/16-bit parallel,
serial
132
LH15JA
Segment
and
Common
Display RAM
capacity
(bit)
132 x 132 x 12
1/33, 1/39,
1/68, 1/74,
1/133, 1/139
+18
8-bit parallel,
serial
176
to 1/176
132 x 176 x 16 (Selectable per 1 line)
+18.6
to 1/162
132 x 162 x 18 (Selectable per 1 line)
±18
Segment Common
288
396
162
Clock
Supply
frequency voltage
(MHz) MAX.
(V)
4 (at 3 V)
1.8 to 3.3 TCP/SOF
3 (at 2.5 V) 1.65 to 3.3 COG
4 (at 3 V)
8/16-bit parallel,
serial
Package
1.8 to 3.3 COG
Core :
1.65 to 1.95
6.25
(at 1.65 to 1.95) Host I/F : COG
1.65 to 3.6
● Color STN-LCD Controller
Model No.
LR38844A
28
LCD
Display
interface colors
(pixel) MAX. MAX.
CPU
interface
Function/Feature
• High-speed host access
• Display colors selectable :
256/4 096/65 536 colors
65 536
128 x 164
• Power saving function reduces the
colors
power consumption in standby mode
• Built-in CPU interface, LCD interface,
clock generator, display memory
Recommended
to be used
together with
LH15H1
Display RAM
capacity
(bit)
Supply
voltage
(V) TYP.
68-family/
80-family
(8/16 bits)
128 x 164 x 16
2.5
Package
TFBGA081-0808
Device_E.book Page 29 Wednesday, July 18, 2007 1:03 PM
LSIs FOR LCDs
★Under development
■ Peripheral ICs for LSIs for LCDs
● Video Interface ICs for TFT-LCDs
IR3Y18A1
Input signal
Composite Y/color Analog
OSD
video
difference RGB (Digital)
᭺
Color
decode
NTSC/PAL
᭺*3
IR3Y26A2/A6
LCD panel
Serial
± power + power Low voltage Digital data
source source source input control
᭺
Power
consumption
(mW) TYP.
Package
4.5/12 or
4.5/–7.5
130
P-QFP048-0707
140
᭺
Supply
voltage
(V) TYP.
P-QFP048-1010/
P-QFP048-0707
᭺
–
5/7.5
IR3Y29A1/B1
᭺
᭺
IR3Y31M1
᭺
᭺
NTSC/PAL
᭺
NTSC/PAL
᭺
IR3Y34M1
᭺
᭺(Common terminal)
IR3Y37A1
᭺*3
RB5P0010M2
᭺
–
4.5/12 or
4.5/–7.5
160
3/12
88
–
᭺
᭺
᭺
᭺
–
᭺
190
᭺
᭺
3/6.5
106/88*5 P-QFP048-0707
RB5P0020M2
᭺(Common terminal)
᭺
–
᭺
RB5P0050M2
᭺(Common terminal)
᭺
–
᭺
3/12 or
3/4.5/–7.5
92
3/5
᭺
᭺
70/57*5
᭺
RB5P0060M2
᭺
᭺
NTSC/PAL
᭺
᭺
RB5P006AM2
᭺
᭺
NTSC/PAL
᭺
᭺
᭺
RB5P0090M
᭺
᭺*3
LRS5751*2
᭺
᭺
95/80*5
᭺
RB5P0070M*1
3/5/13
120
LRS5752*2
★IR3Y63M
*1
*2
*3
*4
*5
LSIs for LCDs
Model No.
᭺
᭺
᭺*3
᭺
᭺*4
᭺
᭺
NTSC/PAL
NTSC/PAL
(automatic
identification)
᭺
NTSC/PAL
᭺
3/7
330
P-QFP072-1010
᭺
5/13
250
P-QFP048-1010
3.3/5/7.5
197
᭺
NTSC/PAL
(automatic
identification)
᭺
NTSC/PAL/
(Built-in) SECAM
P-QFP048-1010
P-LQFP100-1414
᭺
᭺
3.3/5/13
257
᭺
᭺
3.3/5
300
P-TQFP100-1414
For digital signal input panels
Built-in timing generator
Two inputs
Digital RGB input is also available.
At analog input for RGB
29
Device_E.book Page 30 Wednesday, July 18, 2007 1:03 PM
LSI
LSIs FOR LCDs
● Power Supply ICs for TFT-LCDs
IR3M16U
IR3M30M/U
Oscillation frequency
(kHz)
Package
100
Application/Function
Supply voltage
(V)
2.6 to 3.6
P-HQFN020-0404
70 to 1 000
Model No.
2.7 to 5.5
For small TFT-LCD panels, charge pump system DC-DC converter
(15.3 V, 5.1 V, –10.2 V)
For small/medium TFT-LCD panels, PWM switching system DC-DC converter
(Output voltage (3ch) : External setting)
P-QFP048-0707/
P-VQFN036-0505
IR3M58M/U
70 to 500
4.5 to 28
● Gray-scale ICs for TFT-LCDs
Model No.
Panel type
IR3E2015
IR3E2045
Function
γ correction,
gray-scale voltage generator
for LCD drive,
built-in dividing resistors
No.of
output
circuits
Output
current
(mA) MAX.
Common
output current
(mA) MAX.
±1
±1
4.5 to 5.5
5
• Large panels
• Up to 20-inch panels
• SXGA/UXGA
• Dot inversion drive
IR3E12M1
IR3E13N/U
P-QFP048-0707
±150
±15
6
* SHARP can offer semi-custom-made gray-scale ICs in accordance with the characteristics of LCD panels.
30
P-SSOP012-0225/
P-HQFN020-0404
7 to 15
10
γ correction,
gray-scale voltage generator
for LCD drive
7 to 14
P-TQFP048-0707
7 to 15
18
• Medium/large panels
• Dot inversion drive
P-MFP018
4.6 to 5.5
10
IR3E11P1
IR3E11M1
Package
7 to 14
• Small panels
• Line inversion drive
IR3E3XX*
IR3E11A1
Supply
voltage
(V)
±50
5 to 15
P-MFP018/
P-VQFN020-0404
Device_E.book Page 31 Wednesday, July 18, 2007 1:03 PM
SYSTEM LSIs
■ Special-function LSIs
LR388D1
Function
WQVGA LCD controller with a
built-in IrSimple™ function
based on MDDI
LR38888
LR35501/Y
LR38886
LR38875
LR388733
• Built-in video memory : 240 x 400 pixels, 260 k colors (18 bits)
• MDDI*1 TYPE I compliant
• Supports 80-family CPU bus (8/9/16/18 bits)
• Built-in modulation and demodulation IP for IrSimple™, IrDA, and
IR remote controller
• Built-in graphic engine (built-in zoom, scroll functions, etc.)
• Supports dual displays for both main WQVGA and Sub CPU
panels
Supply voltage
(V)
Package
Core : 1.8 (TYP.)
VFBGA144-0808
I/O : 1.8 to 3.3
• Simple function LSI for IrSimple™, IrDA, and IR remote controller
• Built-in 4 160-byte buffer
• System proposal with SHARP front-end module
Core : 1.8 (TYP.)
IrSS™ controller with
JPEG decoder
• High-speed 4-Mbps infrared communication
• IrSimple™ 1.0-compliant one-way communication function
• Built-in JPEG decoder
• SDTV and HDTV video outputs
Core : 1.2 (TYP.)
H. 264 decoder for
one-segment digital terrestrial
TV broadcasting
• Built-in video (H. 264) and audio (MPEG2-AAC + SBR)
decoding functions
• Low power consumption : 150 mW
• Fast play
• Built-in memory (DRAM)
• Input signal : MPEG2-TS
• Image size : QVGA
• Frame rate : 15 frames/s
• Output signal format : Image UYVY/RGB for video, I2S for audio
• Output interface : CPU bus, camera interface
Home & amusement processor
• Capable of moving picture transmission/play, thanks to real-time
image compression and extension technology
• Real images, backgrounds and sprites can be superimposed
• Built-in sprite processor
• Built-in color object detector
• Built-in Bluetooth® interface
• Built-in sound generator (ADPCM/PSG)
• Built-in CMOS camera module interface
• Built-in video encoder : NTSC/PAL composite signal output
• Analog RGB signal output
• CPU : Z80 compatible
• PIO, UART, SIO, NAND flash memory I/F, ADC, PWM, SPI, etc.
Front-end LSI for IrSimple™,
LR388B6/B61 IrDA, and IR remote controller
LR388B3
Features
I/O : 1.8 to 3.3
TFBGA056-0808/
VFBGA057-0505
TFBGA180-1313
System LSIs
Model No.
I/O : 3.3 (TYP.)
Core : 1.3 (TYP.)
TFBGA208-1010
I/O : 1.8 / 3.3
Core : 1.8 ± 0.18
I/O : 3.3 ± 0.3
P-QFP128-1420/
TFBGA160-1212
Image detection engine
• High-speed image processing : 960 MOPS (MAX.)
• Built-in camera interface : 8-bit digital input (UYVY etc.),
Can be connected to a camera directly,
up to 4-million pixel camera
Core : 1.8 (TYP.)
• Built-in SDRAM interface : 512 Mbits (MAX.)
• Universal I/O : 15 ports (MAX.)
P-LQFP176-2424
• Serial interface (SPI)
I/O : 3.3 (TYP.)
• Bus interface (Bus Master)
• Built-in PLL (200 MHz (MAX.))
• Automatic control of power consumption according to amount of
data processed
RSDS transmitter
• RSDSTM*2 spec. V095 compliant
• Low EMI*3 generation
• Low current consumption : 50 mA (MAX. at 85 MHz)
• High noise rejection
• Data rate : 50 to 180 Mbps (CLK : at 25 to 90 MHz)
• Clock delay timing of RSDSTM*2 output can be controlled
by external register
• RSDSTM*2 swing output voltage can be controlled
by external load resistor
USB On-The-Go controller
• USB2.0 supplemental standard OTG1.0 compliant
• Connectable to a product whose data transfer speed
12 Mbps and 1.5 Mbps
• Built-in 2-ch USB line driver (2-port root HUB function)
• Asynchronous SRAM-compatible interface
• Supports 4 transfer modes (control, bulk, interrupt and isochronous)
3.3 ± 0.3
P-TQFP100-1414
Core : 3.3 (TYP.)
P-QFP072-1010
I/O (USB) : 3.3/5
*1 MDDI (Mobile Display Digital Interface) : The serial interface standard developed by QUALCOMM
*2 RSDSTM : Reduced Swing Differential Signaling
*3 EMI : Electro-Magnetic Interference
31
Device_E.book Page 32 Wednesday, July 18, 2007 1:03 PM
LSI
IPs
The IPs contribute to shorter development time, effective use of existing software and improvement in reliability. SHARP is promoting a
comprehensive range of IPs to provide support for top-down design using logic synthesis.
■ CPU Cores
IP
Macro
Function
ARM7TDMI
ARM7TDMI + MMU + 8-Kbyte Cache
ARM922T
ARM9TDMI + MMU + 8-Kbyte I-cache + 8-Kbyte D-cache
ARM946E-S
ARM9E + PU + I-cache (configurable) + D-cache (configurable) + TCM (configurable)
ARM926EJ-S
ARM
32-bit RISC ARM7TDMI CPU Core (16-bit Ins. mode supported)
ARM720T
Data type
Hard Soft
ARM9E + MMU + I-cache (configurable) + D-cache (configurable)
+ TCM (configurable) + Java
■ Peripherals
IP
Macro
Function
Data type
Hard Soft
Bus Interface
PCMCIA1
PCMCIA PC card interface
82365SL
PCMCIA card interface controller
IEEE1284
1284
IEEE 1284 host parallel port
I2C
I2C
I2C bus interface
FDC78
High performance PC compatible floppy disk controller system (82078SL)
765A78
Extended features floppy disk controller core for FM and MFM formats
PCMCIA
FDD-cntl
Microcontroller & Microprocessor
8051
8-bit-cntl
High performance industry compatible 8-bit microcontroller with 2 timers
Microprocessor Peripheral
Synchronous DRAM Controller
SDRAMC
8237A
DMA
General purpose programmable 4-channel DMA controller
Color LCD Controller (TFT, HR-TFT, CSTN, STN, DMTN)
LCDC
PIT
8254
Extended feature 3-channel Programmable Interval Timer (PIT)
RTC
146818
Ultra-low-power real time clock with up to 114 bytes of RAM
PIC
8259A
8-channel cascadable Programmable Interrupt Controller (PIC)
PPI
8255
General purpose Programmable Peripheral Interface (PPI)
Interrupt Controller
INTC
Serial Communication
Universal Serial Bus On The Go Controller Full Speed (12 MHz)/
Low Speed (1.5 MHz)/High Speed (480 MHz)
USB-OTG
USART
8251A
Universal Synchronous/Asynchronous Receiver/Transmitter (USART)
SSP
Synchronous Serial Port
SCC
85C30
Universal Asynchronous Receiver/Transmitter (UART) with FIFO
6402
UART
SCC 2-channel Serial Communications Controller with FIFOs
16550A
Compact Universal Asynchronous Receiver/Transmitter (UART)
■ Analog Cells
IP
Macro
Function
High Speed ADC
12-bit AD/14-bit AD (8 to 32 kHz)
Audio ADC
20-bit AD (44.1 kHz)
High Speed DAC
8-bit DA/9-bit DA (30 MHz)
Voice DAC
10-bit DA (8 to 32 kHz)
Audio DAC
DAC
8-bit AD (80 MHz), 10-bit AD (80 MHz), 6-bit AD (80 MHz)
Voice ADC
ADC
Data type
Hard Soft
20-bit DA (44.1 kHz)
■ Analog PLL (Phase Locked Loop)
IP
Fout : 100 to 200 MHz
PLL
Fout : 200 to 400 MHz
PLL
Fout : 400 to 800 MHz
Fin : 32 kHz, Fout : 33 to 134 MHz
■ Others
IP
Macro
LVDS
32
LVDS Receiver
RSDS
RSDS Transmitter
Function
Input signal : 7-bit 3 ch (6 bits for RGB), 85 MHz (MAX.)
Input signal : 7-bit 4 ch (8 bits for RGB), 85 MHz (MAX.)
Input signal : 8 bits for RGB, 90 MHz (MAX.)
Contact a SHARP sales office about applicable series. A use-fee and license-fee are required for use of the above IPs.
Data type
Hard Soft
Device_E.book Page 33 Wednesday, July 18, 2007 1:03 PM
SMART CARD SYSTEMS
★Under development
■ Smart Cards/LSI Modules for Smart Cards
Communication
standards
Contact
Protocol
Transmission
speed
(kbps) MAX.
ISO/IEC7816
T=1
19.2
ISO/IEC14443-4
ISO/IEC7816
T = 0, 1
Contactless
ISO/IEC14443-4
ISO/IEC7816
T = 0, 1
Contactless
100 000
times
16 bits
100 000
times
32-bit MIPS
76.8
ISO/IEC14443
Type B
RSA, DES, T-DES, etc.
high-speed cryptographic
authentication with built-in
coprocessor,
hardware-based random
number generator
424
Contact
16 bits
76.8
ISO/IEC14443
Type B
100 000
times
424
Contact
Security system
JCOP*
(Under
development)
ISO/IEC14443-4
Smart Card Systems
ISO/IEC14443
Type B
CPU
1 Mbyte
(Flash memory)
Contactless
Cycling
capability
1 Mbyte
(Flash memory)
SJCard 211
Nonvolatile
memory
capacity
1 Mbyte
(Flash memory)
Type
(Under development)
424
SJ card211
JCOP* card
★32-bit MIPS card
• Java CardTM 2.1.1 compliance
• Capable of developing applications
using Java language
• Java CardTM 2.2 compliance
• GP (Global Platform) 2.1.1 compliance
• EMV 2000 compliance
• Capable of developing applications
using Java language
• With built-in 32-bit MIPS on CPU
• Security upgrades thanks to secure
controller, MIPS32TM 4KSdTM
*JCOP : JCOP means IBM's Java Card Open Platform, which was developed by IBM Corporation as an embedded Operating System (OS) for smart cards which
conforms to the standards of Java and Global Platform. This platform ensures the security of applications working on various mobile terminals, such as
a USB key and a smart card suitable for multiple applications.
33
Device_E.book Page 34 Wednesday, July 18, 2007 1:03 PM
LSI
SMART CARD SYSTEMS
■ Reader/Writer for Smart Cards
Model No.
Communication
standard
Host
interface
Transmission speed
between
smart card and RW
(kbps)
Smart card
operation
method
Outline dimensions
WxHxD
(mm)
Mass
(g)
Power
supply
RW-4040
ISO/IEC7816
(T = 0, 1)
USB1.1
9.6 to 153.6
Approx. 65
DC 5 V
(USB
connector)
ISO/IEC7816
(T = 0, 1)
PC card
interface
Type II
10.8 to 344.1
Manual
insertion/
Manual
ejection
70.4 x 14.1 x 60.5
RW-4020
(LR550R03)
Type
54 x 5 x 85.6
Approx. 30
DC 5 V
(PC card
connector)
Contact type
Contact type reader/writer
RW-4040
Contact type reader/writer
RW-4020 (LR550R03)
• High-speed data communication
• Conforms to PC/SC standard
• USB interface
• High-speed data communication
• PC card interface Type II
■ SDK (Software Development Kit) for Smart Cards
SDK type
For SJCard 211
For JCOP
34
Contents
Development kit CD for SJCard
SJCard simulator
Contact type reader/writer (1 set)
Development kit CD for JCOP31id Card
Device_E.book Page 35 Wednesday, July 18, 2007 1:03 PM
LSI
FLASH MEMORIES
■ Highly Functional Flash Memories
● Boot Block Type 3 V Page Mode Flash Memories: LH28FXXXBF Series
LH28F640BFH-PTTL
–40 to 85
LH28F640BFH-PBTL
–40 to 85
LH28F128BFH-PTTL
Bottom boot
x 16
–40 to 85
Top boot
128 M
Model No.
Bottom boot
x 16
Operating
temp. (°C)
Top boot
64 M
Bit
Erasable
block
configuration
size
–40 to 85
Remarks
LH28F128BFH-PBTL
4 Kwords x 8,
32 Kwords x 127
• Built-in dual work function
• Built-in OTP function
[4 words (factory area) +
4 words (user area) ]
Smart Card Systems
Capacity
(bit)
4 Kwords x 8,
32 Kwords x 255
■ Standard Flash Memories
● Boot Block Type 3 V Flash Memories: LH28FXXXBJ Series
Capacity
(bit)
Bit
Erasable
block
configuration
size
Operating
temp. (°C)
0 to 70
Model No.
Remarks
LH28F800BJ-PTTL
Top boot
8M
x 8/
x 16
–40 to 85
4 Kwords x 8,
32 Kwords x 15
(or
8 Kbytes x 8,
64 Kbytes x 15)
LH28F800BJH-PTTL
• Built-in OTP function
[4 words (factory area) +
3 963 words (user area) ]
0 to 70
LH28F800BJ-PBTL
Bottom boot
–40 to 85
16 M
x 8/
x 16
4 Kwords x 8,
32 Kwords x 31
(or
8 Kbytes x 8,
64 Kbytes x 31)
Top boot
LH28F800BJH-PBTL
–40 to 85
LH28F160BJH-PTTL
–
Bottom boot
–40 to 85
LH28F160BJH-PBTL
35
Device_E.book Page 36 Wednesday, July 18, 2007 1:03 PM
LSI
SYSTEM-FLASH
■ Fast-Reprogramming System-Flash for Digital Equipment
Capacity
(bit)
Bit
Erasable
block
configuration
size
Operating
temp. (°C)
Model No.
Remarks
LHF00L24
Top boot
–40 to 85
LHF00L28
16 M
x 16
4 Kwords x 8
+ 32 Kwords x 1,
64 Kwords x 15
LHF00L25
Bottom boot
–40 to 85
LHF00L29
LHF00L08
Top boot
32 M
x 16
–40 to 85
LHF00L10
• Fast-programming
(4-Kword blocks)
• Built-in OTP function
[4 words (factory area) +
4 words (user area) ]
LHF00L14
4 Kwords x 8
+ 32 Kwords x 1,
64 Kwords x 31
LHF00L09
Bottom boot
–40 to 85
LHF00L11
LHF00L15
■ System-Flash for Amusement Products
Capacity
(bit)
Bit
Erasable
block
configuration
size
Operating
temp. (°C)
Model No.
Remarks
32 M
x 16
4 Kwords x 8
+ 32 Kwords x 1,
64 Kwords x 31
Top boot
0 to 70
LHF00L34
• 44 SOP industry standard
package
64 M
x 16
4 Kwords x 8,
32 Kwords x 127
Top boot
0 to 70
LH28F640BF-PTTL
• 44 SOP industry standard
package
256 M
x 16
16 Kwords x 4,
64 Kwords x 255
Top boot
0 to 85
LH28F256BF-PTSL
• 70 SSOP industry standard
package
0 to 70
LH28F512BFBD-PTSL
• Compact FBGA (CSP)
package
0 to 85
LH28F512BFND-PTSL
• 70 SSOP industry standard
package
512 M
36
x 16
16 Kwords x 4,
64 Kwords x 255 x 2
Top/Top boot
Device_E.book Page 37 Wednesday, July 18, 2007 1:03 PM
LSI
SYSTEM-FLASH
■ System-Flash for Automotive Use
32 M
Bit
Erasable
block
configuration
size
x 16
4 Kwords x 8,
32 Kwords x 63
x 16
Operating
temp. (°C)
4 Kwords x 8,
32 Kwords x 127
Top boot
–40 to 85
Remarks
LH28F320BFH-PTTL
LH28F640BFH-PTTL
Top boot
64 M
Model No.
–40 to 85
LH28F640BFH-PBTL
Bottom boot
• Employs copper frame
x 16
4 Kwords x 8,
32 Kwords x 255
x 16
4 Kwords x 8,
x2
32 Kwords x 127
Top/Bottom boot
x 16
4 Kwords x 8,
x2
32 Kwords x 255
Top/Top boot
–40 to 85
128 M
256 M
LH28F128BFH-PTTL
Top boot
LH28F128BFH-PWTL
–40 to 85
LH28F256BFH-PTTL
Flash Memories/
Combination Memories
Capacity
(bit)
■ System-Flash for Network Equipment
Capacity
(bit)
Bit
Erasable
block
configuration
size
Operating
temp. (°C)
Model No.
Remarks
64 M
x 8/
x 16
64 Kwords x 64
or
128 Kbytes x 64
Symmetrical block
–40 to 85
LH28F640SPH-PL
• 56 TSOP industry
standard package
128 M
x 8/
x 16
64 Kwords x 128
or
128 Kbytes x 128
Symmetrical block
–40 to 85
LH28F128SPH-PTL
• 56 TSOP industry
standard package
37
Device_E.book Page 38 Wednesday, July 18, 2007 1:03 PM
LSI
HIGHLY FUNCTIONAL/STANDARD FLASH MEMORIES
■ Highly Functional Flash Memories
Boot Block Type 3 V Page Mode Flash Memories: LH28FXXXBF Series
Supply
voltage
Capacity
Bit
(bit) configuration
64 M
128 M
x 16
x 16
64 M : VCC = 2.7 to 3.6 V, VPP = 1.65 to 3.6 V or 9.0 to 10.0 V
128 M : VCC = 2.7 to 3.6 V, VPP = 2.7 to 3.6 V or 9.0 to 10.0 V
Erasable
block size
Parameter :
4 Kwords x 8
Main :
32 Kwords x 127
Model No.
Top
boot
Bottom
boot
Top
Parameter : 4 Kwords x 8 boot
Main : 32 Kwords x 255 Bottom
boot
Page mode Read current Standby Operating
Access time
(mA) MAX. current
temp.
access time
(ns) MAX.
f = 5 MHz (µA) MAX.
(°C)
(ns) MAX.
(CMOS)
(CMOS)
P-TSOP048-1220
(Normal bend)
LH28F640BFHE-PTTLHFA
70
30
25
Package
20
TFBGA048-0808
LH28F640BFHG-PTTL70A
LH28F640BFHE/G-PBTL70A
70
30
25
20
LH28F128BFHT/B-PTTL75A
75
25
35
40
LH28F128BFHT/B-PBTL75A
75
25
35
P-TSOP048-1220
–40 to 85 (Normal bend)/
TFBGA048-0808
40
P-TSOP056-1420
(Normal bend)/
LFBGA072-0811
Contact a SHARP sales office for other packages and top boot/bottom boot models other than those listed above.
■ Standard Flash Memories
Boot Block Type 3 V Flash Memories: LH28FXXXBJ Series
Supply voltage
Capacity
Bit
(bit) configuration
8M
x 8/
x 16
VCC = 2.7 to 3.6 V, VCCW = 2.7 to 3.6 V or 11.7 to 12.3 V
Erasable
block size
Boot :
Top
4 Kwords (8 Kbytes) x 2
boot
Parameter :
4 Kwords (8 Kbytes) x 6
Main :
Bottom
32 Kwords (64 Kbytes) x 15 boot
Model No.
Read current Standby Operating
Access time (mA) MAX.
current
temp.
f = 5 MHz (µA) MAX.
(ns) MAX.
(°C)
(CMOS)
(CMOS)
LH28F800BJE-PTTL90
0 to 70
90
25
15
LH28F800BJHE-PTTL90
–40 to 85
LH28F800BJE-PBTL90
0 to 70
90
25
P-TSOP048-1220
(Normal bend)
15
LH28F800BJHE-PBTL90
Top
Boot : 4 Kwords (8 Kbytes) x 2
25
70
LH28F160BJHE-PTTL70
x 8/ Parameter :
boot
16 M
Bottom
x 16 4 Kwords (8 Kbytes) x 6
70
25
LH28F160BJHE-PBTL70
Main : 32 Kwords (64 Kbytes) x 31 boot
Contact a SHARP sales office for other packages and top boot/bottom boot models other than those listed above.
38
Package
–40 to 85
15
–40 to 85
15
–40 to 85
P-TSOP048-1220
(Normal bend)
Device_E.book Page 39 Wednesday, July 18, 2007 1:03 PM
SYSTEM-FLASH
■ Fast-Reprogramming System-Flash for Digital Equipment
Capacity
Bit
(bit) configuration
16 M
x 16
VCC = 2.7 to 3.6 V, VPP = 11.7 to 12.3 V
Erasable
block size
Parameter :
4 Kwords x 8
+ 32 Kwords x 1
Main :
64 Kwords x 15
Model No.
Top
boot
Bottom
boot
Read current Standby
4-Kword
Access time
(mA) MAX.
current
programming
(ns) MAX.
f = 5 MHz (µA) MAX.
time (s)
(CMOS)
(CMOS)
Operating
temp.
(°C)
LHF00L24
Package
TFBGA048-0608
70
0.31
17
10
–40 to 85
70
0.31
17
10
–40 to 85
LHF00L28
LHF00L25
P-TSOP048-1220
(Normal bend)
TFBGA048-0608
32 M
x 16
Parameter :
4 Kwords x 8
+ 32 Kwords x 1
Main :
64 Kwords x 31
P-TSOP048-1220
(Normal bend)
LHF00L08
Top
boot
LHF00L29
TFBGA048-0608
LHF00L10
90
0.31
10
17
–40 to 85
TFBGA048-0707
LHF00L14
LHF00L09
Bottom
boot
P-TSOP048-1220
(Normal bend)
TFBGA048-0608
LHF00L11
90
0.31
10
17
–40 to 85
TFBGA048-0707
P-TSOP048-1220
(Normal bend)
LHF00L15
Contact a SHARP sales office for other packages and top boot/bottom boot models other than those listed above.
Flash Memories/
Combination Memories
Supply voltage
■ System-Flash for Amusement Products
Supply voltage
Capacity
Bit
(bit) configuration
32 M/64 M : VCC = 2.7 to 3.6 V
256 M/512 M : VCC = 1.7 to 1.95 V, VCCQ = 2.7 to 3.6 V, VPP = 0.9 to 1.95 V or 8.5 to 9.5 V
Erasable
block size
Model No.
Read
Standby
Operating
Access time Page mode current
(mA) MAX. current
access time
(µA) MAX. temp.
(ns) MAX.
f = 5 MHz
(ns) MAX.
(°C)
(CMOS)
(CMOS)
Package
32 M
x 16
Parameter :
4 Kwords x 8
+ 32 Kwords x 1
Main :
64 Kwords x 31
Top
boot
LHF00L34
90
–
17
10
0 to 70
P-SOP044-0600
64 M
x 16
Parameter :
4 Kwords x 8
Main :
32 Kwords x 127
Top
boot
LH28F640BFN-PTTLZ1A
90
35
25
25
0 to 70
P-SOP044-0600
256 M
x 16
Parameter :
16 Kwords x 4
Main :
64 Kwords x 255
Top
boot
LH28F256BFN-PTSLZ2
100
25
22
60
0 to 85
P-SSOP070-0500
LH28F512BFBD-PTSLZ4
85
0 to 70
LFBGA072-0811
LH28F512BFBD-PTSLZ2
90
25
22
120
LH28F512BFND-PTSLZ1
100
0 to 85
P-SSOP070-0500
512 M
x 16
Parameter :
Top/
16 Kwords x 4
x 2 Top
Main :
boot
64 Kwords x 255
Contact a SHARP sales office for other packages and top boot/bottom boot models other than those listed above.
39
Device_E.book Page 40 Wednesday, July 18, 2007 1:03 PM
LSI
SYSTEM-FLASH
■ System-Flash for Automotive Use
Supply voltage
Capacity
Bit
(bit) configuration
32 M
64 M
128 M
256 M
x 16
x 16
x 16
x 16
VCC = 2.7 to 3.6 V, VCCQ = 2.7 to 3.6 V
Erasable
block size
Model No.
Parameter :
Top
4 Kwords x 8
Main :
boot
32 Kwords x 63
Parameter :
Top
4 Kwords x 8
Main :
boot
32 Kwords x 127
Parameter :
Bottom
4 Kwords x 8
Main :
boot
32 Kwords x 127
Parameter :
Top
4 Kwords x 8
Main :
boot
32 Kwords x 255
Parameter :
Top/
4 Kwords x 8
x 2 Bottom
Main :
boot
32 Kwords x 127
Parameter :
Top/
4 Kwords x 8
x2
Top
Main :
boot
32 Kwords x 255
Page
Read
Standby
Access mode current
current Operating
time
access
(mA)
temp.
(µA)
(ns)
time
MAX.
(°C)
MAX.
MAX.
(ns) f = 5 MHz
(CMOS)
MAX. (CMOS)
LH28F320BFHE-PTTLE0
70
25
25
20
–40 to 85
LH28F640BFHE-PTTLH1A
70
30
25
20
Package
P-TSOP048-1220
(Normal bend)
–40 to 85
P-TSOP048-1220
(Normal bend)
LH28F640BFHE-PBTLHK
70
30
25
20
–40 to 85
LH28F128BFHT-PTTLT1A
75
25
35
40
–40 to 85
P-TSOP056-1420
(Normal bend)
LH28F128BFHED-PWTLT2
70
30
25
40
–40 to 85
P-TSOP048-1220
(Normal bend)
LH28F256BFHTD-PTTLZ3
75
25
40
80
–40 to 85
P-TSOP056-1420
(Normal bend)
■ System-Flash for Network Equipment
Supply voltage
Capacity
Bit
(bit) configuration
VCC = 2.7 to 3.6 V,
VPP = 2.7 to 3.6 V or 9.0 to 10.0 V
Erasable
block size
Model No.
Page
Read
Standby
Access mode current
current Operating
access
time
(mA)
temp.
(µA)
time
(ns)
MAX.
(°C)
MAX.
(ns) f = 5 MHz
MAX.
(CMOS)
MAX. (CMOS)
Package
64 M
64 Kwords x 64
or
128 Kbytes x 64
Symmetrical
block
LH28F640SPHT-PL12B
120
25
15
120
–40 to 85 P-TSOP056-1420
128 M
40
x 8/
x 16
x 8/
x 16
64 Kwords x 128
or
128 Kbytes x 128
Symmetrical
block
LH28F128SPHT-PTL12B
120
25
15
120
–40 to 85 P-TSOP056-1420
Device_E.book Page 41 Wednesday, July 18, 2007 1:03 PM
COMBINATION MEMORIES
★Under development
■ Boot Block Type Flash Memory + Pseudo SRAM
● 1.8 V models with 1.8 V I/O voltage
LRS1890A
Bottom boot
LRS18A6
LRS1897
LRS18CCA
LRS18CP
Capacity (bit)
[Bit configuration]
Access time (ns) MAX.
Supply voltage (V)
Flash memory
Pseudo SRAM
Flash
Pseudo
Flash Pseudo
I/O
SRAM
Synchronous Random
Page
Synchronous memory
memory SRAM Random Page
voltage
mode
mode
burst mode
mode
mode
burst mode core voltage core voltage
256 M
[x 16]
64 M [x 16]
1.7 to 1.95 1.7 to 1.95 1.7 to 1.95 LFBGA072-0811
85
25
–
70
20
–
128 M [x 16]
Bottom/Top
512 M [x 16] 128 M [x 16]
boot
Bottom/Top/
740 M [x 16] 256 M [x 16]
Bottom boot
Bottom boot 128 M [x 16] 64 M [x 16]
Package
1.7 to 1.9 2.7 to 3.1 1.7 to 1.9
85
25
–
70
20
93
25
52 MHz
70
20
85
25
–
70
20
–
LFBGA072-0811
1.7 to 1.9 2.7 to 3.1 1.7 to 1.9
LFBGA072-0811
83 MHz 1.7 to 1.95 1.7 to 1.95 1.7 to 1.95 LFBGA088-0912
–
1.7 to 1.95 1.7 to 1.95 1.7 to 1.95 LFBGA072-0811
● 1.8 V models with 3 V I/O voltage
Model No.
Flash memory
block
configuration
LRS18CJ
Supply voltage (V)
Bottom boot
LRS18BK
Access time (ns) MAX.
Top boot
LRS18CK
Capacity (bit)
[Bit configuration]
Flash Memories/
Combination Memories
Model No.
Flash memory
block
configuration
Top boot
Flash memory
Pseudo SRAM
Flash
Pseudo
Flash Pseudo
I/O
SRAM
Synchronous Random
Page
Synchronous memory
memory SRAM Random Page
voltage
mode
burst mode
mode
mode
burst mode core voltage core voltage
mode
64 M [x 16] 16 M [x 16]
LRS18BL
128 M
[x 16]
★LRS18C8C
LRS18BN
256 M
[x 16]
LRS18B0*
25
–
65
20
–
1.7 to 1.95 2.7 to 3.1 2.7 to 3.1
54 MHz
85
25
LFBGA072-0811
LFBGA088-0811
65
20
–
1.7 to 1.95 2.7 to 3.1 2.7 to 3.1
–
64 M
[x 16]
LFBGA072-0811
54 MHz
64 M [x 16]
Bottom boot
LRS18AZ*
32 M
[x 16]
85
Package
LFBGA088-0811
54 MHz
85
25
LFBGA088-0811
65
20
–
1.7 to 1.95 2.7 to 3.1 2.7 to 3.1
–
LFBGA072-0811
* This flash memory is divided into two banks, each including an enable signal.
● 3 V models with 3 V I/O voltage
Model No.
LRS18BT
Flash memory
block
configuration
Capacity (bit)
[Bit configuration]
Bottom boot
LRS18831
Top boot
LRS18841
Bottom boot
Package
85
–
–
85
–
–
2.7 to 3.1 2.7 to 3.1 2.7 to 3.1 LFBGA072-0811
16 M
[x 16]
Top boot
LRS1872A
Supply voltage (V)
Flash memory
Pseudo SRAM
Flash
Pseudo
Flash Pseudo
I/O
memory
SRAM
Page
Page
memory SRAM Random mode Synchronous Random mode Synchronous core voltage core voltage voltage
burst mode
mode
burst mode
mode
Bottom boot 32 M [x 16] 8 M [x 16]
LRS1871A
Access time (ns) MAX.
85
35
–
85
–
–
2.7 to 3.3 2.7 to 3.1 2.7 to 3.1 LFBGA072-0811
32 M
[x 16]
70
35
–
60
–
–
2.7 to 3.1 2.7 to 3.1 2.7 to 3.1 LFBGA072-0811
64 M
[x 16]
41
Device_E.book Page 42 Wednesday, July 18, 2007 1:03 PM
REG
POWER DEVICES
■ Low Power-Loss Voltage Regulators
● TO-220 type
(Ta = 25°C)
PQxxRD08J00H series
PQ3RD083J00H
ASO protection function
0.8
20 1.25 10
Low dissipation current at
OFF state (Iqs : 1µA (MAX.))
ASO protection function
PQxxxRDA1SZH series
PQxxxRDA2SZH series
ASO protection function,
low dissipation current at
OFF state (Iqs : 5 µA (MAX.))
PQ3RD13J000H
35
1.5
5, 9, 12
ASO protection function
PQxxxEF02SZH series
20
15
1.4
24
5, 8, 9, 12
Minimum operating input
voltage : 2.35 V (4 terminals)
PQxxRF21J00H series
PQ070XF01SZH
PQ070XF02SZH
PQ070VK01FZH
PQ070VK02FZH
15
PQ15RW08J00H
PQ15RW11J00H
35
PQ15RW21J00H
1.5
PQ150VB01FZH
PQ150VB02FZH
PQ7RV4J0000H
*1
*2
*3
*4
*5
*6
*7
42
1.4
Low dissipation
current at OFF state
Lead forming
available
Variable output
voltage
ࠗ
ࠗ
ࠗ
ࠗ
A
ࠗ
ࠗ
ࠗ
ࠗ
A
ࠗ
ࠗ
ࠗ
ࠗ
B
ࠗ
ࠗ
ࠗ
ࠗ
B
ࠗ
ࠗ
ࠗ
A
ࠗ
ࠗ
ࠗ
A
ࠗ
ࠗ
ࠗ
ࠗ
ࠗ
ࠗ
ࠗ
ࠗ
ࠗ
ࠗ
ࠗ
A
ࠗ
ࠗ
ࠗ
A
ࠗ
ࠗ
ࠗ
ࠗ
ࠗ
ࠗ
E
ࠗ
ࠗ
ࠗ
ࠗ
ࠗ
E
ࠗ
ࠗ
ࠗ
A
ࠗ
ࠗ
ࠗ
A
ࠗ
ࠗ
ࠗ
A
ࠗ
ࠗ
ࠗ
A
ࠗ
ࠗ
ࠗ
ࠗ
ࠗ
C
ࠗ
ࠗ
ࠗ
ࠗ
ࠗ
C
ࠗ
ࠗ
ࠗ
ࠗ
E
ࠗ
ࠗ
ࠗ
ࠗ
E
1.5, 1.8,
2.5, 3.3
15
High output current
±3
3.3
±2.5
1.8
3.5
0.5
1
10
2
1.4
15 1.5 to 7
1
±2*4
2
1.25 10
0.8
1
20
1.4
15 3.0 to 15
2
–
–
±2.5*4
0.5
24
10 3.0 to 20
1.25
1
17
12.5 1.5 to 15
2
15
1
1.5
PQ30RV21J00H
PQ30RV31J00H
ࠗ
18
PQ30RV11J00H
A
ࠗ
ࠗ
1.5
Overheat shutdown circuit,
minimum operating input
voltage : 2.35 V (5 terminals)
ࠗ
A
ࠗ
35
General purpose
Variable output voltage,
output ON/OFF control
A
ࠗ
ࠗ
5, 9, 12
ASO protection function
PQ20RX11J00H
ࠗ
ࠗ
5, 9, 12
2
PQ20RX05J00H
ࠗ
B
±3
3.3
PQ150RWA2SZH
ࠗ
ࠗ
A
ࠗ
±2.5
18
20
ASO protection function
ASO protection function,
minimum operating input
voltage : 3.5 V
ࠗ
ࠗ
±2.5
1.5
Minimum operating input
voltage : 2.35 V (5 terminals)
ࠗ
3.3, 5, 9, 12
1
General purpose
Minimum operating input
voltage : 2.35 V (4 terminals)
ࠗ
ࠗ
1.4
10
2
PQ3RF23J000H
PQ3RF33J000H
A
ࠗ
Package
shape
type*7
ࠗ
–
20
PQ3RD23J000H
PQxxRD21J00H series
ࠗ
ࠗ
ࠗ
±3
ࠗ
Package
3.3
–
2
1
PQxxRF11J00H series
PQxxRH11J00H series
1
A
ࠗ
±2.5
ࠗ
ࠗ
±3
6.3
PQxxRD11J00H series
PQxxxEF01SZH series
3.3
ࠗ
ࠗ
5, 9, 12
PQ6RD083J00H
PQxxRA11J00H series
ࠗ
Power
Output Input
Output Output Dropout
dissipation
current voltage
voltage voltage voltage
(W)
Io
Vin
Vo*3 precision VI-O*5
(A)
(V)
(V) TYP.
(%)
(V)
Pd*1 Pd*2
ON/OFF control
Features
Built-in functions
Overcurrent
protection
Model No.
Electrical characteristics
Overheat
protection
Absolute maximum ratings
2
35
2
4.6
10
1.8
ࠗ
B
B
TO-220
B
ࠗ
ࠗ o*6
ࠗ
ࠗ
B
6
ࠗ
ࠗ o*
ࠗ
ࠗ
B
20
ࠗ
ࠗ o*6
ࠗ
ࠗ
B
18 1.5 to 7
ࠗ
ࠗ o*
ࠗ
18 1.5 to 30
Variable output voltage
3
±2*4
A
6
At self-cooling
With infinite heat sink attached
The xx/xxx in the model No. refer to the output voltage values of the model (e.g. 05/050 for 5 V, 12/120 for 12 V, 015 for 1.5 V).
Reference voltage accuracy
Current ratings are defined individually.
o : Available by adding circuit
Refer to page 65
B
Device_E.book Page 43 Wednesday, July 18, 2007 1:03 PM
POWER DEVICES
● High output current type [TO-220 high heat radiation type, TO-3P type]
5
7
1.6
1.5 to 5
45
±1*3
0.5
7.5
ࠗ
ࠗ
ࠗ
ࠗ
ࠗ
ࠗ
ࠗ
Package
TO-220
ࠗ (heat sink
exposure)
ࠗ
At self-cooling
With infinite heat sink attached
Reference voltage accuracy
Current ratings are defined individually.
● Low output current type [TO-92 type]
(Ta = 25°C)
Features
Power
Output Input
Output Output Dropout
dissipacurrent voltage
voltage voltage voltage
tion
Io
Vin
Vo
precision VI-O
Pd*1
(A)
(V)
(V) TYP. (%)
(V)
(W)
PQ033ES1MXPQ
PQ050ES1MXPQ
PQ033ES3MXPQ
16
5
Low output current type with general purpose
TO-92 package (for auxiliary power supply)
3.3
9
5
Package
ࠗ
±2
0.52
0.3
PQ050ES3MXPQ
0.4
(Io = 150 ࠗ
mA)
3.3
0.15
Overcurrent
protection
Model No.
Electrical characteristics
Built-in
functions
Overheat
protection
Absolute maximum
ratings
Power Devices/
Analog ICs
3.5
High output current,
minimum operating input
voltage : 2.35 V
PQ5EV7J0000H
*1
*2
*3
*4
Pd*2
Variable output
voltage
PQ5EV5J0000H
Output Output Dropout
voltage voltage voltage
Vo
precision VI-O*4
(V)
(%)
(V)
ࠗ
ࠗ
Power
dissipation
(W)
ON/OFF control
ࠗ
Output Input
current voltage
Io
Vin
(A)
(V)
Pd*1
PQ5EV3J0000H
Built-in functions
Overcurrent
protection
Features
Model No.
(Ta = 25°C)
Electrical characteristics
Overheat
protection
Absolute maximum ratings
TO-92
0.7
(Io = 300 ࠗ
mA)
ࠗ
*1 At self-cooling
43
Device_E.book Page 44 Wednesday, July 18, 2007 1:03 PM
REG
POWER DEVICES
✩New product
■ Surface Mount Type Low Power-Loss Voltage Regulators
● SOT-23-5 type
(Ta = 25°C)
Absolute maximum
ratings
1.8, 2.5, 2.8, 3.0,
3.3, 3.5, 5.0
0.35
ࠗ
ࠗ
ࠗ
ࠗ
ࠗ
ࠗ
ࠗ
ࠗ SOT-23-5
ࠗ
*3
0.18
± 2.0
(3.0 V
output)
*4
16
Low dissipation
current at OFF state
PQ1XAxx1MZPH series
Compact,
ceramic capacitor compatible
Compact, ceramic capacitor
compatible, high reliability
Output Dropout
voltage voltage
precision
VI-O
(%)
(V)
Output voltage
Vo*2
(V) TYP.
ON/OFF control
PQ1Xxx1M2ZPH series
Compact, low output current
Power
Input
Output
dissipavoltage
current
tion
Vin
Io
Pd*1
(V)
(A)
(W)
Overcurrent
protection
PQ1Uxx1M2ZPH series
Features
Built-in functions
Overheat
protection
Model No.
Electrical characteristics
ࠗ
ࠗ
ࠗ
± 2.0
9
0.26
(Io =
60 mA)
Package
*1 When mounted on a board
*2 The xx in the model No. refer to the output voltage values of the model (e.g. 50 for 5.0 V, 18 for 1.8 V).
*3 1.5, 1.8, 2.5, 2.6, 2.7, 2.8, 2.9, 3.0, 3.3, 3.5, 3.7, 4.0, 4.5, 5.0
*4 1.5, 1.8, 2.5, 3.0, 3.3, 5.0
● SOT-23L type
(Ta = 25°C)
PQ1KAxx3MZPH series
–
16
9
Output
voltage
Vo*2
(V) TYP.
0.18
0.4
0.3
–
15
Output Dropout
voltage voltage
precision
VI-O
(%)
(V)
± 2.7
0.26
ࠗ
(3.0 V output) (Io = 60 mA)
*3
1.8, 2.5, 3.0,
± 2.0
0.7
ࠗ
3.3, 3.6, 5.0
(3.0 V (Io =
1.5, 1.8, 2.5,
output) 300 mA) ࠗ
3.3, 5.0, 9.0
Low dissipation
current at OFF state
PQ1Kxx3M2ZPH series
Compact, surface mount type, low dissipation
current at OFF state (Iqs : 0.1 µA (MAX.))
Compact, surface mount type, high ripple
rejection, output current of up to 300 mA
Compact, surface mount type, output current
of up to 300 mA, ceramic capacitor compatible
Power
Output Input
Output
dissipacurrent voltage
current
tion
Vin
Io
Io
Pd*1
(V)
(A)
(A)
(W)
ON/OFF control
PQ1RxxJ0000H series
Features
Built-in functions
Overheat
protection
Model No.
Electrical characteristics
Overcurrent
protection
Absolute maximum
ratings
ࠗ
ࠗ
ࠗ
ࠗ
ࠗ
ࠗ SOT-23L
ࠗ
ࠗ
ࠗ
Package
*1 When mounted on a board
*2 The xx in the model No. refer to the output voltage values of the model (e.g. 25 for 2.5 V, 47 for 4.7 V, 50 for 5.0 V).
*3 1.8, 2.0, 2.3, 2.5, 2.7, 2.8, 2.9, 3.0, 3.2, 3.3, 3.4, 3.5, 3.7, 3.8, 4.0, 4.2, 4.4, 4.7, 4.9, 5.0, 5.2
● SOT-89 type
(Ta = 25°C)
PQ1LAxx5MSP series
PQ1LAX95MSPQ
PQ1Mxx5M2SPQ
PQ1MX55M2SPQ
PQ1Nxx3MxSPQ
✩PQ1MGxx8MSPQ
✩PQ1MGX38MSPQ
PQ2Lxxx2MSPQ
44
*1
*2
*3
*4
*5
*6
16
ࠗ
1.5, 1.8, 2.5,
3.0, 3.2, 3.3,
5.0
Output Dropout
voltage voltage
precision VI-O*3
(%)
(V)
± 2.0
(3.0 V
1.5, 1.8, 2.5, output)
3.3, 5.0, 9.0
0.3
15
0.7
ࠗ
ࠗ
ࠗ
ࠗ
ࠗ
ࠗ
ࠗ
ࠗ
0.8
0.25/ch
ࠗ
± 2.0*6
ࠗ
ࠗ
ࠗ
1.8, 2.5,
3.3, 5.0
± 2.0
(5.0 V output)
ࠗ
ࠗ
ࠗ
1.3 to 5.0
± 2.0*6
ࠗ
ࠗ
ࠗ
± 2.0
ࠗ
ࠗ
± 2.0
–
ࠗ
ࠗ
0.5 to 3.5
0.35
ࠗ
0.8, 1.0, 1.2
9
ࠗ
2.5, 3.3
0.9
± 2.0
1.5 to 9.0
0.5
1.5, 1.8, 2.5,
3.3, 5.0
± 2.0
–
ࠗ
ࠗ
*5
–
0.4
ࠗ
ࠗ
Variable output
voltage
Output
voltage
Vo*2
(V) TYP.
Low dissipation
current at OFF state
PQ1LAxx3MSPQ
Compact, high radiation package,
low dissipation current at OFF state
(Iqs : 1 µA (MAX.))
Compact, high radiation package,
low dissipation current at OFF state
(Iqs : 1 µA (MAX.)), ceramic
capacitor compatible
Compact, high radiation package,
ceramic capacitor compatible
Ceramic capacitor compatible,
variable output voltage
Compact, high output current,
ceramic capacitor compatible
Ceramic capacitor compatible,
variable output voltage
Reset signal output function*4,
ceramic capacitor compatible
Compact,
ceramic capacitor compatible
Compact, ceramic capacitor
compatible, variable output type
Compact, high radiation package,
2 outputs
Power
Output Input
dissipacurrent voltage
tion
Io
Vin
Pd*1
(A)
(V)
(W)
ON/OFF control
PQ1Lxx3M2SPQ
Features
Built-in functions
Overcurrent
protection
Model No.
Electrical characteristics
Overheat
protection
Absolute maximum
ratings
0.7
ࠗ
SOT-89
ࠗ
6
9
When mounted on a board
The xx in the model No. refer to the output voltage values of the model (e.g. 25 for 2.5 V, 50 for 5.0 V). [Except PQ2Lxxx2MSPQ]
Current ratings are defined individually.
Reset detection voltage : 4.2 V, 3.8 V
Output voltage combination : 3.3/3.3 V, 3.3/2.5 V, 3.3/1.8 V, 3.3/1.5 V, 2.5/1.8 V, 2.5/1.5 V
Reference voltage accuracy
Package
ࠗ
Device_E.book Page 45 Wednesday, July 18, 2007 1:03 PM
POWER DEVICES
★Under development
● SC-63 type
⅜
⅜
⅜
⅜
⅜
Low dissipation
current at OFF state
Variable output
voltage
⅜
⅜
F
⅜
⅜
F
⅜
⅜
⅜
F
⅜
⅜
⅜
⅜
F
⅜
⅜
⅜
⅜
⅜
F
⅜
⅜
⅜
⅜
⅜
G
⅜
⅜
⅜
⅜
⅜
F
⅜
⅜
⅜
⅜
⅜
F
⅜
⅜
⅜
⅜
⅜
F
⅜
⅜
⅜
⅜
⅜
G
⅜
⅜
⅜
⅜
⅜
G
⅜
⅜
⅜
⅜
⅜
G
–
⅜
⅜
⅜
⅜
⅜
1.0
⅜
⅜
⅜
⅜
⅜
F
0.5
⅜
⅜
⅜
⅜
⅜
F
⅜
⅜
⅜
⅜
⅜
F
⅜
⅜
⅜
⅜
⅜
F
⅜
⅜
⅜
G
⅜
⅜
⅜
G
⅜
⅜
⅜
G
⅜
⅜
⅜
⅜
⅜
⅜
F
⅜
⅜
⅜
⅜
⅜
⅜
F
⅜
⅜
⅜
⅜
⅜
⅜
G
⅜
⅜
Package
shape
type*6
⅜
⅜
⅜
⅜
⅜
G
⅜
⅜
⅜
⅜
⅜
⅜
G
⅜
⅜
⅜
⅜
⅜
G
1.5 to 7 ±2.0*3
10
⅜
PQ3DZ53J000H
⅜
ON/OFF control
⅜
Package
Taped package
Reset signal generation function
(input voltage drop detection)
Overcurrent
protection
PQ07VR5MAPH series
Features
Built-in functions
Overheat protection
Model No.
(Ta = 25°C)
Absolute maximum ratings Electrical characteristics
Output
current
Power Output Output
Input
Dropout
IO
dissi- voltage voltage
voltage
voltage
(A)
pation VO*2 preciVin
VI-O*5
Pd*1
(V)
sion
(V)
(V)
(W)
TYP.
(%)
0.5 1 1.5
⅜
PQ3DZ13J000H
PQxxDZ51J00H series
⅜
ASO protection function, low dissipation current at OFF state (Iqs:
5 mA (MAX.))
⅜
⅜
PQxxDZ11J00H series
Ceramic capacitor compatible,
ASO protection function, low disPQxxxDNA1ZPH series sipation current at OFF state (Iqs:
5 mA (MAX.)), solder dip compatible lead shape
Low dissipation current at OFF
PQxxxDZ01ZPH series
state (Iqs: 5 µA (MAX.))
PQxxxEZ5MZPH series
PQxxxEZ01ZPH series
Minimum operating input voltage:
2.35 V
5, 9, 12
24
±3.0
3.3, 5,
8, 9, 12
⅜
0.5
⅜
9, 10
3.3, 5
⅜
1.5, 1.8,
2.5, 3.0, ±2.5*4
3.3
⅜
Minimum operating input voltage:
PQxxxEN01ZPH series 2.35 V, solder dip compatible lead
shape
⅜
PQxxxENA1ZPH series
⅜
Minimum operating input voltage:
2.35 V, ceramic capacitor compat★PQxxxENA1ZPH series
ible, solder dip compatible lead
shape
PQxxxENAHZPH series
PQxxxEZ1HZPH series
10
⅜
⅜
⅜
Minimum operating input voltage:
2.35 V
⅜
(2 A)
PQxxxEZ02ZPH series
PQxxxFZ5MZPH series
PQxxxFZ01ZPH series
Minimum operating input voltage:
1.7 V (Dual power supply type)
⅜
3.7
PQ070XZ5MZPH series
PQ070XZ01ZPH
PQ070XN01ZPH
PQ070XNA1ZPH
PQ070XNAHZPH
★PQ070XNB1ZPH
Minimum operating input voltage:
2.35 V, solder dip compatible lead
shape
Minimum operating input voltage:
2.35 V, ceramic capacitor compatible, solder dip compatible lead
shape
±30
mV
SC-63
G
–
⅜
5.5
⅜
Minimum operating input voltage:
1.1 V (Dual power supply type),
ceramic capacitor compatible,
solder dip compatible lead shape
Minimum operating input voltage:
2.35 V
1.0, 1.2
⅜
PQxxxGN01ZPH series Minimum operating input voltage:
1.7 V (Dual power supply type),
ceramic capacitor compatible, solPQxxxGN1HZPH series der dip compatible lead shape
★PQxxxGM02ZPH
8
1.5, 1.8,
±2.5
2.5, 3.3
1.2, 1.5,
1.8, 2.5, ±2.0
3.3
1.5, 1.8,
–
2.5, 3.3
1.5, 1.8,
2.5, 3.0,
3.3 ±2.5*4
1.5, 1.8,
2.5
Power Devices/
Analog ICs
3.3
–
0.8, 1.0,
1.2
⅜
(2 A)
±2.0
0.3
⅜
⅜
±2.0*3
0.5
⅜
10
1.5 to 7
⅜
⅜
–
–
⅜
±2.0
*1 With infinite heat sink attached
*2 The xx/xxx in the model No. refer to the output voltage values of the model (e.g. 033 for 3.3 V, 05/050 for 5 V, 12/120 for 12 V).
*3 Reference voltage accuracy
*4 The value is defined as ± 50 mV in some models.
*5 Current ratings are defined individually.
*6 Refer to page 65
45
Device_E.book Page 46 Wednesday, July 18, 2007 1:03 PM
REG
POWER DEVICES
★Under development
● SC-63 type (cont’d)
PQ015YZ01ZPH
PQ035ZN01ZPH
PQ035ZN1HZPH
★PQ035ZM02ZPH
PQ20VZ51J00H
PQ20VZ11J00H
PQ20WZ51J00H
PQ20WZ11J00H
PQ200WNA1ZPH
PQ200WN3MZPH
⅜
Reference voltage (Vref): 1.0 V,
minimum operating input voltage:
1.7 V (Dual power supply type)
⅜
Reference voltage (Vref): 0.6 V,
minimum operating input voltage:
1.7 V (Dual power supply type),
ceramic capacitor compatible,
solder dip compatible lead shape
Minimum operating input voltage:
1.1 V (Dual power supply type),
ceramic capacitor compatible,
solder dip compatible lead shape
Minimum operating input voltage:
4.5 V
⅜
⅜
⅜
⅜
⅜
F
0.5
⅜
⅜
⅜
⅜
⅜
⅜
F
⅜
⅜
⅜
⅜
F
⅜
⅜
⅜
⅜
F
⅜
⅜
⅜
⅜
G
⅜
⅜
⅜
⅜
G
⅜
⅜
⅜
G
⅜
⅜
⅜
⅜
⅜
⅜
⅜
⅜
⅜
⅜
⅜
⅜
F
⅜
⅜
⅜
⅜
⅜
⅜
F
⅜
⅜
⅜
⅜
⅜
⅜
F
⅜
⅜
⅜
⅜
⅜
⅜
1.0 to
±3.0*3
1.5
3.7
–
±30
mV
5.5
⅜
0.8 to
3.5
⅜
(2 A)
±2.0
8
⅜
0.3
1.5 to
±2.0*3
20
⅜
Minimum operating input voltage: ⅜
3.5 V, ASO protection function,
low dissipation current at OFF
⅜
state (Iqs: 5 µA (MAX.))
3.0 to
±2.5*3
20
24
SC-63
F
0.5
3.0 to
20
±2.5*3
6.8
5.0 to
20
G
⅜
⅜
⅜
*1 With infinite heat sink attached
*2 The xx/xxx in the model No. refer to the output voltage values of the model (e.g. 033 for 3.3 V, 05/050 for 5 V, 12/120 for 12 V).
*3 Reference voltage accuracy
*4 The value is defined as ± 50 mV in some models.
*5 Current ratings are defined individually.
46
Low dissipation
current at OFF state
Variable output
voltage
⅜
Package
1.5 to 7 ±2.0*3
10
⅜
Minimum operating input voltage:
3.5 V, ASO protection function,
low dissipation current at OFF
⅜
state (Iqs: 5 µA (MAX.)) ceramic
capacitor compatible, solder dip
compatible lead shape
Minimum operating input voltage:
3.5 V, low dissipation current at
⅜
OFF state (Iqs: 5 µA (MAX.)),
(0.3)
ceramic capacitor compatible,
current limit: 800 mA
Taped package
PQ015YZ5MZPH
⅜
(2 A)
ON/OFF control
PQ070XZ02ZPH
Package
shape
type*6
1.0
⅜
Minimum operating input voltage:
2.35 V
Overcurrent
protection
PQ070XZ1HZPH
Features
Built-in functions
Overheat protection
Model No.
(Ta = 25°C)
Absolute maximum ratings Electrical characteristics
Output
current
Power Output Output
Input
Dropout
IO
dissi- voltage voltage
voltage
voltage
(A)
pation VO*2 preciVin
VI-O*5
Pd*1
(V)
sion
(V)
(V)
(W)
TYP.
(%)
0.5 1 1.5
⅜
⅜
⅜
*6 Refer to page 65
Device_E.book Page 47 Wednesday, July 18, 2007 1:03 PM
POWER DEVICES
● TO-263 type
(Ta = 25°C)
ࠗ
ࠗ
ࠗ
1.5 to 5
1.0*3
ࠗ
ࠗ
ࠗ
ࠗ
1.5, 2.5,
3.3
1.0
ࠗ
ࠗ
ࠗ
ࠗ
1.0*3
ࠗ
ࠗ
ࠗ
ࠗ
ࠗ
ࠗ
ࠗ
ࠗ
1.5 to 7 ±2.0*3
ࠗ
ࠗ
ࠗ
ࠗ
1.5, 1.8,
2.5
PQxxxY053ZPH
ࠗ
ࠗ
ࠗ
ࠗ
ࠗ
ࠗ
ࠗ
ࠗ
Taped package
ࠗ
Power
Output Input dissipa- Output Output Dropout
current voltage tion
voltage voltage voltage
Vin
Io
Vo*2 precision VI-O*4
Pd*1
(V)
(A)
(%)
(V) TYP.
(V)
(W)
Variable output
voltage
1.0
1.5 to 5
Features
Low dissipation
current at OFF state
1.5, 2.5,
3.3
Model No.
ON/OFF control
Built-in functions
Overcurrent
protection
Electrical characteristics
Overheat
protection
Absolute maximum ratings
Package
ࠗ
5.0
PQxxxY3H3ZPH
High output current
(minimum operating
input voltage : 2.35 V)
ࠗ
ࠗ
7
ࠗ
3.5
PQ05VY3H3ZPH
1.5, 1.8,
2.5
PQxxxEH02ZPH
2 A output (minimum operating
input voltage : 2.35 V)
ࠗ
ࠗ
0.5
35
±2.5
TO-263
ࠗ
2.0
PQ070XH02ZPH
ࠗ
ࠗ
10
PQxxxEH01ZPH
1 A output (minimum operating
input voltage : 2.35 V)
±2.5
ࠗ
1.0
1.5 to 7 ±2.0*3
PQ070XH01ZPH
*1 With infinite heat sink attached
*3 Reference voltage accuracy
ࠗ
ࠗ
*2 The xxx in the model No. refer to the output voltage values of the model (e.g. 015 for 1.5 V, 025 for 2.5 V, 033 for 3.3 V).
*4 Current ratings are defined individually.
● SOP-8 type
(Ta = 25°C)
Built-in sink source function
(For DDR memory)
±0.8
6
0.6
Output voltage
Vo
(V) TYP.
Output
voltage
precision
(mV)
Taped package
PQ1DX125MZPQ
Built-in sink source function
(For DDR II memory)
Power
Output Input
dissipacurrent voltage
tion
Vin
Io
Pd*
(V)
(A)
(W)
Overcurrent
protection
PQ1DX095MZPQ
Features
Electrical characteristics
Built-in
functions
Overheat
protection
Absolute
maximum ratings
Model No.
Power Devices/
Analog ICs
PQ05VY053ZPH
VDD x 1/2
(VDDQ : 1.5 V (MIN.) )
–
ࠗ
ࠗ
ࠗ
VDD x 1/2
(VDDQ : 2.3 V (MIN.) )
± 35
ࠗ
ࠗ
ࠗ
Package
SOP-8
* When mounted on a board
47
Device_E.book Page 48 Wednesday, July 18, 2007 1:03 PM
REG
POWER DEVICES
★Under development
■ Surface Mount Type Chopper Regulators (DC-DC Converters)
Model No.
Features
No. of Output type Built-in Input voltage Switch
output Step Step Inver- SW
range
current
circuits down up sion
Tr
Vin (V) Isw (A)
PQ6CU11X1APQ
• High voltage CMOS output : 30 V (MAX.)
• White LED driver for back light
• Output ON/OFF control function
• Overvoltage/overcurrent protection circuits
• Soft start function
ࠗ
ࠗ
PQ6CB11X1AP
• High voltage CMOS output : 30 V (MAX.)
• White LED driver for back light
(Capable of driving up to 4 LEDs in series connection)
• Output ON/OFF control function
• Overvoltage/overcurrent protection circuits
• Soft start function
ࠗ
• High voltage CMOS output : 30 V (MAX.)
• White LED driver for back light
(Capable of driving up to 6 LEDs in series connection)
• Output ON/OFF control function
• Overvoltage/overcurrent protection circuits
• Soft start function
ࠗ
ࠗ
PQ6CU12X2APQ
• High switching voltage : 40 V (MAX.)
• For tuner power supply
• Output ON/OFF control function
ࠗ
ࠗ
PQ7L2010BP
• Possible to correspond also to operation
in the minute lighting mode
• High frequecny PWM control for brightness adjustment
• Output ON/OFF control function
ࠗ
ࠗ
Output Oscillation
voltage frequency Package
Vo (V) fo (Hz) TYP.
ࠗ
PQ6CB11X1CP
up to 5.5
1.2 M
3.0 to 5.5
up to 36
up to 30
2.7 to 5.5
PQ1CZ38M2ZPH series
• PWM chopper regulator (high oscillation frequency)
• Output ON/OFF control function
• Overcurrent/overheat protection circuits
• For light load
ࠗ
ࠗ
ࠗ
PQ1CZ21H2ZPH
• PWM chopper regulator
• Output ON/OFF control function
• Overcurrent/overheat protection circuits
• Low dissipation current at OFF state
(Standby crrent & lt; ISD & gt; : 1 µA (MAX.) )
ࠗ
ࠗ
ࠗ
ࠗ
from 0.8
0.8*1
1
up to 40
1.5*1
PQ1CZ41H2ZPH
• PWM chopper regulator (high oscillation frequency)
• Output ON/OFF control function
• Overcurrent/overheat protection circuits
ࠗ
PQ1CX12H2ZPQ
• Bootstrap system for high efficiency
(Efficiency 90% (TYP.) )
• Low dissipation current
ࠗ
ࠗ
up to 33
ࠗ
★PQ1CX41H2ZPQ
ࠗ
ࠗ
2.5*1
ࠗ
• Bootstrap system for high efficiency
(Efficiency 91% (TYP.) )
• Low voltage output : 0.8 V (MIN.)
• Ceramic capacitor compatible
PQ1CYxx3HZPH series
PQ1CYxx3LZPH series
• PWM chopper regulator
• Fixed output voltage : 3.3 V or 5 V
• Output ON/OFF control function
• Overheat protection circuit
IR3M18N
• Soft start function
• Undervoltage protection circuit
• Timer latch short-circuit protection circuit
• Standby function
IR3M19N
• High transient load characteristics from
built-in current control circuit
• Soft start function
• Overcurrent/overvoltage/undervoltage
protection circuits
• Internal reference voltage accuracy (±1%)
ࠗ
ࠗ
up to 28
3.5*1
USB-10
Switchable
between
USB-6
2.0 M and
1.2 M
VREF*3
to 24*5
150 k
(step-down
type)
SC-63
VREF*2 to 35*5
(step-down type)/
–VREF*2 to –30*5
(inverting type)
(Determined
by external
Tr)
4.5 to 22
150 k
TO-263
6
(Determined 100 k to
by external 1 M*7
Tr)
2.2 to 6.0
External
SOP-8
VREF*4
to 24*5
400 k
(step-down
type)
3.3, 5.0*
(TYP.)
ࠗ
ࠗ
ࠗ
1.5*
1
ࠗ
up to 40
ࠗ
2M
300 k
ࠗ
• Bootstrap system for high efficiency
(Efficiency 90% (TYP.) )
• Low dissipation current
• Low voltage output : 1.2 V (MIN.)
300 k to
SOT-23-6W
800 k*7
300 k
VREF*2
to 35*5
(step-down
type)/
–VREF*2
100 k
to –30*5
(inverting
type)
ࠗ
PQ1CX22H2ZPQ
PQ1CY1032ZPH
USB-6
up to 30
0.25*1
ࠗ
• PWM chopper regulator
• Output ON/OFF control function
• Overheat protection/overcurrent shutdown circuits
• High output current type
SOT-23-6
—
2.7 to 5.5
• PWM chopper regulator
• Sleep mode function
(by switching between PWM and PFM)
• Overvoltage/overcurrent protection circuits
• Soft start function
★PQ5CB11X1AP
48
(Ta = 25°C)
P-SSOP008-0150
1.24 to
input
voltage
220 k
*1 Peak current (absolute maximum ratings) *2 VREF nearly equal to 1.26 V (TYP.) *3 VREF nearly equal to 1 V (TYP.) *4 VREF nearly equal to 0.8 V (TYP.)
*5 Output voltage variable range *6 The xx in the model No. refer to the output voltage values of the model (e.g. 33 for 3.3 V, 50 for 5.0 V). *7 Selectable oscillation frequency range
Device_E.book Page 49 Wednesday, July 18, 2007 1:03 PM
POWER DEVICES
★Under development
■ Surface Mount Type Chopper Regulators (DC-DC Converters) (cont’d)
Model No.
★IR3M56N
IR3M17U
★IR3M57N
IR3M30M/U
IR3M58M/U
No. of Output type Built-in Input voltage
output Step Step Inver- SW
range
circuits down up sion Tr
Vin (V)
Features
• High efficiency synchronous rectified step-down converter
• Current mode control
• Soft start function
• Overcurrent/overvoltage/undervoltage/overheat
protection circuits
ࠗ
1
• Standby function (output ON/OFF control
function for each channel)
• Soft start function
• Undervoltage protection circuit
External 4.5 to 36
Switch
current
Isw (A)
ࠗ ࠗ ࠗ
(Determined
by
external Tr)
External
ࠗ
4.5 to 36
ࠗ
ࠗ ࠗ
• ON/OFF sequence setting
• Timer latch short-circuit protection circuit
• Soft start function
• Overcurrent/undervoltage/overheat protection
circuits
ࠗ ࠗ ࠗ
• ON/OFF sequence setting without external control
• Timer latch phase fault protection circuit
• Soft start function
• Overcurrent/undervoltage/overheat protection
circuits
ࠗ ࠗ
o*1
ࠗ
ࠗ
4.5 to 28
ࠗ
70 k to
1M*3
External
setting
External
0.4*2 (when using setting
internal Tr)
ࠗ ࠗ ࠗ External
3
200 k/
300 k/
400 k/
0.8 to 6.3 500 k/ P-TSSOP028-0225
external
sync.
1*2
(when using
2.7 to 5.5 internal Tr)
o*1
External
Package
(Determined 100 k to
by external 500 k*3/ P-HQFN020-0404
Tr)
external sync.
2.2 to 6.5
2
Output Oscillation
voltage frequency
Vo (V) fo (Hz) TYP.
(Determined
200 k/300 k/
by
0.8 to 6.3 400 k/500 k/ P-TSSOP016-0225
external Tr)
external sync.
ࠗ
• High efficiency two channel synchronous
rectified step-down converter
• Current mode control
• Soft start function
• Overcurrent/overvoltage/undervoltage/
overheat protection circuits
(Ta = 25°C)
P-QFP048-0707/
P-VQFN036-0505
70 k to
500 k*3
External
setting
*1 Built-in SW Tr can be used in step-up mode ; external SW Tr is required in step-down or inverting mode.
*2 Constant current (MAX.)
*3 Selectable oscillation frequency range
■ Chopper Regulators (DC-DC Converters)
● TO-220 type
(Ta = 25°C)
Absolute maximum ratings
Model No.
PQ1CG38M2FZH
PQ1CG38M2RZH
PQ1CG21H2FZH
PQ1CG21H2RZH
Power
Switch Input
dissipacurrent voltage
tion
Vin
Isw
Pd*1
(V)
(A)
(W)
Features
• PWM chopper regulator
(high oscillation frequency)
• Built-in overcurrent/overheat protection circuits
• Output ON/OFF control function
• For light load
Electrical characteristics
Output voltage
Vo*2
(V)
Output
Oscillation
saturation
frequency
voltage
fo (kHz)
Vsat
TYP.
(V) TYP.
Package
Outline
shape
type*5
E
3
0.8*
300
0.9
D
E
• PWM chopper regulator
• Built-in overcurrent/overheat protection circuits
• Output ON/OFF control function
100
1.0
D
1.5*3
PQ1CG41H2FZH
PQ1CG41H2RZH
PQ1CG2032FZH
PQ1CG2032RZH
• PWM chopper regulator
(high oscillation frequency)
• Built-in overcurrent/overheat protection circuits
• Output ON/OFF control function
40
14
VREF*4 to 35
(step-down type)/
–VREF*4 to –30
(inverting type)
E
300
TO-220
PQ1CG3032RZH
PQ2CF1J0000H
70
D
1.4
• PWM chopper regulator
(high oscillation frequency)
• Built-in overcurrent/overheat protection circuits
• Output ON/OFF control function
• PWM chopper regulator
• Built-in overcurrent/overheat protection circuits
*1 With infinite heat sink attached
*2 Output voltage variable range
D
E
• PWM chopper regulator
• Built-in overcurrent/overheat protection circuits
• Output ON/OFF control function
3.5*3
PQ1CG3032FZH
0.9
E
150
D
2.5*3
35
*3 Peak current
15
4.5 to 35
(step-up type)
50
*4 VREF nearly equal to 1.26 V (TYP.)
0.6
*5 Refer to page 65
E
49
Device_E.book Page 50 Wednesday, July 18, 2007 1:03 PM
LSI
POWER DEVICES
■ Power Supply ICs for CCDs/CCD Camera Modules
No. of Input voltage
output
range
(V)
circuits
Output
voltage
(V)
System
15
Model No.
Switching
frequency
(Hz)
Step-up type PWM + REG
SW Tr
Switching
Drive capacity
current (mA)
(pF)
[Built-in SW Tr] [External SW Tr]
Built-in
20 (DC)
–
External
–
1 000
100 (DC)
–
100 (DC)
–
100 (DC)
–
1.2 (DC)
Package
–
1M
–8
IR3M52Y7
Inverting type PWM
2.7 to 5.5 2.5 to 3.3
REG
2.5 to 3.3
REG
1.8/1.2
REG
15
5
Charge pump
–
200 k
–
–
–8
Negative charge pump
2.5 (DC)
–
3.3
Step-down type PWM + REG
120 (DC)
–
1.8
Step-down type PWM + REG
50 (DC)
–
15
IR3M61U*1/63U
41WL-CSP*2
Step-up type PWM + REG
600 (DC)
–
–
1 000
–
1 000
170 (DC)
–
10/20 (DC)
–
2/5 (DC)
–
150 (DC)
–
6 (DC)
–
7 (DC)
–
50 (DC)
–
P-VQFN032-0505
4.5 to 10
1M
Built-in
4
IR3M49U6
2.7 to 5.5
Step-up, step-down,
step-up/down type PWM
External
setting
Built-in
1M
Inverting type PWM
IR3M55U* /59U
4.5 to 16
–
–
Charge pump
15/12
1
–
200 k
REG
–8/–5
Negative charge pump
3.3
Step-down type PWM + REG
15
P-VQFN036-0505
External
Charge pump + REG
1M
Built-in
P-VQFN032-0505
3
300 k
IR3M48U6
2.7 to 3.2
–
–8
Negative charge pump + REG
1.8
REG
–
System
Switching
frequency
(Hz)
P-VQFN032-0505
*1 For automotive use
*2 3.97 mm x 3.97 mm x 0.82 mm (TYP.)
■ Power Supply ICs for TFT-LCDs
Model No.
No. of Input voltage
output
range
(V)
circuits
Output
voltage
(V)
IR3M58M/U
IR3M30M/U
4.5 to 28
3
2.7 to 5.5
External
setting
Step-down type PWM
Step-down,
inverting type PWM
Step-up, step-down,
step-up/down type PWM
Step-up, step-down, step-up/
down, inverting type PWM
Step-up, step-down, step-up/
down, inverting type PWM
15.3
50
2.6 to 3.6
5.1
Charge pump + REG
Negative charge pump
External
–
–
Built-in
(Step-up type)
Built-in
(Step-up type)
1 000
–
1 000
–
1 000
0.1 (DC)
–
–
5 (DC)
–
–
0.1 (DC)
–
P-QFP048-0707/
P-VQFN036-0505
–
–
100 k
1 000
External
70 k to
1M
Package
400
External
70 k to
500 k
Charge pump
–10.2
IR3M16U
Switching
Drive capacity
current (mA)
(pF)
[Built-in SW Tr] [External SW Tr]
Built-in
(Step-up type)
Step-up (20 V (MAX.) )/
step-down type PWM
External
setting
SW Tr
P-HQFN020-0404
Device_E.book Page 51 Wednesday, July 18, 2007 1:03 PM
POWER DEVICES
■ Fail Safe IC
Model No.
Operating voltage
Features
VBAT (V)
• Malfunction detection
• Built-in 8-bit ADC
• Built-in timer circuit
• Built-in key detection output OR gate
IR3T46U/46U6*
VBAC (V)
VIO (V)
3.2 to 4.5
3.0 to 3.3
2.6 to 3.0
Dissipation current
(µA)
Operating temp.
(°C)
TYP. 10
–20 to +85
* 46U: Tray package
46U6: Taped package
■ LED Drivers
Model No.
Function
Features
Input
Output
No. of Number Booster Built-in Built-in voltage current 1 Oscillation
constant
* frequency
output
of
SW range
current
(mA)
(Hz)
circuits LEDs method circuit
Tr
(V)
TYP.
MAX.
3
(Series
connection)
PQ6CU11X1APQ
PQ6CB11X1AP
PQ6CB11X1CP
PQ7L2010BP
IR2E46Y6
IR2E47U6
IR2E49U
IR2E51Y6
*1
*2
*3
*4
• High voltage CMOS output: 30 V (MAX.)
• Output ON/OFF control function
• Overvoltage/overcurrent protection circuits
White LED driver • Softstart function
for back light
(for small panels)
1
*1
᭺
4
(Series
connection)
*1
᭺
to 5.5
Package
SOT-23-6
1.2 M
PWM
Power Devices/
Analog ICs
● Built-in step up circuit
USB-6
6
(Series
connection)
*
4
(Series
connection)
*1
᭺
1
250*2
᭺
2.7 to 5.5
• Possible to correspond also to operation in
the minute lighting mode
• High frequency PWM control for brightness
adjustment
• Output ON/OFF control function
• I2C bus control
• Illumination mode (64 levels/ch)
RGB LED driver • Picture light mode (32 levels/ch)
for picture lights • Brightness adjustment
and illuminations • Standby function/soft start function
• Overcurrent/undervoltage/overheat
protection circuits
• Independent current control for two systems
(4 outputs and 2 outputs)
White LED driver
• LED non-connected judging function
for back light
(for small panels) • Brightness adjustment
• Undervoltage/overheat protection circuits
3
3
PWM
᭺
᭺
155/ch
2.7 to 4.5 (in picture 1.2 M 33WL-CSP*4
light mode)
6
4+2
Charge
pump
᭺
–
2.7 to 5.5
• Buit-in 150 mA driver for each channel
• Step-up DC-DC output short-circuit
White LED driver
protection function
• Current driver output open detection
for back light
• Capable of external brightness adjustment
(for medium
using PWM input signal
panels)
• Overcurrent/overvoltage/undervoltage/
overheat protection circuits
5
40
PWM
᭺
• Capable of direct connection of ambient
light sensor
• Brightness adjustment by ambient
illuminance feedback (16-step ambient
illuminance/128-level illuminance)
(for main LCDs)
• Non-external coil thanks to charge pump drive
• Capable of driving 4 main-LEDs, 2 sub-LEDs,
and 3 call alert LEDs with a single device.
• I2C interface
• Standby function/power on reset function/
soft start function
9
LED driver for
back light and
call alert display
LED driver
(auto brightness
adjustment)
4 + 2 Charge
+ 3 pump
᭺
2.0 M USB-10
20/ch
External 6 to 28 150/ch*2
–
3.0 to 4.5
(for drive)/
2.3 to 3.2
(for control)
25/ch
1M
P-HQFN024-0404
100 k to
P-VQFN036-0606
1 M*3
660 k 35WL-CSP*4
Constant current (MAX.)
Use this IC within the range of power dissipation.
Selectable oscillation frequency range
3.57 mm x 3.57 mm x 0.82 mm (TYP.)
51
Device_E.book Page 52 Wednesday, July 18, 2007 1:03 PM
LSI
POWER DEVICES
● External power supply for LEDs
Model No.
Function
Supply voltage
(V)
IR2D20U
24-dot LED panel driver with
constant-current sink outputs
16-dot LED panel driver with
constant current sink outputs
P-HQFN052-0707
3.0 to 5.5
P-SDIP028-0400
• Output current (constant current sink output) : 30 mA (MAX.)
(setup by external resistor)
• Gradation function (clock cycle setting or external synchronization)
• Independent current control for three systems (for RGB LED)
• LED drive voltage : 15 V
• Rated output voltage : 20 V (MAX.)
• fCLK : 20 MHz (MAX.)/16.6 MHz (MAX.) (at cascade connection)
IR2D071
Package
4.5 to 5.5
Features
• Output current (constant-current sink output) : 60 mA (MAX.)
(setup by external resistor)
• Rated output voltage : 7 V (MAX.)
• fCLK : 20 MHz (MAX.)/16.6 MHz (MAX.) (at cascade connection)
■ Laser Diode Drivers
Model No.
Application
Function
Drive
mode
Maximum
output current
(mA) MIN.
Applicable
SHARP
diode type
Supply
voltage
(V)
—
2.4 to 3.5
IR3C14N1
For Mini Disc players
Built-in 100 mA driver,
APC function
DC mode
100
IR3C22N
For CD/DVD players
Built-in APC function,
with inhibit input pin
—
150
Package
P-SSOP008-0150
52
P
4.5 to 5.5
(Single power supply)
Device_E.book Page 53 Wednesday, July 18, 2007 1:03 PM
ANALOG ICs
✩New product
★Under development
■ Video Interface ICs for TFT-LCDs
IR3Y18A1
Input signal
Composite Y/color Analog
OSD
video
difference RGB (Digital)
᭺
LCD panel
Serial
± power + power Low voltage Digital data
source source source input control
Color
decode
NTSC/PAL
Power
consumption
(mW) TYP.
Package
4.5/12 or
4.5/–7.5
130
P-QFP048-0707
140
᭺
–
᭺*3
IR3Y26A2/A6
᭺
Supply
voltage
(V) TYP.
P-QFP048-1010/
P-QFP048-0707
᭺
᭺
5/7.5
IR3Y29A1/B1
᭺
᭺
NTSC/PAL
IR3Y31M1
᭺
᭺
NTSC/PAL
᭺
IR3Y34M1
᭺
᭺(Common terminal)
IR3Y37A1
᭺*3
RB5P0010M2
᭺
–
4.5/12 or
4.5/–7.5
160
3/12
88
–
᭺
᭺
᭺
᭺
–
᭺
190
᭺
᭺
3/6.5
106/88*5 P-QFP048-0707
3/12 or
3/4.5/–7.5
RB5P0020M2
᭺(Common terminal)
᭺
–
᭺
RB5P0050M2
᭺(Common terminal)
᭺
–
᭺
92
3/5
᭺
᭺
70/57*5
᭺
RB5P0060M2
᭺
᭺
NTSC/PAL
᭺
᭺
᭺
NTSC/PAL
᭺
᭺
RB5P0070M*1
᭺
᭺
95/80*5
᭺
RB5P006AM2
Power Devices/
Analog ICs
Model No.
3/5/13
120
RB5P0090M
᭺
᭺*3
LRS5751*2
᭺
᭺
LRS5752*2
✩IR3Y63M
᭺*3
᭺
᭺
᭺
*1 For digital signal input panels
᭺*4
᭺
NTSC/PAL
3/7
330
P-QFP072-1010
5/13
250
P-QFP048-1010
3.3/5/7.5
᭺
᭺
᭺
᭺
NTSC/PAL
NTSC/PAL
(automatic
identification)
197
᭺
P-LQFP100-1414
NTSC/PAL
(automatic
identification)
᭺
NTSC/PAL/
(Built-in) SECAM
*2 Built-in timing generator
*3 Two inputs
P-QFP048-1010
᭺
᭺
3.3/5/13
257
᭺
᭺
3.3/5
300
*4 Digital RGB input is also available.
P-TQFP100-1414
*5 At analog input for RGB
■ Power Amplifiers for Wireless LAN
Model No.
IRM046U7
★IRM065U7
IRM047U7
★IRM060U7
IRM063U7
IRM048U7
★IRM053U7
Application
Operating
frequency
(GHz)
Supply
Output power
voltage
(V) TYP. (dBm) TYP.
For 2.4 GHz wireless LAN
(IEEE 802.11b/g)
2.4 to 2.5
18 (at EVM 3%)
105
30
᭺
–
For 5 GHz wireless LAN
(IEEE 802.11a)
4.9 to 5.9
18 (at EVM 2%)
140
25
᭺
–
For 2.4 GHz wireless LAN
(IEEE 802.11b/g)
2.4 to 2.5
18 (at EVM 3%)
130
29
᭺
Built-in
(IN/OUT)
For 5 GHz wireless LAN
(IEEE 802.11a)
4.9 to 5.9
18 (at EVM 3%)
160
30
᭺
Built-in
(IN/OUT)
18 (at EVM 3%)
105
30
᭺
–
16 (at EVM 2%)
75
28
᭺
Built-in
(IN/OUT)
18 (at EVM 3%)
120
30
᭺
Built-in
(IN/OUT)
140
25
᭺
–
150
31
᭺
For 5 GHz wireless LAN
(IEEE 802.11a)
Package
P-HQFN024-0404
For 2.4 GHz wireless LAN*
(IEEE 802.11b/g)
For 2.4 GHz wireless LAN
(IEEE 802.11b/g)
Supply
Gain Detection Matching
current
circuit
(mA) TYP. (dB) TYP. function
3.3
2.4 to 2.5
4.9 to 5.9
18 (at EVM 2%)
P-HQFN016-0303
P-HQFN024-0404
P-HQFN010-0202A
P-HQFN024-0404
Built-in
(IN/OUT) P-HQFN010-0202A
* Can be used as a power amp for PHS and DECT (1.9 GHz band), or as a driver amp for FWA (1.9 to 2.6 GHz band).
53
Device_E.book Page 54 Wednesday, July 18, 2007 1:03 PM
LSI
ANALOG ICs
■ ICs for Audio Equipment
Model No.
IR3R55M1
Description
RF amp IC
for Mini Disc players
IR3R58M1
Package
P-TQFP048-0707
±1.2 to ±3.25
P-SSOP024-0275
2.4 to 3.5
P-SSOP008-0150
Built-in RF amp, ADIP detection circuit,
connectable to hologram pickup
Built-in 2x speed RF amp, ADIP detection circuit,
connectable to hologram pickup
IR3R59N1
Audio amp IC
Built-in serial control input ATT and filter amp
IR3C14N1
54
Supply voltage
(V)
2.4 to 3.3
Function
Laser diode driver
for Mini Disc players
Built-in 100 mA driver, APC function
Device_E.book Page 55 Wednesday, July 18, 2007 1:03 PM
LSI
PACKAGES
■ CSP
● CSP (Chip Size Package)
The FBGA (commonly known as CSP) has an area array terminal structure with solder balls on the
bottom, to give it a near chip-size footprint. This high-density, compact and low-profile package
technology will greatly help in the design of compact mobile equipment, such as mobile phones and
digital cameras.
●
FBGA (CSP)
Compact and lightweight
Ability to create a near-chip size and lighter-weight package in comparison with conventional plastic packages.
●
High reliability
Comparable high reliability with that of conventional plastic packages.
●
Mountability
Conventional mounting system is available for CSP. SOP and QFP can be mounted together with CSP.
Terminal pitch
0.8 mm
0.65 mm
0.5 mm
0.4 mm
Maximum terminal counts
288 (16 mm x 16 mm)
352 (16 mm x 16 mm)
424 (14 mm x 14 mm)
264 (10 mm x 10 mm)
Nominal dimensions
6 mm x 6 mm to 16 mm x 16 mm
Gold wire
Bare chip
Packages
Features
5 mm x 5 mm to 10 mm x 10 mm
Mold resin
Package height
1.2 mm (MAX.)*
Cross
section
example
Substrate
Cu pattern
Diameter : 0.45 mm
0.4 mm
0.3 mm
0.24 mm
Lead-free solder ball
Terminal pitch : 0.8 mm
0.65 mm
0.5 mm
0.4 mm
* At 0.8 mm terminal pitch
● Wafer-level CSP
The wafer-level CSP (WL-CSP) is a kind of chip-size package which is manufactured by assembling directly onto the finished wafer.
●
Compact and thinner size
It makes it possible to create an almost bare-chip-size and lighter-weight package.
●
Features
Mountability
The conventional CSP mounting system can be also used in that of wafer-level CSP, which facilitates chip
mounting more than bare-chip mounting does. It can be mounted together with other existing packages and
passive components. (The use of underfill is recommended to improve the reliability of assembly.)
Chip size*
4 mm x 4 mm
3.5 mm x 3.5 mm
3 mm x 3 mm
2.5 mm x 2.5 mm
Pad pitch
0.5 mm
0.4 mm
0.5 mm
0.4 mm
0.5 mm
0.4 mm
0.5 mm
0.4 mm
Maximum terminal counts
49 (7 x 7)
81 (9 x 9)
36 (6 x 6)
49 (7 x 7)
25 (5 x 5)
36 (6 x 6)
16 (4 x 4)
25 (5 x 5)
* Rectangular chip form is also available.
Cu pattern
Bare chip
Cross
section
example
Package height
0.5 mm to 1 mm
Passivation layer
Lead-free solder ball
55
Device_E.book Page 56 Wednesday, July 18, 2007 1:03 PM
LSI
PACKAGES
■ LGA
● LGA (Land Grid Array Package)
The LGA package has basically the same structure as the CSP, enabling a thin package by removing
the solder balls from the bottom of the package. The LGA package contributes to the compact and
thinner design of applications, such as mobile phones and digital cameras.
●
Lower package height
Achieves 0.5 mm Max. in package height.
●
High reliability
Comparable high reliability with that of conventional plastic package.
Features
●
Excellent mountability
Conventional mounting system is available for LGA. SOP and QFP can be mounted together with LGA.
Terminal pitch
0.5 mm
Maximum terminal count
216 (10 mm x 10 mm)
Nominal dimensions
6 mm x 6 mm ~ 10 mm x 10 mm
Bare chip
Cross
section
example
Gold wire
Package height
0.5 mm (MAX.)
Cu pattern
56
Mold resin
Substrate
Land
Terminal pitch : 0.5 mm
Device_E.book Page 57 Wednesday, July 18, 2007 1:03 PM
PACKAGES
■ SiP (System in Package)
System in Package is an original SHARP high-density mounting technology that achieves high-density memory capacity and multiple
functions by stacking multiple bare chips or multiple packages. This technology has two major streams. One method refers to a chipstacked package technology that can achieve up to 5-chip mounting by stacking chips in a single package. The other method refers to a
package stack technology with which it is possible to stack a package of over 5 chips, by stacking multiple packages in which 1 to 2
chips are stacked. The System in Package technology contributes to higher functionality of applications, such as mobile phones and
digital cameras, as well as to reduction in size and weight.
● Chip Stacked CSP
Wide variety of lineup
It is possible to provide a wide lineup of stacked CSPs, including 2-chip, 3-chip, 4-chip and 5-chip stacked
CSPs, to respond to customer needs.
●
Compact and thinner size
Encapsulating multiple bare chips into an existing plastic package contributes to decreasing the mounting
area. In addition, SHARP's wafer thinning technology makes it possible to achieve 1.4 mm package height.
●
Multiple functions
Multiple bare chips of different sizes and functions, such as logic LSIs and memories, can be incorporated
in a single package, making possible multiple functions.
●
Same-size chip stacking technology
SHARP's stacking technology enables stacking of multiple same-size bare chips, contributing to higher
memory density.
Features
Packages
●
(4-chip stacked CSP)
When using a SHARP four-chip stacked CSP, the mounting area and weight of a package can be
decreased by half in comparison with using two 2-chip stacked CSPs, or a 3-chip stacked CSP and a
conventional CSP.
(5-chip stacked CSP)
Gold wire
Mold resin
Bare chip
Cross
section
example
Package height
1.4 mm (MAX.)*
1.6 mm (MAX.)*
Substrate
Cu pattern
Diameter : 0.45 mm
0.30 mm
Lead-free solder ball
Terminal pitch : 0.8 mm
0.5 mm
* At 0.8 mm terminal pitch
● Chip Stacked TSOP/QFP*/VQFN/HQFN
●
Decreased mounting area
By encapsulating two identical or different types of bare chips into a single conventional plastic package,
the mounting area of the package can be decreased.
●
Multiple functions
Thanks to the incorporation of different sizes and functions of multiple bare chips, such as logic LSIs and
memories, the functionality increases.
●
Higher memory density
When incorporating two identical memory bare chips into a single package, memory density doubles on
the same mounting area.
Features
(TSOP, TQFP)
Cross
section
example
Gold wire
Bare chip
Lead
Package height
1.2 mm (MAX.)
Bare chip
(VQFN) Gold wire
Mold resin
Package height
1.0 mm (MAX.)
* Including TQFP and LQFP.
Mold resin
(HQFN) Gold wire
Mold resin
Package height
1.0 mm (MAX.)
57
Device_E.book Page 58 Wednesday, July 18, 2007 1:03 PM
LSI
PACKAGES
● Package Stacked
●
●
Decreased mounting area and height
The package stacked technology makes it possible to decrease the mounting area by stacking multiple
packages in which 1 to 2 chips are stacked, also achieving 1.5 mm height when six chips are stacked.
●
Features
Multi stacking
The package stacking technology makes it possible to increase the memory capacity and create a
combined system with memory and logic LSI. In the case of combination memories, memory capacity can
be increased by stacking multiple 0.5 mm height packages in which 1 to 2 chips are stacked.
Multiple functions
Thanks to the combination of packages in which various kinds of LSIs are mounted, such as a memory
and ASIC, achieving an increase in and enhancement of functionality is easy.
LSI : 1 chip
Mold resin
LSI : 2 chips
Mold resin
Gold wire
Substrate
Substrate
Through hole
Through hole
Gold wire
Lead-free solder ball
Lead-free solder ball
Terminal pitch : 0.5 mm
Gold wire
LSI : 3 chips
Terminal pitch : 0.5 mm
Mold resin
Substrate
Lead-free solder ball
Terminal pitch : 0.5 mm
Cross
section
example
Examples of 3D-SiP composition
• High-density combination memory (3-package stacking)
6 chips
1.5 mm
(MAX.)
1.5 mm
(MAX.)
2 chips
2 chips
2 chips
• System LSI (Logic LSI + Memory) (2-package stacking)
4 chips
1.8 mm
(MAX.)
58
1.8 mm
(MAX.)
3 chips
1 chip
Device_E.book Page 59 Wednesday, July 18, 2007 1:03 PM
PACKAGES
■ SOF
● SOF (System On Film)
SOF is a highly flexible thin film package, created from SHARP’s TCP technologies.
It can be easily bent, and contributes to thin and compact design of products.
Peripheral circuit components can also be mounted.
●
Highly flexible and thin film package
By using highly flexible and thin film, SOF contributes to creating thin and compact products.
It can also achieve finer terminal pitches and multiple outputs easily, and pattern layout on a film under the chip
makes it possible to improve the flexibility of the pattern layout.
Features
●
Multiple chip mounting
Bare chip
Cross
section
example
Packages
Plural bare chip mounting and incorporation of peripheral components contribute to the higher functionality
of products.
Cu pattern
Solder resist
38 µm
Thickness 0.6 mm (MIN.)
1.0 mm (TYP.)
Under fill material Gold bump
Film width : W1
Maximum pattern layout area : W2
35 mm super wide
48 mm super wide
70 mm wide
28.6 mm
41.6 mm
59.0 mm
Maximum device pitch : L
15 sprockets
8 µm
Copper foil thickness
Copper foil type
Rolled or electrolytic
Copper foil plating
Tin (Sn)
Minimum pattern pitch
0.029 mm
Sprocket hole : A
1.981 mm (wide) /1.42 mm (super wide)
Sprocket hole : B
1.981 mm (wide) /1.42 mm (super wide)
4.75 mm
Sprocket hole pitch
B
A
W1 W2
L
Other components
Maximum pattern layout area
Film
specifications
Bare chips and peripheral circuit components can be mounted on the film.
In addition to the SOF described above, a conventional TCP (Tape Carrier Package) is also available.
59
Device_E.book Page 60 Wednesday, July 18, 2007 1:03 PM
LSI
PACKAGES
★Under development
■ Package Lineup
● Surface-mount Type
Package
type
Appearance
(Package material)
Package code
No. of terminals
Terminal pitch Nominal dimensions
mm
mm
6x 6
TFBGA048-0808
TFBGA056-0808
56
TFBGA060-0811
64
8.0 x 8.0 x (1.2)
60 (48)*
TFBGA064-0811
6.0 x 8.0 x (1.2)
8x 8
48
6.0 x 6.0 x (1.4)
6x 8
LFBGA048-0606
TFBGA048-0608
Package width & length
x (seated height [MAX.])
mm
TFBGA072-0811
LFBGA072-0811
8 x 11
72 (64)*
TFBGA081-0808
85
LFBGA087-0811
8.0 x 11.0 x (1.4) / (1.6)
81
LFBGA085-0811
8.0 x 11.0 x (1.2)
87
LFBGA088-0811
LFBGA088-0912
8x 8
8 x 11
8.0 x 11.0 x (1.4) / (1.6)
9 x 12
9.0 x 12.0 x (1.4) / (1.6)
8 x 11
88
8.0 x 8.0 x (1.2)
8.0 x 11.0 x (1.4) / (1.6)
LFBGA090-0811
TFBGA096-1010
96
LFBGA107-0912
107
TFBGA111-1010
111
TFBGA112-1010
112
LFBGA115-0914
115
9 x 14
9.0 x 14.0 x (1.4) / (1.6)
LFBGA116-1010
116
10 x 10
10.0 x 10.0 x (1.4) / (1.6)
LFBGA130-1013
130
10 x 13
10.0 x 13.0 x (1.4) / (1.6)
TFBGA144-1111
144
11 x 11
11.0 x 11.0 x (1.2)
TFBGA160-1212
160
12.0 x 12.0 x (1.2)
LFBGA168-1212
168
12.0 x 12.0 x (1.4) / (1.6)
TFBGA180-1212
180
TFBGA184-1212
184
TFBGA240-1414
240
LFBGA280-1616
280
★LFBGA352-1616
FBGA
(CSP)
90
352
0.8
10 x 10
10.0 x 10.0 x (1.2)
9 x 12
9.0 x 12.0 x (1.4) / (1.6)
10 x 10
10.0 x 10.0 x (1.2)
12 x 12
12.0 x 12.0 x (1.2)
14 x 14
14.0 x 14.0 x (1.2)
16 x 16
16.0 x 16.0 x (1.5)
6.0 x 6.0 x (1.2)
TFBGA064-0606
6x 6
140
9x 9
9.0 x 9.0 x (1.4)
LFBGA160-1010
160
10 x 10
10.0 x 10.0 x (1.4) / (1.6)
TFBGA180-1313
180
LFBGA192-1010
192
LFBGA208-1212
208
LFBGA224-1313
(Plastic)
64
LFBGA144-0909
224
TFBGA260-1313
260
* Figures in brackets indicate available terminal counts.
60
0.65
13 x 13
13.0 x 13.0 x (1.2)
10 x 10
10.0 x 10.0 x (1.4) / (1.6)
12 x 12
12.0 x 12.0 x (1.4) / (1.6)
13 x 13
13.0 x 13.0 x (1.4) / (1.6)
13.0 x 13.0 x (1.2)
Device_E.book Page 61 Wednesday, July 18, 2007 1:03 PM
PACKAGES
★Under development
● Surface-mount Type (cont’d)
Appearance
(Package material)
Package code
No. of terminals
LFBGA064-0606
64
TFBGA068-0606
68
VFBGA081-0606
81
TFBGA084-0606
Terminal pitch Nominal dimensions
mm
mm
84
6.0 x 6.0 x (1.1)
6x 6
6.0 x 6.0 x (0.9)
100
7.0 x 7.0 x (0.9)
TFBGA100-0707
VFBGA108-0707
TFBGA108-0707
VFBGA120-0707
TFBGA120-0707
7.0 x 7.0 x (1.1)
108
7x 7
TFBGA152-0808
FBGA
(CSP)
VFBGA171-0811
LFBGA171-0811
VFBGA176-0909
TFBGA176-0909
TFBGA180-0909
VFBGA188-1111
TFBGA188-0909
VFBGA208-1010
TFBGA208-1010
TFBGA245-1010
LFBGA245-1010
8x 8
8.0 x 8.0 x (0.9)
8.0 x 8.0 x (1.3) / (1.5)
8 x 11
8.0 x 11.0 x (1.3)
152
8x 8
8.0 x 8.0 x (1.1)
171
8 x 11
0.5
9x 9
180
11 x 11
188
9x 9
10 x 10
245
144
121
TFBGA168-0707
168
TFBGA204-0808
204
11.0 x 11.0 x (0.9)
9.0 x 9.0 x (1.1)
10.0 x 10.0 x (1.1)
10.0 x 10.0 x (1.3)
424
★WFBGA121-0606
9.0 x 9.0 x (1.1)
10.0 x 10.0 x (0.9)
208
WFBGA144-0606
8.0 x 11.0 x (0.9)
8.0 x 11.0 x (1.3) / (1.5)
9.0 x 9.0 x (0.9)
176
FBGA424-1414
(Plastic)
7.0 x 7.0 x (1.1)
7.0 x 7.0 x (1.1)
144
LFBGA144-0811
7.0 x 7.0 x (0.9)
7.0 x 7.0 x (0.9)
120
VFBGA144-0808
LFBGA144-0808
6.0 x 6.0 x (0.9)
6.0 x 6.0 x (1.1)
VFBGA100-0606
VFBGA100-0707
Package width & length
x (seated height [MAX.])
mm
Packages
Package
type
14 x 14
6x 6
0.4
14.0 x 14.0 x (1.8)
6.0 x 6.0 x (0.75)
6.0 x 6.0 x (0.8)
7x 7
7.0 x 7.0 x (1.0)
8x 8
8.0 x 8.0 x (1.0)
61
Device_E.book Page 62 Wednesday, July 18, 2007 1:03 PM
LSI
PACKAGES
★Under development
● Surface-mount Type (cont’d)
Package
type
Appearance
(Package material)
Package code
No. of terminals
Terminal pitch Nominal dimensions
mm
mm
Package width & length
x (seated height [MAX.])
mm
TFBGAXXX-0606
to 36
6x 6
6.0 x 6.0 x (1.2)
TFBGAXXX-0707
to 49
7x 7
7.0 x 7.0 x (1.2)
TFBGAXXX-0808
to 81
8x 8
8.0 x 8.0 x (1.2)
TFBGAXXX-0909
to 100
9x 9
9.0 x 9.0 x (1.2)
TFBGAXXX-1010
to 121
10 x 10
10.0 x 10.0 x (1.2)
TFBGAXXX-1111
to 144
11 x 11
11.0 x 11.0 x (1.2)
TFBGAXXX-1212
to 196
12 x 12
12.0 x 12.0 x (1.2)
TFBGAXXX-1313
to 216
13 x 13
13.0 x 13.0 x (1.2)
14 x 14
14.0 x 14.0 x (1.2)
15 x 15
15.0 x 15.0 x (1.2)
TFBGAXXX-1414
TFBGAXXX-1515
0.8
to 240
TFBGAXXX-1616
6x 6
6.0 x 6.0 x (1.2)
to 81
7x 7
7.0 x 7.0 x (1.2)
TFBGAXXX-0808
to 121
8x 8
8.0 x 8.0 x (1.2)
TFBGAXXX-0909
to 144
9x 9
9.0 x 9.0 x (1.2)
TFBGAXXX-1010
to 196
10 x 10
10.0 x 10.0 x (1.2)
TFBGAXXX-1111
to 224
11 x 11
11.0 x 11.0 x (1.2)
TFBGAXXX-1212
to 256
12 x 12
12.0 x 12.0 x (1.2)
TFBGAXXX-1313
to 272
13 x 13
13.0 x 13.0 x (1.2)
TFBGAXXX-1414
to 304
14 x 14
14.0 x 14.0 x (1.2)
TFBGAXXX-1515
to 320
15 x 15
15.0 x 15.0 x (1.2)
TFBGAXXX-1616
to 352
16 x 16
16.0 x 16.0 x (1.2)
TFBGAXXX-0606
to 100
6x 6
6.0 x 6.0 x (1.1)
TFBGAXXX-0707
to 132
7x 7
7.0 x 7.0 x (1.1)
TFBGAXXX-0808
to 164
8x 8
8.0 x 8.0 x (1.1)
TFBGAXXX-0909
to 192
9x 9
9.0 x 9.0 x (1.1)
TFBGAXXX-1010
to 216
10 x 10
10.0 x 10.0 x (1.1)
TFBGAXXX-1111
to 244
11 x 11
11.0 x 11.0 x (1.1)
TFBGAXXX-1212
to 268
12 x 12
12.0 x 12.0 x (1.1)
TFBGAXXX-1313
to 296
13 x 13
13.0 x 13.0 x (1.1)
TFBGAXXX-1414
to 320
14 x 14
14.0 x 14.0 x (1.1)
TFBGAXXX-1515
to 348
15 x 15
15.0 x 15.0 x (1.1)
TFBGAXXX-1616
to 372
16 x 16
16.0 x 16.0 x (1.1)
TFBGAXXX-0505
to 100
5x 5
5.0 x 5.0 x (1.0)
TFBGAXXX-0606
to 144
6x 6
6.0 x 6.0 x (1.0)
TFBGAXXX-0707
to 168
7x 7
7.0 x 7.0 x (1.0)
TFBGAXXX-0808
to 204
8x 8
8.0 x 8.0 x (1.0)
TFBGAXXX-0909
to 228
9x 9
9.0 x 9.0 x (1.0)
TFBGAXXX-1010
to 264
10 x 10
10.0 x 10.0 x (1.0)
XFLGA100-0707
100
0.5
7x 7
7.0 x 7.0 x (0.5)
★PBGA0356-2121
356
1.0
21 x 21
21.0 x 21.0 x (2.2)
PBGA0476-3535
476
1.27
35 x 35
35.0 x 35.0 x (2.63)
PBGA0528-3535
FLGA
(LGA)
16.0 x 16.0 x (1.2)
to 49
TFBGAXXX-0707
(Plastic)
16 x 16
TFBGAXXX-0606
FBGA
(CSP)
to 280
528
0.65
0.5
0.4
(Plastic)
PBGA
(BGA)
XXX: Terminal counts
62
Device_E.book Page 63 Wednesday, July 18, 2007 1:03 PM
PACKAGES
● Surface-mount Type (cont’d)
Appearance
(Package material)
Package code
No. of
terminals
Terminal pitch Nominal dimensions
mm (mil)
mm (mil)
Package width & length
x (seated height [MAX.])
mm
Lead frame material
Alloy42 Copper alloy
P-SOP044-0600
᭺
–
᭺
12
0.75
5.7 (225)
4.4 x 5.0 x (1.8)
᭺
–
24
7.0 (275)
6.0 x 7.8 x (1.27)
–
᭺
40
7.6 (300)
6.3 x 13.5 x (1.8)
–
᭺
70
0.8
12.7 (500)
12.7 x 28.6 x (3.05)
–
᭺
P-MFP018
18
0.8
᭺
–
P-MFP020
20
0.75
P-TSOP040-1020
40
P-TSOP048-1220
(Plastic)
᭺
3.0 x 3.0 x (1.1)
P-SSOP070-0500
TSOP
13.2 x 28.2 x (3.1)
4.5 (150)
P-SSOP024-0275
(Plastic)
15.2 (600)
0.65
P-SSOP040-0300
MFP
1.27 (50)
8
P-SSOP012-0225
SSOP
44
P-SSOP008-0150
SOP
48
P-TSOP056-1420
56
P-QFP048-0707
P-QFP048-1010
48
P-QFP064-1010
72
P-QFP128-1420
156
P-LQFP080-1212
6.0 x 7.5 x (1.8)
᭺
–
0.5
10.0 x 18.4 x (1.2)
᭺
᭺
12 x 20
12.0 x 18.4 x (1.2)
᭺
᭺
14 x 20
0.5
14.0 x 18.4 x (1.2)
᭺
᭺
7.0 x 7.0 x (1.65)
᭺
–
10.0 x 10.0 x (1.82)
᭺
–
᭺
–
᭺
–
᭺
–
᭺
–
–
7x 7
0.75
128
P-QFP156-1420
–
10 x 20
64
P-QFP072-1010
QFP
0.65
10 x 10
0.5
10.0 x 10.0 x (1.8)
14.0 x 20.0 x (2.3)
80
12 x 12
12.0 x 12.0 x (1.7)
᭺
P-LQFP100-1414
100
14 x 14
14.0 x 14.0 x (1.7)
᭺
–
P-LQFP144-2020
LQFP
14 x 20
144
20 x 20
20.0 x 20.0 x (1.7)
–
᭺
24 x 24
24.0 x 24.0 x (1.7)
–
᭺
28 x 28
28.0 x 28.0 x (1.7)
–
᭺
7x 7
7.0 x 7.0 x (1.2)
᭺
–
᭺
–
P-LQFP176-2424
P-TQFP048-0707
48
P-TQFP100-1414
100
P-TQFP128-1414
128
P-VQFN020-0404
0.5
20
P-VQFN028-0505
(Plastic)
256
0.4
176
★ P-LQFP256-2828
TQFP
28
0.4
0.5
14 x 14
14.0 x 14.0 x (1.2)
4x 4
4.2 x 4.2 x (1.0)
5x 5
5.2 x 5.2 x (1.0)
0.4
0.5
᭺
–
–
᭺
–
᭺
–
᭺
P-VQFN032-0505
32
P-VQFN036-0606
36
6x 6
6.2 x 6.2 x (1.0)
–
᭺
P-VQFN048-0707
48
7x 7
7.2 x 7.2 x (1.0)
–
᭺
P-VQFN036-0505
36
5x 5
5.2 x 5.2 x (1.0)
–
᭺
P-VQFN052-0707
52
7x 7
7.2 x 7.2 x (1.0)
–
᭺
P-VQFN064-0808
VQFN
64
8x 8
8.2 x 8.2 x (1.0)
–
᭺
2.0 x 2.0 x (0.35)
–
᭺
2.2 x 2.2 x (0.35)
–
᭺
2.2 x 2.2 x (0.55)
–
᭺
3.0 x 3.0 x (0.85)
–
᭺
–
᭺
–
᭺
4.0 x 4.0 x (0.85)
–
᭺
4.2 x 4.2 x (1.0)
–
᭺
5x 5
5.0 x 5.0 x (1.0)
–
᭺
7x 7
7.2 x 7.2 x (1.0)
–
᭺
P-HQFN010-0202A
★ P-HQFN010-0202B
10
★ P-HQFN014-0202
P-HQFN016-0404
P-HQFN020-0404
16
0.4
0.5
24
P-HQFN028-0505
52
* HQFN is a higher heat dissipation package of VQFN.
3x 3
4.0 x 4.0 x (1.0)
4x 4
28
P-HQFN052-0707
2x 2
0.65
20
P-HQFN024-0404
(Plastic)
0.4
14
P-HQFN016-0303
HQFN*
Packages
Package
type
0.5
0.4
100 mil = 2.54 mm
63
Device_E.book Page 64 Wednesday, July 18, 2007 1:03 PM
LSI
PACKAGES
● For CCDs
Package code
No. of
terminals
Terminal pitch
mm
Nominal dimensions
mm (mil)
Package width & length
x (seated height)
mm
P-DIP014-0400A
14
1.27
10.16 (400)
10.0 x 10.0
P-DIP016-0500C
16
1.78
12.7 (500)
12.4 x 14.0
P-DIP020-0400
Package
type
20
1.00
10.16 (400)
10.0 x 10.0
1.27
11.43 (450)
11.4 x 12.2
1.78
12.7 (500)
12.4 x 14.0
Appearance
(Package material)
DIP
(Plastic)
N-DIP016-0450
16
N-DIP016-0500C
(Ceramic)
P-SOP028-0400
28
0.69
10.16 (400)
10.0 x 10.0 x (3.5)
P-SOP032-0525
32
0.78
13.3 (525)
12.0 x 13.8 x (3.9)
N-LCC028-S450A
28
0.80
11.5
11.5 x 11.5 x (1.62)
N-LCC032-R543
32
0.80
13.8
12.9 x 13.8 x (1.35)
SOP
(Plastic)
LCC
(Ceramic)
100 mil = 2.54 mm
Nominal dimensions
FBGA (CSP)
FLGA (LGA)
PBGA (BGA)
VQFN
HQFN
SOP
SSOP
MFP
TSOP
DIP
LCC
FBGA
QFP
: fine-pitch land grid array package
LQFP : low profile quad flat package
PBGA
: plastic ball grid array package
TQFP : thin quad flat package
SOP
: small outline package
VQFN : very thin quad flat non-leaded package
SSOP
: shrink small outline package
HQFN : heat sink quad flat non-leaded package
MFP
: mini flat package
DIP
: dual inline package
TSOP
64
: fine-pitch ball grid array package
FLGA
: quad flat package
: thin small outline package
LCC
: leadless chip carrier
QFP
LQFP
TQFP
Device_E.book Page 65 Wednesday, July 18, 2007 1:03 PM
PACKAGES
● Lead-inserting Type Packages [For regulators: PQ series]
Terminal pitch
mm
Outline dimensions
(Width x Thickness x Height) mm
Lead frame
material
(1.7)*1
10.2 (MAX.) x 3.5 x 25.2*2
Cu
4
2.54
10.2 (MAX.) x 4.5 x 29.1*2
Cu
4
2.54
10.2 (MAX.) x 4.5 x 29.1*2
Cu
5
(1.7)*1
10.2 (MAX.) x 4.5 x 24.6*2
Cu
5
(1.7)*1
10.2 (MAX.) x 4.5 x 24.6*2
Cu
5
(1.7)*1
10.2 (MAX.) x 4.5 x 24.6*2
Cu
3
TO-220
(Heat sink exposure)
[Lead forming type]
No.of
terminals
5
Appearance
(Package material)
Package type
2.5
5.2 (MAX.) x 4.2 (MAX.) x 18.2 (MAX.)*2
Cu
(Plastic)
A
TO-220
(Plastic)
B
TO-220
(Full mold)
Packages
(Plastic)
C
TO-220
(Full mold)
[Lead forming type]
(Plastic)
D
TO-220
[Lead forming type]
(Plastic)
E
TO-220
[Lead forming type]
(Plastic)
TO-92
(Plastic)
*1 The figure in parentheses indicates reference value.
*2 Including lead length
● Surface-mount Type Packages [For regulators/LED drivers: PQ series]
Appearance
(Package material)
Terminal pitch
mm
Outline dimensions
(Width x Height x Thickness) mm
Lead frame
material
(1.7)*1
10.6 (MAX). x 13.7 (MAX.)*2 x 3.5
Cu
5
(Heat sink
not included)
(1.27)*1
6.6 (MAX.) x 9.7 (MAX.)*2 x 2.3
Cu
5
(Heat sink included)
(1.27)*1
6.6(MAX.) x 9.7 (MAX.)*2 x 2.1
Cu
8
TO-263
No.of
terminals
5
(Heat sink
not included)
Package type
1.27
5 x 6.2*2 x 1.55*2
Cu
(Plastic)
F
SC-63
(Plastic)
G
SC-63
(Plastic)
SOP-8
(Plastic)
*1 The figure in parentheses indicates reference value.
*2 Including lead length
65
Device_E.book Page 66 Wednesday, July 18, 2007 1:03 PM
LSI
PACKAGES
● Surface-mount Type Packages [For regulators/LED drivers: PQ series] (cont’d)
No.of
terminals
Terminal pitch
mm
Outline dimensions
(Width x Height x Thickness) mm
Lead frame
material
6
1.5
4.5 x 4.3*2 x 1.5
Cu
6
0.95
2.9 x 2.8*2 x 1.3
Cu
6
0.95
2.9 x 2.8*2 x 1.3
Cu
6
(0.95)*1
(3.4)*1 x 3.3*2 x 1.4 (MAX.)
Cu
5
(0.95)*1
(2.9)*1 x 2.8*2 x 1.3 (MAX.)
Cu
USB-6
6
0.5
2.0 x 1.8 x 0.8
Cu
(Terminal material)/
Au plating
(Terminal finish)
USB-10
10
0.5
2.8 x 2.0 x 0.8
—
Package type
Appearance
(Package material)
SOT-89
(Plastic)
SOT-23-6
(Plastic)
SOT-23-6W
(Plastic)
SOT-23-L
(Plastic)
SOT-23-5
(Plastic)
*1 The figure in parentheses indicates reference value.
*2 Including lead length
The companies listed below own the trademarks of the relevant LSIs.
ARM, ARM7TDMI, ARM720T, ARM922T, ARM946E-S, ARM926EJ-S and Developer Suite are trademarks of ARM Ltd.
Windows is a trademark of Microsoft Corporation.
Ball Grid Array and BGA are trademarks of Motorola Nippon Ltd.
RSDS is a trademark of National Semiconductor Corporation.
Java and Java Card are trademarks of Sun Microsystems, Inc.
SmartMedia is a trademark of Toshiba Corporation.
Z80 is a trademark of ZiLOG, Inc.
CompactFlash is a trademark of SanDisk Corporation.
MIPS, MIPS32, 4KSd are trademarks of MIPS Technologies, Inc.
QUALCOMM and MSM are trademarks of QUALCOMM Incorporated.
IrSS and IrSimple are trademarks of Infrared Data Association®.
Bluetooth is a trademark of Bluetooth SIG, Inc.
All other product or company names are trademarks of their respective holders.
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using
any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any
SHARP device.
66
Device_E.book Page 67 Wednesday, July 18, 2007 1:03 PM
OPTO
PHOTOCOUPLER INDEX TREE
■ Photocoupler Lineup
& lt; Phototransistor output type & gt;
Output type
Single phototransistor
Features
Model No. (series)
General purpose,
High collector-emitter voltage, etc.
Page
PC35x series/PC451J00000F
68
Low input current
PC367NJ0000F
68
PC354NJ0000F
68
Low input current
PC364NJ0000F
68
AC input response
Darlington phototransistor
High sensitivity,
High collector-emitter voltage
68
PC3Hx series
69
PC3H71xNIP0F
69
High collector-emitter voltage
PC4H510NIP0F
69
AC input response
Single phototransistor
68
PC365NJ0000F
Low input current
Compact, Half pitch
(lead space), SMT type
PC355NJ0000F
Low input current
PC3H3J00000F/PC3H4J00000F
69
PC3H41xNIP0F
69
PC3Q62J0000F ▲/PC3Q67QJ000F ▲
69
PC3Q71xNIP0F ▲
69
PC3Q63J0000F ▲/PC3Q64QJ000F ▲
69
PC3Q41xNIP0F ▲
69
General purpose,
High collector-emitter voltage, etc.
▲
Low input current
4-channel output
Low input current
AC input response
Low input current
Darlington phototransistor
General purpose
PC3H5J00000F
69
PC3H510NIP0F
69
High collector-emitter voltage
PC4H520NIP0F ▲
69
4-channel output
PC3Q65J0000F ▲
69
Low input current
PC3Q510NIP0F ▲
69
Isolation thickness:
0.4 mm or more
Creepage distance:
6.4 mm or more
PC123J00000F series
70
Low input current
PC1231xNSZ0F
70
Low input current
DIP type (4/16-pin)
Single phototransistor
Approved by safety standards
other than UL
General purpose,
High collector-emitter voltage, etc.
PC817XJ0000F/PC847XJ0000F/
PC851XJ0000F
70
Low input current
PC817xxNSZ0F
70
PC814XJ0000F/PC844XJ0000F
70
Low input current
PC8141xNSZ0F
70
Built-in SBD/High response speed
PC81100NSZ0F
70
General purpose,
High collector-emitter voltage
PC815XJ0000F/PC845XJ0000F/
PC852XJ0000F/PC853XJ0000F
70
PC81510NSZ0F
70
AC input response
Darlington phototransistor
Low input current
Single phototransistor
General purpose,
High collector-emitter voltage, etc.
PC7xxV0NSZXF
71
Darlington phototransistor
DIP type (6-pin)
Optoelectronics
Package type
4-pin SOP
Compact, SMT type
General purpose,
High collector-emitter voltage, etc.
PC7x5V0NSZXF
71
& lt; OPIC output type & gt;
Package type
Output type
Features
Model No. (series)
Page
Digital output
High CMR
PC457S0NIP0F/PC457L0NIP0F
73
Digital output
General purpose, High response speed, etc.
PC9xxV0NSZXF/PC956L0NSZ0F/
PC910L0NSZ0F/PC911L0NSZ0F/
PC912L0NSZ0F ▲
73
Built-in base amplifier
For inverter control/For inverter control,
Built-in short-circuit protection circuit
PC928J00000F▲/PC929J00000F ▲/
PC942J00000F/PC92xL0NSZ0F series
74
Analog/Digital output
DIP type, SMT type
General purpose, High response speed, 2ch, etc.
Analog/Digital output
Compact, SMT type
PC4xxJ00000F/PC456L0NIP0F/
PC41xS0NIP0F/PC410L0NIP0F/
PC411L0NIP0F/PC4D10SNIP0F
High speed, High CMR, etc.
PC957L0NSZ0F
74
▲
72
The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use.
67
Device_E.book Page 68 Wednesday, July 18, 2007 1:03 PM
OPTO
PHOTOCOUPLERS
■ Photocouplers
Output Type
◆ Phototransistor Output
& lt; Compact, SMT type & gt;
Model No.
Internal
connection
diagram
⅜: Approved, o: Under application
Approved
by safety
standards*2
Features
UL
(Ta = 25°C)
Absolute maximum ratings
Electro-optical characteristics
Isolation
Current transfer ratio
Response time
CollectorForward voltage
emitter
Package current (AC)
tr
voltage CTR
RL VCE
VCE
IF
IC
Viso
IF
(%)
(µs)
VCEO
(mA) (Ω) (V)
(mA) (V)
(mA)
(rms)
MIN.
TYP.
(V)
(kV)
General purpose
⅜❇
50
3.75
80
50
5
5
4
2
100
2
General purpose,
high resistance to noise* 1
High collector-emitter
voltage
⅜
50
3.75
80
90
5
5
4
2
100
2
⅜❇
50
3.75
350
40
5
5
4
2
100
2
PC367NJ0000F
Low input current,
high CMR (MIN. 10kV/µs)
⅜
10
3.75
80
100
0.5
5
4
2
100
2
PC354NJ0000F
AC input response
⅜❇
±50
3.75
80
20
±1
5
4
2
100
2
PC364NJ0000F
Low input current,
high resistance to noise* 1,
AC input response
⅜
±10
3.75
70
50
±0.5
5
4
2
100
2
PC355NJ0000F
High sensitivity
⅜❇
50
3.75
35
600
1
2
60
2
100
2
PC365NJ0000F
High sensitivity,
low input current
⅜
10
3.75
35
600
0.5
2
60
2
100
2
Darlington phototransistor output
Single phototransistor output
PC357NJ0000F
PC352NJ000F
PC451J00000F
Mini-flat
4-pin
*1 CMR: MIN.10 kV/µs
*2 Please refer to Specification Sheets for model numbers approved by safety standards.
❇ A VDE approved type is optionally available.
PC357NJ0000F
(Mini-flat 4-pin)
*PC353TJ0000F only: Same shape, 5-pin
68
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Device_E.book Page 69 Wednesday, July 18, 2007 1:03 PM
PHOTOCOUPLERS
★Under development
Model No.
★PC3HU7NYIP0F
Internal
connection
diagram
Features
UL
Reinforced insulation
(internal insulation distance:
MIN. 0.4 mm),
low-profile package
⅜
Standard
PC3H3J00000F
High resistance to noise* 1,
low input current
AC input response,
high resistance to noise *1
2.5
80
20
1
5
4
2
100
2
50
2.5
80
20
1
5
4
2
100
2
10
2.5
80
100
0.5
5
4
2
100
2
±50
2.5
80
20
±1
5
4
2
100
2
±50
2.5
80
20
±1
5
4
2
100
2
⅜
⅜ *2
Mini-flat
4-pin
PC3H4J00000F
AC input response
PC3H41xNIP0F
AC input response,
high resistance to noise* 1,
low input current
⅜
±10
2.5
80
50
±0.5
5
4
2
100
2
PC4H510NIP0F
High collector-emitter
voltage
⅜
50
2.5
350
40
5
5
4
2
100
2
PC3Q67QJ000F ▲
4-ch type
⅜ *2
50
2.5
80
50
5
5
4
2
100
2
⅜
50
2.5
80
20
1
5
4
2
100
2
⅜
10
2.5
80
100
0.5
5
4
2
100
2
±50
2.5
80
20
±1
5
4
2
100
2
⅜ *2
±50
2.5
80
20
±1
5
4
2
100
2
⅜
±10
2.5
80
50
±0.5
5
4
2
100
2
50
2.5
35
600
1
2
60
2
100
2
10
2.5
35
600
0.5
2
60
2
100
2
50
2.5
350
1 000
1
2
100
2
100
2
50
2.5
35
600
1
2
60
2
100
2
10
2.5
35
600
0.5
2
60
2
100
2
PC3Q62J0000F ▲
PC3Q71xNIP0F ▲
PC3Q63J0000F ▲
noise *1,
High resistance to
4-ch type
High resistance to noise *1,
4-ch type, low input current
AC input response,
high resistance to noise* 1,
4-ch type
⅜
PC3Q64QJ000F ▲
AC input response, 4-ch type
PC3Q41xNIP0F ▲
AC input response,
high resistance to noise* 1,
low input current, 4-ch type
PC3H5J00000F
Darlington phototransistor output
50
⅜
High resistance to noise* 1
PC3H7J00000F
Single phototransistor output
⅜*4, 5
(Ta = 25°C)
Absolute maximum ratings
Electro-optical characteristics
Isolation
Current transfer
CollectorResponse time
ratio
Forward voltage
emitter
Package current (AC)
voltage CTR
tr
Viso
IF
VCE
IC RL VCE
IF
VCEO
(µs)
(%)
(mA)
(rms)
(mA) (Ω) (V)
(mA) (V)
(V)
TYP.
MIN.
(kV)
Lowprofile
50
3.75
80
50
5
5
4
2 100 2
mini-flat
4-pin
⅜ *2
PC3H2J00000F
PC3H71xNIP0F
⅜: Approved, o: Under application
Approved
by safety
standards*3
High sensitivity
⅜ *2
PC4H520NIP0F ▲
High sensitivity,
low input current
High collector-emitter
voltage
PC3Q65J0000F ▲
4-ch type, high sensitivity
⅜ *2
PC3Q510NIP0F ▲
4-ch type, high sensitivity,
low input current
⅜
PC3H510NIP0F
Mini-flat
16-pin
⅜
Mini-flat
4-pin
⅜
Mini-flat
16-pin
Optoelectronics
Type
◆ Phototransistor Output
& lt; Compact, half pitch (lead space) SMT type & gt;
*1 CMR: MIN.10 kV/µs
*2 A VDE approved type is optionally available.
*3 Please refer to Specification Sheets for model numbers approved by safety standards.
*4 VDE, CSA approved
*5 In conformance with BSI, SEMKO, DEMKO, NEMKO, and FIMKO
The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use.
PC3HU7NYIP0F
PC3H2J00000F
(Mini-flat 4-pin)
PC3Q64QJ000F▲
(Mini-flat 16-pin)
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
69
Device_E.book Page 70 Wednesday, July 18, 2007 1:03 PM
OPTO
PHOTOCOUPLERS
Output Type
◆ Phototransistor Output
& lt; DIP type (4/16-pin) & gt;
Model No.
Internal
connection
diagram
⅜: Approved, o: Under application
Absolute maximum ratings
Isolation CollectorForward
Package current voltage emitter
(AC)
voltage
VDE Others
IF
UL
Viso (rms) VCEO
*2
*3
(mA)
(kV)
(V)
Approved by
safety standards*8
Features
High isolation voltage,
long creepage distance
High isolation voltage, long
creepage distance, low input
current, high resistance to noise *4
⅜
⅜
⅜
⅜
⅜
–
PC817XJ0000F* 5, *6, *7
High isolation voltage
⅜
⅜
–
PC847XJ0000F* 5, *9
High isolation voltage (4-ch)
⅜
⅜
–
High isolation voltage, low input
current, high resistance to noise *4
High isolation voltage,
high collector-emitter voltage
⅜
–
–
⅜
–
–
PC814XJ0000F* 5, *6
High isolation voltage,
AC input response
⅜
⅜
–
PC844XJ0000F
High isolation voltage,
AC input response (4-ch)
⅜
⅜
–
PC8141xNSZ0F
High isolation voltage, AC input
response, low input current,
high resistance to noise *4
⅜
–
–
PC81100NSZ0F
Built-in schottky barrier diode,
toff: 35µs TYP.
(In saturation, RL = 100kΩ)
⅜
–
–
PC815XJ0000F
High isolation voltage,
high sensitivity
⅜
–
–
PC845XJ0000F
High isolation voltage,
high sensitivity (4-ch)
⅜
–
–
PC81510NSZ0F
High isolation voltage,
high sensitivity, low input current
⅜
–
–
High isolation voltage,
high collector-emitter voltage
High isolation voltage,
high collector-emitter voltage
⅜
⅜
–
⅜
⅜
–
PC123J00000F* 1
Single phototransistor output
PC1231xNSZ0F
PC8171xNSZ0F
PC851XJ0000F
Darlington phototransistor output
Schottky barrier diode
*1
*2
*3
*4
*5
*6
*7
*8
*9
PC852XJ0000F* 5, *6
PC853XJ0000F* 5, *6
CTR
(%)
MIN.
IF
(mA)
tr
RL
(µs) (Ω)
TYP.
50
5.0
70
50
5
4
100
10
5.0
70
50
0.5
4
100
50
5.0
80
50
5
4
100
50
5.0
80
50
5
4
100
10
5.0
70
100
0.5
4
100
50
5.0
350
40
5
4
100
±50
5.0
80
20
±1
4
100
±50
5.0
80
20
±1
4
100
±10
5.0
80
50
±0.5
4
100
50
5.0
70
50
5
4-pin
DIP
50
5.0
35
600
1
60
100
16-pin
DIP
50
5.0
35
600
1
60
100
10
5.0
35
600
0.5
60
100
50
5.0
350
1 000
1
100 100
50
5.0
350
1 000
1
100 100
4-pin
DIP
16-pin
DIP
4-pin
DIP
16-pin
DIP
4-pin
DIP
4-pin
DIP
ton:
TYP. 100
9
Wide lead spacing type (F type) is also available. Creepage distance PC123: 6.4 mm or more, PC123F: 8 mm or more
Optionally available.
BSI, SEMKO, DEMKO, NEMKO, FIMKO, CSA
CMR: 10 kV/µs MIN.
Lead forming type (I type) is also available for surface mounting.
Taped package of lead forming type for surface mounting is also available.
Wide lead spacing type (F type) is also available. Lead forming type (FI type) of F type is also available.Taped package is also available for I and FI type of lead forming type.
Please refer to Specification Sheets for model numbers approved by safety standards.
Approved by UL as multi-channel type of PC817.
PC817XJ0000F
(4-pin DIP)
70
(Ta = 25°C)
Electro-optical characteristics
Current transfer ratio Response time
PC847XJ0000F
(16-pin DIP)
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Device_E.book Page 71 Wednesday, July 18, 2007 1:03 PM
PHOTOCOUPLERS
Darlington phototransistor output Single phototransistor output
Output Type
◆ Phototransistor Output
& lt; DIP type (6-pin) & gt;
Model No.
Internal
connection
diagram
⅜: Approved, o: Under application
Features
UL
(Ta = 25°C)
Absolute maximum ratings
Electro-optical characteristics
Isolation Collector- Current transfer Response
Forward
ratio
time
emitter
Package current voltage
(AC)
voltage CTR
IF
tr
RL
IF
Viso (rms) VCEO
(%)
(mA) (µs)
(Ω )
VDE*1
(mA)
(V)
(kV)
MIN.
TYP.
Approved
by safety
standards*2
PC714V0NSZXF
High isolation voltage
⅜
⅜
50
5.0
80
50
5
4
100
PC724V0NSZXF
High isolation voltage,
large input current
⅜
–
150
5.0
35
20
100
4
100
PC713V0NSZXF
High isolation voltage,
with base terminal
⅜
⅜
50
5.0
80
50
5
4
100
6-pin
DIP
PC715V0NSZXF
High isolation voltage,
high sensitivity
⅜
⅜
50
5.0
35
600
1
60
100
PC725V0NSZXF
High isolation voltage,
high sensitivity,
high collector-emitter voltage,
high power
⅜
⅜
50
5.0
300
1 000
1
100
100
Optoelectronics
*1 Optionally available.
*2 Please refer to Specification Sheets for model numbers approved by safety standards.
PC713V0NSZXF
(6-pin DIP)
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
71
Device_E.book Page 72 Wednesday, July 18, 2007 1:03 PM
OPTO
PHOTOCOUPLERS
◆ OPIC∗ Output
& lt; Compact, SMT type & gt; (1-1)
∗ “OPIC” (Optical IC) is a trademark of SHARP Corporation. An OPIC consists of a light-
detecting element and a signal-processing circuit integrated onto a single chip.
⅜: Approved, o: Under application
Model No.
Internal
connection
diagram
(Ta = 25°C)
Absolute maximum
Electro-optical characteristics*1
ratings
Low level output voltage
Threshold input current
Isolation
Package Forward voltage
current
IFLH
VOL
IFHL
(AC)
IF
RL
Ta
IOL
IF
(mA) (mA)
UL VDE*3
Viso (rms) (V)
(mA) (mA)
(Ω )
(°C)
(mA)
MAX. MAX.
MAX.
(kV)
Approved by
safety
standards*2
Features
PC400J00000F
A
Digital output,
normal-off operation
⅜
–
50
3.75
0.4
0 to +70
16
4
2.0
–
280
PC401J00000F
A
Digital output,
normal-on operation
⅜
–
50
3.75
0.4
0 to +70
16
0
–
2.0
280
PC456L0NIP0F
A
⅜
⅜
25
3.75
0.6
–40 to +85
4.4
10
5.0
–
20 k
⅜
⅜
20
3.75
0.6
–40 to +85
13
5
5.0
–
350
⅜
⅜
20
3.75
0.6
–40 to +85
13
5
5.0
–
350
–*4
3.75
1
–40 to +85
4
VIN =
VIL
–
–
–
20
3.75
0.1
–40 to +85 0.02
12
6.0
–
–
20
3.75
0.1
–40 to +85 0.02
12
6.0
–
–
20
3.75
0.6
–40 to +85
5
5.0
–
–
PC410L0NIP0F
PC410S0NIP0F
PC412S0NIP0F
PC411L0NIP0F
PC411S0NIP0F
PC4D10SNIP0F
Built-in preamplifier,
high speed transmission
(2 Mb/s),
For flow soldering
High speed (10 Mb/s),
High CMR (10 kV/µs),
For flow soldering
High speed (10 Mb/s),
High CMR (10 kV/µs),
For flow soldering,
Solder heat resistance:
270°C
High speed (25 Mb/s),
High CMR (10 kV/µs),
For flow soldering,
Solder heat resistance:
270°C
High speed (15 Mb/s),
High CMR (10 kV/µs),
For flow soldering
High speed (15 Mb/s),
High CMR (10 kV/µs),
For flow soldering,
Solder heat resistance:
270°C
High speed (10 Mb/s),
For flow soldering,
Solder heat resistance:
270°C
2ch output
Mini-flat
5-pin
SOP
8-pin
⅜
–
⅜
⅜
⅜
⅜
Mini-flat
5-pin
SOP
8-pin
⅜
–
13
A: Rated voltage circuit
*1 Each item is measured at Vcc=5V. (PC400, PC401)
*2 Please refer to Specification Sheets for model numbers approved by safety standards.
*3 Optionally available.
*4 No forward current rating for voltage input (rated input voltage: –0.5 to 6.0 V).
72
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Device_E.book Page 73 Wednesday, July 18, 2007 1:03 PM
PHOTOCOUPLERS
& lt; Compact, SMT type & gt; (1-2)
Internal
connection
diagram
Features
UL
High speed (1 Mb/s),
high CMR (15 kV/µs),
For flow soldering
High speed (1 Mb/s),
high CMR (15 kV/µs),
For flow soldering,
Solder heat resistance:
270°C
PC457L0NIP0F
PC457S0NIP0F
⅜
⅜
Mini-flat
5-pin
25
3.75
19
16
0.4
4.5
0.2
0.6
1 900
16
⅜
⅜
SOP
8-pin
25
3.75
19
16
0.4
4.5
0.2
0.6
1 900
16
*1 Please refer to Specification Sheets for model numbers approved by safety standards.
PC400J00000F
(Mini-flat 5-pin)
Internal
connection
diagram
⅜: Approved, o: Under application
Features
A
PC901V0NSZXF
A
PC956L0NSZ0F
A
PC910L0NSZ0F
Absolute
maximum ratings
Approved by
safety
standards*6
UL
PC900V0NSZXF* 2, *3
*2 Optionally available.
PC412S0NIP0F
(SOP 8-pin)
◆ OPIC Output
& lt; DIP type, digital output & gt;
Model No.
(Ta = 25°C)
Absolute maximum
Electro-optical characteristics
ratings
Isolation
Current transfer ratio
Propagation delay time
Package Forward voltage
current
CTR
tPHL tPLH
(AC)
VO VCC
IF
RL
IF
IF
VDE*2
Viso (rms) (%) (mA) (V) (V) (µs) (µs)
(Ω) (mA)
(mA)
TYP. TYP.
MIN.
(kV)
Electro-optical characteristics*1
Threshold input
Isolation
Low level output voltage
current
Package Forward voltage
current
(AC)
VOL
IFHL IFLH
IF
IF
VDE
RL
Ta
IOL
Viso (rms) (V)
(mA) (mA)
(mA)
(mA) (mA)
*4
(Ω )
(°C)
(kV)
MAX. MAX.
MAX.
Digital output,
normal-off operation
⅜
⅜
Digital output,
normal-on operation
⅜
⅜
⅜
⅜
⅜
⅜
Built-in preamplifier,
high speed transmission (2 Mb/s)
For soldering flow
Digital output,
High speed (10 Mb/s),
high CMR (20 kV/µs)
For soldering flow
(Ta = 25°C)
50
5.0
0.4
0 to +70
16
4
2.0
–
280
50
5.0
0.4
0 to +70
16
0
–
2.0
280
25
5.0
0.6
–40 to +85
2.4
10
5.0
–
20 k
20
5.0
0.6
–40 to +85
13
5
5.0
–
350
12
6.0
–
–
VIN =
VIL
–
–
Optoelectronics
Model No.
⅜: Approved, o: Under application
Approved by
safety
standards*1
–
6-pin
DIP
8-pin
DIP
PC911L0NSZ0F
High speed (15 Mb/s),
high CMR (10 kV/µs),
For soldering flow
⅜
⅜
20
5.0
0.1
–40 to +85 0.02
PC912L0NSZ0F ▲
Digital output,
High speed (25 Mb/s),
high CMR (20 kV/µs)
⅜
⅜
–*5
5.0
1.0
–40 to +85
4
A: Rated voltage circuit
*1 Each item is measured at Vcc=5V.
*2 Lead forming type (I type) is also available for surface mounting.
*3 Taped package of lead forming type for surface mounting is also available.
*4 Optionally available.
*5 No forward current rating due to voltage input. (rated input voltage: –0.5 to 6.0 V)
*6 Please refer to Specification Sheets for model numbers approved by safety standards.
The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use.
PC90xV0NSZXF series
(6-pin DIP)
PC910L0NSZ0F
(8-pin DIP)
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
73
Device_E.book Page 74 Wednesday, July 18, 2007 1:03 PM
OPTO
PHOTOCOUPLERS
◆ OPIC Output
& lt; DIP type, Gate drive type & gt;
Model No.
Internal
connection
diagram
PC942J00000F
Interface
Amplifier
PC923L0NSZ0F* 1
Interface
Amplifier
PC924L0NSZ0F* 1
Interface
Amplifier
PD
Interface
OPIC
PC925L0NSZ0F
Tr1
Tr2
IGBT protection circuit
PC928J00000F▲
Interface
Voltage
regulator
Amplifier
IGBT protection circuit
PC929J00000F▲
Interface
Voltage
regulator
Amplifier
⅜: Approved, o: Under application
Approved by
safety
standards*3
Features
Package
(Ta = 25°C)
Absolute maximum ratings
Electro-optical characteristics
Isolation
Propagation delay time
Forward
Output
voltage
current
current
tPHL tPLH
(AC)
IF
IF
RL1 RL2
IO1
VCC
Viso (rms)
(µs) (µs)
(A)
(mA)
(V) (mA) (Ω) (Ω)
(kV)
TYP. TYP.
UL
VDE
*2
⅜
⅜
25
5.0
0.5
2.0
2.0
6
5
5
10
⅜
⅜
20
5.0
0.1
0.3
0.3
24
5
RG =
47
–
⅜
⅜
25
5.0
0.1
1.0
1.0
24
10
RG =
47
–
–
–
–
5.0
2.5
24
10
RG =
10
–
For driving inverter IGBT,
built-in short
protection circuit
⅜
⅜
25
4.0
0.1
1.0
1.0
24
10
RG =
47
–
For driving inverter IGBT,
high speed, built-in short
protection circuit
⅜
20
4.0
0.1
0.3
0.3
24
5
RG =
47
–
For controlling invertercontrolled air-conditioner
• Built-in drive circuit
directly connectable to
MOS-FET and IGBT
• Low dissipation current
(Icc = TYP. 1.3 mA)
• High resistance to noise
(CMR: MIN. 15 kV/µs)
• Built-in drive circuit
directly connectable to
MOS-FET and IGBT
• Low dissipation current
(Icc = TYP. 1.3 mA)
• High resistance to noise
(CMR: MIN. 15 kV/µs)
• Built-in drive circuit
directly connectable to
MOS-FET and IGBT
• Peak output current:
2.5 A
• Low dissipation current
(Icc = TYP. 5 mA)
• High resistance to noise
(CMR: MIN. 15 kV/µs)
8-pin
DIP
MAX. MAX.
0.5 0.5
14-pin SMT
(Half pitch
lead)
⅜
*1 Lead forming type (I type) is also available for surface mounting. Taped package of lead forming type for surface mounting is also available.
*2 A VDE approved type is optionally available.
*3 Please refer to Specification Sheets for model numbers approved by safety standards.
The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use.
◆ OPIC Output
& lt; DIP type, analog/digital output & gt;
Model No.
PC957L0NSZ0F
Internal
connection
diagram
⅜: Approved, o: Under application
Approved by
safety
standards*3
Features
UL
High speed (1 Mb/s),
high CMR (15 kV/µs),
for flow soldering
VDE*2
⅜
⅜
Absolute maximum
ratings
Isolation
Package Forward voltage
current
(AC)
IF
Viso (rms)
(mA)
(kV)
8-pin
DIP
25
5.0
(Ta = 25°C)
Electro-optical characteristics
Current transfer ratio
Propagation delay time*1
CTR
(%)
MIN
IF
(mA)
VO
(V)
VCC
(V)
tPHL tPLH
(µs) (µs)
TYP. TYP.
19
16
0.4
4.5
0.2
RL
(Ω )
0.6 1 900
IF
(mA)
16
*1 Vcc = 5V
*2 Optionally available.
*3 Please refer to Specification Sheets for title(s) of safety standards.
PC92xL0NSZ0F
(8-pin DIP)
74
PC928J00000F
(14-pin SMT (Half pitch lead))
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Device_E.book Page 75 Wednesday, July 18, 2007 1:03 PM
OPTO
PHOTOTRIAC COUPLER INDEX TREE
■ Phototriac Coupler Lineup
Mini-flat (SMD)
Applied voltage
AC 200 V lines
(VDRM = 600V)
ON-state
current (rms)
0.05 A
Features
Model No.
Page
S2S3000F*4 / S2S5A00F*4
76
S2S4000F*4
76
PC3SG11YIZ0F ▲*4
76
PC3SG21YIZ0F ▲*4
76
PC3ST11NSZAF
76
PC3ST21NSZBF* 3
77
PC3SH11YFZAF* 4 / PC3SH13YFZAF* 4
76
PC3SH21YFZBF* 3
77
General purpose (5th-pin cut)
PC2SD11NTZAF* 4
76
General purpose (5th-pin cut)
PC3SD12NTZAF* 4 / PC3SD11NTZAF ▲*4 /
PC3SD11NTZBF* 3 / PC3SD11NTZCF* 2 /
PC3SD11YTZDF* 1 / PC3SD21YTZEF* 5
General purpose
Built-in zero-cross circuit
Reinforced isolation
Built-in zero-cross circuit
DIP type
AC 200 V lines
(VDRM = 600V)
0.1 A
General purpose
(4-pin)
Built-in zero-cross circuit
Reinforced isolation
Built-in zero-cross circuit
DIP type
AC 100 V lines
(VDRM = 400V)
0.1 A
(6-pin)
AC 200 V lines
(VDRM = 600V)
0.1 A
Built-in zero-cross circuit
0.1 A
General purpose
Built-in zero-cross circuit
Reinforced isolation
Built-in zero-cross circuit
77
PC3SF11YVZAF* 4 / PC3SF11YVZBF* 3
76
PC3SF21YVZAF* 4 / PC3SF21YVZBF* 3 /
PC3SF23YVZSF* 3
77
PC4SD11NTZBF* 3 / PC4SD11NTZCF* 2
Built-in zero-cross circuit
Reinforced isolation (5th-pin cut)
AC 200 V lines
(VDRM = 800V)
76/77
PC3SD21NTZBF* 3 / PC3SD21NTZCF* 2 /
PC3SD21NTZDF* 1 / PC3SD23YTZCF* 2
76
PC4SD21NTZCF* 2 / PC4SD21NTZDF* 1
77
PC4SF11YVZAF* 4 / PC4SF11YVZBF* 3
76
PC4SF21YVZBF* 3 / PC4SF21YVZCF* 2
77
Optoelectronics
Package
Minimum trigger current: *1 IFT & 3 mA, *2 IFT & 5 mA, *3 IFT & 7 mA, *4 IFT & 10 mA, *5 IFT & 2 mA
The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use.
75
Device_E.book Page 76 Wednesday, July 18, 2007 1:03 PM
OPTO
PHOTOTRIAC COUPLERS
■ Phototriac Couplers
⅜: Approved, o: Under application
Absolute maximum ratings
Approved by
safety standards*4
Type
Model No.
Internal
connection
diagram
Features
UL
(Ta = 25°C)
Electro-optical
characteristics
Min. trigger current
Repetitive
Isolation
Package ON-state peak
voltage
current OFF-state
IFT
(AC)
Others
IT (rms) voltage
VDE
Viso (rms) (mA)
*5
VDRM
(A)
MAX.
(kV)
(V)
VD
(V)
RL
(Ω )
10
6
100
10
6
100
S2S3000F
200 V lines, compact
⅜
⅜ *6
⅜
S2S5A00F
200 V lines, compact
⅜
⅜ *6
⅜
PC3SG11YIZ0F ▲
200 V lines,
reinforced insulation
(isolation thickness: 0.4 mm)
⅜
⅜
–
10
6
100
PC3ST11NSZAF
200 V lines, compact
⅜
⅜ *6
⅜
10
6
100
200 V lines, compact,
reinforced isolation
200 V lines, compact,
reinforced isolation,
High noise resistance
⅜
⅜
⅜ *2
10
6
100
⅜
⅜
⅜ *2
10
6
100
PC2SD11NTZAF* 7
100 V lines
⅜
–
⅜
10
6
100
PC3SD12NTZAF* 8
200 V lines
⅜
⅜ *6
⅜
10
6
100
PC3SD11NTZAF
200 V lines
⅜
⅜ *6
⅜
10
6
100
PC3SD11NTZBF
200 V lines
⅜
⅜ *6
⅜
7
6
100
PC4SD11NTZBF
200 V lines,
repetitive peak-OFF-state voltage
⅜
⅜ *6
⅜
7
6
100
PC3SD11NTZCF
200 V lines
⅜
⅜ *6
⅜
5
6
100
3
6
100
5
6
100
10
6
100
7
6
100
10
6
100
7
6
100
PC3SH11YFZAF
For triggering
PC3SH13YFZAF
PC3SD11YTZDF
200 V lines, low input drive
⅜
⅜
⅜
PC4SD11NTZCF
200 V lines,
repetitive peak-OFF-state voltage
⅜
⅜ *6
200 V lines, reinforced isolation
⅜
⅜
4-pin
DIP
0.05
0.1
600
600
3.75
5.0
400
600
800
6-pin
DIP*1, 3
⅜
PC3SF11YVZAF
Mini-flat
4-pin
0.1
600
⅜ *2
800
5.0
600
PC3SF11YVZBF
PC4SF11YVZAF
PC4SF11YVZBF
200 V lines, reinforced isolation
⅜
⅜
⅜ *2
200 V lines, reinforced isolation,
repetitive peak-OFF-state voltage
200 V lines, reinforced isolation,
repetitive peak-OFF-state voltage
⅜
⅜
⅜ *2
800
⅜
⅜
⅜ *2
For the note *1 to *9, see next page.
The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use.
76
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Device_E.book Page 77 Wednesday, July 18, 2007 1:03 PM
PHOTOTRIAC COUPLERS
■ Phototriac Couplers (cont’d)
Model No.
Internal
connection
diagram
S2S4000F
Zero-cross
circuit
PC3SG21YIZ0F ▲
PC3ST21NSZBF
PC3SH21YFZBF
Zero-cross
circuit
PC3SD21NTZBF
PC3SD21NTZCF* 9
For triggering
PC3SD23YTZCF
PC3SD21NTZDF
PC3SD21YTZEF
PC4SD21NTZCF
PC4SD21NTZDF
PC3SF21YVZAF
PC3SF21YVZBF
PC3SF23YVZSF
PC4SF21YVZBF
PC4SF21YVZCF
Zero-cross
circuit
(Ta = 25°C)
Electro-optical
Absolute maximum ratings
Approved by
characteristics
safety standards*4
Repetitive Isolation Min. trigger current
Package ON-state peak
voltage
current
IFT
OFF-state (AC)
RL
VD
Others
IT (rms)
UL VDE
VDRM Viso (rms) (mA) (V)
(Ω )
*5
(A)
MAX.
(V)
(kV)
Features
200 V lines, compact,
built-in zero-cross circuit
200 V lines,
reinforced insulation
(isolation thickness: 0.4 mm),
built-in zero-cross circuit
200 V lines, compact,
built-in zero-cross circuit
200 V lines, compact, reinforced
isolation, built-in zero-cross circuit
200 V lines, low zero-cross voltage:
MAX. 20 V, built-in zero-cross circuit
200 V lines, low zero-cross voltage:
MAX. 20 V, built-in zero-cross circuit
200 V lines, built-in zero-cross circuit,
High pulse/noise resistance
(TYP. 2 kV)
200 V lines, low zero-cross voltage:
MAX. 20 V, built-in zero-cross circuit
200 V lines, built-in zero-cross circuit,
Low input drive
200 V lines, built-in zero-cross circuit,
repetitive peak-OFF-state voltage
200 V lines, built-in zero-cross circuit,
repetitive peak-OFF-state voltage
200 V lines, reinforced isolation
built-in zero-cross circuit
200 V lines, reinforced isolation
built-in zero-cross circuit
200 V lines, reinforced isolation,
built-in zero-cross circuit, High pulse/
noise resistance (TYP. 2 kV)
200 V lines, reinforced isolation,
built-in zero-cross circuit,
repetitive peak-OFF-state voltage
200 V lines, reinforced isolation,
built-in zero-cross circuit,
repetitive peak-OFF-state voltage
⅜
⅜ *6
⅜
0.05
Mini-flat
4-pin
600
3.75
10
6
100
0.05
600
3.75
10
6
100
0.1
600
5.0
7
4
100
0.1
600
5.0
7
4
100
⅜
⅜
–
⅜
⅜ *6
⅜
⅜
⅜
⅜ *2
⅜
⅜ *6
⅜
0.1
600
5.0
7
4
100
⅜
⅜ *6
⅜
0.1
600
5.0
5
4
100
⅜
⅜
⅜
0.1
600
5.0
5
4
100
⅜
⅜ *6
⅜
0.1
600
5.0
3
4
100
⅜
⅜
⅜
0.1
600
5.0
2
4
100
⅜
⅜ *6
⅜
0.1
800
5.0
5
4
100
⅜
⅜ *6
⅜
0.1
800
5.0
3
4
100
⅜
⅜
⅜ *2
0.1
600
5.0
10
4
100
⅜
⅜
⅜ *2
0.1
600
5.0
7
4
100
⅜
⅜
⅜ *2
0.1
600
5.0
7
4
100
⅜
⅜
⅜ *2
0.1
800
5.0
7
4
100
⅜
⅜
⅜ *2
0.1
800
5.0
5
4
100
4-pin
DIP
6-pin
DIP*1, 3
Optoelectronics
Type
⅜: Approved, o: Under application
*1 Lead forming type for surface mounting is also available.
*2 In conformance with BSI, SEMKO, DEMKO, NEMKO, and FIMKO
*3 These are molded pin No. 5.
*4 Please refer to Specification Sheets for model numbers approved by safety standards.
*5 CSA approval
*6 Optionally available
*7 An equivalent model (IFT MAX.: 15 mA) with overseas brand compatibility is also available. (PC1S3021NTZF)
*8 An equivalent model with overseas brand compatibility is also available. (PC1S3052NTZF)
*9 An equivalent model with overseas brand compatibility is also available. (PC1S3063NTZF)
The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use.
S2S3000F
(Mini-flat 4-pin)
PC2SD series
(PC3SD series, PC4SD series)
(6-pin DIP)
PC3SF series
(PC4SF series)
(6-pin DIP)
PC3ST11NSZAF
(PC3ST21NSZBF)
(4-pin DIP)
PC3SH11YFZAF
PC3SH21YFZBF,
PC3SH13YFZAF
(4-pin DIP)
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
77
Device_E.book Page 78 Wednesday, July 18, 2007 1:03 PM
OPTO
SOLID STATE RELAY INDEX TREE
■ Solid State Relay Lineup
Package
DIP 6-pin
Applied voltage
Features
Model No.
Page
General purpose
PR22MA11NTZF
79
AC 200 V lines
General purpose
PR31MA11NTZF / PR32MA11NTZF
79
AC 100 V lines
General purpose
PR23MF11NSZF / PR26MF series / PR29MF series
79
Built-in zero-cross circuit
PR26MF21NSZF / PR29MF21NSZF
79
General purpose
PR33MF51NSZF / PR36MF series / PR39MF series /
PR3BMF11NSZF ▲
79
Built-in zero-cross circuit
PR36MF series / PR39MF series / PR3BMF21NSZF
79
General purpose
S102T01F▲ / S108T01F▲ / S101S05F▲ /
S102S01F▲ / S112S01F▲ / S116S01F▲
80
Built-in zero-cross circuit
S102T02F▲ / S108T02F▲ / S101S06F▲ /
S102S02F▲ / S116S02F▲
80
Built-in snubber circuit
S102S11F▲
80
Built-in zero-cross/snubber circuit
S101S16F▲ / S102S12F▲
80
General purpose
S202T01F▲ / S208T01F▲ / S202S01F▲ /
S212S01F▲ / S216S01F▲
80
Built-in zero-cross circuit
S202T02F▲ / S208T02F▲ / S201S06F▲ /
S202S02F▲ / S216S02F▲
80/81
Built-in snubber circuit
S202S15F▲ / S202S11F▲
80/81
Built-in zero-cross/snubber circuit
S202S12F▲
81
Reinforced isolation
DIP 8-pin
AC 100 V lines
S202SE1F▲ / S216SE1F▲
81
S202SE2F▲ / S216SE2F▲
81
AC 200 V lines
SIP 4-pin
AC 100 V lines
Sx0xT0xF series
AC 200 V lines
Built-in zero-cross circuit
The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use.
78
Device_E.book Page 79 Wednesday, July 18, 2007 1:03 PM
SOLID STATE RELAYS
■ Solid State Relays
& lt; DIP type & gt;
Model No.
⅜: Approved, o: Under application
Internal
connection
diagram
(Ta = 25°C)
Absolute maximum ratings Electrical characteristics
Repetitive Isolation Min. trigger current
ON-state
voltage
peak
Package current
IFT
OFF-state (AC)
RL
VD
IT (rms)
UL CSA VDE*2
voltage Viso (rms) (mA)
(V) (Ω)
(A)
MAX.
(kV)
VDRM (V)
Approved by
safety standards*1
Features
200 V lines, compact
⅜
⅜
⅜
100 V lines,
150 mA output in a small package
200 V lines,
150 mA output in a small package
⅜
⅜
⅜
⅜
⅜
⅜
PR23MF11NSZF
100 V lines, compact
⅜
⅜
–
PR33MF51NSZF
200 V lines, compact
⅜
⅜
PR26MF11NSZF
100 V lines, compact
⅜
PR26MF12NSZF
100 V lines, compact,
low input current
PR29MF11NSZF
600
5.0
10
6
100
400
5.0
10
6
100
600
5.0
10
6
100
0.3
400
4.0
10
6
100
⅜
0.3
600
4.0
10
6
100
⅜
–
0.6
400
4.0
10
6
100
⅜
⅜
–
0.6
400
4.0
5
6
100
100 V lines, compact
⅜
⅜
–
0.9
400
4.0
10
6
100
100 V lines, compact,
low input current
100 V lines, compact
(built-in zero-cross circuit)
100 V lines, compact
(built-in zero-cross circuit)
⅜
⅜
–
0.9
400
4.0
5
6
100
⅜
⅜
–
0.6
400
4.0
10
6
100
⅜
⅜
–
0.9
400
4.0
10
6
100
PR36MF51NSZF
200 V lines, compact
⅜
⅜
⅜
0.6
600
4.0
10
6
100
PR36MF12NSZF
200 V lines, compact,
low input current
⅜
⅜
⅜
0.6
600
4.0
5
6
100
PR39MF11NSZF ▲
200 V lines, compact
⅜
⅜
⅜
0.9
600
4.0
10
6
100
PR39MF12NSZF
200 V lines, compact,
low input current
⅜
⅜
⅜
0.9
600
4.0
5
6
100
PR39MF51NSZF
200 V lines, compact
⅜
⅜
⅜
0.9
800
4.0
10
6
100
PR3BMF11NSZF ▲
200 V lines, compact,
High-temperature operation
200 V lines, compact (built-in zerocross circuit), low input current
200 V lines, compact (built-in zerocross circuit), low input current
200 V lines, compact (built-in zerocross circuit)
200 V lines, compact (built-in zerocross circuit)
200 V lines, compact (built-in zerocross circuit)
⅜
⅜
⅜
1.2
600
4.0
10
6
100
⅜
⅜
⅜
0.6
600
4.0
5
6
100
⅜
⅜
⅜
0.9
600
4.0
5
6
100
0.6
600
4.0
10
6
100
PR22MA11NTZF
PR32MA11NTZF
PR29MF12NSZF
PR26MF21NSZF
PR29MF21NSZF
Zerocross
circuit
PR36MF22NSZF
PR39MF22NSZF
PR36MF21NSZF
PR39MF21NSZF
PR3BMF21NSZF
Zerocross
circuit
0.06
6-pin
DIP
8-pin
DIP
8-pin
DIP
0.15
⅜
⅜
⅜
⅜
⅜
⅜
0.9
600
4.0
10
6
100
⅜
⅜
⅜
1.2
600
4.0
10
6
Optoelectronics
PR31MA11NTZF
100
*1 Please refer to Specification Sheets for model numbers approved by safety standards.
*2 Optionally available.
The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use.
PR22MA11NTZF
(6-pin DIP)
PR26MF21NSZF
(8-pin DIP)
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
79
Device_E.book Page 80 Wednesday, July 18, 2007 1:03 PM
OPTO
SOLID STATE RELAYS
& lt; SIP type & gt; (1)
Model No.
⅜: Approved, o: Under application
Electrical characteristics
Min. trigger current
UL
Internal
connection
diagram
S102T01F▲
IFT
(mA)
MAX.
VD
(V)
RL
(Ω )
8
12
30
8
12
30
15
12
30
8
12
30
8
12
30
8
12
30
8
12
30
8
12
30
15
6
30
8
6
30
8
6
30
4.0
8
12
30
3.0
15
6
30
4.0
8
6
30
8
12
30
8*2
8
12
30
8
12
30
8
12
30
8
12
30
10
12
30
8
12
30
8
12
30
15
6
30
8
6
30
8
6
30
Features
100 V lines, low profile
⅜
Absolute maximum ratings
Repetitive Isolation
ON-state
voltage
peak
TÜV Package current OFF-state (AC)
IT (rms)
CSA EN
voltage Viso (rms)
(A)
60950
(kV)
VDRM(V)
⅜
–
S108T01F▲
100 V lines, low profile
–
–
–
S101S05F▲
100 V lines
⅜
⅜
S102S01F▲
100 V lines
⅜
⅜
–
Low
profile
4-pin
SIP
–
2
400
3*3
4-pin
SIP
3.0
8*2
400
100 V lines
⅜
⅜
–
S116S01F▲
100 V lines
⅜
⅜
–
S102T02F▲
100 V lines, low profile
(built-in zero-cross circuit)
100 V lines, low profile
(built-in zero-cross circuit)
⅜
⅜
–
–
–
–
100 V lines (built-in zero-cross circuit)
⅜
⅜
–
3*3
100 V lines (built-in zero-cross circuit)
⅜
⅜
–
8*2
S108T02F▲
S101S06F▲
S102S02F▲
S116S02F▲
Zerocross
circuit
⅜
⅜
100 V lines (built-in snubber circuit)
⅜
⅜
–
S101S16F▲
100 V lines (built-in snubber circuit,
built-in zero-cross circuit)
100 V lines (built-in snubber circuit,
built-in zero-cross circuit)
⅜
⅜
Low
profile
4-pin
SIP
2
400
3.0
8*2
3.0
400
16*5
⅜
⅜
–
200 V lines, low profile
⅜
⅜
–
4-pin
SIP
–
S202T01F▲
4.0
16*5
–
S102S11F▲
S102S12F▲
12*4
4.0
100 V lines (built-in zero-cross circuit)
Zerocross
circuit
3.0
8*2
S112S01F▲
Zerocross
circuit
(Ta = 25°C)
Approved by
safety standards*6
8*1
400
3*3
400
8*1
Low
profile
4-pin
SIP
2
600
S208T01F▲
200 V lines, low profile
–
–
–
S202S01F▲
200 V lines
⅜
⅜
–
8*2
S212S01F▲
200 V lines
–
–
–
12*4
3.0
S216S01F▲
200 V lines
–
–
–
S202S15F▲
200 V lines, built-in snubber circuit
–
–
–
S202T02F▲
200 V lines, low profile
(built-in zero-cross circuit)
200 V lines, low profile
(built-in zero-cross circuit)
⅜
⅜
–
–
–
–
200 V lines (built-in zero-cross circuit)
⅜
⅜
–
200 V lines (built-in zero-cross circuit)
⅜
⅜
–
4-pin
SIP
S208T02F▲
S201S06F▲
S202S02F▲
S216S02F▲
Zerocross
circuit
200 V lines (built-in zero-cross circuit)
–
–
–
600
3.0
2
8*2
3*3
4-pin
SIP
4.0
16*5
8*6
Low
profile
4-pin
SIP
600
3.0
600
8*2
4.0
16*5
*1 to *6: Please refer to the next page.
The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use.
80
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Device_E.book Page 81 Wednesday, July 18, 2007 1:03 PM
SOLID STATE RELAYS
& lt; SIP type & gt; (2)
Internal
connection
diagram
S202S11F▲
S202S12F▲
UL
IFT
(mA)
MAX.
VD
(V)
RL
(Ω )
Features
200 V lines (built-in snubber circuit)
⅜
–
8*1
600
4.0
8
12
30
200 V lines (built-in snubber circuit,
built-in zero-cross circuit)
⅜
⅜
–
8*1
600
4.0
8
6
30
⅜
Zerocross
circuit
⅜
⅜
⅜
8
12
30
600
3.0
8
12
30
8
6
30
8
6
30
S202SE1F▲
4-pin
SIP
8*2
200 V lines, reinforced isolation
S216SE1F▲
–
S202SE2F▲
S216SE2F▲
(Ta = 25°C)
Electrical characteristics
Min. trigger current
Absolute maximum ratings
Repetitive Isolation
ON-state
voltage
peak
TÜV Package current OFF-state (AC)
IT (rms)
CSA EN
voltage Viso (rms)
(A)
60950
(kV)
VDRM(V)
Zerocross
circuit
200 V lines (built-in zero-cross circuit),
reinforced isolation
–
⅜
16*5
⅜
⅜
⅜
8*2
600
–
–
⅜
16*5
*1 Tc & 88°C
*2 Tc & 80°C
*3 Tc & 100°C
*4 Tc & 70°C
*6 Please refer to Specification Sheets for model numbers approved by safety standards.
The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use.
S102T01 series
(Low profile 4-pin SIP)
3.0
*5 Tc & 60°C
Optoelectronics
Model No.
⅜: Approved, o: Under application
Approved by
safety standards*6
S102S01 series
(4-pin SIP)
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
81
Device_E.book Page 82 Wednesday, July 18, 2007 1:03 PM
OPTO
PHOTOINTERRUPTER INDEX TREE
■ Photointerrupter Lineup
& lt; Transmissive type & gt;
Output type
Single phototransistor
Package type
Compact
Outline
General purpose
Mounting method
Model No. (series)
Page
PWB mounting type
GP1S2x series/GP1S37J0000F
High resolution
PWB mounting type/
Soldering reflow
GP1S2xJ0000F series/GP1S092HCPIF/
GP1S9xJ0000F series/
GP1S09xHCZ0F series/
GP1S19xHCZ0F/GP1S19xHCxSF
83
Two-phase PT output
PWB mounting type
GP1S39J0000F
83
General purpose
Snap-in
GP1S566VJ00F
84
84
High response speed
Case type
83
PWB mounting type, etc.
GP1S5x series/GP1S5xVJ000F series/
GP1S56x series
Horizontal slit,
High resolution
PWB mounting type
GP1S59J0000F/GP1S525VJ00F
84
With connector
General purpose
Snap-in
GP1S74PJ000F
84
Case type
General purpose
PWB mounting type, etc.
GP1L5xJ series/GP1L5xV series
85
Wide gap
PWB mounting type
GP1L57J0000F
85
85
High resolution
Darlington
phototransistor
High sensitivity
Digital output
Compact
Low voltage operation
PWB mounting type
GP1A91 series/GP1A98HCZ0F
(OPIC output)
Case type
High resolution
PWB mounting type
GP1A5x series
86
Wide gap
Both-side/PWB mounting type
GP1A5xHR series/GP1A52LRJ00F
86
General purpose
Screw mounting type/Snap-in
GP1A05 series/GP1A7x series/
GP1A07x series
87
With connector
& lt; Reflective type & gt;
Output type
Single phototransistor
Package type
Compact, DIP
Outline
Mounting method
Model No. (series)
Page
General purpose
PWB mounting type
GP2S2x series
87
Long focal distance
PWB mounting type
GP2S40J0000F
87
Leadless
Long focal distance
PWB mounting type
GP2S700HCP
87
Compact,
thin (leadless)
General purpose
PWB mounting type
GP2S60
87
Compact, DIP
General purpose
PWB mounting type
GP2L24J0000F
88
With connector
Light modulation type,
Sensitivity adjusted
Screw mounting type/
Compact snap-in/
Inverter light countermeasures
GP2A2x series, GP2A200LCS0F/
GP2A231LRSAF, GP2A240LCS0F
88
High response speed
Darlington
phototransistor
High sensitivity
OPIC output
& lt; Application-specific photointerrupter lineup & gt;
Detection type
Outline (Output type etc.)
Mounting method
Model No. (series)
Page
Snap-in
GP1S44S1J00F
89
With connector
With actuator (OPIC output)
Snap-in
GP1A44E1J00F
89
Compact,
[built-in ball]
(2-phase PT output)
3 direction detection
PWB mounting type
GP1S36J0000F
90
(2-phase PT output)
4 direction detection
PWB mounting type
GP1S036HEZ
90
Resolution: Disk slit pitch:
0.7 mm
Side mounting type
GP1A3xR series
90
Resolution: Linear scale
slit pitch: 0.17/0.14 mm
PWB mounting type
GP1A038RBK0F/GP1A046RBZLF/
GP1A047RBZLF/GP1A038RCK0F/
GP1A044RCKLF
90
Resolution: Linear scale
slit pitch: 0.085
Transmissive type
With connector
With actuator (Phototransistor output)
PWB mounting type
GP1A037RDKJF/GP1A047RDZLF
90
Case type
With encoder function
Phase A (digital output)
Phase B (digital output)
82
Injection
For prism system (Single phototransistor)
Screw mounting
GP2S29SJ000F
91
For amusement industry
Reflective type
–
GP2A221HRKA/GP2A222HCKA
91
Device_E.book Page 83 Wednesday, July 18, 2007 1:03 PM
PHOTOINTERRUPTERS
■ Photointerrupters
& lt; Transmissive type & gt;
◆ Single phototransistor output
& lt; Compact type & gt;
Internal
connection
diagram
Features
GP1S25J0000F ▲
Side lead type,
For soldering reflow
GP1S27J0000F ▲
PWB mounting type
Height: 2.9 mm,
For soldering reflow, with positioning boss
PWB mounting type
Wide gap, low profile (3.1 mm)
Wide gap, low profile (2.9 mm)
Wide gap, with positioning pin
Wide gap, with positioning pin,
PWB mounting type (5.5 × 2.6 × 4.8 mm)
High resolution, thin detector type
Low profile (3.5 × 2.6 × 3.1 mm)
Low profile (3.5 × 2.6 × 2.9 mm)
Compact, wide gap,
size: 3.7 × 2.0 × 2.7 mm
Compact, wide gap, surface mount compatible,
size: 3.5 × 2.0 × 2.7 mm
Compact, Low profile (3.1 × 2.0 × 2.7 mm)
Surface mount, for soldering reflow,
compact, low profile (3.1 × 2.0 × 2.7 mm)
High resolution, wide gap, with mounting hole,
PWB mounting type
High resolution, wide gap,
with mounting hole (4.5 × 2.6 × 4.5 mm)
GP1S092HCPIF
GP1S37J0000F ▲
GP1S93J0000F ▲
GP1S093HCZ0F
GP1S94J0000F ▲
GP1S094HCZ0F
GP1S95J0000F ▲
GP1S96J0000F ▲
GP1S096HCZ0F
GP1S194HCZ0F
GP1S195HCZSF
GP1S195HCPSF
GP1S196HCZ0F
GP1S196HCZSF
GP1S97J0000F ▲
GP1S097HCZ0F
PT1
GP1S39J0000F ▲
PT2
1.6
PWB mounting type,
two-phase output type
0.3
1.0
5
5
35
0.1
1 000
5
0.9
0.8
4.3
1.5
5
50
0.1
1 000
5
2.0
0.3
2.0
5
5
50
0.1
1 000
5
2.0
2.0
2.0
3.5
0.8
0.3
0.3
0.3
1
2.0
2.0
0.8
3
5
5
5
5
5
5
5
50
50
50
50
0.1
0.1
0.1
0.1
1 000
1 000
1 000
1 000
5
5
5
5
3.0
0.3
0.8
5
5
50
0.1
1 000
5
1.6
1.0
1.0
0.3
0.3
0.3
1.0
2.0
2.0
5
5
5
5
5
5
35
50
50
0.1
0.1
0.1
1 000
1 000
1 000
5
5
5
1.7
0.3
1.0
5
5
–
–
–
–
1.5
0.3
1.0
5
5
–
–
–
–
1.1
0.3
2.0
5
5
50
0.1
1 000
5
1.1
0.3
2.0
5
5
50
0.1
1 000
5
2.2
0.3
1.6
5
5
50
0.1
1 000
5
2.0
0.3
2.0
5
5
50
0.1
1 000
5
1.5
0.6*1
3.3
4
5
50
0.1
1 000
5
Optoelectronics
Model No.
(Ta = 25°C)
Electro-optical characteristics
Detecting
and
Current transfer ratio
Response time
Slit width
emitting
tr
CTR
(mm)
VCE
RL VCE
IC
IF
gap
(µs)
(%)
(mA) (V)
(mA) (Ω) (V)
(mm)
TYP.
MIN.
❇ Topr: –25 to +85 °C
*1 Reading pitch
The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use.
GP1S25J0000F▲
GP1S27J0000F▲
GP1S092HCPIF
GP1S37J0000F▲
GP1S93J0000F▲
GP1S093HCZ0F
GP1S94J0000F▲
GP1S094HCZ0F
GP1S95J0000F▲
GP1S96J0000F▲
GP1S096HCZ0F
GP1S194HCZ0F
GP1S195HCPSF
GP1S195HCZSF
GP1S196HCZ0F
GP1S196HCZSF
GP1S97J0000F▲
GP1S097HCZ0F
GP1S39J0000F▲
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
83
Device_E.book Page 84 Wednesday, July 18, 2007 1:03 PM
OPTO
PHOTOINTERRUPTERS
& lt; Case type & gt;
Model No.
(Ta = 25°C)
Internal
connection
diagram
Electro-optical characteristics
Detecting
and
Current transfer ratio
Response time
Slit width
emitting
tr
CTR
(mm)
VCE
RL VCE
IC
IF
gap
(µs)
(%)
(mA) (V)
(mA) (Ω) (V)
(mm)
TYP.
MIN.
Features
GP1S566VJ00F
Long case, snap-in mounting type
3.0
0.5
2.5
20
5
3
2
100
2
GP1S50J0000F
High resolution, both-side mounting type
3.0
0.5
2.5
20
5
3
2
100
2
GP1S51VJ000F* 1
High resolution, side mounting type
3.0
0.5
2.5
20
5
3
2
100
2
GP1S52VJ000F* 1
High resolution, PWB mounting type
3.0
0.5
2.5
20
5
3
2
100
2
GP1S53VJ000F
High resolution, PWB mounting type
5.0
0.5
2.5
20
5
3
2
100
2
3.0
0.5
2.5
20
5
3
2
100
2
2.0
0.15
2.0
20
5
38
0.5
1 000
2
5.0
0.5
2.5
20
5
3
2
100
2
4.2
0.5
2.5
20
5
3
2
100
2
5.0
0.5
3.25
20
10
3
2
100
2
High resolution, with positioning pin,
PWB mounting type
High resolution, with positioning pin,
PWB mounting type
High resolution, with positioning pin,
PWB mounting type
High resolution, horizontal slit, with positioning pin,
PWB mounting type
Short lead type with easy board mounting,
horizontal slit,
high precision positioning (lead: within ø1.2 mm)
GP1S54J0000F
GP1S56TJ000F
GP1S58VJ000F
GP1S59J0000F
GP1S525VJ00F
❇ Topr: –25 to +85 °C
*1 High reliability types: GP1SQ51VJ00F, and GP1SQ52J000F are also available.
GP1S566VJ00F
GP1S50J0000F
GP1S51VJ000F
GP1S52VJ000F
GP1S53VJ000F
GP1S54J0000F
GP1S56TJ000F
GP1S58VJ000F
GP1S59J0000F
GP1S525VJ00F
& lt; With connector type & gt;
Model No.
GP1S74PJ000F
Internal
connection
diagram
(Ta = 25°C)
Electro-optical characteristics
Detecting
and
Current transfer ratio
Response time
Slit width
emitting
tr
CTR
(mm)
VCE
RL VCE
IC
IF
gap
(µs)
(%)
(mA) (V)
(mA) (Ω) (V)
(mm)
TYP.
MIN.
Features
Snap-in mounting type with connector
Applicable to 3 kinds of thickness of mounting boards
5.0
0.5
2.5
20
5
3
2
100
2
❇ Topr: –25 to +85 °C
GP1S74PJ000F
84
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Device_E.book Page 85 Wednesday, July 18, 2007 1:03 PM
PHOTOINTERRUPTERS
✩New product
◆ Darlington phototransistor output
& lt; Case type & gt;
Model No.
Internal
connection
diagram
(Ta = 25°C)
Electro-optical characteristics
Detecting
and
Current transfer ratio
Response time
Slit width
emitting
tr
CTR
(mm)
VCE
RL VCE
IC
IF
gap
(µs)
(%)
(mA) (V)
(mA) (Ω) (V)
(mm)
TYP.
MIN.
Features
GP1L50J0000F
High resolution, both-side mounting type
3.0
0.5
50
1
2
80
2
100
2
GP1L51J0000F
High resolution, side mounting type
3.0
0.5
50
1
2
80
2
100
2
GP1L52VJ000F
High resolution, PWB mounting type
3.0
0.5
50
1
2
80
2
100
2
GP1L53VJ000F
High resolution, PWB mounting type
5.0
0.5
30
1
2
80
2
100
2
GP1L57J0000F
Wide gap, PWB mounting type
10.0
1.8
70
1
2
130
2
100
2
❇ Topr: –25 to +85 °C
GP1L50J0000F
GP1L51J0000F
GP1L52VJ000F
GP1L53VJ000F
GP1L57J0000F
“OPIC” (Optical IC) is a trademark of SHARP Corporation. An OPIC consists of a
◆ OPIC type ( light-detecting element and signal-processing circuit integrated onto a single chip. )
& lt; Compact type & gt;
Amplifier
GP1A91LRJ00F ▲
(15 kΩ)
GP1A91LCJ00F ▲
(15 kΩ)
Amplifier
✩GP1A98HCZ0F
Detecting
and
emitting
gap
(mm)
Slit width
(mm)
Compact, PWB mounting,
low operating voltage
(1.4 V to 7.0 V)
1.2
(0.23) *1
–
3.5
3
10.0
3.0
5
3 000
3
Compact, PWB mounting,
low operating voltage
(1.4 V to 7.0 V)
1.2
(0.23) *1
–
3.5
3
10.0
3.0
5
2 500
3
Compact, PWB mounting
3.0
0.5
8
–
3.3 to
24
10.0
2.0
10
Optoelectronics
Model No.
Internal
connection
diagram
(Ta = 25°C)
Electro-optical characteristics
Threshold input current
Propagation delay time
IFHL
tPLH
tPHL
IFLH
RL
VCC
IF
(mA)
(mA)
(µs)
(µs)
(Ω )
(V)
(mA)
MAX.
MAX.
TYP.
TYP.
3 900
3.3
to
to 24
20 000
Features
Voltage
regulator
Amplifier
VCC
(V)
❇ Topr = –25 to +85°C
*1 Resolution of detecting portion
The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use.
GP1A91LRJ00F
(GP1A91LCJ00F)
GP1A98HCZ0F
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
85
Device_E.book Page 86 Wednesday, July 18, 2007 1:03 PM
OPTO
PHOTOINTERRUPTERS
& lt; Case type & gt;
Model No.
(Ta = 25°C)
Internal
connection
diagram
GP1A50HRJ00F
Threshold input current
IFHL
IFLH
VCC
(mA)
(mA)
(V)
MAX.
MAX.
tPLH
(µs)
TYP.
Propagation delay time
tPHL
RL
IF
(µs)
(mA) (Ω)
TYP.
VCC
(V)
Both-side mounting type
GP1A53HRJ00F
0.5
5
–
5
3
5
5
280
5
3.0
0.5
5
–
5
3
5
5
280
5
PWB mounting type
3.0
0.5
5
–
5
3
5
5
280
5
PWB mounting type
Voltage
regulator
Amplifier
3.0
Side mounting type
GP1A51HRJ00F
GP1A52HRJ00F
Features
Detecting
and
Slit width
emitting
(mm)
gap
(mm)
Electro-optical characteristics
5.0
0.5
8
–
5
3
5
8
280
5
10.0
1.8
7
–
5
3
5
7
280
5
5.0
0.5
8
–
5
3
5
8
280
5
3.0
0.5
–
5
5
5
3
5
280
5
PWB mounting type,
with positioning pin
PWB mounting type,
with positioning pin
GP1A57HRJ00F
GP1A58HRJ00F
Voltage
regulator
Amplifier
GP1A52LRJ00F
PWB mounting type
❇ Topr = –25 to +85°C
GP1A50HRJ00F
86
GP1A51HRJ00F
GP1A52LRJ00F
(GP1A52HRJ00F)
GP1A53HRJ00F
GP1A58HRJ00F
with positioning pin
GP1A57HRJ00F
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Device_E.book Page 87 Wednesday, July 18, 2007 1:03 PM
PHOTOINTERRUPTERS
“OPIC” (Optical IC) is a trademark of SHARP Corporation. An OPIC consists of a
◆ OPIC type ( light-detecting element and signal-processing circuit integrated onto a single chip.
& lt; With 3-pin connector terminal & gt;
Internal
connection
diagram
Model No.
GP1A05AJ000F
Features
Detecting
and
Slit width
emitting
(mm)
gap
(mm)
)
(Ta = 25°C)
Electro-optical characteristics
Low level output voltage
Supply voltage
VCC
VOL
VCC
Light
IOL
(V)
(V)
(mA)
(V)
cut-off
MIN.
MAX.
MAX.
Either-side mounting type
5.0
0.5
4.5
5.5
0.35
No
16
5
GP1A05A2J00F
Either-side mounting type
5.0
0.5
4.5
5.5
0.35
No
16
5
GP1A05A5J00F
Either-side mounting type
5.0
0.5
4.5
5.5
0.35
No
16
5
5.0
0.5
4.5
5.5
0.35
No
4
5
5.0
0.5
2.7
5.5
0.35
No
4
5
5.0
0.5
4.5
5.5
0.35
Yes
16
5
5.0
0.5
4.5
5.5
0.4
Yes
16
5
5.0
0.5
4.5
5.5
0.4
Yes
16
5
GP1A73AJ000F
Voltage
regulator
Amplifier
GP1A073LCS
Voltage
regulator
Amplifier
GP1A75EJ000F
Voltage
regulator
Amplifier
GP1A05EJ000F
15 kΩ
GP1A05E2J00F
with 3-pin connector
Voltage
regulator
Amplifier
Compact,
snap-in mounting type
Compact,
snap-in mounting type,
low voltage operation
Either-side mounting type
Either-side mounting type
Screw mounting type
GP1A05AJ000F
(GP1A05EJ000F)
GP1A05A2J00F
(GP1A05E2J00F)
GP1A05A5J00F
GP1A73AJ000F, GP1A073LCS
Optoelectronics
❇ Topr: –20 to +75°C
GP1A75EJ000F
■ Photointerrupters
& lt; Reflective type & gt;
◆ Single Phototransistor output
& lt; Compact & gt;
Model No.
(Ta = 25°C)
Internal
connection
diagram
Focal
distance
(mm)
Features
Electro-optical characteristics
Current transfer ratio
Response time
VCE
tr (µs)
IC
RL
CTR (%)
IF
(mA)
(V)
TYP.
(mA)
(Ω )
MIN.
VCE
(V)
GP2S24J0000F
Compact (DIP), visible light cut-off
0.7
0.5
4
2
20
0.1
1 000
2
GP2S27J0000F
Compact, allow reflow soldering,
visible light cut-off
0.7
0.5
4
2
20
0.1
1 000
2
GP2S40J0000F
Compact, long focal distance, visible light cut-off
3
2.5
20
5
50
0.1
1 000
2
GP2S700HCP
Compact, long focal distance, surface mounting
leadless type
3
1.5
4
2
20
0.1
1 000
2
GP2S60
Thin (3.2 × 1.7 × t: 1.1 mm), leadless type
(0.5)
1.75*1 TYP.
4
2
20
0.1
1 000
2
❇ Topr: –25 to +85°C
GP2S24J0000F
*1 Detection area
GP2S27J0000F
GP2S40J0000F
GP2S700HCP
GP2S60
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
87
Device_E.book Page 88 Wednesday, July 18, 2007 1:03 PM
OPTO
PHOTOINTERRUPTERS
◆ Darlington Phototransistor output
& lt; Compact & gt;
Model No.
Internal
connection
diagram
GP2L24J0000F
(Ta = 25°C)
Focal
distance
(mm)
Features
Compact (DIP), visible light cut-off
Electro-optical characteristics
Current transfer ratio
Response time
VCE
tr (µs)
IC
RL
CTR (%)
IF
(mA)
(V)
TYP.
(mA) (Ω)
MIN.
0.7
12.5
4
2
80
10
VCE
(V)
100
2
GP2L24J0000F
“OPIC” (Optical IC) is a trademark of SHARP Corporation. An OPIC consists of a
◆ OPIC output ( light-detecting element and signal-processing circuit integrated onto a single chip.
& lt; With 3-pin connector terminal & gt;
Model No.
GP2A22J0000F ▲
GP2A200LCS0F
GP2A240LCS0F
OPIC output
GP2A250LCS0F
GP2A25J0000F
GP2A231LRSAF
GP2A25NJJ00F
GP2A25BJ000F
GP2A28AJ000F
Internal
connection
diagram
Features
Multi types of paper detectable, light modulation type,
with connector, sensitivity adjusted
Multi types of paper detectable, light modulation type,
with connector, sensitivity adjusted
Improved light-resistance characteristic for inverter lighting
(500 lx), light modulation type, connector output
Static electricity resistant,
improved light-resistance characteristic for inverter lighting
(500 lx), light modulation type, connector output
Multi types of paper detectable, light modulation type,
(Following
with connector, sensitivity adjusted
diagram)
Compact, Hook type, Multi types of paper detectable,
light modulation type, with connector, sensitivity adjusted
Multi types of paper detectable, light modulation type,
sensitivity adjusted, applicable to inverter fluorescent lamp,
built-in visible light cut filter
Multi types of paper detectable, light modulation type,
with connector, sensitivity adjusted
Multi types of paper detectable, light modulation type,
with connector, sensitivity adjusted,
detecting portion with flat configuration
)
(Ta = 25°C)
Electro-optical characteristics
Optimum
Supply voltage Dissipation current Low level output voltage
detecting
VCC
ICC
VOL
distance
VCC
VCC
(V)
(mA)
(V)
(mm)
(V)
(V)
MAX.
MAX.
MIN. MAX.
9 to 15
4.75
5.25
30*1
5
0.4
5
5 to 15
4.75
5.25
30*1
5
0.4
5
5 to 15
4.75
5.25
30*1
5
0.4
5
5 to 15
4.75
5.25
30*1
5
0.4
5
3 to 7
4.75
5.25
30*1
5
0.4
5
3 to 7
4.75
5.25
20*1
5
0.4
5
3 to 6
4.75
5.25
30*1
5
0.4
5
3 to 7
4.75
5.25
30*1
5
0.4
5
3 to 7
4.75
5.25
30*1
5
0.4
5
❇ Topr: –10 to +60°C (GP2A22J0000F, GP2A25J0000F, GP2A25BJ000F)
*1 Smoothing value RL = ∞
The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use.
[Internal connection diagram]
Amplifier
Comparator
Voltage regulator
Demodulator
Synchronous detector
Oscillator
GP2A22J0000F
GP2A250LCS0F
88
GP2A25J0000F
GP2A25NJ, GP2A28AJ000F, GP2A200LCS0F,
GP2A240LCS0F
GP2A25BJ000F
GP2A231LRSAF
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Device_E.book Page 89 Wednesday, July 18, 2007 1:03 PM
PHOTOINTERRUPTERS
■ Photointerrupters for Specific Applications
◆ Transmissive type
& lt; Single phototransistor output type with actuator and 3-pin connector terminal & gt;
Model No.
Internal
connection
diagram
Actuator lever
starting torque
(Initial)
MAX.
Features
Spring lever type actuator
United with connector
GP1S44S1J00F
(Ta = 25°C)
Electro-mechanical characteristics*1
Light beam interrupted
Light beam uninterrupted
Dissipation current
Collector current
Dissipation current
Collector current
VCC
VO
ICC2
IC2
VCC
IC1
VCC
VCC
VO
ICC1
(µA)
(V)
(V)
(V)
(V)
(mA)
(V)
(mA)
(mA)
(V)
1 × 10-4 N•m or
less
20
MAX.
5
50
MAX.
5
5
20
MAX.
0.25
MIN.
5
5
5
❇ Topr: –25 to +75 °C
*1 Operating voltage: 4.5 to 5.5 V
GP1S44S1J00F
& lt; OPIC type with actuator and 3-pin connector terminal & gt;
Voltage
regulator
Amplifier
GP1A44E1J00F
15 kΩ
Features
Spring lever type
actuator, United with
connector
Electromechanical
characteristics
Electro-mechanical characteristics*1
Supply Output
voltage current
IOL
VCC
(V)
(mA)
Actuator
lever
starting
torque
Light beam interrupted
Light beam uninterrupted
Dissipation current Low level output voltage Dissipation current High level output voltage
ICCL VCC VOL VCC IOL ICCH VCC
VOH
VCC RL
(mA) (V)
(V) (kΩ)
(V) (V) (mA) (mA) (V)
(V)
10
50
1 × 10–4 N•m 20
or less
MAX.
5
0.4
MAX.
5
16
20
MAX.
5
Vcc ×
0.9
MIN.
5
Optoelectronics
Model No.
Internal
connection
diagram
(Ta = 25°C)
Absolute
maximum
ratings
47
❇ Topr: –25 to +75 °C
*1 Operating voltage: 4.5 to 5.5 V
GP1A44E1J00F
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
89
Device_E.book Page 90 Wednesday, July 18, 2007 1:03 PM
OPTO
PHOTOINTERRUPTERS
& lt; Compact, 2-phase phototransistor output type & gt;
Model No.
Internal
connection
diagram
GP1S36J0000F ▲
PT1
PT2
GP1S036HEZ▲
(Ta = 25°C)
Electro-optical characteristics
Current transfer ratio
Response time
CTR
tr
VCE
RL VCE
IF
IC
(%)
(µs)
(mA) (V)
(mA) (Ω) (V)
MIN.
TYP.
Features
Built-in ball (2 phase output),
compact,
PWB mounting type
Built-in ball (2 phase output),
compact,
PWB mounting type, 4-direction detection
1.2
5
5
50
0.1
1 000
5
1.1
5
5
50
0.1
1 000
5
❇ Topr: –25 to +85 °C
The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use.
GP1S36J0000F
GP1S036HEZ
& lt; Case type, with encoder function & gt;
(Ta = 25°C)
Absolute maximum ratings
Electro-optical characteristics
Response frequency Dissipation current
(output side)
(kHz)
IF (mA)
Icc (mA) MAX.
MAX.
Model No.
Vcc
(V)
Topr
(°C)
Operating
voltage
Vcc (V)
GP1A30RJ000F ▲
7
0 to +70
4.5 to 5.5
Disk slit pitch 0.7 (mm)
5
30
20
GP1A038RBK0F* 1, *3
7
0 to +70
2.7 to 5.5
Linear scale slit pitch 0.17 (mm)
20
11
5
GP1A038RCK0F* 1, *3
7
0 to +70
2.7 to 5.5
Linear scale slit pitch 0.14 (mm)
20
11
5
Output signal
Resolution
GP1A037RDKJF* 1, *3
7
0 to +70
40
25
10
—
–10 to +60
2.7 to 5.5 Phase A (Digital output)
2.7 to 5.5 Phase B (Digital output)
Linear scale slit pitch 0.0847 (mm)
GP1A044RCKLF* 1
Linear scale slit pitch 0.14 (mm)
20
15
5
GP1A046RBZLF* 1
—
–10 to +60
2.7 to 5.5
Linear scale slit pitch 0.17 (mm)
20
20
5
GP1A047RBZLF
—
0 to +60
2.7 to 5.5
Linear scale slit pitch 0.17 (mm)
20
20
7
GP1A047RDZLF
—
–10 to +60
2.7 to 5.5
Linear scale slit pitch 0.0847 (mm)
120
20
7
*1 High precision read and low affection of angle error from vibration thanks to the multi-segment PD system
*2 Duty ratio: 50±10%, phase difference: 90±30°
*3 Duty ratio: 50±20%, phase difference: 90±45°
The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use.
GP1A30RJ000F ▲
90
GP1A044RCKLF
GP1A038RBK0F
(GP1A038RCK0F, GP1A037RDKJF)
GP1A046RBZLF
GP1A047RBZLF
(GP1A047RDZLF)
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Device_E.book Page 91 Wednesday, July 18, 2007 1:03 PM
PHOTOINTERRUPTERS
◆ Reflective type
& lt; Case type, phototransistor output & gt;
Model No.
Internal
connection
diagram
(Ta = 25°C)
Focal
distance
(mm)
Features
Long focal distance (with prism system),
compact, screw mounting type
GP2S29SJ000F
❇ Topr: –25 to +85°C
*1
Electro-optical characteristics
Current transfer ratio
Response time
VCE
tr (µs)
IC
RL
CTR (%)
IF
(mA)
(V)
TYP.
(mA) (Ω)
MIN.
1.0*1
20
5
38
0.5
1 000
VCE
(V)
2
*1 Space between prism and sensor is 8 mm.
GP2S29SJ000F
& lt; For the amusement industry & gt;
Model No.
(Ta = 25°C)
Electro-optical characteristics
Dissipation current Response frequency
Supply voltage
Vcc
f (Hz)
Icc (mA)
Features
GP2A221HRKA Employs reflective type, pinball detector, connector with lock
GP2A222HCKA
Employs reflective type, pinball detector, connector with lock
In conjunction with an IC, detects beam interuption*1
4.5 to 15
MAX. 10
MAX. 500
4.5 to 16.5
MAX. 10
MAX. 500
Optoelectronics
*1 Used together with interface IC for control (IR3N184)
GP2A221HRKA
(GP2A222HCKA)
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
91
Device_E.book Page 92 Wednesday, July 18, 2007 1:03 PM
OPTO
PHOTOTRANSISTOR INDEX TREE
■ Phototransistor Lineup
Package
Epoxy resin with lens
(ø3 mm)
Output type
Features
Model No.
Half
sensitivity
angle
Single phototransistor
General purpose
Darlington
phototransistor
High sensitivity
±20°
PT381
PT381F
Single phototransistor
General purpose/Narrow acceptance
±13°
PT480E00000F
PT480FE0000F
Compact, thin
Epoxy resin with lens
±35°
PT4800E0000F
PT4800FE000F /
PT4850FE000F
Darlington
phototransistor
±20°
Visible light
cut-off
Standard
PT380
PT380F
High sensitivity/Narrow acceptance
±13°
PT481E00000F
PT481FE0000F
High sensitivity/Narrow acceptance/Long lead
±13°
—
PT483F1E000F
PT4810FJE00F
High sensitivity/Compact, thin
Narrow acceptance
±6°
PT501 ▲
—
±6°
PT510 ▲
—
Narrow acceptance/With base terminal
±6°
PT550 ▲
—
±50°
PT550F ▲
—
Compact
±60°
PT600T
—
±70°
PT200MC0NP
—
±60°
PT202MR0MP1
—
Compact
(side view/top view mounting possible)
±15°
PT100MC0MP
PT100MF0MP
Compact
±60°
PT601T
—
Compact
(side view/top view mounting possible)
Darlington
phototransistor
PT493FE0000F
Compact
(infrared cut type)
Single phototransistor
—
Compact
(surface mounting type)
Surface mounting
leadless type
PT491FE0000F
±40°
Wide acceptance/With base terminal
Darlington
phototransistor
—
Narrow acceptance/With base terminal
Single phototransistor
PT4810E0000F
±40°
High sensitivity/Intermediate acceptance/Long lead
TO-18
±35°
High sensitivity/Intermediate acceptance
±15°
—
PT100MF1MP
The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use.
92
Device_E.book Page 93 Wednesday, July 18, 2007 1:03 PM
PHOTOTRANSISTORS
Model No.
Package
(Ta = 25°C)
Absolute maximum ratings
VCEO
Topr
PC
(mW)
(°C)
(V)
MIN.
ICEO(A)
Ic (mA)
VCE
MAX.
(V)
Ee
(mW/cm2)
MAX.
VCE
(V)
Dq
(°)
TYP.
λp
(nm)
TYP.
35
50
–25 to +85
0.16
1.17
5
Ev, 100 Ix
1 × 10–7
20
±20
800
35
50
–25 to +85
0.095
0.9
5
Ev, 100 Ix
1 × 10–7
20
±20
860
PT600T
35
50
–25 to +85
0.7
TYP. 3.5
5
5
1 × 10–7
20
±60
880
PT200MC0NP
50
50
–25 to +85
0.016
0.059
5
0.1
1 × 10–7
20
±70
930
5
5
–30 to +85
—
TYP. 0.043
1.5
Ev, 100 Ix
1 × 10–7
1.5
±60
620
35
75
–30 to +85
1.7
5.1
5
1
1 × 10–7
20
±15
900
PT380
PT380F*1
PT202MR0MP1* 2
ø3 epoxy resin
Surface mounting
leadless type
PT100MC0MP
35
75
–30 to +85
1.15
3.45
5
1
1 × 10–7
20
±15
910
PT480E00000F
35
75
–25 to +85
0.4
TYP. 1.7
5
1
1 × 10–7
20
±13
800
PT480FE0000F* 1
35
75
–25 to +85
0.25
TYP. 0.8
5
1
1 × 10–7
20
±13
860
35
75
–25 to +85
0.12
TYP. 0.4
5
1
1 × 10–7
20
±35
800
PT4800FE000F* 1
35
75
–25 to +85
0.08
TYP. 0.25
5
1
1 × 10–7
20
±35
860
PT4850FE000F* 1
35
75
–25 to +85
0.12
0.56
5
1
1 × 10–7
20
±35
860
PT501 ▲
45
75
–25 to +125
2.5
TYP. 10
5
10
1 × 10–7
30
±6
800
35
75
–25 to +125
2.5
TYP. 20.0
5
10
1 × 10–7
30
±6
800
35
50
–25 to +85
0.12
1.5
10
Ev, 2 Ix
1 × 10–6
10
±20
800
35
50
–25 to +85
0.07
1.08
10
Ev, 2 Ix
1 × 10–6
10
±20
860
PT481E0000F
35
75
–25 to +85
1.5
25
2
0.1
1 × 10–6
10
±13
800
PT481FE0000F* 1
35
75
–25 to +85
0.9
27
2
0.1
1 × 10–6
10
±13
860
PT4810E0000F
35
75
–25 to +85
0.45
7.0
2
0.1
1 × 10–6
10
±35
800
35
75
–25 to +85
0.27
6.0
2
0.1
1 × 10–6
10
±35
860
PT483F1E000F* 1
35
75
–25 to +85
1.5
4.0
2
0.1
1 × 10–6
10
±13
860
PT491FE0000F* 1
35
75
–25 to +85
0.2
0.8
2
Ev, 2 Ix
1 × 10–6
10
±40
860
PT493FE0000F* 1
35
75
–25 to +85
0.2
0.8
2
Ev, 2 Ix
1 × 10–6
10
±40
860
PT550 ▲
Single
PT100MF0MP*1
35
150
–25 to +125
3
TYP. 20.0
5
0.1
1 × 10–6
10
±6
800
35
150
–25 to +125
3
TYP. 20.0
5
1.0
1 × 10–6
10
±50
800
10–6
10
±60
880
10
±15
860
PT4800E0000F
PT510 ▲
PT381
Darlington
PT381F*1
PT4810FJE00F* 1
PT550F ▲
PT601T
PT100MF1MP*1
Epoxy resin with
lens
TO-18
ø3 epoxy resin
Epoxy resin with
lens
TO-18
Leadless
chip type
Surface mounting
leadless type
35
50
–25 to +85
0.03
0.3
10
0.01
1×
35
75
–30 to +85
0.2
1.2
5
0.01
1 × 10–6
Optoelectronics
Type
■ Phototransistors
*1 Visible light cut-off type
*2 Infrared cut-off type
Note) Some products are handled by the Compound Semiconductor Division.
The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use.
PT600T
(PT601T)
PT4800E0000F
PT4800FE000F,
PT4810E0000F,
PT4810FJ00F,
PT4810FJE00F,
PT4850FE000F
PT200MC0NP
PT483F1E000F
PT202MR0MP1
PT501 ▲
PT100MF0MP
PT100MF1MP,
PT100MC0MP:
Transparent resin
PT510 ▲
(PT550 ▲)
PT380
PT380F, PT381
PT381F
PT491FE0000F
PT493FE0000F
PT480E00000F
PT480FE0000F,
PT481E00000F,
PT481FE0000F
PT550F ▲
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
93
Device_E.book Page 94 Wednesday, July 18, 2007 1:03 PM
OPTO
PHOTODIODES
■ PIN Photodiodes
Model No.
(Ta = 25°C)
PD49PIE0000F▲*1
PD410PI2E00F* 1
PD411PI2E00F
PD412PI2E00F* 2
PD413PI2E00F* 1
PD60T
PD100MC0MP
PD100MF0MP*1
Active
area
(mm2)
Package
(Material)
Features
Topr
(°C)
Isc
(µA)
MIN.
Ev
(Ix)
Id
(A)
MAX.
VR
(V)
tr, tf
(µs)
TYP.
VR
(V)
RL
(kΩ)
λp
(nm)
TYP.
7.73
–25 to +85
2.4
100
3 × 10–8
10
0.2
10
1
1 000
3.31
–25 to +85
2.5
100
1 × 10–8
10
0.2
10
1
1 000
3.31
–25 to +85
5.0
100
1 × 10–8
10
0.2
10
1
960
3.31
–25 to +85
3.5
100
1 × 10–8
10
0.25
10
1
800
1 × 10–8
10
0.2
10
1
960
1 × 10–8
10
0.1
10
1
960
10–8
10
0.01
15
0.18
820
10
0.01
15
0.18
850
Visible light cut-off epoxy
resin
Visible light cut-off epoxy
resin with condenser (lens)
PIN type
Epoxy resin with transparent
condenser (lens)
Epoxy resin with transparent
condenser (lens)
PIN type
Visible light cut-off epoxy
IrDA1.0
resin with condenser (lens)
Chip device type Transparent resin
Surface mounting Transparent epoxy resin
leadless type
board with lens
Surface mounting Visible light cut-off epoxy
leadless type
resin board with lens
3.31
–25 to +85
–
–25 to +85
MIN. 4.5
100
(TYP. 5.4)
TYP. 4
1 000
–
–30 to +85
0.6
100
1×
–
–30 to +85
0.4
100
1 × 10–8
*1 Visible light cut-off type
*2 Tape packaging type (PD412TNE00F)
The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use.
PD49PIE0000F▲
PD410PIE00F
PD60T
PD411PI2E00F: transparent; PD412PI2E00F: transparent,
PD413PI2E00F
PD100MC0MP
(PD100MF0MP: black)
■ PSD (Position Sensitive Detector)
Model No.
Features
PD3122FE000F ▲
Package
(Material)
(Ta = 25°C)
Topr
(°C)
Active area
(mm2)
Position sensitive detector
Visible light
1.2
–25 to +85
With mounting hole
cut-off epoxy resin (1.0 × 1.2 mm)
IL
(µA)
MIN.
6.4
Ev
(Ix)
Interelectrode
resistance
VR
(kΩ)
(V)
TYP.
1 000 110 to 170
1
tr, tf
(µs)
TYP.
VR
(V)
5
1
Position
detection
RL
error
(kΩ) (µm) MAX.
1
±25
Custom-made products (detecting portion changed products) are also available.
The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use.
PD3122FE000F
■ Blue Sensitive Photodiodes
Model No.
BS520E0F
Features
Planer type
(Ta = 25°C)
Package
(Material)
Active area
(mm2)
Topr
(°C)
Isc
(µA)
MIN.
Resin (black)
5.34
–20 to +60
0.4
Ev
(Ix)
100
Id
(A)
MAX.
1 × 10–11
VR
(V)
1
λp
(nm)
TYP.
560
BS520E0F
(with filter)
94
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Device_E.book Page 95 Wednesday, July 18, 2007 1:03 PM
OPTO
OPIC LIGHT DETECTORS
✩New product
■ Laser Power Monitoring Photodiodes for Optical Disc System
Model No.
PD101SC0SS0F
Features
High response speed
(cut-off frequency: 400 MHz)
Package
(Material)
Active area
(mm)
Topr
(°C)
Transparent epoxy resin
ø0.8
–25 to +85
(Ta = 25°C)
Ev
(Ix)
450
Id
(A)
MAX.
VR
(V)
λp
(nm)
TYP.
100
Isc
(mA)
TYP.
1 × 10–9
5
820
PD101SC0SS0F
■ RGB Color Sensor
Features
Package
Light receiving sensitivity
(A/W) TYP.
Blue
✩PD30CMC31MZ
RGB 3-color LED compatible 3PD structure
Filter-on chip structure allows for both infrared
light reducing characteristics and a more compact size (1.1 mm thick)
Red
Blue
Green
540
620
0.18
0.23
0.16
Topr
(°C)
Red
460
Surface mounting
3 x 4 mm
Green
–40 to +85
Optoelectronics
Model No.
(Ta = 25°C)
Peak sensitivity wavelength
(nm)
PD30CMC31MZ
IC) is trademark of the SHARP Corporation.
■ Ambient Light Sensors ( “OPIC” (Opticalelementa and signal-processing circuit integratedAn OPIC consists of a )
light-detecting
onto a single chip.
Absolute maximum ratings
Model No.
IS485E
IS486E
Type
Package
Built-in schmidt trigger
circuit, amplifier and
voltage regulator
Transparent
epoxy resin with
condenser (lens)
VCC
(V)
P
IO
(mW) (mA)
Topr
(°C)
EVLH EVHL
(Ix)
(Ix)
MAX. MAX.
(Ta = 25°C)
Electro-optical characteristics
tPLH
tPHL
(µs)
(µs)
VCC
VCC
(V)
TYP.
TYP.
(V)
EV
(Ix)
RL
(Ω )
–0.5 to +17
175
50
–25 to +85
–
35
5
5
3
5
50
280
–0.5 to +17
175
50
–25 to +85
35
–
5
3
5
5
50
280
IS485E
(IS486E)
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
95
Device_E.book Page 96 Wednesday, July 18, 2007 1:03 PM
OPTO
OPIC LIGHT DETECTORS
& lt; Low-voltage operation & gt;
(Ta = 25°C)
Absolute maximum ratings
Model No.
IS489E
Type
Package
Built-in Schmidt trigger
circuit and amplifier
Transparent
epoxy resin with
condenser (lens)
Topr
(°C)
Operating
supply
voltage (V)
–25 to +85
1.4 to 7.0
P
IO
(mW) (mA)
80
2
Electro-optical characteristics
tPHL
tPLH
EVLH EVHL
(µs)
(µs)
(Ix)
(Ix)
VCC
(V)
TYP.
TYP.
MAX. MAX.
–
15
3
1.3
8.5
VCC
(V)
EV
(Ix)
RL
(Ω )
3
125
3 000
IS489E
& lt; Model employing a light modulating system & gt;
(Ta = 25°C)
Absolute maximum ratings
Model No.
IS471FE*1, *3
Type
Package
VCC
(V)
Built-in pulse driver
circuit at the emitter
Visible light
side, synchronous
cut-off epoxy
detector circuit,
resin
amplifier circuit and
demodulator circuit
–0.5 to +16
Topr
(°C)
VOL
(V)
MAX.
–25 to +60
0.35
P
IO
(mW) (mA)
250
50
Electro-optical characteristics*2
tPHL
tPLH
VOH
(V)
(µs)
(µs)
VCC
MIN.
(V)
TYP.
TYP.
4.97
400
400
5
RL
(Ω )
External
disturbing light
illuminance
EVDX(Ix) TYP.
280
7 000
*1 IS471FE is less susceptible to disturbing effects thanks to the light modulation system
*2 Vcc = 5 V
*3 Straight lead type (IS471FSE) is also available.
IS471FE
& lt; For laser beam printers (laser origin detection) & gt;
(Ta = 25°C)
Electro-optical characteristics
Model No.
GA220T2L1IZ
Type
2PD, differential type
Package
Transparent epoxy resin
18-pin
Recommended supply
voltage
VCC
(V)
VOH
(V)
MIN.
VOL
(V)
MAX.
4.5 to 5.5
4.9
0.6
H → L delay time variation
∆tPHL
(ns) MAX.
±8.5
GA220T2L1IZ
96
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Device_E.book Page 97 Wednesday, July 18, 2007 1:03 PM
OPIC LIGHT DETECTORS
✩New product
& lt; Ambient light sensor & gt;
(Ta = 25°C)
Absolute maximum ratings
Type
Built-in amplification circuit
Peak sensitivity characteristic close
to human visual sensitivity
✩GA1A2S100SS
Output characteristic: Linear current
output for illuminance
Lead frame (straight) type
Built-in amplification circuit
Peak sensitivity characteristic close
to human visual sensitivity
✩GA1A2S100LY
Output characteristic: Linear current
output for illuminance
Lead frame (L bend) type
Built-in amplification circuit
Peak sensitivity characteristic close
✩GA1A1S201WP to human visual sensitivity
Output characteristic: Logarithmic
current output for illuminance
GA1A2S100SS
Package
Output current
Recommended Recommended Current
Peak
Topr supply voltage illuminance consumption sensitivity
Io2
Io1
(°C)
VCC
Icc (µA)
wavelength (µA)
range
(µA)
(V)
Ex (lx)
TYP.
λp (nm)
TYP. TYP.
VCC
(V)
IO
(mA)
7.0
5
–40 to
+85
2.7 to 3.6
10 to 10 000
500
555
48
480
(at Ev = (at Ev =
1000 lx) 100 lx)
7.0
5
–40 to
+85
2.7 to 3.6
10 to 10 000
500
555
480
48
(at Ev = (at Ev =
1000 lx) 100 lx)
7.0
1
–40 to
+85
2.3 to 3.2
3 to 55 000
70
555
20
30
(at Ev = (at Ev =
100 lx) 1000 lx)
Transparent
epoxy resin
(3 × 4 mm)
Compact
(2.0 mm ×
1.6 mm)
Leadless
GA1A2S100LY
GA1A1S201WP
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Optoelectronics
Model No.
Electro-optical characteristics
97
Device_E.book Page 98 Wednesday, July 18, 2007 1:03 PM
OPTO
OPIC LIGHT DETECTORS
✩New product
& lt; Optical disk devices for RF signal detection & gt;
(Ta = 25°C)
Absolute maximum ratings
Model No.
Type
Package
Vcc P
(V) (mW)
Topr
(°C)
Electro-optical characteristics
Response frequency Output noise level
Icc
Vn Main Ch.
fc*1
(mA) Vcc
Vcc
f
TYP. (V) (MHz) (V) (dBm)
(Hz)
TYP.
TYP.
Built-in amplifier circuit,
built-in RF addition amplifier
(6-division PINPD + IC),
for ×50 CD-ROM
IS1682Q
GA250T6C3SY
GA250T6C4SY
Transparent
10-pin package
6.0
–
–30 to +80 14.8
5
(72/70)
72/70
5
–81
23.1M
Built-in amplifier circuit,
(6-division PINPD + IC),
for CD player
Low operating voltage (MIN. 2.5 V)
Transparent
10-pin package
7.0
–
–20 to +75
5
5/0.3
5
(–78)
2.8M
Transparent flat
10-pin package
6.0
5.3/3.8*2
3
–90
720k
Built-in amplifier circuit,
(8-division PINPD + IC),
switchable of sensitivity due to playback/
recording mode for MD
Built-in RF amplifier,
for ×6 DVD-ROM drive
IS1623Q
IS1684Q
GA210TXV8SY ▲*3
✩GA230TXW6SY
✩GA230TXR1ZY
GA202TXV15K▲
GA202TXV15J
GA301TXW5MZ ▲
Transparent flat
10-pin package
Transparent flat
For 2-wavelength laser (For DVD player),
12-pin package
10-division PD pattern
(4 x 5.0 mm)
For ×16 DVD-R/RW, +R/W ultra-writable drive Transparent flat
High-precision 3-step gain compatible
14-pin package
DVD-ROM: for MAX. ×16 read only
Transparent flat
CD-ROM: for MAX. ×52 read only
14-pin package
CD-R: for MAX. ×52 writable drive
CD-RW: for MAX. ×32 writable drive
Transparent Gull wing
lead
For 2-wavelength laser (For DVD player),
12-pin
10-division PD pattern
package
(3 x 4 mm) Flat lead
For ×16 DVD-R/RW, +R/W ultra-writable drive
For MAX. ×60 CD-R writable drive
(For HiHi combo drive),
Leadless
settling time: 13 ns
chip-type
DVD-ROM: for MAX. ×16 read only,
built-in bypass condenser for power supply,
WPP system (Gain ×4 switching)
150 –20 to +70
6
4.2/
3
4.6*2
6.0
–
–30 to +80 14.8
5
(70/60)
70/50
5
–81
23.1M
6.0
–
–10 to +70
17
5
–/75
5
–80
23M
6.0
–
–30 to +85
–
5
140
5
–
–
6.0
–
–20 to +85
40
5
140
5
–80
72M
6.0
–
–30 to +80
57/57
50/50
5
–
–
6.0
–
–20 to +85
110
5
(–78)
72M
MAX.
5
19
38
5
*1 (RF/main) ... 650 nm, RF/main ... 780 nm
*2 Playback/recording mode
*3 We can supply custom orders for modified PD patterns, packages, and lead shapes for 2-wavelength laser compatible OPIC light detectors.
*4 L gain mode/M gain mode
The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use.
IS1682Q
(IS1684Q, GA250T6C3SY, GA250T6C4SY)
GA230TXR1ZY
98
IS1623Q
GA202TXV15K▲
GA230TXW6SY
GA202TXV15J
GA210TXV8SY▲
GA301TXW5MZ▲
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Device_E.book Page 99 Wednesday, July 18, 2007 1:03 PM
OPIC LIGHT DETECTORS
& lt; Laser power monitoring diode for optical disc system & gt;
(Ta = 25°C)
Absolute maximum ratings
Model No.
GA104T1M1MZ ▲
Type
Package
For ×48 CD-R writable drive Leadless chip-type
built-in amplifier circuit
[3.0 x 3.5 mm]
Vcc
(V)
P
(mW)
Topr
(°C)
6.0
–
–20 to +70
Electro-optical characteristics
Response frequency
Icc
fc
(mA)
Vcc
Vcc
(MHz)
TYP.
(V)
(V)
MIN.
20
5
50
5
*1 Power monitoring photodiodes are also available. Please refer to the page for photodiodes.
The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use.
Optoelectronics
GA104T1M1MZ▲
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
99
Device_E.book Page 100 Wednesday, July 18, 2007 1:03 PM
OPTO
INFRARED EMITTING DIODE INDEX TREE
■ Infrared Emitting Diode Lineup
Type
Single-end lead
Package
Epoxy resin with lens
(ø3 mm type)
Features
Half intensity
angle
Model No.
±13°
±13°
GL381
High speed signal transmission (12 MHz)
Epoxy resin (Arch type)
General purpose
High output type
(Top view type)
GL380
±17°
GL382
±18°
GL390
±18°
GL390V
General purpose/Narrow beam angle
±13°
GL480E00000F
Compact and thin
±30°
GL4800E0000F
Flat epoxy resin
Wide beam angle
±90°
GL4100E0000F
Epoxy resin with lens
Compact package, bi-directional emitting type
Bidirectional
GL453E00000F ▲
TO-18
High reliability
±50°
GL513F ▲
High reliability/Narrow beam angle
±7°
GL514 ▲
Low forward voltage type
±21°
GL560
Low forward voltage type/Narrow beam angle
±13°
GL561
High output type
±25°
GL537
High output type/Narrow beam angle
±13°
GL538
Leadless
Compact
±60°
GL610T
Epoxy resin with lens/
leadless
Single-end lead
General purpose
Low forward voltage type
Compact/Narrow beam angle
±10°
GL100MN0MP
±10°/±9°
GL100MN1MP /
GL100MN3MP
±80°
GL100MD1MP1
Epoxy resin with lens
(Side view type)
Single-end lead
(Top view type)
Epoxy resin with lens
(ø5 mm type)
Surface mount type
High output type
(Output: radiant flux/
radiant intensity indicated)
(Mountable for Top view/
Side view type)
Compact/Wide beam angle
The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use.
100
Device_E.book Page 101 Wednesday, July 18, 2007 1:03 PM
INFRARED EMITTING DIODES
■ Infrared Emitting Diodes
Model No.
GL380
GL381
GL382
GL390
GL390V
Package, features
ø3 epoxy resin
ø3 epoxy resin, for high speed
signal transmission:12 MHz
GL4800E0000F
GL4100E0000F
GL513F ▲
GL514 ▲
Φe (mW)
MIN.
TYP.
IF
(mA)
TYP.
MAX.
IF
(mA)
∆θ
(°)
TYP.
VF (V)
λp
(nm)
TYP.
60
6
150
–25 to +85
4.5*1
11*1
50
1.3
1.5
50
±13
950
60
6
150
–25 to +85
8.5*1
20*1
50
1.3
1.5
50
±13
950
60
4
–
–25 to +85
6
18
50
1.5
1.7
50
±17
880
13*1
60
Epoxy resin with lens
Side-view flat type, Epoxy resin
6
150
–25 to +85
7*1
50
1.3
1.5
50
±18
950
60
Arch type
GL453E00000F ▲ Resin with bidirectional lens
GL480E00000F
(Ta = 25°C)
Absolute maximum ratings
IF
P
Topr
VR
(°C)
(mA) (V) (mW)
6
150
–25 to +85
9*1
16*1
50
1.3
1.5
50
±18
950
50
6
75
–25 to +85
0.85
1.3
20
1.2
1.5
20
(Bidirectional)
950
50
6
75
–25 to +85
0.7
–
20
1.2
1.4
20
±13
950
50
6
75
–25 to +85
0.7
1.6
20
1.2
1.4
20
±30
950
950
6
75
–25 to +85
1.0
–
20
1.2
1.4
20
±90
6
250
–40 to +125
1.44
2.88
100
1.35
1.6
100
±50
950
150
TO-18
50
150
6
250
–40 to +125
3.31
5.35
100
1.35
1.6
100
±7
950
100
6
150
–25 to +85
5*1
14*1
50
1.25
1.37
50
±21
940
100
6
150
–25 to +85
12*1
25*1
50
1.25
1.37
50
±13
940
100
6
150
–25 to +85
6*1
13*1
50
1.3
1.5
50
±25
950
100
6
150
–25 to +85
15*1
30*1
50
1.3
1.5
50
±13
950
50
6
150
–25 to +85
0.7
2
20
1.3
1.5
50
±60
950
50
6
75
–30 to +85
1.0
3.0
(MAX.)
20
1.2
1.4
20
±10
940
50
6
75
–30 to +85
2.0
6.0
(MAX.)
20
1.2
1.5
20
±10
940
50
6
75
–30 to +85
3.0*1
6.0*1
20
1.25
1.5
20
±9
940
50
6
75
–30 to +85
–
6.0
(MAX.)
20
–
1.5
20
±80
940
GL537
ø5 epoxy resin
GL538
GL610T
GL100MN0MP
GL100MN1MP
GL100MN3MP
GL100MD1MP1
Leadless chip type
Surface mounting leadless type,
Epoxy resin board with lens
Surface mounting leadless type,
Epoxy resin board with lens,
high output type
Surface mounting leadless type,
Epoxy resin board with lens,
high output type
Surface mounting leadless type,
Epoxy resin board with lens, wide
beam angle
Optoelectronics
GL560
GL561
*1 Radiant intensity mW/sr
Note) Some products are handled by the Compound Semiconductor Division.
The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use.
GL380
(GL381, GL382)
GL513F ▲
GL390
(GL390V)
GL514 ▲
GL453E00000F ▲
GL560
(GL561)
GL480E00000F
GL537
(GL538)
GL4800E0000F
GL610T
GL4100E0000F
GL100MN0MP
GL100MN1MP, GL100MN3MP,
GL100MD1MP1
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
101
Device_E.book Page 102 Wednesday, July 18, 2007 1:03 PM
OPTO
OPTICAL-ELECTRIC SENSOR INDEX TREE
■ Distance Measuring Sensor Lineup
Range of distance
measuring
Output
1-bit digital output according
to distance measuring
Features
3 to 30 cm
1-bit digital output
(detected distance: 15/17.5/13 cm)
10 to 80 cm
Model No.
GP2D150AJ00F/GP2D150MJ00F/
GP2Y0D413K0F
1-bit digital output (detected distance: 24 cm)
GP2D15J0000F
General purpose
20 to 150 cm
GP2Y0D21YK0F
GP2Y0D02YK0F
Battery drive compatible, compact,
operating supply voltage (2.7 V to 6.2 V),
1-bit digital output (detected distance: 5/10 cm)
GP2Y0D805Z0F/GP2Y0D810Z0F
Compact, thin
1-bit digital output (detected distance: 10/40 cm)
GP2Y0D310K/GP2Y0D340K
Battery drive compatible, compact,
operating supply voltage (2.7 V to 6.2 V),
1-bit digital output (detected distance: 1.5 cm)
Capable of operation at high temperature
GP2Y5D91S00F
4 to 30 cm
Analog voltage output
GP2D120XJ00F/GP2Y0A41SK0F
10 to 80 cm
Output according to distance
measuring
1-bit digital output (detected distance: 80 cm)
Analog voltage output
GP2D12J0000F
General purpose
GP2Y0A21YK0F
20 to 150 cm
Analog voltage output
GP2Y0A02YK0F
100 to 550 cm
Analog voltage output
GP2Y0A710K0F
■ Wide Angle Sensor Lineup
Range of distance
measuring
Output
Voltage output according to
distance measuring
Detection angle of view
Model No.
4 to 30 cm
25° (When using 5 beams)
GP2Y3A001K0F
20 to 150 cm
25° (When using 5 beams)
GP2Y3A002K0F
40 to 300 cm
25° (When using 5 beams)
GP2Y3A003K0F
■ High-Precision Displacement Sensor
Range of distance
measuring
Output
Voltage output according to
distance measuring
4.5 to 6.0 mm
Features
Model No.
Resolution: 50 µm
GP2Y0AH01K0F
■ Paper Size Sensor (Using Optical Distance Measuring Method) Lineup
Output
8-bit serial output
Features
Model No.
GP2D06J0000F/GP2D061J000F/
GP2D062J000F
1-beam
Thin type (T: 11 mm)
GP2Y2E101K0F
2-beam
GP2D03J0000F/GP2D032J0000F
3-beam
GP2D07J0000F/GP2D071J000F/
GP2D072J000F
Thin type (T: 11 mm)
GP2Y2E301K0F
1-bit output
1-beam (detection height: 60 mm)
Thin type (T: 11.5 mm)
GP2Y2D160K0F
Analog output relative to measuring distance
1-beam (detection height: 80 mm)
Thin type (T: 11.5 mm)
GP2Y2A180K0F
2-beam (detection height: 80 mm)
Thin type (T: 11.5 mm)
GP2Y2A280K0F
■ Dust Sensor Unit Lineup
Output
Analog output
Features
Model No.
With peak-hold circuit
GP2U06J0000F
Pulse analog output, single-shot detection of house dust, Gener al purpose
GP2Y1010AU0F
■ Color Toner Concentration (Deposition Amount) Sensor Lineup
Output
Analog output
102
Features
Model No.
Employs diffuse reflection system
GP2TC1J0000F
Employs diffuse reflection system + mirror reflection system
GP2Y40010K0F
Device_E.book Page 103 Wednesday, July 18, 2007 1:03 PM
OPTICAL SYSTEM DEVICE
✩New product
■ Distance Measuring Sensors (1)
(Ta = 25°C)
Electro-optical characteristics*1
Distance
Dissipation current MeaVOL
VOH
Topr
measuring
sured
(V)
(V)
Operating Standby distance
(°C)
range
MIN.
MAX.
(mA)
(µA)
(cm)
(cm)
VO (TYP.) = 0.4 V
(at L = 80 cm),
–10 to +60 10 to 80
MAX. 50
–
–
∆VO (TYP.) = 2.0 V
(at L: 80 cm → 10 cm)
VO (TYP.) = 0.4 V
(at L = 80 cm),
–10 to +60 10 to 80
MAX. 40
–
–
∆VO (TYP.) = 1.9 V
(at L: 80 cm → 10 cm)
VO (TYP.) = 0.4 V
(at L = 30 cm),
–10 to +60
4 to 30
MAX. 50
–
–
∆VO (TYP.) = 2.25 V
(at L = 30 cm → 4 cm)
Absolute maximum ratings
Features
Vcc
(V)
GP2D12J0000F
Distance measuring sensor united with PSD ❇,
infrared LED and signal processing circuit,
Linear voltage output
–0.3 to +7
GP2Y0A21YK0F
Distance measuring sensor united with PSD ❇,
infrared LED and signal processing circuit,
Linear voltage output
–0.3 to +7
GP2D120XJ00F
Distance measuring sensor united with PSD ❇,
infrared LED and signal processing circuit,
Linear voltage output
–0.3 to +7
GP2Y0D805Z0F
GP2Y0D810Z0F
✩GP2Y5D91S00F
GP2Y0D310K
GP2Y0D340K
GP2D15J0000F
GP2Y0D21YK0F
GP2Y0A41SK0F
Light detector,
infrared LED and signal processing circuit,
short distance measuring sensor unit,
battery drive compatible
(operating power supply: 2.7 to 6.2 V)
Light detector,
infrared LED and signal processing circuit,
short distance measuring sensor unit,
battery drive compatible
(operating power supply: 2.7 to 6.2 V)
Light detector,
infrared LED and signal processing circuit,
short distance measuring sensor unit,
battery drive compatible (operating power supply:
2.7 to 6.2 V), Capable of operation at high
temperature
Digital voltage output according to the measured
distance of GP2Y0D340K
Compact, thin type (15 x 9.6 x 8.7 mm: sensor
part), Light detector, infrared LED and signal processing circuit,Digital voltage output according to
the measured distance
Distance measuring sensor united with PSD ❇,
infrared LED and signal processing circuit,
Digital voltage output
Distance measuring sensor united with PSD ❇,
infrared LED and signal processing circuit,
Digital voltage output
Distance measuring sensor united with PSD ❇,
infrared LED and signal processing circuit,
Short measuring cycle (16.5 ms)
Distance measuring sensor united with PSD ❇,
infrared LED and signal processing circuit,
Digital voltage output
Distance measuring sensor united with PSD ❇,
GP2D150MJ00F ▲ infrared LED and signal processing circuit,
Digital voltage output
Distance measuring sensor united with PSD ❇,
GP2Y0D413K0F infrared LED and signal processing circuit,
Digital voltage output
Distance measuring sensor united with PSD ❇,
infrared LED and signal processing circuit,
GP2Y0D02YK0F long distance measuring sensor unit
(No external control signal required), Digital voltage output according to the measured distance
GP2D150AJ00F
–0.3 to +7
–10 to +60
–
Vcc –0.6
0.6
MAX. 6.5 MAX. 8
5
–0.3 to +7
–10 to +60
–
Vcc –0.6
0.6
MAX. 6.5 MAX. 8
10
–0.3 to +7
–30 to +105
–
Vcc –0.6
0.6
TYP. 7
–
1.5
–0.3 to +7
–10 to +60
–
Vcc –0.3
0.6
MAX. 35
–
10
–0.3 to +7
–10 to +60
–
Vcc –0.3
0.6
MAX. 35
–
40
–0.3 to +7
–10 to +60
10 to 80
Vcc –0.3
0.6
MAX. 50
–
24
–0.3 to +7
–10 to +60
10 to 80
Vcc –0.3
0.6
MAX. 40
–
24
–0.3 to +7
–10 to +60
4 to 30
VO (TYP.) = 0.4 V
(at L = 30 cm),
∆VO (TYP.) = 2.25 V
(at L = 30 cm → 4 cm)
MAX. 22
–
–
–0.3 to +7
–10 to +60
3 to 30
Vcc –0.3
0.6
MAX. 50
–
–
–0.3 to +7
–10 to +60
3 to 30
Vcc –0.3
0.6
MAX. 50
–
17.5
–0.3 to +7
–10 to +60
3 to 30
Vcc –0.3
0.6
–
–
13
–0.3 to +7
–10 to +60
20 to 150
Vcc –0.3
0.6
MAX. 50
–
80
*1 Vcc = 5 V
The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use.
Optoelectronics
Model No.
❇ PSD: Position Sensitive Detector
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
103
Device_E.book Page 104 Wednesday, July 18, 2007 1:03 PM
OPTO
OPTICAL SYSTEM DEVICE
✩New product
■ Distance Measuring Sensors (2)
(Ta = 25°C)
Electro-optical characteristics*1
Distance
Dissipation current MeaVOL
VOH
Topr
measuring
sured
(V)
(V)
Operating Standby distance
(°C)
range
MIN.
MAX.
(mA)
(µA)
(cm)
(cm)
VO (TYP.) = 0.4 V
(at L = 150 cm),
MAX. 50
–
–
–10 to +60 20 to 150
∆VO (TYP.) = 2.0 V
(at L = 150 cm → 20 cm)
VO (TYP.) = 2.5 V
(at L = 100 cm),
TYP. 30
–
–
–10 to +60 100 to 550
∆VO (TYP.) = 0.7 V
(at L = 100 cm → 200 cm)
Absolute maximum ratings
Model No.
Features
Vcc
(V)
GP2Y0A02YK0F
Distance measuring sensor united with PSD ❇,
infrared LED and signal processing circuit
–0.3 to +7
✩GP2Y0A710K0F
Distance measuring sensor united with PSD ❇,
infrared LED and signal processing circuit
–0.3 to +7
❇ PSD: Position Sensitive Detector
*1 Vcc = 5 V
GP2Y5D91S00F
GP2Y0D805Z0F
(GP2Y0D810Z0F)
GP2Y0D340K
(GP2Y0D310K)
GP2D15J0000F
GP2D12J0000F, GP2D120XJ00F,
GP2D150AJ00F, GP2Y0A21YK0F,
GP2Y0D21YK0F, GP2Y0A41SK0F
GP2D150MJ00F, GP2Y0D413K:
without mounting hole
GP2Y0D02YK0F
(GP2Y0A02YK0F)
■ Wide Angle Sensors
GP2Y0A710K0F
(Ta = 25°C)
Absolute maximum ratings
Model No.
Features
Vcc
(V)
Topr
(°C)
Distance
measuring
range
(cm)
Electro-optical characteristics
Output
Output
Input voltage (V)
terminal
voltage
voltage
difference
LEDL
VINH
(V)
(V)
GP2Y3A001K0F
Distance measuring sensor united with PSD ❇,
infrared LED and signal processing circuit,
Distance measuring sensor application product,
Wide range (field of view) detection using 5 infrared
beams
–0.3 to +7
–10 to +60
4 to 30
TYP. 2.8*1 TYP. 1.6*4 MIN. 4.5 MAX. 0.5
–0.3 to +7
–10 to +60
20 to 150
TYP. 2.3*2 TYP. 1.6*5 MIN. 4.5 MAX. 0.5
–0.3 to +7
–10 to +60
40 to 300
TYP. 2.2*3 TYP. 1.2*6 MIN. 4.5 MAX. 0.5
GP2Y3A002K0F
GP2Y3A003K0F
❇ PSD: Position Sensitive Detector
Reflector used: White paper (Gray chart R-27/white surface, made by Kodak Corp., reflectance 90%)
*1 L = 4 cm
*4 Change in output voltage from L = 4 cm to 10 cm
*2 L = 20 cm
*5 Change in output voltage from L = 20 cm to 80 cm
*3 L = 40 cm
*6 Change in output voltage from L = 40 cm to 100 cm
GP2Y3A001K0F
104
GP2Y3A002K0F
L = Reflector - Sensor distance
GP2Y3A003K0F
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Device_E.book Page 105 Wednesday, July 18, 2007 1:03 PM
OPTICAL SYSTEM DEVICE
■ Paper Size Sensors
(Ta = 25°C)
Operating
temperature
Supply
voltage
Topr
(°C)
Vcc
(V)
Paper
detection
height
H
(mm)
8-bit serial output using optical distance
measuring method (2-beam)
0 to +60
5 ±0.5
TYP. 60
TYP. 21
MAX. ±6
0.7 or less*1
TYP. 30
8-bit serial output using optical distance
measuring method (1-beam)
0 to +60
5 ±0.5
TYP. 60
–
MAX. ±6
0.7 or less*1
TYP. 33
0 to +60
5 ±0.5
TYP. 85
–
MAX. ±6
0.7 or less*1
–
–10 to +60
5 ±0.5
TYP. 60
–
MIN. ±7.5
0.7 or less*1
–
0 to +60
5 ±0.5
TYP. 60
TYP. 36
MAX. ±6
0.7 or less*1
TYP. 33
0 to +60
5 ±0.5
TYP. 85
TYP. 33
MAX. ±6
0.7 or less*1
–
–10 to +60
5 ±0.5
TYP. 80
–
–
–
MAX. 25
–10 to +60
5 ±0.5
TYP. 80
–
–
–
MAX. 50
Model No.
GP2D03J0000F
GP2D032J0000F* 4
GP2D06J0000F
GP2D061J000F* 2
GP2D062J000F* 2
GP2Y2E101K0F
GP2Y2D160K0F
GP2D07J0000F
GP2D071J000F* 3
GP2Y2E301K0F
GP2Y2A180K0F
GP2Y2A280K0F
Thin type (T: 11 mm)
8-bit serial output using optical distance
measuring method (1-beam)
Thin type (T: 11.5 mm)
using optical distance measuring method
(1-beam)
Digital output (1-bit)
8-bit serial output using optical distance
measuring method (3-beam)
Thin type (T: 11 mm)
8-bit serial output using optical distance
measuring method (3-beam)
Thin type (T: 11.5 mm)
Analog output using optical distance
measuring method (1-beam)
Thin type (T: 11.5 mm)
Analog output using optical distance
measuring method (2-beam)
Paper
detection
density
Dissipation
current
OD
Icc
(mA)
This table shows the characteristics when configured in the paper size sensor system.
Reflectivity: 18% or more, OD = log (1/T), T: Reflectivity
Paper detection height GP2D061: TYP. 45 mm GP2D062: TYP. 90 mm
Paper detection height GP2D071: TYP. 45 mm
Paper detection height GP2D032: TYP. 45 mm
GP2D03J0000F
(GP2D032J000F)
GP2D06J0000F
(GP2D061J000F/GP2D062J000F)
GP2D07J0000F
(GP2D071J000F)
GP2Y2E101K0F
GP2Y2E301K0F
Optoelectronics
❇
*1
*2
*3
*4
Features
Approved value of
LED beam
paper
pitch
position sliding
∆x
Lp
(mm)
(mm)
GP2Y2D160K0F
GP2Y2A180K0F
GP2Y2A280K0F
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
105
Device_E.book Page 106 Wednesday, July 18, 2007 1:03 PM
OPTO
OPTICAL SYSTEM DEVICE
✩New product
■ High-Precision Displacement Sensor
Model No.
(Ta = 25°C)
Topr
(°C)
GP2Y0AH01K0F Resolution: 50 µm
Dissipation
current
(mA)
Distance
measuring
range (mm)
Distance characteristic of output
–10 to +60
Features
Operating
supply voltage
(V)
4.5 to 5.5
TYP. 20
4.5 to 6.0
TYP. 1.73 V
Variation in output over range
(4.5 to 6.0 mm)
GP2Y0AH01K0F
■ Dust Sensor Units
Model No.
GP2U06J0000F ▲
GP2Y1010AU0F
(Ta = 25°C)
Topr
(°C)
Features
Built-in infrared emitting diode,
photodiode and signal processing circuit
Compact,
single-shot detection of house dust
Electro-optical characteristics
Output voltage
Operating
Dissipation
Detection
at no dust
supply voltage
current
sensitivity
3)
Voc (V)
(V)
(mA)
V/(0.1 mg/m
Output voltage
range
VOH (V)
–10 to +65
4.5 to 5.5
TYP. 15
TYP. 0.5
MAX. 1
MIN. 3.2
–10 to +65
4.5 to 5.5
TYP. 11
TYP. 0.5
TYP. 0.9
MIN. 3.4
The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use.
GP2U06J0000F
GP2Y1010AU0F
■ Color Toner Concentration (Deposition Amount) Sensors
Model No.
Features
Employs diffuse reflection system, high-precision detection of toner
concentration on photo-sensitive drum, 2-line analog output
Employs diffuse reflection system + mirror reflection system,
✩GP2Y40010K0F high-precision detection of toner concentration on transfer belt,
2-line analog output
GP2TC1J0000F
Topr
(°C)
(Ta = 25°C)
Electro-optical characteristics
Dissipation current
Output voltage
Output voltage
(mA)
V01 (V)
V02 (V)
0 to +60
TYP. 4*1
TYP. 1.06*2
TYP. 2.63*2
0 to +60
MAX. 10
MAX. 1.61
MAX. 3.5
*1 Dissipation current with LED drive current of I F = 0 mA
*2 With reflection object A (Reflectance: 15.6%)
GP2TC1J0000F
106
GP2Y40010K0F
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Device_E.book Page 107 Wednesday, July 18, 2007 1:03 PM
OPTO
FIBER OPTICS INDEX TREE
■ Fiber Optics Lineup for Audio Equipment
Model No.
Type
Features
Supply voltage
2.5 V
Supply voltage
3.0 V
Supply voltage
5.0 V
GP1FM513TZ0F/
GP1FM55HTZ0F**
Compact (without
mounting hole)
Fiber optic
transmitter
–
GP1FM313TZ0F*/
GP1FMV31TK0F*
with mounting hole
Square connector
High speed signal transmission
(13.2 Mb/s MAX., 15.5 Mb/s
MAX.*, 50 Mb/s MAX.**),
With shutter
High speed signal transmission
(13.2 Mb/s MAX. [15.5 Mb/s
MAX.*, 25 Mb/s MAX.**,
50 Mb/s MAX.***])
–
GP1FAV30TK0F*
(EIAJ RC-5720B)
TTL drive
compatible
With shutter
–
GP1FAV31TK0F*
Vertical
mounting type
GP1FSV31TK0F
TTL drive
compatible
Vertical
mounting type
GP1FSV51TK0F
High speed signal
transmission
Electric jack integrated type
(Transmission speed 13.2 Mb/s)
With shutter
–
–
–
GP1FAV50TK0F
–
–
GP1FAV51TK0F
–
GP1FAV55TK0F***
GP1FP513TK0F
Compact (without
mounting hole)
–
GP1FMV31RK0F*
GP1FMV51RK0F
with mounting hole
Fiber optic receiver
High speed signal transmission
(13.2 Mb/s MAX., 15.5 Mb/s
MAX.*), With shutter
High speed signal transmission
(13.2 Mb/s MAX. [15.5 Mb/s
MAX.*, 25 Mb/s MAX.**])
ø3.5 mm
Optical mini-jack
(JIS C6560 &
EIAJ RC5720B)
Fiber optic
transmitter
GP1FAV30RK0F*
GP1FAV50RK0F
–
GP1FAV31RK0F*
GP1FAV51RK0F
With shutter
–
–
GP1FP513RK0F
GP1FD210TP0F
Electric jack integrated type
(Transmission speed 13.2 Mb/s)
–
With shutter
GP1FD310TP0F/
GP1FD320TP0F
–
GP1FD210RP0F
–
–
GP1FA51HRZ0F**
Thin type (t: 4.2 mm)
Fiber optic receiver
Thin type (t: 4.2 mm)
Optoelectronics
Connector type
Low operating
voltage
■ Transmission/Reception Devices for MOST*1 Compatible Optical Fiber
Connector type
MOST ver1.1
standard compatible
Type
Features
Transmission speed
Operating voltage
Model No.
Optic transmission
device
Wide operating temperature range
(–40°C to +105°C)
25Mb/s as optic fiber link
(Biphase)
5V
GP5FM5T01AZ
Optic reception
device
Wide operating temperature range
(–40°C to +105°C)
25Mb/s as optic fiber link
(Biphase)
5V
GP5FM5R01AZ
*1 “MOST” is a registered trademark of MOST Cooperation.
107
Device_E.book Page 108 Wednesday, July 18, 2007 1:03 PM
OPTO
FIBER OPTICS
✩New product
■ Fiber Optic Transmitters (Square Connector)
(Ta = 25°C)
Absolute maximum ratings
Model No.
GP1FM313TZ0F
GP1FMV31TK0F
GP1FM513TZ0F
GP1FMV51TK0F
GP1FM55HTZ0F
GP1FAV30TK0F
GP1FAV50TK0F
GP1FAV51TK0F
✩GP1FSV51TK0F
GP1FAV31TK0F
✩GP1FSV31TK0F
GP1FAV55TK0F
GP1FP513TK0F
Features
Vcc
(V)
Compact (without mounting hole),
With shutter,
High response speed (up to x2)
Compact (without mounting hole),
With shutter,
High response speed (up to x2)
Compact (without mounting hole),
With shutter,
High response speed (up to x2)
Compact (without mounting hole),
With shutter,
High response speed (up to x2)
Compact (without mounting hole),
With shutter,
High response speed (up to x2)
With mounting hole,
Low voltage drive,
High response speed (up to x2)
With mounting hole,
Mass-market model,
High response speed (up to x2),
TTL drive compatible
With mounting hole,
Mass-market model,
High response speed,
With shutter, TTL drive compatible
With mounting hole,
Vertical mounting,
With shutter,
Low voltage drive,
High response speed
With mounting hole, With shutter,
Low voltage drive,
High response speed
With mounting hole,
Vertical mounting,
With shutter,
Low voltage drive,
High response speed
With mounting hole,
High response speed (50 Mb/s),
With shutter
Electric jack/optical connector
integrated type
Vin
(V)
Supply
voltage
(V)
Topr
(°C)
Electro-optical characteristics
Propagation Dissipation Pulse Transmisdelay time
width sion speed
current
T
Icc
distortion
tPLH tPHL
∆tw
(Mb/s)
(mA)
(ns) (ns)
(ns)
MAX.
MAX. MAX. MAX.
–0.5 to +7 –0.5 to Vcc + 0.5 –20 to +70
2.7 to 3.6
180
180
12
±15
15.5
–0.5 to +7 –0.5 to Vcc + 0.5 –20 to +70
2.7 to 5.25
180
180
12
±15
15.5
–0.5 to +7 –0.5 to Vcc + 0.5 –20 to +70
4.75 to 5.25
180
180
13
±15
13.2
–0.5 to +7 –0.5 to Vcc + 0.5 –20 to +70
4.75 to 5.25
180
180
13
±15
13.2
–0.5 to +7 –0.5 to Vcc + 0.5 –20 to +70
4.75 to 5.25
180
180
13
±15
50
–0.5 to +7 –0.5 to Vcc + 0.5 –20 to +70
2.7 to 5.25
180
180
12
±15
15.5
4.75 to 5.25
–0.5 to +7 –0.5 to Vcc + 0.5 –20 to +70 Input voltage: 180
MIN. 2.0 V
180
13
±15
13.2
–0.5 to +7 –0.5 to Vcc + 0.5 –20 to +70
4.75 to 5.25
180
180
13
±15
13.2
–0.5 to +7 –0.5 to Vcc + 0.5 –20 to +70
4.75 to 5.25
180
180
13
±15
13.2
–0.5 to +7 –0.5 to Vcc + 0.5 –20 to +70
2.7 to 5.25
180
180
12
±15
15.5
–0.5 to +7 –0.5 to Vcc + 0.5 –20 to +70
2.7 to 5.25
180
180
13
±15
15.5
–0.5 to +7 –0.5 to Vcc + 0.5 –20 to +70
4.75 to 5.25
180
180
13
±15
50
–0.5 to +7 –0.5 to Vcc + 0.5 –20 to +70
4.75 to 5.25
180
180
13
±15
13.2
■ Fiber Optic Transmitters (ø3.5 mm Optical Mini-jack)
(Ta = 25°C)
Absolute maximum ratings
Model No.
GP1FD210TP0F
GP1FD310TP0F
GP1FD320TP0F
108
Features
Vcc
(V)
Compact, Thin type (t: 4.2 mm),
Optical mini-jack (low voltage type)
Compact, Thin type (t: 4.2 mm),
Optical mini-jack (low voltage type)
Compact, Thin type (t: 4.2 mm),
Optical mini-jack (low voltage type)
Vin
(V)
Topr
(°C)
Supply
voltage
(V)
Electro-optical characteristics
Propagation Dissipation Pulse Transmisdelay time
width sion speed
current
Icc
distortion
T
tPLH tPHL
(mA)
∆tw
(Mb/s)
(ns) (ns)
(ns)
MAX.
MAX. MAX. MAX.
–0.5 to +7 –0.5 to Vcc + 0.5 –20 to +70 2.2 to 3.0
180
180
10
±30
8
–0.5 to +7 –0.5 to Vcc + 0.5 –20 to +70 2.7 to 3.6
180
180
12
±30
8
–
–
12
–
25
–
–
–20 to +70 2.3 to 5.5
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Device_E.book Page 109 Wednesday, July 18, 2007 1:03 PM
FIBER OPTICS
■ Fiber Optic Receivers (Square Connector)
(Ta = 25°C)
Absolute maximum ratings
GP1FMV31RK0F
GP1FMV51RK0F
GP1FAV30RK0F
GP1FAV50RK0F
GP1FAV51RK0F
GP1FAV31RK0F
GP1FA51HRZ0F
GP1FP513RK0F
Features
Vcc (V)
Compact (without mounting hole), With shutter,
High response speed (up to x2)
Compact (without mounting hole), With shutter,
High response speed (up to x2)
With mounting hole, Low voltage drive,
High response speed
With mounting hole, Mass-market model,
High response speed (up to x2)
Topr
(°C)
IOL
(mA)
–0.5 to +7 10 –20 to +70
Supply
voltage
(V)
180
180
15
±20
15.5
–0.5 to +7 10 –20 to +70 4.75 to 5.25 180
180
25
±20
13.2
–0.5 to +7 10 –20 to +70
180
180
15
±20
15.5
–0.5 to +7 10 –20 to +70 4.75 to 5.25 180
180
25
±20
13.2
–0.5 to +7 10 –20 to +70 4.75 to 5.25 180
High response speed (up to x2), with shutter
180
25
±20
13.2
–
–
15
–
15.5
–
–
15
–
25
180
25
±20
13.2
With mounting hole, With shutter, Low voltage drive,
High response speed (up to x2)
With mounting hole, High response speed (up to x4),
with shutter
Electric jack/optical connector integrated type
2.7 to 3.6
2.7 to 3.6
–
–
–20 to +70
2.7 to 3.6
–
–
–20 to +70 4.75 to 5.25
–0.5 to +7 10 –20 to +70 4.75 to 5.25 180
■ Fiber Optic Receivers (ø3.5 mm Optical Mini-jack)
(Ta = 25°C)
Absolute maximum ratings
Model No.
Jack
GP1FD210RP0F ø3.5
Features
Vcc (V)
Thin (thickness: 4.2 mm),
optical mini-jack (low voltage drive)
GP1FM313 series
(GP1FM513 series)
GP1FSV31TK0F
(GP1FSV51TK0F)
IOL
(mA)
–0.5 to +7
4
Topr
(°C)
GP1FAV51TK0F
Supply
voltage
(V)
–20 to +70 2.4 to 3.0
GP1FMV31 series
(GP1FMV51 series)
GP1FAV31TK0F,
GP1FAV55TK0F,
GP1FAV51RK0F,
GP1FAV31RK0F
Electro-optical characteristics
Propagation Dissipation Pulse Transmisdelay time
width sion speed
current
T
Icc
distortion
tPLH tPHL
∆tw
(Mb/s)
(mA)
(ns) (ns)
(ns)
MAX.
MAX. MAX. MAX.
GP1FP513TK0F
(GP1FP513RK0F)
180
180
7.5
±30
Optoelectronics
Model No.
Electro-optical characteristics
Propagation Dissipation Pulse Transmisdelay time current
width sion speed
T
Icc
distortion
tPLH tPHL
∆tw
(Mb/s)
(mA)
(ns) (ns)
(ns)
MAX.
MAX. MAX. MAX.
8
GP1FAV50TK0F
GP1FAV50RK0F,
GP1FAV30TK0F,
GP1FAV30RK0F
GP1FD210TP0F
GP1FD210RP0F,
GP1FD310TP0F,
GP1FD320TP0F
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
109
Device_E.book Page 110 Wednesday, July 18, 2007 1:03 PM
OPTO
FIBER OPTICS
■ Optical Transmission Device
Model No.
GP5FM5T01AZ
Operating temperature
(°C)
• MOST standard compatible
• Wide operating temperature range
Optic output
(dBm)
Operating voltage
(V)
–40 to +105
–9 to –1.5
4.75 to 5.25
Operating temperature
(°C)
Features
Optic output
(dBm)
Operating voltage
(V)
–40 to +105
–24 to –2
4.75 to 5.25
Transmission speed
T
(Mb/s)
25
(Biphase)
GP5FM5T01AZ
■ Optical Reception Device
Model No.
GP5FM5R01AZ
Features
• MOST standard compatible
• Wide operating temperature range
Transmission speed
T
(Mb/s)
25
(Biphase)
GP5FM5R01AZ
110
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Device_E.book Page 111 Wednesday, July 18, 2007 1:03 PM
LED
HIGH-LUMINOSITY LED LAMPS
■ High-Luminosity (AIGaInP) LED Series
(Ta = 25°C)
Radiation color
Green
Yellow-green
Amber
Sunset orange
Orange
Red
Series
Dominant emission
wavelength (nm)
Radiation material
ZG, JG
ZE, JE
ZV, JV, YV
ZS, JS, YS
ZJ, JJ, YJ
ZR, JR
JU
(560)
(572)
(588)
(605)
(618)
(630)
(638)
AlGaInP on GaAs
■ High-Luminosity (InGaN) LED Series
■ White Type LED Series
(Ta = 25°C)
Radiation color
Blue
Series
Dominant emission
wavelength (nm)
Radiation material
BC
(Ta = 25°C)
Green
GC
(470)
Radiation color
Series
Color range
(x, y)
Radiation material
(525)
InGaN
■ Pastel Color LED Series
Radiation color
Light blue
Series
BW
(0.31, 0.31)
InGaN + Fluorescent powder
(Ta = 25°C)
Lemon yellow
Purple
CA
CY
CV
(0.17, 0.20)
Color range (x, y)
White
(0.42, 0.48)
(0.35, 0.15)
Radiation material
InGaN + Fluorescent powder
■ LED Series
(Ta = 25°C)
HY, H
HS, S
HD, D
HA, A
Red
(Highluminosity)
TR, T
555
565
565
585
610
635
650
660
GaP
GaP
GaP
GaAsP on
GaP
GaAsP on
GaP
GaAsP on
GaP
GaAsP on
GaP
Radiation color
Green
Series
Peak emission
wavelength (nm)
KG, K
Radiation
material
Yellow
Sunset
orange
Red
Red
Red
(Highluminosity)
UR, U
PR, P
660
695
GaAlAs on
GaAlAs on
GaAs
GaAlAs
Single hetero Double hetero
Red
LED
Yellow-green
Yellow-green
(Highluminosity)
EG, E, C*
FG, F
GaP
* C is the opposite polarity of EG’s.
■ High-Luminosity (AlGaInP) LED Lamps
(IF = 20 mA, Ta = 25°C)
High-luminosity
85
400
GL3ZS402B0SE
GL3ZV802B0SE
200
●
GL3JV404B0SE
●
GL3JV804B0SE
GL3ZV402B0SE
●
●
●
Cylinder
ø3
Model No.
ZR, JR, JU
(Red)
Model No.
400
GL3ZJ402B0SE
400
GL3ZS802B0SE
210
GL3ZJ802B0SE
230
280
GL3JS404B0SE
280
GL3JJ404B0SE
200
110
GL3JS804B0SE
120
GL3JJ804B0SE
100
GL3JE402B0SE 200
Model No.
Luminous intensity
(mcd) TYP.
Model No.
Model No.
ZJ, JJ
(Orange)
Luminous intensity
(mcd) TYP.
GL3JG402B0SE
JS, ZS
(Sunset orange)
Luminous intensity
(mcd) TYP.
Model No.
JV, ZV
(Amber)
Luminous intensity
(mcd) TYP.
JE, ZE
(Yellow-green)
Luminous intensity
(mcd) TYP.
JG, ZG
(Green)
Luminous intensity
(mcd) TYP.
Radiation
shape
(mm)
Colored diffusion
Colored transparency
Colorless transparency
Milky diffusion
Appearance
Resin type
GL3ZR402B0SE 250
GL3JR402B0S3
200
GL3ZR802B0SE 150
●
GL5ZV152B0SE 2 700
GL5ZS152B0SE 3 000
GL5ZJ152B0SE 3 000
GL5ZR152B0SE 2 000
●
GL5ZV302B0SE
900
GL5ZS302B0SE 1 000
GL5ZJ302B0SE
900
GL5ZR302B0SE 600
●
GL5JV302B0SE
640
GL5JS302B0SE
680
GL5JJ302B0SE
570
ø10
●
GL0ZV042B0S
16 900
GL0ZS042B0S
22 600
GL0ZJ042B0S
18 500
Long: 5.8
Short: 4.6
●
GL6ZV27
●
GL5JV7D2D0SE 210
Oval
ø5
750
GL6ZS27
850
GL5JS7D2D0SE 230
GL6ZJ27
750
GL5JJ7D2D0SE
190
GL6ZR27
360
Taped model is also available.
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
111
Device_E.book Page 112 Wednesday, July 18, 2007 1:03 PM
LED
HIGH-LUMINOSITY LED LAMPS
✩New product
■ High-Luminosity LED Lamps
●
●
●
650
Luminous intensity
(mcd) TYP.
300
250
20
GL3UR43
100
350
900
GL3B2402B0SC
GL3UR44
GL3UR402B0S
GL3BC302B0S2
GL3UR8
110
GL3TR43
●
60
GL3TR44
●
GL3G2402B0SC
●
Cylinder
Model No.
GL3TR8
●
ø3
Model No.
UR, U (Red)
Luminous intensity
(mcd) TYP.
Model No.
TR, T (Red)
Luminous intensity
(mcd) TYP.
Model No.
GC (Green)
Luminous intensity
(mcd) TYP.
BC (Blue)
Milky diffusion
Radiation
shape
(mm)
Colored
diffusion
Colored
transparency
Colorless
transparency
Resin type
Appearance
(IF = 20 mA, Ta = 25°C)
High-luminosity
2 800
GL5TR8
80
●
GL5UR44
●
850
GL5UR2K
●
2 000
GL5UR3K1
3 000
GL6UR11T*1
300
●
GL6UR31
950
GL6UR26T*1
400
GL8UR21
16
●
Long: 5.8
Short: 4.6
Rectangle
3 000
2 000
●
Oval
GL5UR3K
GL5UR2K1
●
ø5
GL5TR43
500
●
2.0 × 5.0
●
GL8TR21
4
1.8 × 3.9
●
GL8TR42
4
*1 With tie-bar
Taped model is also available.
GL3UR8
GL3UR43
GL3MM402B0SM series
GL3ZS802B0S series
GL3JV404B0SE series
GL5UR2K
GL5UR3K
GL5UR2K1
GL5UR3K1
GL5ZR302B0SE series
GL5JV302B0SE series
GL6UR11T
GL6UR26T
GL6ZR27 series
GL5JV7D2D0SE series
112
GL6UR31
GL0ZV042B0S series
GL8TR21
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Device_E.book Page 113 Wednesday, July 18, 2007 1:03 PM
LED LAMPS
■ LED Lamps
(I F = 20 mA*1, Ta = 25°C)
●
Red
(555 nm)
GL3KG8
30 GL3EG8
●
GL3HY8
55 GL3HS8
60 GL3HD8
40 GL3PR8
8
130
130
GL3HY44
100 GL3HS44
100 GL3HD44
110 GL3PR44
12
20 GL3EG43
38
GL3HY43
25 GL3HS43
25 GL3HD43
25 GL3PR43
3
●
GL3KG62
22 GL3EG62
65
GL3HY62
40 GL3HS62
40 GL3HD62
50
GL3KG63
6
18
GL3HY63
16 GL3HS63
15 GL3HD63
17 GL3PR63
LT3E31W*2 18
LT3E65W*2 25
●
3
110 GL4HS8
80 GL4HD8
15
GL5HD4
25 GL5PR4
3
150
GL5HY8
120 GL5HS8
80 GL5HD8
80 GL5PR8
15
70 GL5EG41
160
GL5HY41
100 GL5HS41
100 GL5HD41
150 GL5PR41
15
70 GL5EG44
160
GL5HY44
100 GL5HS44
100 GL5HD44
100 GL5PR44
15
GL5EG4
20
60 GL5EG8
GL5KG41
GL5KG44
●
●
●
ø5
100
GL5EG261B0SB 150
●
GL5EG40
●
GL5KG43
2
LT3D31W*2 15 LT3P31W*2 1.5
LT3H65W*2 25 LT3S65W*2 25 LT3D65W*2 25 LT3P65W*2
30 GL4EG8
GL5KG8
●
LT3H31W*2 15
GL4HY8
GL4KG8
●
120 GL5EG43
●
GL5EG60
●
ø5
(Inverted
cone)
Long: 5.8
Oval
Short: 4.6
GL3EG63
250
300 GL5FG43
GL5HD261B0SB
110 GL4PR8
80 GL5PR261B0SB
15
35
GL5HY40
250 GL5HS40
200 GL5HD40
250 GL5PR40
600 GL5HY43
250 GL5HS43
250 GL5HD43
300
23
GL5HD60
8
GL5HD47
8
GL2HD6
12 GL2PR6
GL8HD2
30
GL8HD4
40
GL6EG11T*3 120
●
GL5EG47
15
●
GL6EG26T*3
140
●
GL2EG6
15
2.5 × 5.0 ●
GL8EG2
30
GL8EG4
50
LED
Cylinder
(695 nm)
60 GL3EG44
●
ø2
2.0 × 3.1
●
1.8 × 3.9 ●
GL8KG42
1.9 × 3.9
2.0 × 3.2
●
1.5 GL8EG42
2.0 × 3.2 ●
GL5HS47
GL2HY6
6
12
5
GL8HY42
6
GL8HD42
5
GL8EG5
●
28
GL8HY5
25
GL8HD5
1.5
22
GL8KG25
9
GL8EG25
12
GL8HY25
12 GL8HS25
10 GL8HD25
GL8KG29
5
GL8EG29
12
GL8HY29
10 GL8HS29
GL8EG23
6
GL8HY23
8
GL8PR42
0.7
12 GL8PR25
1.5
7
2.0 × 4.5 ●
GL8PR29
3
GL8KG21
4
GL8EG21
8
GL8HY21
8
●
GL8KG26
4
GL8EG26
8
GL8HY26
0.7
GL8KG22
3.5 GL8EG22
6
GL8HY22
5
Isosceles
●
triangle
*1 PR series (Red): I F = 5 mA (GL8PR25, GL8PR29: IF = 10 mA)
*2 Taped model
*3 With tie-bar
HL: High-luminosity
GL8HS21
GL8HS22
8
5
6
GL8HD21
8
GL8PR21
GL8HD26
8
Square 5.0 × 5.0 ●
GL8HD23
8
GL8PR26
0.7
GL8HD22
8
GL8PR22
1.2
GL8PR28
●
2.0 × 5.0
Triangle
(635 nm)
GL3KG43
●
Rectangle
(610 nm)
GL3KG44
●
Arch
(585 nm)
●
ø3
Convex
(565 nm)
60
GL3EG41
●
ø4
(565 nm)
Luminous intensity
(mcd) TYP.
PR
Red
Luminous intensity
(mcd) TYP.
HD
Sunset orange
Luminous intensity
(mcd) TYP.
HS
Yellow
Luminous intensity
(mcd) TYP.
HY
Luminous intensity
(mcd) TYP.
FG
Yellow-green (HL)
Luminous intensity
(mcd) TYP.
EG
Yellow-green
Luminous intensity
(mcd) TYP.
KG
Green
Milky diffusion
Colorless transparency
Colored transparency
Radiation
shape
(mm)
Colored diffusion
Appearance
Resin type
0.9
Taped model is also available.
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
113
Device_E.book Page 114 Wednesday, July 18, 2007 1:03 PM
LED
LED LAMPS
Cylinder
GL3PR8 series
GL3PR44 series
GL3HY43 series
GL3KG62 series
LT3E31W series
GL3PR63 series
LT3E65W series
GL4PR8 series
GL5PR4 series
GL5HS8 series
GL5KG41 series
GL5PR44 series
GL5EG40 series
GL5HY43 series
GL5EG60 series
GL6EG11T
Oval
Convex
GL6EG26T
GL5HD47 series
Arch
GL2HY6
GL8EG2 series
GL8HD4 series
GL8HS21 series
GL8HY26 series
Rectangle
GL8KG42 series
GL8KG25 series
Square
GL8HD22 series
114
GL8HY29 series
GL8HD23 series
Triangle
GL8PR28
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Device_E.book Page 115 Wednesday, July 18, 2007 1:03 PM
DICHROMATIC LED LAMPS
GL5CU44
100/240
GL6CU7
40/9
20/15
GL5ED5
40/25
GL5ED44
GL5EP5
Luminous intensity
(mcd) TYP.
Yellow + Red
Luminous intensity
(mcd) TYP.
H P
Luminous intensity
(mcd) TYP.
E H
Yellow+ Yellow
green
80/50
GL5ED60
●
11/8
GL5HP5
15/9
120/250
●
●
Rectangle
E D
Yellow+ Red
green
GL3ED8
● GL5EJJ502C0X* 2 110/170
ø5
E P
Yellow+ Red
green
Luminous intensity
(mcd) TYP.
Luminous intensity
(mcd) TYP.
Yellow- Red
+
green
(HL)
●
ø3
Cylinder
C U
Milky diffusion
Colorless transparency
Colored transparency
Colored diffusion
Appearance
Radiation
shape
(mm)
❇
E JJ
Yellow- Orange
+
green
(HL)
Resin type
(I F = 20 mA*1, Ta = 25°C)
(The values in luminous intensity are radiation color order)
Luminous intensity
(mcd) TYP.
■ Dichromatic LED Lamps
1.9 × 3.9
●
GL8ED5
10/6.5
2.0 × 5.0
●
GL9ED2
8/3
5.0 × 5.0
●
GL9ED4
7/4
❇ CU series: Common anode pin connection
GL5EJJ502C0X
GL5ED5 series
6/2
3/1.5
GL9HP2
1/0.8
*2 Taped model
HL: High-luminosity
GL5ED44 series
GL5ED60 series
LED
GL3ED8
*1 P (Red) and H (yellow): I F = 10 mA
GL8HP5
GL9EH2
GL6CU7
GL8HP5 series
GL9ED2 series
GL9ED4
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
115
Device_E.book Page 116 Wednesday, July 18, 2007 1:03 PM
LED
HIGH-LUMINOSITY CHIP LEDs
✩New product
★Under development
■ High-Luminosity (AlGaInP) Chip LEDs (Taped Models Only)
1.6 × 0.8 (T: 0.55)
●
GM1JE55200AE*1
75
GM1JJ35200AE*1
19
20.9
GM1JJ55200AE*1
19
GM1ZJ80300AE
GM1ZS80300AE
Red
GM1JR35200AE*1
13
75
GM1ZR80300AE
55
GM1ZR40300AE
55
GM1ZV80300AE
●
LT1JV67A*1
●
GM1ZV40300AE
60
GM1ZS40300AE
78
GM1ZJ40300AE
60
●
2.0 × 1.25 (T: 0.8)
6.0 × 5.0 (T: 2.3)
(board insertion type)
2.8 × 1.2 (T: 0.8)
(Side emitting)
5.0 × 5.0 (T: 1.5)
16.8
GM1JS55200AE*1
19
GM1JS35200AE*1
GM1JV55200AE*1
●
1.6 × 0.8 (T: 0.8)
6.0 × 5.0 (T: 2.5)
GM1JV35200AE*1 18.8
Orange
75
Sunset
orange
Amber
ZR JR
Luminous intensity
(mcd) TYP.
13
GM1JE35200AE*1
ZJ JJ
SJ
Luminous intensity
(mcd) TYP.
13
●
ZS JS
Luminous intensity
(mcd) TYP.
Yellow-green
1.6 × 0.8 (T: 0.35)
3.2 × 2.8 (T: 1.9)
ZV JV
Luminous intensity
(mcd) TYP.
JE SE
Luminous intensity
(mcd) TYP.
Milky diffusion
Colorless transparency
Colored transparency
Outline
dimensions
(mm)
Colored diffusion
Resin type
(I F = 20 mA, Ta = 25°C*3)
GM1JV40300AE
11
GM1JS40300AE
12
GM1JJ40300AE
9.5
16.5
LT1JS67A*1
14.1
●
★GM5ZV96270A
600
★GM5ZR96270A
600
●
✩GM5ZV96260AE
320
✩GM5ZR96260AE
300
●
GM5ZV01200A*2
500
GM5ZR01200A*2
400
●
GM5ZJ01200A*2
500
GM5SJ01250AL
1 050
GM5ZJ03200Z*2
500
GM5ZR03200Z*2
400
(150) ✩GM4ZJ83200AE
(150)
GM4ZR83200AE
(90)
GM5ZR05240A
GM5SE01200A*2
GM5ZS01200A*2
3 000
700
400
●
GM5ZV03200Z*2
●
✩GM4ZV83200AE
500
GM5ZS03200Z*2
(100) ✩GM4ZS83200AE
700
●
*1 LT1JS67A, LT1JV67A, GM1JV55200AE series, GM1JV35200AE series, GM1JV40300AE series: I F = 5 mA
*2 GM5ZR01200A series, GM5ZR03200Z series: IF = 60 mA
*3 GM5ZV96260AE series, GM5ZV96270A series, GM5ZV01200A series, GM5ZV03200Z series: Tc= 25°C
■ High-Luminosity (InGaN) Chip LEDs
(Taped Models Only)
1.6 × 0.8 (T: 0.35)
1.6 × 0.8 (T: 0.55)
3.2 × 2.8 (T: 1.9)
6.0 × 5.0 (T: 2.5)
6.0 × 5.0 (T: 2.3)
board insertion type
2.8 × 1.2 (T: 0.8)
Side emitting
5.0 × 5.0 (T: 1.5)
*1
*2
*3
*4
*5
116
Milky diffusion
Colorless
transparency
Colored
transparency
Outline
dimensions
(mm)
Colored
diffusion
Resin type
●
(I F = 10 mA, Ta = 25°C*5)
BC
GC
Blue
Green
Luminous
intensity
(mcd) TYP.
Luminous
intensity
(mcd) TYP.
GM1BC35370AC*1
23
●
✩GM1BC55255AC*1
23
✩GM1GC55310AC*4
●
★GM5BC96270A* 2
500
★GM5GC96270A
●
✩GM5BC96260AC*2
300
✩GM5GC96260AC*2
700
●
✩GM5BC01250AC*3
400
✩GM5GC01250AC*3
1 200
●
✩GM5BC03210Z* 3
400
✩GM5GC03210Z* 3
1 200
●
★GM4BC83200AC*2
(150)
★GM4GC83200AC*2
(300)
●
★GM5BC05240AC*2
2 000
★GM5GC05240AC*2
4 000
100
1 300
GM1BC35370AC, GM1BC55255AC: IF = 5 mA
GM5BC96260AC series, GM5BC96270A series, GM4BC83200AC series, GM5BC05240AC series: I F = 20 mA
GM5BC01250AC series, GM5BC03210Z series: I F = 50 mA
GM1GC55310AC: IF = 10 mA
GM5BC96260AC series, GM5BC96270A series, GM5BC01250AC series, GM5BC03210Z series: Tc= 25°C
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Device_E.book Page 117 Wednesday, July 18, 2007 1:03 PM
CHIP LEDs
■ Chip LEDs (Taped Models Only)
5
●
●
●
S HS
GM1HS55200A
LT1S67A
LT1S40A
Milky diffusion
Sunset orange
●
●
●
11.5
23
LT1H67A
8.3
19
18.1
LT1H40A
10.8
U UR
D HD
Luminous intensity
(mcd) TYP.
1.6 × 0.8 (T: 0.55)
1.6 × 0.8 (T: 0.8)
2.0 × 1.25 (T: 0.8)
3.2 × 2.8 (T: 1.9)
Colorless transparency
11.4
6.9
9.4
Red
GM1HD55200A
LT1D67A
LT1D40A
GM5HD95200A
●
P
Red
(HL)
12.5
8.8
11.9
13.8
GM1UR55200A
LT1U67A
LT1U40A
GM5UR95200A
29.7
29.7
35.6
80
Red
LT1P67A
LT1P40A
*1 P (Red) series: IF = 5 mA
HL: High-luminosity
LT1D67A series
LT1JS67A series
GM1ZV80300AE series
GM1EG55200A series
GM1JV55200AE series
GM1BC55255AC series
GM4ZV83200AE series
GM4BC83200AC series
LT1E40A series
GM1JV40300AE series
GM1ZV40300AE series
GM5ZR05240A
GM5BC05240AC series
GM5ZR01200A series
GM5BC01250AC series
GM1JV35200AE series
GM1EG35200A
GM1BC35370AC
GM5EG95200A series
GM5ZV96260AE series, GM5BC96260AC series
GM5BC96270A series
GM5ZV03200Z series
GM5BC03210Z series
Taped model
■ High-Luminosity Dichromatic Type Chip LEDs
(Taped Models Only)
6.0 × 5.0 (T: 2.5)
●
Milky diffusion
Colorless
transparency
Colored
transparency
Colored
diffusion
Resin type
Outline
dimensions
(mm)
1.3
1.3
LED
Outline dimensions
(mm)
Colored transparency
Colored diffusion
Resin type
GM1HY55200A
Luminous intensity
(mcd) TYP.
2.0 × 1.25 (T: 0.8)
3.2 × 2.8 (T: 1.9)
19
19
Luminous intensity
(mcd) TYP.
1.6 × 0.8 (T: 0.8)
Yellow
Luminous intensity
(mcd) TYP.
LT1K40A
Green
Luminous intensity
(mcd) TYP.
3.8
GM1EG35200A
GM1EG55200A
LT1E67A
LT1F67A
LT1F67AF
LT1E40A
GM5EG95200A
Milky diffusion
Colored diffusion
LT1K67A
●
1.6 × 0.8 (T: 0.35)
1.6 × 0.8 (T: 0.55)
Yellow-green
●
Outline dimensions
(mm)
H HY
E FEG
Luminous intensity
(mcd) TYP.
K
Luminous intensity
(mcd) TYP.
Colorless transparency
Colored transparency
Resin type
(IF = 20 mA*1, Ta = 25°C)
(I F = 40 mA, Tc = 25°C)
BC GC
BC ZR
GC ZR
Blue + Green
Blue + Red
Green + Red
Luminous
intensity
(mcd) TYP.
GM5BG01210A
300/860
Luminous
intensity
(mcd) TYP.
GM5ZRB01210A
300/580
Luminous
intensity
(mcd) TYP.
GM5ZRG01210A
860/580
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
117
Device_E.book Page 118 Wednesday, July 18, 2007 1:03 PM
LED
CHIP LEDs
✩New product
★Under development
■ Dichromatic Type Chip LEDs
(Taped Models Only)
(I F = 20 mA, Ta = 25°C)
1.6 × 1.6 (T: 0.8)
E H
Milky diffusion
Colorless
transparency
Colored
diffusion
Outline
dimensions
(mm)
Colored
transparency
Resin type
Yellow-green + Yellow
Luminous
intensity
(mcd) TYP.
●
GM5BG01210A series
E D
LT1EH67A
K S
Yellow-green + Red
Luminous
intensity
(mcd) TYP.
19/8.3
LT1ED67A
19/8.3
LT1KS67A
(Ta = 25°C*4)
BW
Outline
dimensions
(mm)
Color
coordinates
(x, y)
Radiation color
2.8 × 1.2 (T: 0.8)
Side view type
(0.30, 0.29)
White
White
Luminous
intensity
(mcd) TYP.
3.85 × 1.2 (T: 0.6)
Side view type
(0.30, 0.29)
(0.30, 0.29)
GM4BW83380A* 1
1 900
GM4BW63360A* 1
1 550
✩GM4BW63370A* 1
1 800
★GM5BW53340A* 1
1 800
✩GM5BW96320A* 1
1 400
★GM5BW96370A* 1
White
1 700
✩GM4BW83390A* 1
White
3.85 × 1.0 (T: 0.5)
Side view type
2 000
3.2 × 2.8 (T: 1.9)
(0.31, 0.31)
White
3.2 × 2.8 (T: 1.4)
(0.31, 0.31)
White
✩GM5BW94320A* 1
3 800
5.0 × 5.0 (T: 1.5)
(0.31, 0.31)
White
GM5BW05340A* 1
10 000
5.0 × 5.0 (T: 1.6)
(0.31, 0.31)
White
★GM5BW05343A* 2
20 000
White
GM5BW01300A* 2
4 200
GM5BW01301A* 3
1 800
★GM5BW01311A* 3
3 300
6.0 × 5.0 (T: 1.5)
6-terminal leadless
6.0 × 5.0 (T: 2.5)
4-terminal leadless
(0.31, 0.31)
(0.31, 0.31)
White
GM5BW83380 series, GM4BW63360A series, GM4BW53340A, GM5BW96320A, GM5BW96370A, GM5BW94320A, GM5BW05340A: I F = 20 mA
GM5BW05343A, GM5BW01300A: IF = 35 mA/chip
GM5BW01301A series: IF = 40 mA
GM5BW96320A, GM5BW96370A, GM5BW01300A, GM5BW01301A series: Tc = 25°C
■ Pastel Color Chip LEDs
(Taped Models Only)
3.2 × 2.8 (T: 0.9)
(I F = 20 mA, Tc = 25°C)
CA
Outline
dimensions
(mm)
118
3.8/6.9
LT1ED67A series
■ High-Luminosity White Type Chip LEDs
(Taped Models Only)
*1
*2
*3
*4
Green + Sunset orange
Luminous
intensity
(mcd) TYP.
CY
Light blue
Color
Luminous
coodinates intensity
(x, y)
(mcd) TYP.
✩GM5CA96320A
(0.17, 0.20)
1 000
CV
Lemon yellow
Color
Luminous
coodinates intensity
(x, y)
(mcd) TYP.
★GM5CY96320A
(0.42, 0.48)
1 500
Purple
Color
Luminous
coodinates intensity
(x, y)
(mcd) TYP.
★GM5CV96320A
(0.35, 0.15)
500
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Device_E.book Page 119 Wednesday, July 18, 2007 1:03 PM
CHIP LEDs / LEDs FOR CAMERA DATA BACK
✩New product
★Under development
GM5BW96320A
GM5BW96370A
GM5CA96320A
series
GM5BW01300A
GM5BW01301A
GM5BW01311A
GM4BW83380A
series
GM4BW53340A
GM5BW05340A
GM5BW05343A
GM4BW63360A
series
GM4WA10200A
GM4WA25300A
■ High-Luminosity Dichromatic Type Chip LEDs (RGB 3-color)
(Taped Models Only)
(Ta = 25°C*11)
WA
1.6 × 1.6 (T: 0.55)
Luminous intensity
(mcd) TYP.
●
GM1WA55311A*5
●
2.7 × 1.35 (T: 1.0)
Side view type
3.2 × 2.8 (T: 1.4)
Red + Green + Blue
Milky
diffusion
Colorless
transparency
Colored
transparency
Colored
diffusion
Resin type
Outline
dimensions
(mm)
✩GM4WA10200A*5
10 to 40/16 to 100/10 to 42
✩GM5WA94200A*7
●
5.0 × 2.5 (T: 2.5)
20/70/23
●
(920) [Mixed color]
★GM4WA25300A*8
(2 000) [Mixed color]
●
6.0 × 5.0
(T: 2.3 [resin part])
6-terminal
●
1 725 [Mixed color]
●
GM5WA06256A*6
1 500 [Mixed color]
GM5WA06270A*3, 4
3 000 [Mixed color]
●
GM5WA06250Z*2
1 400 [Mixed color]
●
GM5WA06256Z*6
1 500 [Mixed color]
GM5WA06260A: IF = 40 mA (Red, Green), IF = 20 mA (Blue)
GM5WA06250A, GM5WA06250Z: IF = 35 mA (Red, Green), IF = 20 mA (Blue)
GM5WA06270A: IF = 35 mA (Red, Green, Blue)
GM5WA06270A: T: 2.4 mm
GM1WA55311A/GM4WA10200A: IF = 5 mA (Red, Green, Blue)
GM5WA06256A: IF = 22 mA (Red), IF = 35 mA (Green), IF = 13 mA (Blue)
GM5WA94200A: IF = 17 mA (Red), IF = 20 mA (Green), IF = 10 mA (Blue)
GM4WA25300A: IF = 21 mA (Red), IF = 25 mA (Green), IF = 7 mA (Blue)
GM5WA94200A, GM4WA10200A, GM4WA25300A, GM5WA06250A series: Tc = 25°C
GM1WA55311A
GM5WA06250A
GM5WA06260A
GM5WA06256A
GM5WA06250Z
GM5WA06256Z
GM5WA06270A
LED
*1
*2
*3
*4
*5
*6
*7
*8
*9
1 400 [Mixed color]
GM5WA06260A*1
●
6.0 × 5.0 (T: 2.5)
6-terminal leadless
GM5WA06250A*2
GM5WA94200A
■ LEDs for Camera Data Back
Model No.
GW01M59001PE
(I F = 1 mA, Ta = 25°C)
No. of dots
Outline dimensions (mm)
Radiation color
7
2.6 × 2.9 (T: 0.9) Surface-mount type
Amber
Luminous intensity (mcd)
(MIN. 0.4
TYP. 0.8)
( ) indicates reference value.
GW01M59001PE
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
119
Device_E.book Page 120 Wednesday, July 18, 2007 1:03 PM
LASER
LASER DIODES
✩New product
■ Laser Diodes
◆ Model Configurations
Package
Optical power
output (Pulse)
(mW)
MAX.
Wavelength
(nm)
20*1
240
405 band
650 band
ø5.6 mm
Metal type
✩GH04020A2GE
ø3.3 mm
Metal type
1.8 mm t
Resin type
GH06P24A2C
GH16P24A8C
✩GH16P30A8C
300
✩GH16P35A8C
350
5*1
GH07805C2K
25*1
GH07825C2K
240
GH07P24C1C
GH07P24C4C
GH17P24C8C
280
780 band
ø5.6 mm
Resin type
GH07P28A1C
GH07P28A4C
✩GH17P28A8C
GH17805B2AS
*1 Optical power output (CW) MAX. (mW)
◆ Specifications
(Tc = 25°C)
Optical power
Wave- output (mW)
Model No.
length
MAX.
(nm)
CW Pulse
405
GH04020A2GE
20
—
band
GH06P24A2C
100
240
GH16P24A8C
100
240
650
band
GH16P30A8C
120
300
GH16P35A8C
125
350
Features
ø5.6 mm CAN package, operating temperature: 70°C MAX.
Next generation DVD playback
E
Double-layer DVD ×4 writing
Double-layer DVD ×4 writing
Double-layer DVD ×8 writing
Double-layer DVD ×16 writing
B
GH17805B2AS
5
—
GH07805C2K
5
—
GH07825C2K
25
—
120
150
240
280
ø5.6 mm CAN package, operating temperature: 75°C MAX. (pulse drive)
1.8 mm frame package, operating temperature: 75°C MAX. (pulse drive)
1.8 mm frame package, operating temperature: 75°C MAX. (pulse drive)
1.8 mm frame package, operating temperature: 75°C MAX. (pulse drive)
ø5.6 mm frame package, operating temperature: 70°C MAX.,
with built-in monitor PD
ø5.6 mm CAN package, operating temperature: 60°C MAX.,
with built-in monitor PD
ø5.6 mm CAN package, operating temperature: 60°C MAX.,
with built-in monitor PD
ø5.6 mm CAN package, operating temperature: 75°C MAX. (pulse drive)
ø5.6 mm CAN package, operating temperature: 75°C MAX. (pulse drive)
120
240
ø3.3 mm CAN package, operating temperature: 75°C MAX. (pulse drive)
GH07P28A4C
150
280
ø3.3 mm CAN package, operating temperature: 75°C MAX. (pulse drive)
GH17P24C8C
120
240
1.8 mm frame package, operating temperature: 75°C MAX. (pulse drive)
GH17P28A8C
150
280
1.8 mm frame package, operating temperature: 75°C MAX. (pulse drive)
GH07P24C1C
GH07P28A1C
780
band
GH07P24C4C
Terminal
connections
Applications
C
CD-ROM, CD-Audio
A
Printer, copier, complex machine
D
Printer, copier, complex machine
CD-R/RW (MAX. ×48 to ×52 writing)
CD-R/RW (MAX. ×48 to ×52 writing)
CD-R/RW (H/H, slim dual-purpose)
(MAX. ×48 to ×52 writing)
CD-R/RW (H/H, slim dual-purpose)
(MAX. ×48 to ×52 writing)
CD-R/RW (H/H, slim dual-purpose)
(MAX. ×48 to ×52 writing)
CD-R/RW (H/H, slim dual-purpose)
(MAX. ×48 to ×52 writing)
B
C
• Terminal Connections
A
1
Laser diode
B
3
Photodiode
1
C
Laser diode
E
3 GND
3
D
2 Stem
2 Stem
Laser diode
Photodiode
2 Stem
120
2 Stem
1
4
2
Laser diode
3
1
Laser diode
3
1
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Device_E.book Page 121 Wednesday, July 18, 2007 1:03 PM
RF
LOW NOISE BLOCKDOWN CONVERTER
■ Europe: LNB for Broadcasting Satellite
◆ Features
(1)
(2)
(3)
(4)
Wide band type receiving all broadcasting channels (analog & digital) of Europe. [Universal LNB]
Originally developed feed-horn waveguide makes the wide-band, low-noise characteristics possible.
One of the industry’s most compact and lightweight package
Low consumption current design for energy saving [80 mA (TYP.): BS1R8EL100A]
◆ Specifications
Destination
Receiving polarization
Model No. & lt; Type & gt;
Input frequency (GHz)
Output frequency (MHz)
Local oscillation frequency (GHz)
NF (dB)
Conversion gain (dB)
Phase noise
Cross-polar discrimination (dB)
Europe, Astra/Eutelsat Satellite etc.
Horizontal/Vertical polarization
BS1R8EL500A & lt; 4 output & gt; BS1R8EL400A & lt; 4 output & gt; BS1R8EL200A & lt; 2 output & gt; BS1R8EL100A & lt; 1 output & gt;
10.7 to 11.7 [Low band], 11.7 to 12.75 [High band]
950 to 1 950 [Low band], 1 100 to 2 150 [High band]
9.75 [Low band], 10.6 [High band]
0.7 (TYP.)
56 (TYP.)
–55 dBc/Hz @1 kHz (TYP.)
25 (TYP.)
Vertical polarization
11.5 to 14.0 (0/22 kHz)
Supply voltage (V DC)
(Polarization switching voltage) Horizontal polarization
16.0 to 19.0 (0/22 kHz)
Power consumption (mA)
210 (TYP.)/250 (MAX.)
310 (TYP.)/350 (MAX.)
190 (TYP.)/250 (MAX.)
80 (TYP.)/120 (MAX.)
Waveguide
Feed-horn (F/D = 0.6)
75
Output impedance ( Ω)
4-output
2-output
1-output
4-output
Output connector (F-type)
(H/V, High and low switching) (H/V, High and low switching) (H/V, High and low switching)
(H/H, H/L, V/H, V/L)
Outline dimensions (mm)
133.0 × 103.6 × 60.0
133.0 × 103.6 × 60.0
123.5 × 97.0 × 60.0
107.3 × 60.0 × 60.0
Weight (g)
Approx. 255
Approx. 256
Approx. 215
Approx. 110
BS1R8EL400A
BS1R8EL200A
BS1R8EL100A
RF Components
BS1R8EL500A
■ U.S.A.: LNB for FSS Broadcast/(Others: LNB for Communication)
◆ Specifications
Receiving system
Receiving polarization
Model No.
Input frequency (GHz)
Output frequency (MHz)
Local oscillation frequency (GHz)
NF (dB)
Conversion gain (dB)
Phase noise
Cross-polar discrimination (dB)
Supply voltage (V DC)
Power consumption (mA)
Waveguide
Output impedance ( Ω)
Output connector (F-type)
Outline dimensions (mm)
Weight (g)
U.S.A.: FSS, Japan and others: for communication
Horizontal/vertical polarization
BS1C1UR100A
11.7 to 12.2
950 to 1 450
10.75
0.7 (TYP.)/0.9 (MAX.)
50 to 62
-60 dBc/Hz @1 kHz (TYP.)
—
12 to 24
120 (TYP.)/150 (MAX.)
WR-75
75
1-output
48.6 × 96.3 × 45.5
Approx. 100
BS1C1UR100A
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment
using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets
before using any SHARP device.
121
Device_E.book Page 122 Wednesday, July 18, 2007 1:03 PM
RF
LOW NOISE BLOCKDOWN CONVERTER
■ Japan/Asia/Australia: LNBs for CS Digital Satellite Broadcast
◆ Specifications
Destination
Receiving polarization
Model No. & lt; Type & gt;
Input frequency (GHz)
Output frequency (MHz)
Local oscillation frequency (GHz)
NF (dB)
Conversion gain (dB)
Phase noise
Cross-polar discrimination (dB)
Vertical polarization
Supply voltage (V DC)
(Polarization switching voltage) Horizontal polarization
Power consumption (mA)
Waveguide
Output impedance ( Ω)
Output connector (F-type)
Outline dimensions (mm)
Weight (g)
Japan, Asia, Australia, CS Satellite
Horizontal/Vertical
polarization
BS1R8AR100A
11.70 to 12.75
1 000 to 2 050
10.7
0.7 (TYP.) / 0.9 (MAX.)
55 to 64
–75 dBc/Hz @1 kHz (TYP.)
25 (TYP.)
11.5 to 14.0
16.0 to 19.0
80 (TYP.)120 (MAX.)
Feed-horn (F/D = 0.6)
75
1-output (H/V switching)
107.3 × 60 × 60
Approx. 110
BS1R8AR100A
■ Japan: LNBs for BS/CS 110° Satellite Broadcast
◆ Features
(1) Can receive 2 satellite broadcasts of 110° BS/CS digital
[Employs wide-band (1 GHz) circular’ linear polarization conversion technology (septum waveguide structure)]
(2) Outstanding noise figure (NF) characteristics enabling compact design of antenna diameter. [NF: 0.45 dB (TYP.)/BS1F6JU300A]
(3) Low current consumption design for improved energy saving. [80 mA (TYP.)]
◆ Standard Specifications
Destination
Receiving polarization
Model No.
Input frequency (GHz)
Output frequency (MHz)
Local oscillation frequency (GHz)
NF (dB)
Conversion gain (dB)
Phase noise
Cross-polar discrimination (dB)
Right circular polarization
Supply voltage (V DC)
(Polarization switching voltage) Left circular polarization
Power consumption (mA)
Waveguide
Output impedance ( Ω)
Output connector (F-type)
Outline dimensions (mm)
Weight (g)
122
Japan BS/CS 110° Satellite
Right/Left circular
polarization
BS1F6JU300A
BS1F6JP300A
BS1F6JP100A
11.71023 to 12.751
1 032.23 to 2 073
10.678
0.45 (TYP.) /
0.7 (TYP.) / 1.1 (MAX.)
0.6 (MAX.)
48 to 60
-65 dBc/Hz @1 kHz (TYP.)
25 (TYP.)/20 (MIN.)
9.5 to 18.0
13.5 to 16.5
—
9.5 to 12.0
80 (TYP.)/110 (MAX.)
Feed-horn (F/D=0.5)
75
1-output
1-output
(R/L switching)
96 × 53.07 × 71
Approx. 130 (not including outer cabinet)
Right circular polarization
BS1F6JP300A
* Outer cabinet is made upon request.
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment
using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets
before using any SHARP device.
Device_E.book Page 123 Wednesday, July 18, 2007 1:03 PM
DIGITAL DBS FRONT-END UNITS
■ Digital DBS Front-End Units
broadcasting
D BS front-end unit for digitalusing Sharp’sfeatures high quality of signal transmission and improved elimination ability of various
kinds of rejection thanks to
original ICs.
◆ Features
(1) Equipped with a direct conversion IC developed by Sharp. Reliability is improved by reducing power consumption and component
counts.
(2) Wide-band reception design also covering CS broadcast band. [Reception frequency: 950 to 2 150 MHz]
(3) Wide product line-up of LINK integrated types for contributing to set development time reduction.
[Compatible with DVB-S/DVB-S2/ISDB-S demodulation]
(4) User support tools can be provided. [Sample/evaluation boards and software are available.]
◆ Standard Specifications & lt; IQ output type & gt;
Destination
Global
Demodulator system
DVB-S
ISDB-S/DVB-S2
Input type
1-input/1-loop through output
1-input
Model No.
BS2S7HZ0502
BS2S7HZ6306
Input frequency (MHz)
950 to 2 150
Input signal level (dBm)
–65 to –25
The 1st intermediate frequency
(MHz)
Zero-IF (Direct conversion)
Base band frequency bandwidth
10 to 30, 2.0 MHz
step (BB LPF)
RF input local leak (dBm)
PLL phase noise
(dBc/Hz)
–70 and below
10 kHz offset
1 kHz offset
BS2S7HZ0502
–80 (TYP.)
–85 (TYP.)
–75 (TYP.)
–80 (TYP.)
Output type
I/Q
PLL (I2C-bus)*1
Channel selection system
Noise figure (dB)
Tuning voltage (V DC)
7 (TYP.)
Shared with a 3.3 V power source
Supply voltage (V DC)
LNB power supply
3.3
DC 25 V, 400 mA (MAX.)
Input impedance ( Ω)
Outline dimensions (mm)
75
29.6 × 29.4 × 13.0
BS2S7HZ6306
30.6 × 25.0 × 13.0
RF Components
❇ Contact SHARP for custom design product. (Vertical chassis compatible)
*1 I2C-bus is a trademark of Philips Corporation.
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment
using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets
before using any SHARP device.
123
Device_E.book Page 124 Wednesday, July 18, 2007 1:03 PM
RF
DIGITAL DBS FRONT-END UNITS
■ Digital DBS Front-End Units (QPSK Demodulator Circuit Built-in Type)
◆ Specifications & lt; QPSK demodulator circuit built-in type & gt;
Destination
Global
Input type
1-input, 1-loop through output
Model No.
BS2F7VZ7395
Input frequency (MHz)
950 to 2 150
Input signal level (dB m)
–65 to –25
The 1st intermediate frequency (MHz)
Zero-IF (Direct conversion)
Base band frequency bandwidth (MHz)
10 to 30, 2.0 MHz step (BB LPF)
RF input local leak (dB m)
–70 and below
Output type
TS parallel/serial
Symbol rate (M baud)
45 (MAX.)
Eb/No = 5.5 dB (Max.) [PR = 3/4, BER = 2 x 10 –4]
BER (Viterbi output)
PLL (I2C-bus)*1
Channel selection system
Noise figure (dB)
7 (TYP.)
Tuning voltage (V DC)
Shared with a 3.3 V power source
Supply voltage (V DC)
3.3, 2.5
LNB power supply
25 V DC, 400 mA (MAX.)
Input impedance ( Ω)
75
BS2F7VZ7395
57.5 × 29.6 × 13.2
Outline dimensions (mm)
❇ Contact SHARP for custom design product.
*1 I2C-bus is a trademark of Philips Corporation.
■ Digital DBS Front-End Units (8 PSK Demodulator Circuit Built-in Type)
◆ Specifications & lt; 8 PSK demodulator circuit built-in type & gt;
Destination
Japan (ISDB-S)
Input type/Features
Model No.
1-input
BS2F7HZ6460
BS2F7VZ0460
Input frequency (MHz)
–65 to –25
The 1st intermediate frequency (MHz)
Zero-IF (Direct conversion)
Base band frequency bandwidth (MHz)
22 (BB LPF) variable type
RF input local leak (dB m)
10 to 30
–70 and below
Serial
transport output
Symbol rate (M baud)
BS2F7HZ6460
Parallel/serial
transport output
28.86
10 to 30
PLL (I2C-bus)*1
Channel selection system
Noise figure (dB)
7 (TYP.)
Tuning voltage (V DC)
Shared with a 3.3 V power source
Supply voltage (V DC)
3.3, 1.5
LNB power supply
3.3, 1.25
25 V DC, 400 mA (MAX.)
Input impedance ( Ω)
Outline dimensions (mm)
BS2F7VZ0165
950 to 2 150
Input signal level (dB m)
Output type
Europe (DVB-S2)
1-input,
1-loop through output
75
65.8 × 26.5 × 14.6
BS2F7VZ0165
55.1 × 37.9 × 13.2
*1 I2C-bus is a trademark of Philips Corporation.
124
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment
using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets
before using any SHARP device.
Device_E.book Page 125 Wednesday, July 18, 2007 1:03 PM
COMBINATION FRONT-END FOR DIGITAL TERRESTRIAL AND DIGITAL SATELLITE BROADCASTING
■ Combination Front-End for Digital Terrestrial, Analog Terrestrial and Digital Satellite
Broadcasting
◆ Features
(1) Enables simultaneous reception of digital terrestrial and digital satellite, or analog terrestrial and digital satellite, broadcasting.
(2) Contributes to making LCD TVs, etc. thinner.
◆ Standard Specifications
Destination
Japan
Model No.
VA1R5JF7002
RF circuit system
Digital terrestrial
Output type
Digital DBS
Direct conversion type
VHF, UHF, CATV
VHF Low: 93 to 167
VHF High: 173 to 399
UHF: 405 to 767
Input frequency (MHz)
Input signal level*1 (dBm)
Analog terrestrial
Single conversion type
1 049.48 to 2 053
–75 to –20
–
–65 to –25
Serial transport
CVBS/SIF
Serial transport
IF bandwidth (MHz)
IQ Base band frequency
bandwidth
Noise figure (dB)
PLL phase noise (dBc/Hz)
Image rejection (dB)
Channel selection system
Supply voltage (V DC)
Outline dimensions (mm)
6
–
–
10 MHz to 30 MHz,
2.0 MHz step (BB LPF)
6 (TYP.)
6 (TYP.)
–90 (TYP.)
at 10kHz offset
–80 (TYP.)
at 10kHz offset
65 (TYP.)
–
VA1R5JF7002
PLL (I2C-bus)*2
1.5, 2.5, 3.3, 5.0
85.5 × 45.2 × 12.7
RF Components
*1 It conforms to the ARIB standard.
*2 I2C-bus is a trademark of Philips Corporation.
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment
using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets
before using any SHARP device.
125
Device_E.book Page 126 Wednesday, July 18, 2007 1:03 PM
RF
DIGITAL TERRESTRIAL FRONT-END UNIT
■ Front-End Units for ISDB-T/DVB-T
◆ Features
(1)
(2)
(3)
(4)
Low phase noise characteristics, high elimination of adjacent channel interference.
Transport stream output front-end units with built-in OFDM demodulation IC. [VA1L5JF6013/VA1J5ED5055]
Compact, low power consumption.
Other types are available with various forms of chassis (vertical or horizontal type) and input connectors (F or DIN type), etc.
◆ Standard Specifications
Destination
Japan
Europe/Asia
ISDB-T/S front end
(built-in OFDM/8PSK demodulation)
Product name
Model No.
VA1J5JF7007
VHF, UHF, CATV
VHF Low: 93 to 167
VHF High: 173 to 399
UHF: 405 to 767
Input frequency (MHz)* 1
DVB-T front end (IF output)
VA1T1ED5065
IF bandwidth (MHz)
6
VHF: 146 to 430
UHF: 430 to 862
Direct IF
Transport stream
(Built-in OFDM
demodulation)
—
Mode
7, 8, selectable
Mode 1, 2, 3
2k, 8k, both compatible
–79 dBm (TYP.)
[in mode 3, 64 QAM,
CR = 7/8 (QEF)]
–85 dBm (TYP.)
6 (TYP.)
Input sensitivity
Noise figure (dB)
–81 dBm (TYP.)
[at 2 k, 64 QAM,
CR = 2/3 (QEF)]
—
6 (TYP.)
–80 dBc/Hz (TYP.)
–90 dBc/Hz (TYP.)
[at 10 kHz offset]
65 (TYP.)
Image rejection (dB)
8 (TYP.)
–90 dBc/Hz (TYP.)
[at 10 kHz offset]
Phase noise
—
21.5 dB (TYP.)
[at input level: –45 dBm,
in mode 3, 64 QAM,
CR = 7/8 (QEF)]
C/N
VA1K5ED5255
VHF: 143.5 to 430
UHF: 430 to 862
1 049.48 to 2 053
Transport stream
(Built-in OFDM/8PSK demodulation)
Output
VA1H1ED5265
DVB-T front end
(built-in OFDM
demodulation)
0.75
1.2, 2.5, 3.3, 5
Outline dimensions (mm)
—
PLL (I2C-bus)*2
2.0*3
Power consumption (W)
—
17.2 dB (TYP.)
[at input level: –50 dBm,
64 QAM,
CR = 2/3 (QEF)]
85 dB (TYP.)
[8PSK, PC = 2/3
BW = 28.9 MHz]
Channel selection/control system
Supply voltage (V DC)
55 (TYP.)
0.85
5 (DC-DC converter)
70.0 x 36.9 x 12.5
52.0 x 35.9 x 13.4
47.7 x 29.6 x 13.2
1.33
5, 3.3, 1.8
(DC-DC converter)
70.0 x 29.6 x 13.2
*1 Enables simultaneous reception of digital terrestrial and digital satellite broadcasting.
*2 I2C-bus is a trademark of Philips Corporation.
*3 During simultaneous OFDM/8PSK demodulation operation.
VA1J5JF7007
126
VA1S1ED5056
(VA1S8ED5056)
VA1K5ED5255
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment
using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets
before using any SHARP device.
Device_E.book Page 127 Wednesday, July 18, 2007 1:03 PM
TWO-IN-ONE RF UNIT
■ Two-In-One RF Units (RF Front-End Unit + PIF Unit)
◆ Features
(1) High performance RF front-end unit and PIF unit are integrated in one unit, resulting in a short developing time.
(2) A composite unit structure improves operability during mounting.
(3) Horizontal shaped models for LCD TVs/LCD monitors are available.
(Vertical shaped models are also available.)
◆ Specifications
North America & lt; Digital/Analog & gt;
VA1Y2UF2307/VA1Y2UF2312
VHF
UHF
Air
CATV
CATV
Air
A5 to W+12 to
1 to 13
14 to 69
W+11
W+84
BL: 2 to 6, A5 to B
BH: 7 to 13, C to W+11
BU: 14 to 69, W+12 to W+84
Receiving channels (ch)
Input frequency
Analog band split
Video
Analog intermediate
frequency (MHz)
Audio
Digital intermediate frequency (MHz)
Digital IF bandwidth (MHz)
Phase noise
Detection system
Terminals
Input impedance ( Ω)
RF with loop through
B voltage (V DC)
Noise figure (dB)
Type
RF
Channel selection system
front-end
Image rejection (dB)
IF rejection (dB)
Video output level (Vp-p)
Video output S/N (dB)
Noise limit sensitivity (dBµ)
at S/N = 30 dB
IF
Audio output level (mVrms)
Audio output S/N (dB)
Audio frequency
characteristics (at 70 kHz)
SIF output
Outline dimensions (mm)
Europe & lt; Digital/Analog & gt;
VA1Y2ED1401
China/Asia & lt; Analog & gt;
VT2W5CD551
VHF
UHF
Air
CATV
CATV
Air
1A, Z1 to Z34 to
1 to 12
13 to 57
Z33
Z38
BL: 1 to 5, 1A, Z1 to Z4
BH: 6 to 12, Z5 to Z33
BU: 13 to 57, Z34 to Z38
VHF-Low: 50.5 to 142.5 MHz
VHF-High: 149.5 to 426 MHz
UHF: 434 to 858 MHz
42
42
42
—
—
—
—
290
45
—
—
–0 (at 10 kHz)
65.0 × 40.4 × 15.0
Possible to SIF output
61.5 × 35.2 × 10.9
60.9 × 41.5 × 15.0
BL: 2 to 4, X to S6
BH: 5 to 12, S7 to S36
BU: 13 to 69, S37 to S41
B/G, I, D/K, L: 39.875
45.75
38.0
L': 33.125
D/K, L: 33.375
I: 33.875
41.25
D/K: 31.5, I: 32.0, B/G: 32.5, M/N: 33.5
B/G: 34.375
L': 39.625
44
36.0
—
6
7/8 (switchable)
—
-80dBc/Hz (Typ.) at 20kHz offset
-85dBc/Hz (Typ.) at 10kHz offset
—
Pseudo synchronization detection system, split-carr ier audio receiving system
Input: F-type junction, SO
Input: DIN type terminal
Input: DIN type terminal
75
—*2
—
—*2
MB: 5
MB: 5/BT: 31
MB: 5/BT: 31
6
6
7
7
Typ. 6
6
7
6
6
Digital analog receiver front end
PLL (I2C-bus)*1
VL: 65, VH: 65
60
Typ. 65
VL: 70, VH: 70
55
100
Typ. 100
VL: 50 to 70, VH: 90
90
VL: 75, VH: 85
1.0
1.0
1.0
48
50
44
RF Components
TV system
Model No.
*1 I2C-bus is a trademark of Philips Corporation.
*2 Compatible with RF loop through type.
VA1Y2UF2307
VA1Y2UF2312
VA1Y2ED1401
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment
using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets
before using any SHARP device.
127
Device_E.book Page 128 Wednesday, July 18, 2007 1:03 PM
RF
ANALOG TERRESTRIAL RF FRONT-END UNIT
■ RF Front-End Units
& lt; VT1Y Series & gt;
◆ Features
(1) Miniature size achieved using thin profile, low height design in industry standard RF front-end unit (terminal shape and terminal pin
arrays)
(2) Model lineup corresponding to domestic product standards of Europe, China, Japan and the United States.
DIN-type junction input type
With RF output terminal type
◆ Specifications (Major models of VT1Y series)
Destination
Europe
Type
Model No.
VT1Y5ED211
VHF
Receiving channel
(ch)
Band split
Intermediate
frequency
(MHz)
U.S.A.
China/Asia
With PLL, for frequency
CS, for frequency
synthesizer, F-type junction
synthesizer
input
IF output*1: No equilibrium
Air
CATV CATV
GB, hyper, for frequency
synthesizer
VT1Y5UF201
UHF
Air
VHF
Air
With PLL, for frequency With PLL, for frequency synsynthesizer
thesizer, with RF output
VT1Y5CD201
UHF
CATV CATV
Japan
Air
VHF
Air
VT1Y5JF201
UHF
CATV CATV
Air
VHF
Air
VT1Y5JB201
UHF
CATV CATV
VHF
Air
Air
UHF
CATV CATV
Air
W+12
X to S37 to 21 to
A-5 to
14 to
1A, Z1 Z34 to 13 to
C13 to C53 to 13 to
C13 to C53 to 13 to
2 to 12
2 to 13
to
1 to 12
1 to 12
1 to 12
S36 S41 C57
W+11
69
to Z33 Z38
57
C52 C63
62
C52 C63
62
W+84
BL: 2 to 6, A-5 to B
BL: 1 to 5, 1A, Z1 to Z4
BL: 1 to 3, C13 to C22
BL: 1 to 3, C13 to C22
BL: 2 to 4, X to S6
BH: 5 to 12, S7 to S36
BH: 6 to 12, Z5 to Z33
BH: 4 to 12, C23 to C52
BH: 4 to 12, C23 to C52
BH: 7 to 13, C to W+11
BU: 21 to C57, S37 to S41 BU: 14 to 69, W+12 to W+84 BU: 13 to 57, Z34 to Z38 BU: 13 to 62, C53 to C63 BU: 13 to 62, C53 to C63
Video
38.9
45.75
38.0
58.75
Audio
33.4
41.25
31.5
54.25
+B: 5/BT: 31
+B: 5/BT: 31.5
+B: 5/BT: 31
+B: 5/BT: 31.5
B voltage (V DC)
Input impedance ( Ω)
VSWR
75
2
2
2
1.5
1.5
1.5
2
2
2
1.5
1.5
1.5
–
–
–
Noise figure (dB)
5
7
6
5
5
6
5
7
6
4
5
4.5
8
9
8.5
Power gain (dB)
40
38
40
39
39
37
40
38
40
40
37
40
36
33
36
Image rejection (dB)
IF rejection (dB)
VL: 70
VH: 65
VL: 70
VH: 90
60
90
Outline dimensions
(mm)
VL: 70
VH: 60
VL: 80
VH: 90
60
85
VL: 70
VH: 65
VL: 70
VH: 90
60
90
VL: 85
VH: 85
VL: 85
VH: 85
80
100
VL: 85
VH: 85
VL: 85
VH: 85
80
100
53.0 × 33.6 × 14.3
(Note) The figures in the table are typical values.
*1 Available IF output equilibrium model
128
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment
using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets
before using any SHARP device.
Device_E.book Page 129 Wednesday, July 18, 2007 1:03 PM
MOBILE DIGITAL TERRESTRIAL MODULE
■ 1-Segment Digital Terrestrial Module
◆ Features
(1)
(2)
(3)
(4)
High sensitivity:
Compact and thin design:
Low power consumption:
Output interface:
-109 dBm [typ.] (GPSK, CR1/2 ch13)
9.0 x 9.0 x 1.5 mm
95 mW*1
TS serial output
VA35JZ9910
◆ Standard Specifications
Destination
Japan
Model No.
VA35JZ9910
Input frequency
470 to 770 MHz (UHF: 13 to 62)
Input signal level
-109 dBm [typ.] (GPSK, CR1/2)
2.9 V (RF)
1.5 V (OFDM Core)
1.8 V to 2.9 V (I/O)
Supply voltage
95 mW*1
Power consumption
Operating temperature
-20 to 85°C
I2C-bus*2
Control I/F
Power off function
OFF for RF/OFDM power supply, 2 µA (MAX.) for I/O power supply (ON state)
*1 Average value when current consumption is controlled by software
*2 I2C-bus is a trademark of Philips Corporation.
■ 1-segment/3-segment Digital Terrestrial Module
◆ Features
(1) High sensitivity:
-109 dBm [typ.] (QPSK, CR1/2 ch15)
-110 dBm [typ.] (QPSK, CR1/2 ch7)
(2) Compact and thin design: 9.0 x 9.0 x 1.5 mm
(3) Low power consumption: 125 mW (at 3-segment), 120 mW (at 1-segment)
(4) Output interface:
TS serial output
RF Components
VA35JZ9910
◆ Standard Specifications
Destination
Japan
Model No.
VA35JZ9904
Input frequency
Input signal level
Supply voltage
Power consumption
Operating temperature
Control I/F
Power off function
188 to 198 MHz (UHF: 7, 8)
470 to 770 MHz (UHF: 13 to 62)
-109 dBm [typ.] (GPSK, CR1/2, ch7)
-110 dBm [typ.] (GPSK, CR1/2, ch15)
1.8 V (RF)
1.2 V (OFDM Core)
1.8 V to 2.8 V (I/O)
125 mW (at 3-segment), 120 mW (at 1-segment)
-20 to 85°C
I2C-bus*1
All power supplies can be OFF.
*1 I2C-bus is a trademark of Philips Corporation.
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment
using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets
before using any SHARP device.
129
Device_E.book Page 130 Wednesday, July 18, 2007 1:03 PM
RF
EMBEDDED WIRELESS LAN MODULE
■ USB Interface Wireless LAN Module
◆ Features
(1) Interface: USB2.0
(2) Supports security functions.
[Encryption method: WEP (64 bit/128 bit), TKIP, AES
Authentic method: IEEE802.1x (TLS/PEAP/LEAP), WPA (TLS/PEAP)]
DC2J1AZxxx
◆ Specifications
Standard
IEEE802.11b (option: IEEE802.11g)
Model No.
DC2J1AZxxx (Japan)*1
Output connector
Power amp.
Current
FTP throughput (Mbps)
Clock (MHz)
Voltage (V DC)
Outline dimensions (mm)
B to B, 10 pin & Antenna connector
Included
Uplink (FTP): 440 mW (typ.)*2
Downlink (FTP): 410 mW (typ.)*2
4.5 (typ.) [Using FTP ‘get’ command]*2
40 (included)
3.3±5%
20 × 30 × 3.8
Driver software consults separately.
*1 Different models are available in accordance with the laws of the country where the product is to be sold or used.
*2 Measurement of FTP of specifications description.
130
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment
using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets
before using any SHARP device.
Device_E.book Page 131 Wednesday, July 18, 2007 1:03 PM
IR
INFRARED DATA COMMUNICATION DEVICE INDEX TREE
■ Infrared Data Communication Device Lineup
Communication
system
Transmission
speed
Transmission
distance
Operating
supply voltage
Features
Model No.
FIR 4 Mb/s
100 cm
2.4 to 3.6 V
GP2W1004YP0F
Compact
IrDA data
Compact, thin (height: 2.5 mm),
low voltage operation type,
LP/HP mode switching function
2.7 to 5.5 V
GP2W1001YP0F
(IrDA 1.x)
70 cm
LP/HP mode switching function
GP2W1010YP0F
50/20 cm
LP/HP mode switching and remote control
transmission functions
GP2W3120YP0F
50/20 cm
LP/HP mode switching function
2.7 to 3.6 V
GP2W1320YP0F
FIR LP 4 Mb/s
70/20 cm
LP/MP/HP mode switching and remote control transmission functions
2.6 to 3.3 V
GP2W3104YP0F
MIR 1.152 Mb/s
100 cm
Compact, low dissipation current
2.4 to 3.6 V
GP2W1002YP0F
70 cm
2.4 to 3.6 V
GP2W1302YP0F
50 cm
2.4 to 3.6 V
GP2W1304YP
SIR LP 115.2 kb/s
100 cm
Compact, low dissipation current
2.4 to 5.5 V
GP2W0004YP0F/
GP2W0004XP0F
80 cm
SIR 115.2 kb/s
Remote control transmission function,
compact, low dissipation current
2.4 to 5.5 V
GP2W3020YP
20 cm
Built-in LED constant current circuit,
3-state output
2.0 to 3.6 V
GP2W0110VX/
GP2W0110VY
Compact
2.0 to 3.6 V
GP2W0116YP0F
(Height: 1.5 mm) 2.4 to 3.6 V
GP2W0150YP0F
2.0 to 3.6 V
GP2W0114YP0F
Built-in LED constant current circuit,
3-state output, top view type
Compact
2.0 to 3.6 V
GP2W0118YP0F
(Height: 2.1 mm) 2.4 to 3.6 V
GP2W0150XP0F
Built-in LED constant current circuit,
3-state output, low voltage operation type,
low dissipation current type
1.8 to 2.5 V
GP2W0112YP0F
Remote control transmission function (built-in drive circuit)
λp: 870, 940 nm
2.4 to 3.6 V
GP2W3240YP
λp: 890 nm
2.4 to 3.6 V
GP2W3250YP
(Height: 1.5 mm) 2.4 to 3.6 V
GP2W3270YP0F
Top view type
IR Device
FIR LP 4 Mb/s
GP2W3270XP0F
2.4 to 3.6 V
■ Infrared Wireless Audio Transmission Device Lineup
Communication system
Infrared system
(1-bit audio transmission)
Features
For designing compact,
low-power-consumption audio transmission systems
Operating
supply voltage
2.4 to 3.6 V
Model No.
GP2WVR01YP0F/
GP2WVC01MP0F
(Transmission LSI)
131
Device_E.book Page 132 Wednesday, July 18, 2007 1:03 PM
IR
INFRARED DATA COMMUNICATION DEVICES
✩New product
★Under development
■ Infrared Data Communication Devices
◆ IrDA FIR Compliant Devices
Model No.
Communication system
✩GP2W3120YP0F
Bi-directional (half-duplex)
communication
Bi-directional (half-duplex)
communication
Bi-directional (half-duplex)
communication
Bi-directional (half-duplex)
communication
✩GP2W1010YP0F
★GP2W1004YP0F
GP2W1001YP0F
Transmission
rate
9.6 k to 4
Mb/s
9.6 k to 4
Mb/s
9.6 k to 4
Mb/s
9.6 k to 4
Mb/s
✩GP2W1320YP0F
Bi-directional (half-duplex)
communication
9.6 k to 4
Mb/s
✩GP2W3104YP0F
Bi-directional (half-duplex)
communication
9.6 k to 4
Mb/s
Transmission Supply voltage
Outline
distance (cm)
(V DC)
dimensions (mm)
Description
With remote control transmission function,
LP/HP mode switching function
50/20*1
2.4 to 3.6
7.16 × 2.73 × 1.82
LP/HP mode switching function
70
2.4 to 3.6
7.9 × 2.85 × 2.15
LP/HP mode switching function
100
2.4 to 3.6
7.9 × 2.85 × 2.5
100
2.7 to 5.5
10.01 × 4.4 × 3.5
50/20*1
2.7 to 3.6
7.16 × 2.73 × 1.82
70/20*2
2.6 to 3.3
7.9 × 2.85 × 2.5
Compact, thin,
low dissipation current during shutdown
(Icc: TYP. 0.45 mA)
Compact, thin,
with remote control transmission function,
LP/MP/HP mode switching function
*1 MIN. 20 cm at 150 mA MIN. 50 cm at 250 mA
*2 MIN. 21 cm at 150 mA MIN. 70 cm at 450 mA
GP2W3120YP0F
GP2W1010YP0F
GP2W1004YP0F
(GP2W3104YP0F)
GP2W1001YP0F
GP2W1320YP0F
◆ IrDA MIR Compliant Devices
Model No.
GP2W1002YP0F
GP2W1302YP0F
GP2W1304YP
Transmission
rate
Bi-directional (half-duplex) 9.6 k to 1.152
communication
Mb/s
Bi-directional (half-duplex) 9.6 k to 1.152
communication
Mb/s
Bi-directional (half-duplex) 9.6 k to 1.152
communication
Mb/s
Communication system
GP2W1304YP
Transmission Supply voltage
Outline
distance (cm)
(V DC)
dimensions (mm)
Description
100
Compact, compatible with 2.15 mm height for
mobile phone
Compact, compatible with 1.82 mm height for
mobile phone
GP2W1302YP0F
2.4 to 3.6
8.0 × 3.0 × 2.5
70
2.4 to 3.6
7.9 × 2.85 × 2.15
50
2.4 to 3.6
7.16 × 2.73 × 1.82
GP2W1002YP0F
◆ IrDA SIR Compliant Front-Ends
Model No.
GP2W0004YP0F
GP2W0004XP0F
GP2W3020YP
Transmission
rate
Bi-directional (half-duplex) 9.6 k to 115.2
communication
kb/s
Bi-directional (half-duplex) 9.6 k to 115.2
communication
kb/s
Communication system
Low dissipation current
(Icc: 130 µA MAX.)
Low dissipation current
(Icc: 130 µA MAX.)
With remote control transmission function
Bi-directional (half-duplex) 9.6 k to 115.2 (Transmission distance TYP. 7 m, IF = 350 mA)
communication
kb/s
Low dissipation current during shutdown
(Icc: 130 µA MAX.)
GP2W0004YP0F
132
Description
GP2W0004XP0F
Transmission Supply voltage
Outline
distance (cm)
(V DC)
dimensions (mm)
100
2.4 to 5.5
9.21 × 3.76 × 2.71
100
2.4 to 5.5
9.2 × 3.35 × 2.95
80
2.4 to 5.5
7.9 × 2.85 × 2.15
GP2W3020YP
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Device_E.book Page 133 Wednesday, July 18, 2007 1:03 PM
INFRARED DATA COMMUNICATION DEVICE
◆ IrDA SIR LP Compliant Front-Ends
Model No.
Communication system
Transmission
rate
Description
Top-view and side view compatible (Model
Bi-directional (half-duplex) 2.4 k to 115.2
name is prescribed based on the packaging
communication
kb/s
status.), lead-free type available
Low voltage operation, low dissipation current,
Bi-directional (half-duplex) 2.4 k to 115.2
GP2W0112YP0F ▲
3-state output type, independent power supply
communication
kb/s
for light-emitting and light-detecting circuits
Bi-directional (half-duplex) 2.4 k to 115.2 Compact, thin, low dissipation current
GP2W0150YP0F
communication
kb/s
(Icc: 100 µA MAX.)
Compact, thin, low dissipation current
Bi-directional (half-duplex) 2.4 k to 115.2
GP2W0150XP0F
(Icc: 100 µA MAX.)
communication
kb/s
Top view type
Bi-directional (half-duplex) 2.4 k to 115.2 Compact, thin, low dissipation current
GP2W0116YP0F ▲
communication
kb/s
(Icc: 120 µA MAX.)
Compact, thin, low dissipation current
Bi-directional (half-duplex) 2.4 k to 115.2
GP2W0118YP0F ▲
(Icc: 120 µA MAX.)
communication
kb/s
Top view type
With remote control transmit function
Bi-directional (half-duplex) 2.4 k to 115.2
GP2W3240YP▲
(with remote control drive circuit) (λp = 940 nm)
communication
kb/s
IR communication part (λp = 870 nm)
Bi-directional (half-duplex) 2.4 k to 115.2 Remote control transmission function, shared
GP2W3250YP
communication
kb/s
IR communication section ( λp = 890 nm)
Bi-directional (half-duplex) 2.4 k to 115.2 Remote control transmission function, shared
GP2W3270YP0F
communication
kb/s
IR communication section ( λp = 890 nm)
Remote control transmission function, shared
Bi-directional (half-duplex) 2.4 k to 115.2
GP2W3270XP0F
IR communication section ( λp = 890 nm)
communication
kb/s
Top view type
GP2W0110VX/VY
Transmission Supply voltage
Outline
distance (cm)
(V DC)
dimensions (mm)
20
2.0 to 3.6
6.8 × 2.35 × 2.1
20
1.7 to 2.5
7.9 × 2.85 × 2.15
20
2.4 to 3.6
7.6 × 2.4 × 1.5
20
2.4 to 3.6
8.3 × 2.1 × 1.7
20
2.0 to 3.6
7.2 × 2.75 × 1.85
20
2.0 to 3.6
7.9 × 2.25 × 2.0
20
2.4 to 3.6
8.6 × 2.85 × 1.85
20
2.4 to 3.6
7.2 × 2.55 × 1.85
20
2.4 to 3.6
7.6 × 2.4 × 1.5
20
2.4 to 3.6
8.3 × 2.1 × 1.7
The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use.
GP2W0110VX
(GP2W0110VY)
GP2W0112YP0F
GP2W0150YP0F
(GP2W3270YP0F)
GP2W0150XP0F
(GP2W3270XP0F)
GP2W0116YP0F
GP2W0118YP0F
GP2W3240YP
GP2W3250YP
■ Infrared Wireless Audio Transmission Device
Communication system
Features
S/N ratio
GP2WVR01YP0F
(Reception Device)
1-bit audio transmission
(1.5 MHz)
Compact, low power consumption type
Simple circuit configuration:
Used in combination with transmission LSI (GP2WVC01MP0F)
and transmission device (GP2W1004YP0F, etc.)
70 dB
Supply voltage
Outline
(V DC)
dimensions (mm)
2.4 to 3.6
IR Device
Model No.
2.5 × 8 × 3
GP2WVR01YP0F
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
133
Device_E.book Page 134 Wednesday, July 18, 2007 1:03 PM
IR
IR DETECTING UNIT FOR REMOTE CONTROL INDEX TREE
■ IR Detecting Unit for Remote Control Lineup
Package
Type
Form
Lead L
IR detecting unit bend with
for remote control holder
Model No.
Detection
position*5
(from PCB)
16.0 mm*1
Features
Compact size
Compact size,
Strengthened resistance to
electromagnetic induction noise
(Mesh type)
Operating voltage:
3V
Operating voltage:
5V
GP1UE28XK0VF series
GP1UM28XK0VF series
GP1UE28RK0VF series
GP1UM28RK0VF series
GP1UE27XK0VF series
GP1UM27XK0VF series
GP1UE27RK0VF series
GP1UM27RK0VF series
GP1UE26XK0VF series
GP1UM26XK0VF series
GP1UE26RK0VF series
GP1UM26RK0VF series
Low dissipation current
12.0 mm*2
Compact size
Compact size,
Strengthened resistance to
electromagnetic induction noise
(Mesh type)
GP1UD28XK00F series
Low dissipation current
6.8 mm*3
Compact size
Compact size,
Strengthened resistance to
electromagnetic induction noise
(Mesh type)
GP1UD27XK00F series
Low dissipation current
Lead
straight with
holder
19.0 mm
9.6 mm
Operating voltage:
3 to 5 V
GP1UD26XK00F series
Compact size,
Strengthened resistance to
electromagnetic induction noise
(Mesh type)
GP1UE29QK0VF series
GP1UM29QK0VF series
Compact size
GP1UE28YK0VF series
GP1UM28YK0VF series
GP1UE28QK0VF series
GP1UM28QK0VF series
Compact size,
Strengthened resistance to
electromagnetic induction noise
(Mesh type)
Low dissipation current
GP1UD28YK00F series
Compact, thin type
SMD
(4.1 × 3.84 × 0.95 t mm)
GP1US30XP series
Compact type
SMD
(6.8 × 2.1 × 2.35 t mm)
GP1UF31 series
*1
*2
*3
*4
*5
134
GP1UX31QS series
GP1UX51QS series
Lead L bend*4
5.3 mm
Holderless
Lead straight
6.0 mm
GP1UX31RK series
GP1UX51RK series
Mesh type (strengthened resistance to electromagnetic induction noise): 16.4 mm
Mesh type: 12.4 mm
Mesh type: 7.2 mm
Mesh type: 5.3 mm
Lead straight: Distance from lens center to mounting board upper surface
No mesh lead L bend: Distance from tip of lens to mounting board upper surface
Mesh-type lead L bend: Distance from tip of mesh to mounting board upper surface
Device_E.book Page 135 Wednesday, July 18, 2007 1:03 PM
IR DETECTING UNIT FOR REMOTE CONTROL
✩New product
■ IR Detecting Units for Remote Control
Absolute maximum ratings
(Ta = 25°C)
Electrical characteristics
VOH
VOL
Icc
(V)
(V)
(mA) *1
MAX.
MIN.
MAX.
0.6 (0.65)*18 Vcc–0.5*10 0.45*10
0.6 (0.65)*18 Vcc–0.5*10 0.45*10
0.6 (0.65)*18 Vcc–0.5*10 0.45*10
0.6 (0.65)*18 Vcc–0.5*10 0.45*10
0.6 (0.65)*18 Vcc–0.5*11 0.45*11
0.6 (0.65)*18 Vcc–0.5*11 0.45*11
0.6 (0.65)*18 Vcc–0.5*11 0.45*11
0.6 (0.65)*18 Vcc–0.5*11 0.45*11
0.6 (0.65)*18 Vcc–0.5*11 0.45*11
0.4
Vcc–0.5*9
0.45*9
0.4
Vcc–0.5*9
0.45*9
0.4
Vcc–0.5*9
0.45*9
0.4
Vcc–0.5*9
0.45*9
0.4
Vcc–0.5*14 0.45*14
0.4
Vcc–0.5*14 0.45*14
0.4
Vcc–0.5*14 0.45*14
0.4
Vcc–0.5*14 0.45*14
0.4
Vcc–0.5*14 0.45*14
0.2 (Vcc = 3 V) Vcc–0.5*9
0.5*9
0.2 (Vcc = 3 V) Vcc–0.5*9
0.5*9
0.2 (Vcc = 3 V) Vcc–0.5*9
0.5*9
0.2 (Vcc = 3 V) Vcc–0.5*9
0.5*9
fo
(kHz)
TYP.
40*3
40*3
40*3
40*3
40*3
40*3
40*3
40*3
40*3
40*16
40*16
40*16
40*16
40*16
40*16
40*16
40*16
40*16
40*3
40*3
40*3
40*3
Size (mm)
Remarks
5.6 × 9.6 × 6.8
5.6 × 9.6 × 12.0
5.6 × 9.6 × 16.0
5.6 × 8.6 × 12.5(9.6)*2
5.6 × 9.6 × 7.2
5.6 × 9.6 × 12.4
5.6 × 9.6 × 16.4
5.6 × 9.0 × 12.5(9.6)*2
5.6 × 16.2 × 21.9(19)*2
5.6 × 9.6 × 6.8
5.6 × 9.6 × 12.0
5.6 × 9.6 × 16.0
5.6 × 8.6 × 12.5(9.6)*2
5.6 × 9.6 × 7.2
5.6 × 9.6 × 12.4
5.6 × 9.6 × 16.4
5.6 × 9.0 × 12.5(9.6)*2
5.6 × 16.2 × 21.9(19)*2
7.3 × 13.1 × 6.8
7.3 × 13.1 × 12.0
7.3 × 13.1 × 16.0
7.3 × 8.4 × 13.0(9.6)*2
0.45*11
40*3
5.6 × 6.2 × 7.6(6.0)*2
Vcc–0.5
0.45
40*3
5.6 × 6.2 × 7.6(6.0)*2
0.6
Vcc–0.5*11
0.45*11
40*16
5.5 × 5.3 × 7.5
–10 to +70
1.5
Vcc–0.5
0.45
40*3
5.5 × 5.3 × 7.5
0 to 6.0
–10 to +70
0.4
Vcc–0.5*14
0.45*14
40
5.5 × 5.3 × 7.5
GP1UX31RK*8
0 to 6.0
–10 to +70
0.4
Vcc–0.5*14
0.45*14
40
5.5 × 5.3 × 7.5
GP1US30XP*6, 17
✩GP1UF31xXP0F
✩GP1UF31xYP0F
–
0 to 6.0
0 to 6.0
–30 to +85
–30 to +85
–30 to +85
0.6
0.4
0.4
Vcc–0.5*11
Vcc–0.5
Vcc–0.5
0.45*19
0.45
0.45
40
40*20
40*20
4.1 × 3.95 × 0.95
6.8 × 2.1 × 2.0
6.8 × 2.1 × 2.0
*5
*5
*5
*5
*5
*5
*5
*5
*5
*5
*5
*5
*5
*5
*5
*5
*5
*5
*5
*5
*5
*5
*5, Pin configuration
(Pin No. 2: GND)
*5, Pin configuration
(Pin No. 2: GND)
*5, Pin configuration
(Pin No. 2: GND)
*5, Pin configuration
(Pin No. 2: GND), Folded lead
*5, Pin configuration
(Pin No. 2: GND)
*5, Pin configuration
(Pin No. 2: GND), Folded lead
*5, Surface mount compatible
*5, Surface mount compatible
*5, Surface mount compatible
Vcc (V)
Topr (°C)
0 to 6.0
0 to 6.0
0 to 6.0
0 to 6.0
0 to 6.0
0 to 6.0
0 to 6.0
0 to 6.0
0 to 6.0
0 to 6.0
0 to 6.0
0 to 6.0
0 to 6.0
0 to 6.0
0 to 6.0
0 to 6.0
0 to 6.0
0 to 6.0
0 to 6.0
0 to 6.0
0 to 6.0
0 to 6.0
–10 to +70
–10 to +70
–10 to +70
–10 to +70
–10 to +70
–10 to +70
–10 to +70
–10 to +70
–10 to +70
–10 to +70
–10 to +70
–10 to +70
–10 to +70
–10 to +70
–10 to +70
–10 to +70
–10 to +70
–10 to +70
–10 to +70
–10 to +70
–10 to +70
–10 to +70
GP1UV70QS00F* 13
–
–10 to +70
1.5
Vcc–0.5*11
GP1UW70QS00F* 7
–
–10 to +70
0.6
GP1UX51QS*13
0 to 6.0
–10 to +70
GP1UX51RK*13
0 to 6.0
GP1UX31QS*7, *8
GP1UM26XK0VF* 12
GP1UM27XK0VF* 12
GP1UM28XK0VF* 12
GP1UM28YK0VF* 12
GP1UM26RK0VF* 4, 12
GP1UM27RK0VF* 4, 12
GP1UM28RK0VF* 4, 12
GP1UM28QK0VF* 4, 12
GP1UM29QK0VF* 4, 12
GP1UE26XK0VF* 8
GP1UE27XK0VF* 8
GP1UE28XK0VF* 8
GP1UE28YK0VF* 8
GP1UE26RK0VF* 8
GP1UE27RK0VF* 8
GP1UE28RK0VF* 8
GP1UE28QK0VF* 8
GP1UE29QK0VF* 8
GP1UD26XK00F* 8
GP1UD27XK00F* 8
GP1UD28XK00F* 8
GP1UD28YK00F* 8
*1
*2
*3
*4
*5
*6
*7
*8
*9
*10
*11
*12
*13
*14
*15
*16
*17
*18
*19
*20
When no signal is input (during input light).
Figures in parentheses indicate the distance to the light detection center.
In addition to the fo = 40kHz type, types fo = 36, 38, 36.7, 56.8, 32.75 kHz are also available.
Type with strengthened resistance to electromagnetic induction noise.
A voltage regulator circuit is built-in but may be affected by the usage environment. Install with an externally mounted
C and R as a power supply filter.
Allows reflow soldering.
Operating voltage: 2.4 to 3.6 V (2.7 to 3.6 V for fo = 56.8 kHz type)
Operating voltage: 2.7 to 5.5 V
Distance to transmitter on optical axis is 0.2 to 10.0 m. Ev & lt; 10 lx when burst wave is input as shown in the right figure.
Distance to transmitter on optical axis is 0.2 to 10.0 m. Ev & lt; 10 lx when burst wave is input as shown in the right figure.
(fo = 56.8 kHz: 0.2 to 9.0 m)
Distance to transmitter on optical axis is 0.2 to 8.5 m. Ev & lt; 10 lx when burst wave is input as shown in the right figure.
(fo = 56.8 kHz: 0.2 to 7.0 m, fo = 32.75 kHz: 0.2 to 6.5 m)
GP1UM series operating voltage: 4.5 to 5.5 V
Operating voltage: 4.5 to 5.5 V
Distance to transmitter on optical axis is 0.2 to 8.0 m. Ev & lt; 10 lx when burst wave is input as shown in the right figure.
Distance to transmitter on optical axis is 0.2 to 6.5 m. Ev & lt; 10 lx when burst wave is input as shown in the right figure.
Types fo = 32.75, 36, 36.7, and 38 kHz are also available.
Operating voltage: 2.4 to 5.5 V
fo = 56.8 kHz
Distance to transmitter on optical axis is 0.2 to 5.0 m. Ev & lt; 10 lx when burst wave is input as shown in the right figure.
In addition to the fo = 40 kHz type, types fo = 36, 36.7, and 38 kHz are also available.
& lt; Burst wave & gt;
600 µs
1 000 µs
IR Device
Series No.
Duty = 50%
GP1UD series, GP1UM series,
GP1UE series have different fo
values for each model.
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
135
Device_E.book Page 136 Wednesday, July 18, 2007 1:03 PM
IR
IR DETECTING UNIT FOR REMOTE CONTROL
GP1UD28XK00F
GP1UM28XK0VF
(GP1UE28XK0VF)
GP1UM28RK0VF
(GP1UE28RK0VF)
GP1UM29QK0VF
(GP1UE29QK0VF)
GP1UD27XK00F
GP1UM27XK0VF
(GP1UE27XK0VF)
GP1UM27RK0VF
(GP1UE27RK0VF)
GP1UV70QS00F
(GP1UW70QS00F)
GP1UD26XK00F
GP1UM26XK0VF
(GP1UE26XK0VF)
GP1UM26RK0VF
(GP1UE26RK0VF)
GP1UX51QS
(GP1UX31QS)
GP1UD28YK00F
136
GP1UM28YK0VF
(GP1UE28YK0VF)
GP1UM28QK0VF
(GP1UE28QK0VF)
GP1US30XP
GP1UF31xYP0F
(GP1UF31xXP0F)
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Device_E.book Page 137 Wednesday, July 18, 2007 1:03 PM
POWER
SWITCHING POWER SUPPLY
■ Switching Power Supplies (Custom)
◆ Features
(1)
(2)
(3)
(4)
Satisfies energy saving regulations thanks to the high conversion efficiency
Compact and high reliability thanks to the modulated main switching and chopper circuits
EMI filter built-in, low noise design
Environmentally safe types are also available. [RoHS, lead-free]
◆ Specification examples
Input voltage (V AC)
Input frequency (Hz)
LCD TV
(20 to 22′′)
90 to 110
50/60
Output voltage (V)
(Current capacity)
+24 (1.9 A)
+12 (3.5 A)
Applications
Rated output power (W)
Stand-by power loss (W)
Protection circuit
Configuration
Outline dimensions (mm)
87.6
0.3
(without load)
LCD TV
(26 to 32′′)
90 to 264
50/60
+24 (5.0 A)
+12 (4.0 A)
+5 (5.5 A)
+5 (1.5 A)
+3.3 (3.0 A)
213
Laser-beam printer/
Scanner/FAX
85 to 138
50/60
0.1
–
+3.3 (0.25 A)
+5 (1.1 A)
+12 (0.13 A)
+24 (2.0 A)
55.9
Overcurrent and overvoltage protection
On-board
140 × 244 × 35.6
204 × 124 × 40
118 × 208 × 36
* Types with input voltage of AC 100 V, 120 V, 200 V are also available. Types with other specification are also available upon request.
For LCD TVs (20′′ to 22′′), an integrated power source with an inverter circuit for backlights is also available.
■ Switching Power Supply with Integrated High/Low Voltage Circuit (Custom)
◆ Features
(1) Realizes compact and low cost thanks to the integrated high/low voltage circuit
(2) Easy connection between high voltage and low voltage circuits
(3) Highly efficiency energy saving power supply at standby mode can be installed
for low voltage circuit
(4) Environmentally safe types are also available. [RoHS, lead-free]
◆ Specifications
Low
voltage
Switching power supply system
Input voltage (V DC)
Output voltage (kV DC)
Switching power supply system
Input voltage (V AC)
Power capacity (W)
Power Supply Device
High
voltage
Sharp ‘Green Power Supply’ adapting with
integrated high/low voltage circuit regulation
Pulse width control or RCC method
24
+5.5 (+280 µA)/-5.5 (-560 µA), etc.
Pulse width control or RCC method
100, 120, 230
184
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment
using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets
before using any SHARP device.
137
Device_E.book Page 138 Wednesday, July 18, 2007 1:03 PM
PCB
PRINTED CIRCUIT BOARDS
■ Advanced Flex Printed Circuit Boards
he advanced flex printed circuit board is a multilayered composite wiring board comprised of flexible printed circuits (FPC)
laminated into a multilayer configuration. The PWBs and FPCs are connected to each other via copper-plated through holes. It is
ideal for compact, light-weight equipment design.
T
◆ Features
(1) For selecting optimal specifications to suit specific applications, special specifications such as for mobile phones are available.
• Minimum thickness in multi-layer part: 0.26 mm (4-layer), 0.33 mm (6-layer)
• Minimum pattern width/pitch: 0.06/0.07 mm
• Flexibility of single/double sided FPC part (dedicated for hinge): More than 200 000 times 180-degree bending of radius 3 mm
(2) Capable of board-to-board connection without connectors, which enables space-saving and 3-dimensional equipment assembly.
(3) Through hole plating connection of multi-layer (3 to 8) part to flexible part significantly improves reliability.
(4) Blind Via Hole (BVH) forming with laser via drilling of small diameter.
(5) Sheet design provides excellent mountablity, equivalent to that of PWB.
◆ Outline Specifications
Type
Min. base thickness
Min. line width/spacing
Min. through hole
diameter
Through hole
Min. via
hole land Blind via hole
diameter Inner via hole
Solder resist
Surface finish
Safety standard
(UL approval)
138
Construction of Advanced Flex Board (6-layer sample)
Folding type/Flying tail type
0.26 mm (4-layer), 0.33 mm (6-layer),
0.40 mm (8-layer)
0.06/0.07 mm
Laser via hole (BVH)
FPC
PP
ø0.25 mm
Outer layer: ø0.5 mm, Inner layer: ø0.5 mm
ø0.09 mm
ø0.30 mm
Multi layer: Liquid photo solder resist,
FPC: Film cover ray
Heat-resistant preflux, Ni-Au plating
(Ni-Au plating for flying tail)
94V-0
FPC
PP
FPC
Through hole
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment
using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets
before using any SHARP device.
Device_E.book Page 139 Wednesday, July 18, 2007 1:03 PM
PRINTED CIRCUIT BOARDS
■ Flexible Build-Up Multilayer PCBs
& lt; Flex-rigid specifications & gt;
dvanced flex specifications are used for the inner layer core material of this build-up multilayer PCB, so the board can handle finer
mounting patterns and achieve connectorless between-board connections using an inner layer flexible printed circuit (FPC). This
facilitates greater equipment design flexibility and ultra-compact designs.
A
◆ Features
(1) Multiple build-up layers are connected internally with an FPC, thereby improving
connection reliability between multilayer boards and reducing both connection
space and connector weight.
(2) Enables narrow pitch (0.5 mm) CSP and bare chip mounting, and thus greater
equipment compactness through ultra-high density mounting.
(3) Enables via-on-inner-via-hole configurations, and makes it possible to achieve
ultra-high density wiring designs.
(Facilitates a diverse range of designs for greater compactness and thinness.)
◆ Outline Specifications
Type
No. of build-up layers
Core layer configuration
Min. board thickness*1
Conformal via hole
Via hole diameter
Land hole diameter Stacked via hole
Via-on inner via hole
Inner via hole diameter
Min. line width/spacing* 2
CSP mountable pitch
Safety standard
F1 (6- to 8-layer)
1 for each side of core layer
3 to 6 layers (Polyimide, FR-4)
0.8 mm (6-layer), 0.87 mm (8-layer)
ø0.09 mm/ø0.30 mm
–
Available
ø0.2 mm
0.09 mm/0.09 mm
0.5 mm
UL (94V-0)
Via directly above IVH
Laser via hole
RCC
PP
FPC
PP
RCC
*1 Consult with SHARP if a thinner type is required for special designs.
*2 Values are measured at build-up portion.
Inner via hole (IVH)
Printed Circuit Board
Through hole
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment
using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets
before using any SHARP device.
139
Device_E.book Page 140 Wednesday, July 18, 2007 1:03 PM
PCB
PRINTED CIRCUIT BOARDS
■ Flexible Printed Circuit Boards
he flexible printed circuit board is designed for high space efficiency and product design flexibility, which are now aiming at more
compact and higher density mounting. It also contributes to the reduction of assembly process and to the enhancement of the
reliability.
T
◆ Features
(1) High density mounting circuit, SMT and other most suitable flexible PCB are
available.
(2) High precision type for COF with flip chip mounting and wire bonding
capabilities and other connector mounting type are available.
◆ Standard specifications
Number of layers
Substrate materials
Design pattern width
Design pattern spacing
Through-hole / land diameter
Cover lay
Safety standard
One side
Both-side through-hole
Polyimido film, non-adhesive polyimido
0.02 mm (MIN.)
0.05 mm (MIN.)
0.04 mm (MIN.)
0.05 mm (MIN.)
–
ø0.1 mm / ø0.3 mm (MIN.)
Polyimido film, heat resistant ink, liquid soldering resist
UL (94V-0)
◆ Line-up
Other line-up
Multi-layer flexible PCB
Single-layer flexible PCB
Flex-rigid PCB
Highly flexible (bending capacity)
Single-side high precision flexible PCB
140
Both-side flexible PCB
Bonding Ni-Au plating
Both-side high precision flexible PCB
High density SMT
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment
using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets
before using any SHARP device.
Device_E.book Page 141 Wednesday, July 18, 2007 1:03 PM
UNIT
PICKUP
■ Slim Combo Drive Pickup
& lt; DD-56 & gt;
◆ Features
● Thin type pickup compatible with half-inch-height drive
(12.7 mm thickness)
● Playback speed: ×8 (DVD-ROM), ×24 (CD-ROM)
● Recording speed: ×24 (CD-R), ×24 (CD-RW)
● DVD-RAM readable
● Outline dimensions: W 38.6 × H 7.3 × D 48.7 (mm)
● Weight: Approx. 15 g
■ Slim DVD-ROM Drive Pickup
& lt; DD-30 & gt;
◆ Features
● Thin type pickup compatible with half-inch-height drive
(12.7 mm thickness)
● Playable disk: DVD-ROM/RAM, CD-ROM
● Playback speed: ×8 (DVD-ROM), ×24 (CD-ROM)
● Outline dimensions: W 38.7 × H 7.3 × D 48.7 (mm)
● Weight: Approx. 8 g
■ DVD Pickup for Automotive Use
& lt; HPD-66 & gt;
◆ Features
Compact, thin (7.3 mm) pickup
Playable disk: DVD-ROM, CD-ROM
Operating temperature: –30 to +85°C
Outline dimensions: W 30.2 × H 7.3 × D 48.7 (mm)
Unit
●
●
●
●
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment
using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets
before using any SHARP device.
141
E_index.fm Page 142 Friday, July 20, 2007 3:20 PM
INDEX
INDEX
GL3HY43.........................................113
BS
GH1
GL3HY44.........................................113
GL5
BS1C1UR100A............................... 121
GH16P24A8C ................................. 120
GL3HY62.........................................113
GL513F........................................... 101
BS1F6JP100A ................................ 122
GH16P30A8C ................................. 120
GL3HY63.........................................113
GL514............................................. 101
BS1F6JP300A ................................ 122
GH16P35A8C ................................. 120
GL3HY8...........................................113
GL537............................................. 101
BS1F6JU300A................................ 122
GH17805B2AS ............................... 120
GL3JE402B0SE ..............................111
GL538............................................. 101
BS1R8AR100A............................... 122
GH17P24C8C ................................. 120
GL3JG402B0SE..............................111
GL560............................................. 101
BS1R8EL100A ............................... 121
GH17P28A8C ................................. 120
GL3JJ404B0SE...............................111
GL561............................................. 101
GL3JJ804B0SE...............................111
GL5CU44........................................ 115
BS1R8EL400A ............................... 121
GL0
GL3JR402B0S3 ..............................111
GL5ED44........................................ 115
BS1R8EL500A ............................... 121
GL0ZJ042B0S ................................ 111
GL3JS404B0SE ..............................111
GL5ED5.......................................... 115
BS2F7HZ6460................................ 124
GL0ZS042B0S................................ 111
GL3JS804B0SE ..............................111
GL5ED60........................................ 115
BS2F7VZ0165 ................................ 124
GL0ZV042B0S................................ 111
GL3JV404B0SE ..............................111
GL5EG261B0SB ............................ 113
BS1R8EL200A ............................... 121
GL3JV804B0SE ..............................111
GL5EG4.......................................... 113
BS2F7VZ7395 ................................ 124
GL1
GL3KG43 ........................................113
GL5EG40........................................ 113
BS2S7HZ0502................................ 123
GL100MD1MP1 .............................. 101
GL3KG44 ........................................113
GL5EG41........................................ 113
BS2S7HZ6306................................ 123
GL100MN0MP ................................ 101
GL3KG62 ........................................113
GL5EG43........................................ 113
BS520E0F ........................................ 94
GL100MN1MP ................................ 101
GL3KG63 ........................................113
GL5EG44........................................ 113
GL100MN3MP ................................ 101
GL3KG8 ..........................................113
GL5EG47........................................ 113
GL3PR43.........................................113
GL5EG60........................................ 113
GL2
GL3PR44.........................................113
GL5EG8.......................................... 113
BS2F7VZ0460 ................................ 124
DC
DC2J1AZxxx................................... 130
GL2EG6 .......................................... 113
GL3PR63.........................................113
GL5EJJ502C0X.............................. 115
DD
GL2HD6 .......................................... 113
GL3PR8...........................................113
GL5EP5 .......................................... 115
DD-30 ............................................. 141
GL2HY6 .......................................... 113
GL3TR43.........................................112
GL5FG43........................................ 113
DD-56 ............................................. 141
GL2PR6 .......................................... 113
GL3TR44.........................................112
GL5HD261B0SB ............................ 113
GL3TR8...........................................112
GL5HD4.......................................... 113
GA
GL3
GL3UR402B0S................................112
GL5HD40........................................ 113
GA104T1M1MZ ................................ 99
GL380 ............................................. 101
GL3UR43 ........................................112
GL5HD41........................................ 113
GA1A1S201WP................................ 97
GL381 ............................................. 101
GL3UR44 ........................................112
GL5HD43........................................ 113
GA1A2S100LY.................................. 97
GL382 ............................................. 101
GL3UR8 ..........................................112
GL5HD44........................................ 113
GA1A2S100SS................................. 97
GL390 ............................................. 101
GL3ZJ402B0SE ..............................111
GL5HD47........................................ 113
GA202TXV15J.................................. 98
GL390V........................................... 101
GL3ZJ802B0SE ..............................111
GL5HD60........................................ 113
GA202TXV15K ................................. 98
GL3B2402B0SC ............................. 112
GL3ZR402B0SE..............................111
GL5HD8.......................................... 113
GA210TXV8SY................................. 98
GL3BC302B0S2 ............................. 112
GL3ZR802B0SE..............................111
GL5HP5.......................................... 115
GA220T2L1IZ ................................... 96
GL3ED8 .......................................... 115
GL3ZS402B0SE..............................111
GL5HS40........................................ 113
GA230TXR1ZY................................. 98
GL3EG41 ........................................ 113
GL3ZS802B0SE..............................111
GL5HS41........................................ 113
GA230TXW6SY................................ 98
GL3EG43 ........................................ 113
GL3ZV402B0SE..............................111
GL5HS43........................................ 113
GA250T6C3SY................................. 98
GL3EG44 ........................................ 113
GL3ZV802B0SE..............................111
GL5HS44........................................ 113
GA250T6C4SY................................. 98
GL3EG62 ........................................ 113
GA301TXW5MZ ............................... 98
GL3EG63 ........................................ 113
GL4
GL5HS8.......................................... 113
GL3EG8 .......................................... 113
GL4100E0000F...............................101
GL5HY40........................................ 113
GH0
GL3G2402B0SC ............................. 112
GL453E00000F...............................101
GL5HY41........................................ 113
GH04020A2GE............................... 120
GL3HD43 ........................................ 113
GL4800E0000F...............................101
GL5HY43........................................ 113
GH06P24A2C................................. 120
GL3HD44 ........................................ 113
GL480E00000F...............................101
GL5HY44........................................ 113
GH07805C2K ................................. 120
GL3HD62 ........................................ 113
GL4EG8 ..........................................113
GL5HY8.......................................... 113
GH07825C2K ................................. 120
GL3HD63 ........................................ 113
GL4HD8 ..........................................113
GL5JJ302B0SE .............................. 111
GH07P24C1C................................. 120
GL3HD8 .......................................... 113
GL4HS8...........................................113
GL5JJ7D2D0SE ............................. 111
GH07P24C4C................................. 120
GL3HS43 ........................................ 113
GL4HY8...........................................113
GL5JS302B0SE ............................. 111
GH07P28A1C................................. 120
GL3HS44 ........................................ 113
GL4KG8 ..........................................113
GL5JS7D2D0SE............................. 111
GH07P28A4C................................. 120
GL3HS62 ........................................ 113
GL4PR8...........................................113
GL5JV302B0SE ............................. 111
GL5HS47........................................ 113
GL3HS63 ........................................ 113
142
GL5JV7D2D0SE............................. 111
GL3HS8 .......................................... 113
GL5KG41........................................ 113
E_index.fm Page 143 Friday, July 20, 2007 3:20 PM
INDEX
INDEX
GL5KG43........................................ 113
GL8HD22 ........................................ 113
GM1JE35200AE..............................116
GM5BW96370A.............................. 118
GL5KG44........................................ 113
GL8HD23 ........................................ 113
GM1JE55200AE..............................116
GM5CA96320A .............................. 118
GL5KG8.......................................... 113
GL8HD25 ........................................ 113
GM1JJ35200AE ..............................116
GM5CV96320A .............................. 118
GL5PR261B0SB............................. 113
GL8HD26 ........................................ 113
GM1JJ40300AE ..............................116
GM5CY96320A .............................. 118
GL5PR4.......................................... 113
GL8HD4 .......................................... 113
GM1JJ55200AE ..............................116
GM5EG95200A .............................. 117
GL5PR40........................................ 113
GL8HD42 ........................................ 113
GM1JR35200AE .............................116
GM5GC01250AC............................ 116
GL5PR41........................................ 113
GL8HD5 .......................................... 113
GM1JS35200AE..............................116
GM5GC03210Z .............................. 116
GL5PR44........................................ 113
GL8HP5 .......................................... 115
GM1JS40300AE..............................116
GM5GC05240AC............................ 116
GL5PR8.......................................... 113
GL8HS21 ........................................ 113
GM1JS55200AE..............................116
GM5GC96260AC............................ 116
GL5TR43 ........................................ 112
GL8HS22 ........................................ 113
GM1JV35200AE..............................116
GM5GC96270A .............................. 116
GL5TR8 .......................................... 112
GL8HS25 ........................................ 113
GM1JV40300AE..............................116
GM5HD95200A .............................. 117
GL5UR2K ....................................... 112
GL8HS29 ........................................ 113
GM1JV55200AE..............................116
GM5SE01200A............................... 116
GL5UR2K1 ..................................... 112
GL8HY21 ........................................ 113
GM1UR55200A...............................117
GM5SJ01250AL ............................. 116
GL5UR3K ....................................... 112
GL8HY22 ........................................ 113
GM1WA55311A ..............................119
GM5UR95200A .............................. 117
GL5UR3K1 ..................................... 112
GL8HY23 ........................................ 113
GM1ZJ40300AE..............................116
GM5WA06250A.............................. 119
GL5UR44........................................ 112
GL8HY25 ........................................ 113
GM1ZJ80300AE..............................116
GM5WA06250Z .............................. 119
GL5ZJ152B0SE.............................. 111
GL8HY26 ........................................ 113
GM1ZR40300AE.............................116
GM5WA06256A.............................. 119
GL5ZJ302B0SE.............................. 111
GL8HY29 ........................................ 113
GM1ZR80300AE.............................116
GM5WA06256Z .............................. 119
GL5ZR152B0SE............................. 111
GL8HY42 ........................................ 113
GM1ZS40300AE .............................116
GM5WA06260A.............................. 119
GL5ZR302B0SE............................. 111
GL8HY5 .......................................... 113
GM1ZS80300AE .............................116
GM5WA06270A.............................. 119
GL5ZS152B0SE ............................. 111
GL8KG21 ........................................ 113
GM1ZV40300AE .............................116
GM5WA94200A.............................. 119
GL5ZS302B0SE ............................. 111
GL8KG22 ........................................ 113
GM1ZV80300AE .............................116
GM5ZJ01200A ............................... 116
GL5ZV152B0SE ............................. 111
GL8KG25 ........................................ 113
GL5ZV302B0SE ............................. 111
GL8KG26 ........................................ 113
GM4
GM5ZR01200A............................... 116
GL8KG29 ........................................ 113
GM4BC83200AC.............................116
GM5ZR03200Z............................... 116
GL6
GL8KG42 ........................................ 113
GM4BW63360A ..............................118
GM5ZR05240A............................... 116
GL610T........................................... 101
GL8PR21 ........................................ 113
GM4BW63370A ..............................118
GM5ZR96260AE ............................ 116
GL6CU7.......................................... 115
GL8PR22 ........................................ 113
GM4BW83380A ..............................118
GM5ZR96270A............................... 116
GL6EG11T ..................................... 113
GL8PR25 ........................................ 113
GM4BW83390A ..............................118
GM5ZRB01210A ............................ 117
GL6EG26T ..................................... 113
GL8PR26 ........................................ 113
GM4GC83200AC ............................116
GM5ZRG01210A............................ 117
GL6UR11T ..................................... 112
GL8PR28 ........................................ 113
GM4WA10200A ..............................119
GM5ZS01200A............................... 116
GL6UR26T ..................................... 112
GL8PR29 ........................................ 113
GM4WA25300A ..............................119
GM5ZS03200Z ............................... 116
GL6UR31........................................ 112
GL8PR42 ........................................ 113
GM4ZJ83200AE..............................116
GM5ZV01200A............................... 116
GL6ZJ27......................................... 111
GL8TR21 ........................................ 112
GM4ZR83200AE.............................116
GM5ZV03200Z ............................... 116
GL6ZR27 ........................................ 111
GL8TR42 ........................................ 112
GM4ZS83200AE .............................116
GM5ZV96260AE ............................ 116
GL6ZS27 ........................................ 111
GL8UR21 ........................................ 112
GM4ZV83200AE .............................116
GM5ZV96270A............................... 116
GM5ZJ03200Z................................ 116
GL6ZV27 ........................................ 111
GL9
GM5
GP1
GL8
GL9ED2 .......................................... 115
GM5BC01250AC.............................116
GP1A037RDKJF .............................. 90
GL8ED5.......................................... 115
GL9ED4 .......................................... 115
GM5BC03210Z ...............................116
GP1A038RBK0F .............................. 90
GL8EG2.......................................... 113
GL9EH2 .......................................... 115
GM5BC05240AC.............................116
GP1A038RCK0F .............................. 90
GL8EG21........................................ 113
GL9HP2 .......................................... 115
GM5BC96260AC.............................116
GP1A044RCKLF .............................. 90
GM5BC96270A ...............................116
GP1A046RBZLF............................... 90
GL8EG22........................................ 113
GL8EG23........................................ 113
GM1
GM5BG01210A...............................117
GP1A047RBZLF............................... 90
GL8EG25........................................ 113
GM1BC35370AC ............................ 116
GM5BW01300A ..............................118
GP1A047RDZLF .............................. 90
GL8EG26........................................ 113
GM1BC55255AC ............................ 116
GM5BW01301A ..............................118
GP1A05A2J00F................................ 87
GL8EG29........................................ 113
GM1EG35200A............................... 117
GM5BW01311A ..............................118
GP1A05A5J00F................................ 87
GL8EG4.......................................... 113
GM1EG55200A............................... 117
GM5BW05340A ..............................118
GP1A05AJ000F................................ 87
GL8EG42........................................ 113
GM1GC55310AC............................ 116
GM5BW05343A ..............................118
GP1A05E2J00F................................ 87
GL8EG5.......................................... 113
GM1HD55200A............................... 117
GM5BW53340A ..............................118
GP1A05EJ000F................................ 87
GL8HD2.......................................... 113
GM1HS55200A............................... 117
GM5BW94320A ..............................118
GP1A073LCS ................................... 87
GL8HD21........................................ 113
GM1HY55200A............................... 117
GM5BW96320A ..............................118
GP1A30RJ000F ............................... 90
143
E_index.fm Page 144 Friday, July 20, 2007 3:20 PM
INDEX
INDEX
GP1A44E1J00F................................ 89
GP1UX31RK ...................................135
GP2W1320YP0F ............................ 132
GP1A50HRJ00F............................... 86
GP1S196HCZSF .............................. 83
GP1UX51QS...................................135
GP2W3020YP ................................ 132
GP1A51HRJ00F............................... 86
GP1S25J0000F ................................ 83
GP1UX51RK ...................................135
GP2W3104YP0F ............................ 132
GP1A52HRJ00F............................... 86
GP1S27J0000F ................................ 83
GP1A52LRJ00F ............................... 86
GP1S36J0000F ................................ 90
GP2
GP2W3240YP ................................ 133
GP1A53HRJ00F............................... 86
GP1S37J0000F ................................ 83
GP2A200LCS0F................................88
GP2W3250YP ................................ 133
GP1A57HRJ00F............................... 86
GP1S39J0000F ................................ 83
GP2A221HRKA.................................91
GP2W3270XP0F ............................ 133
GP1A58HRJ00F............................... 86
GP1S44S1J00F ................................ 89
GP2A222HCKA.................................91
GP2W3270YP0F ............................ 133
GP1A73AJ000F................................ 87
GP1S50J0000F ................................ 84
GP2A22J0000F.................................88
GP2WVR01YP0F ........................... 133
GP1A75EJ000F................................ 87
GP1S51VJ000F ................................ 84
GP2A231LRSAF ...............................88
GP2Y0A02YK0F............................. 104
GP1A91LCJ00F ............................... 85
GP1S525VJ00F ................................ 84
GP2A240LCS0F................................88
GP2Y0A21YK0F............................. 103
GP1A91LRJ00F ............................... 85
GP1S52VJ000F ................................ 84
GP2A250LCS0F................................88
GP2Y0A41SK0F............................. 103
GP1A98HCZ0F ................................ 85
GP1S53VJ000F ................................ 84
GP2A25BJ000F ................................88
GP2Y0A710K0F ............................. 104
GP1FA51HRZ0F............................. 109
GP1S54J0000F ................................ 84
GP2A25J0000F.................................88
GP2Y0AH01K0F ............................ 106
GP1FAV30RK0F............................. 109
GP1S566VJ00F ................................ 84
GP2A25NJJ00F ................................88
GP2Y0D02YK0F ............................ 103
GP1FAV30TK0F ............................. 108
GP1S56TJ000F ................................ 84
GP2A28AJ000F ................................88
GP2Y0D21YK0F ............................ 103
GP1FAV31RK0F............................. 109
GP1S58VJ000F ................................ 84
GP2D032J0000F.............................105
GP2Y0D310K ................................. 103
GP1FAV31TK0F ............................. 108
GP1S59J0000F ................................ 84
GP2D03J0000F...............................105
GP2Y0D340K ................................. 103
GP1FAV50RK0F............................. 109
GP1S74PJ000F ................................ 84
GP2D061J000F...............................105
GP2Y0D413K0F............................. 103
GP1FAV50TK0F ............................. 108
GP1S93J0000F ................................ 83
GP2D062J000F...............................105
GP2Y0D805Z0F ............................. 103
GP1FAV51RK0F............................. 109
GP1S94J0000F ................................ 83
GP2D06J0000F...............................105
GP2Y0D810Z0F ............................. 103
GP1FAV51TK0F ............................. 108
GP1S95J0000F ................................ 83
GP2D071J000F...............................105
GP2Y1010AU0F ............................. 106
GP1FAV55TK0F ............................. 108
GP1S96J0000F ................................ 83
GP2D07J0000F...............................105
GP2Y2A180K0F ............................. 105
GP1FD210RP0F ............................ 109
GP1S97J0000F ................................ 83
GP2D120XJ00F ..............................103
GP2Y2A280K0F ............................. 105
GP1FD210TP0F............................. 108
GP1UD26XK00F............................. 135
GP2D12J0000F...............................103
GP2Y2D160K0F............................. 105
GP1FD310TP0F............................. 108
GP1UD27XK00F............................. 135
GP2D150AJ00F ..............................103
GP2Y2E101K0F ............................. 105
GP1FD320TP0F............................. 108
GP1UD28XK00F............................. 135
GP2D150MJ00F..............................103
GP2Y2E301K0F ............................. 105
GP1FM313TZ0F............................. 108
GP1UD28YK00F............................. 135
GP2D15J0000F...............................103
GP2Y3A001K0F ............................. 104
GP1FM513TZ0F............................. 108
GP1UE26RK0VF ............................ 135
GP2L24J0000F .................................88
GP2Y3A002K0F ............................. 104
GP1FM55HTZ0F ............................ 108
GP1UE26XK0VF ............................ 135
GP2S24J0000F.................................87
GP2Y3A003K0F ............................. 104
GP1FMV31RK0F............................ 109
GP1UE27RK0VF ............................ 135
GP2S27J0000F.................................87
GP2Y40010K0F ............................. 106
GP1FMV31TK0F ............................ 108
GP1UE27XK0VF ............................ 135
GP2S29SJ000F ................................91
GP2Y5D91S00F............................. 103
GP1FMV51RK0F............................ 109
GP1UE28QK0VF ............................ 135
GP2S40J0000F.................................87
GP1FMV51TK0F ............................ 108
GP1UE28RK0VF ............................ 135
GP2S60.............................................87
GP5
GP1FP513RK0F............................. 109
GP1UE28XK0VF ............................ 135
GP2S700HCP ...................................87
GP5FM5R01AZ .............................. 110
GP1FP513TK0F ............................. 108
GP1UE28YK0VF ............................ 135
GP2TC1J0000F ..............................106
GP5FM5T01AZ .............................. 110
GP1FSV31TK0F............................. 108
GP1UE29QK0VF ............................ 135
GP2U06J0000F...............................106
GP1FSV51TK0F............................. 108
GP1UF31xXP0F ............................. 135
GP2W0004XP0F.............................132
GW
GP1L50J0000F ................................ 85
GP1UF31xYP0F ............................. 135
GP2W0004YP0F.............................132
GW01M59001PE............................ 119
GP1L51J0000F ................................ 85
GP1UM26RK0VF............................ 135
GP2W0110VX.................................133
GP1L52VJ000F ................................ 85
GP1UM26XK0VF............................ 135
GP2W0110VY.................................133
HPD
GP1L53VJ000F ................................ 85
GP1UM27RK0VF............................ 135
GP2W0112YP0F.............................133
HPD-66........................................... 141
GP1L57J0000F ................................ 85
GP1UM27XK0VF............................ 135
GP2W0116YP0F.............................133
GP1S036HEZ................................... 90
GP1UM28QK0VF ........................... 135
GP2W0118YP0F.............................133
IR2
GP1S092HCPIF ............................... 83
GP1UM28RK0VF............................ 135
GP2W0150XP0F.............................133
IR2D071 ........................................... 52
GP1S093HCZ0F .............................. 83
GP1UM28XK0VF............................ 135
GP2W0150YP0F.............................133
IR2D20U........................................... 52
GP1S094HCZ0F .............................. 83
GP1UM28YK0VF............................ 135
GP2W1001YP0F.............................132
IR2E46Y6 ......................................... 51
GP1S096HCZ0F .............................. 83
GP1UM29QK0VF ........................... 135
GP2W1002YP0F.............................132
IR2E47U6 ......................................... 51
GP1S097HCZ0F .............................. 83
GP1US30XP ................................... 135
GP2W1004YP0F.............................132
IR2E49U ........................................... 51
GP1S194HCZ0F .............................. 83
GP1UV70QS00F ............................ 135
GP2W1010YP0F.............................132
IR2E51Y6 ......................................... 51
GP1S195HCPSF.............................. 83
GP1UW70QS00F ........................... 135
GP2W1302YP0F.............................132
GP1S195HCZSF .............................. 83
144
GP1S196HCZ0F............................... 83
GP1UX31QS................................... 135
GP2W1304YP.................................132
GP2W3120YP0F ............................ 132
E_index.fm Page 145 Friday, July 20, 2007 3:20 PM
INDEX
INDEX
LH16B9 .............................................25
LHF00L11.................................... 36/39
LH16BP.............................................25
LHF00L14.................................... 36/39
IR3
IRM
IR3C14N1.................................... 52/54
IRM046U7......................................... 53
IR3C22N........................................... 52
IRM047U7......................................... 53
LH2
LHF00L24.................................... 36/39
IR3E11A1 ......................................... 30
IRM048U7......................................... 53
LH28F128BFH-PBTL ........................35
LHF00L25.................................... 36/39
IR3E11M1......................................... 30
IRM053U7......................................... 53
LH28F128BFH-PTTL ...................35/37
LHF00L28.................................... 36/39
IR3E11P1 ......................................... 30
IRM060U7......................................... 53
LH28F128BFH-PWTL .......................37
LHF00L29.................................... 36/39
IR3E12M1......................................... 30
IRM063U7......................................... 53
LH28F128BFHED-PWTLT2 ..............40
LHF00L34.................................... 36/39
IR3E13N ........................................... 30
IRM065U7......................................... 53
LH28F128BFHT-PTTLT1A ................40
LHF00L15.................................... 36/39
LH28F128BFHT/B-PBTL75A ............38
LJ
IR3E2015.......................................... 30
IS
LH28F128BFHT/B-PTTL75A ............38
LJ089MB2S01 .................................. 14
IR3E2045.......................................... 30
IS1623Q............................................ 98
LH28F128SPH-PTL ..........................37
LJ64H034 ......................................... 14
IR3E3XX........................................... 30
IS1682Q............................................ 98
LH28F128SPHT-PTL12B ..................40
IR3M16U ..................................... 30/50
IS1684Q............................................ 98
LH28F160BJH-PBTL.........................35
LK
IR3M17U .......................................... 49
IS471FE ............................................ 96
LH28F160BJH-PTTL.........................35
LK460D3LZ19 .................................. 10
IR3M18N .......................................... 48
IS485E .............................................. 95
LH28F160BJHE-PBTL70 ..................38
LK460D3LZxx................................... 10
IR3M19N .......................................... 48
IS486E .............................................. 95
LH28F160BJHE-PTTL70 ..................38
LK520D3LZ19 .................................. 10
IR3M30M ................................ 30/49/50
IS489E .............................................. 96
LH28F256BF-PTSL...........................36
LK520D3LZxx................................... 10
LH28F256BFH-PTTL ........................37
LK645D3LZ29 .................................. 10
LK645D3LZ2U.................................. 10
IR3E13U ........................................... 30
IR3M30U ................................ 30/49/50
IR3M48U6 ........................................ 50
LH1
LH28F256BFHTD-PTTLZ3 ...............40
IR3M49U6 ........................................ 50
LH1530 ............................................. 26
LH28F256BFN-PTSLZ2....................39
IR3M52Y7......................................... 50
LH1537 ............................................. 26
LH28F320BFH-PTTL ........................37
LM
IR3M55U ..................................... 19/50
LH1538 ............................................. 26
LH28F320BFHE-PTTLE0..................40
LM046QB1S02 ................................... 9
IR3M56N .......................................... 49
LH1542 ............................................. 26
LH28F512BFBD-PTSL......................36
LM050QC1T01 ................................... 9
IR3M57N .......................................... 49
LH1548 ............................................. 26
LH28F512BFBD-PTSLZ2..................39
LM077VS1T01.................................... 9
IR3M58M ................................ 30/49/50
LH1549 ............................................. 26
LH28F512BFBD-PTSLZ4..................39
LM081HB1T01B ................................. 9
IR3M58U ................................ 30/49/50
LH1560 ............................................. 26
LH28F512BFND-PTSL......................36
LM085YB1T01.................................... 9
IR3M59U ........................... 19/22/23/50
LH1562 ............................................. 26
LH28F512BFND-PTSLZ1 .................39
LM089HB1T04 ................................... 9
IR3M61U ..................................... 19/50
LH1565 ............................................. 26
LH28F640BF-PTTL...........................36
LM32019P .......................................... 9
IR3M63U ........................... 19/21/24/50
LH1580 ............................................. 26
LH28F640BFH-PBTL ...................35/37
LM32019T .......................................... 9
IR3R55M1 ........................................ 54
LH1583 ............................................. 26
LH28F640BFH-PTTL ...................35/37
IR3R58M1 ........................................ 54
LH15H1............................................. 28
LH28F640BFHE-PBTLHK.................40
LQ0
IR3R59N1......................................... 54
LH15JA ............................................. 28
LH28F640BFHE-PTTLH1A...............40
LQ025A3DS01 ................................. 13
IR3T46U ........................................... 51
LH15KA............................................. 28
LH28F640BFHE-PTTLHFA ...............38
LQ031B5DG01 ................................. 11
IR3T46U6 ......................................... 51
LH15LA ............................................. 28
LH28F640BFHE/G-PBTL70A............38
LQ033B5DG02 ................................. 11
IR3T47G ...................................... 19/20
LH1687 ............................................. 26
LH28F640BFHG-PTTL70A ...............38
LQ035Q3DG01................................... 9
IR3Y18A1 .................................... 29/53
LH168Y ............................................. 26
LH28F640BFN-PTTLZ1A..................39
LQ035Q5DG02................................. 11
IR3Y26A2 .................................... 29/53
LH1691 ........................................ 25/26
LH28F640SPH-PL.............................37
LQ038Q3DC01................................... 9
IR3Y26A6 .................................... 29/53
LH1694 ............................................. 25
LH28F640SPHT-PL12B ....................40
LQ050Q5DR01................................... 9
IR3Y29A1 .................................... 29/53
LH169C............................................. 27
LH28F800BJ-PBTL ...........................35
LQ057Q3DC12................................... 9
IR3Y29B1 .................................... 29/53
LH169H............................................. 26
LH28F800BJ-PTTL ...........................35
LQ057V3DG01 ................................... 9
IR3Y30M2.................................... 18/24
LH169J.............................................. 25
LH28F800BJE-PBTL90.....................38
LQ061T5GG01 ................................. 11
IR3Y31M1.................................... 29/53
LH16AD ............................................ 25
LH28F800BJE-PTTL90.....................38
LQ064V3DG01 ................................... 9
IR3Y34M1.................................... 29/53
LH16AE............................................. 25
LH28F800BJH-PBTL.........................35
LQ064V3DG04 ................................... 9
IR3Y37A1 .................................... 29/53
LH16AF............................................. 25
LH28F800BJH-PTTL.........................35
LQ065T5DG02 ................................. 11
IR3Y48A3 .................................... 18/23
LH16AM ............................................ 25
LH28F800BJHE-PBTL90 ..................38
LQ065T5GG61 ................................. 11
IR3Y48A5 .................................... 18/23
LH16AP............................................. 27
LH28F800BJHE-PTTL90 ..................38
LQ065T9DZ03.................................. 11
IR3Y48B1 .................................... 18/23
LH16AR ............................................ 26
IR3Y50U6 .................................... 18/24
LH16AV............................................. 26
LHF
LQ070T5GG21 ................................. 12
IR3Y60U6 .................................... 18/23
LH16AW............................................ 25
LHF00L08.....................................36/39
LQ070Y5DE02 ................................. 12
IR3Y63M...................................... 29/53
LH16B5 ............................................. 25
LHF00L09.....................................36/39
LQ070Y5DG05 ................................. 12
LH16B6 ............................................. 25
LHF00L10.....................................36/39
LQ070Y5DG06 ................................. 12
LQ070T5DR05 ................................. 12
145
E_index.fm Page 146 Friday, July 20, 2007 3:20 PM
INDEX
INDEX
LRS18BN ..........................................41
LZ0P393D ........................................ 15
LQ080Y5CGXX ................................ 12
LR3
LRS18BT...........................................41
LZ0P393M ........................................ 15
LQ080Y5DG03 ................................. 12
LR35501 ........................................... 31
LRS18C8C ........................................41
LZ0P394K......................................... 15
LQ080Y5DG04 ................................. 12
LR35501Y ......................................... 31
LRS18CCA........................................41
LZ0P3955 ......................................... 15
LQ084S3DG01 ................................... 9
LR366851 ............................... 18/23/24
LRS18CJ...........................................41
LZ0P395V......................................... 15
LQ084S3LG01.................................... 9
LR36687U......................................... 18
LRS18CK ..........................................41
LZ0P396K......................................... 15
LQ084V1DG21 ................................... 9
LR36687Y ......................................... 18
LRS18CP ..........................................41
LZ0P399A......................................... 15
LQ084V3DG01 ................................... 9
LR36689U......................................... 18
LRS5751 ......................................29/53
LZ0P39AG ........................................ 15
LQ085Y3DG03 ................................... 9
LR3697A ........................................... 26
LRS5752 ......................................29/53
LZ0P39DS ........................................ 15
LQ085Y3DG04 ................................... 9
LR36B11 ...................................... 18/20
LQ088H9DZ03 ................................. 12
LR385851 .................................... 18/24
LS
LR386032 .................................... 19/23
LS022Q8UX05 ..................................13
LQ1
LR386071 .................................... 19/23
LS025A8DZ01...................................13
PC1
LQ104S1DG21 ................................... 8
LR38627 ...................................... 19/24
LS027T3DG01 ..................................13
PC1231xNSZ0F ............................... 70
LQ104S1DG31 ................................... 8
LR386431 .................................... 18/22
LS028B7UX01...................................13
PC123J00000F................................. 70
LQ104S1DG61 ................................... 8
LR386433 .................................... 18/22
LQ104S1LG21.................................... 8
LR38653 ...................................... 18/21
LT1
PC2
LQ104S1LG31.................................... 8
LR38654 ...................................... 19/21
LT1D40A..........................................117
PC2SD11NTZAF .............................. 76
LQ104S1LG61.................................... 8
LR38667 ...................................... 18/20
LT1D67A..........................................117
LQ104V1DG21 ................................... 9
LR38675 ...................................... 18/20
LT1E40A..........................................117
PC3
LQ104V1DG51 ................................... 9
LR38677 ...................................... 18/20
LT1E67A..........................................117
PC352NJ000F .................................. 68
LQ104V1DG61 ................................... 9
LR38678 ...................................... 18/20
LT1ED67A .......................................118
PC354NJ0000F ................................ 68
LQ104V1DG64 ................................... 9
LR38822A ......................................... 27
LT1EH67A .......................................118
PC355NJ0000F ................................ 68
LQ104V1DW02................................... 9
LR38825 ........................................... 27
LT1F67A..........................................117
PC357NJ0000F ................................ 68
LQ104V1LG61.................................... 9
LR38826 ........................................... 27
LT1F67AF........................................117
PC364NJ0000F ................................ 68
LQ121S1DG41 ................................... 8
LR38844A ......................................... 28
LT1H40A..........................................117
PC365NJ0000F ................................ 68
LQ121S1DG61 ................................... 8
LR38869A ......................................... 27
LT1H67A..........................................117
PC367NJ0000F ................................ 68
LQ121S1LG41.................................... 8
LR388733 ......................................... 31
LT1JS67A........................................116
PC3H2J00000F ................................ 69
LQ121S1LG61.................................... 8
LR38875 ........................................... 31
LT1JV67A........................................116
PC3H3J00000F ................................ 69
LQ121S1LG64.................................... 8
LR38886 ........................................... 31
LT1K40A..........................................117
PC3H41xNIP0F ................................ 69
LQ121S1LW01 ................................... 8
LR38888 ........................................... 31
LT1K67A..........................................117
PC3H4J00000F ................................ 69
LQ121S7LY01..................................... 8
LR388B3 ........................................... 31
LT1KS67A .......................................118
PC3H510NIP0F................................ 69
LQ121S7LY11..................................... 8
LR388B6 ........................................... 31
LT1P40A..........................................117
PC3H5J00000F ................................ 69
LQ150X1LGB1 ................................... 8
LR388B61 ......................................... 31
LT1P67A..........................................117
PC3H71xNIP0F ................................ 69
LQ150X1LGB2 ................................... 8
LR388D0........................................... 27
LT1S40A..........................................117
PC3H7J00000F ................................ 69
LQ150X1LGN2A................................. 8
LR388D1...................................... 27/31
LT1S67A..........................................117
PC3HU7NYIP0F............................... 69
LT1U40A..........................................117
PC3Q41xNIP0F................................ 69
LT1U67A..........................................117
PC3Q510NIP0F................................ 69
LQ075V3DG01 ................................... 9
LQ150X1LGN2E................................. 8
LQ150X1LW71N................................. 8
LR5
LQ150X1LW72 ................................... 8
LZ2316A3 .................................... 17/24
LR550R03......................................... 34
PC3Q62J0000F................................ 69
LT3
PC3Q63J0000F................................ 69
LRS
LT3D31W.........................................113
PC3Q64QJ000F ............................... 69
LQ190E1LW01 ................................... 8
LQ190E1LW41 ................................... 8
LZ2326A3 .................................... 17/24
LRS1871A......................................... 41
LT3D65W.........................................113
PC3Q65J0000F................................ 69
LQ2
LRS1872A......................................... 41
LT3E31W.........................................113
PC3Q67QJ000F ............................... 69
LQ201U1LW11Z................................. 8
LRS18831 ......................................... 41
LT3E65W.........................................113
PC3Q71xNIP0F................................ 69
LQ201U1LW21 ................................... 8
LRS18841 ......................................... 41
LT3H31W.........................................113
PC3SD11NTZAF .............................. 76
LQ231U1LW01 ................................... 8
LRS1890A......................................... 41
LT3H65W.........................................113
PC3SD11NTZBF .............................. 76
LQ231U1LW21 ................................... 8
LRS1897 ........................................... 41
LT3P31W.........................................113
PC3SD11NTZCF.............................. 76
LQ281L1LW11.................................... 8
LRS18A6........................................... 41
LT3P65W.........................................113
PC3SD11YTZDF .............................. 76
LQ281L1LW14.................................... 8
LRS18AZ .......................................... 41
LT3S65W.........................................113
PC3SD12NTZAF .............................. 76
LQ283G1TW11 .................................. 8
LRS18B0........................................... 41
PC3SD21NTZBF .............................. 77
LRS18BK .......................................... 41
PC3SD21NTZCF.............................. 77
LRS18BL........................................... 41
146
LZ
LZ0P392N .........................................15
PC3SD21NTZDF.............................. 77
E_index.fm Page 147 Friday, July 20, 2007 3:20 PM
INDEX
INDEX
PC3SD21YTZEF .............................. 77
PC8171xNSZ0F................................ 70
PQ070XF02SZH ...............................42
PQ1RxxJ0000H series ..................... 44
PC3SD23YTZCF .............................. 77
PC817XJ0000F................................. 70
PQ070XH01ZPH...............................47
PQ1Uxx1M2ZPH series ................... 44
PC3SF11YVZAF .............................. 76
PC844XJ0000F................................. 70
PQ070XH02ZPH...............................47
PQ1XAxx1MZPH series ................... 44
PC3SF11YVZBF .............................. 76
PC845XJ0000F................................. 70
PQ070XN01ZPH...............................45
PQ1Xxx1M2ZPH series.................... 44
PC3SF21YVZAF .............................. 77
PC847XJ0000F................................. 70
PQ070XNA1ZPH...............................45
PC3SF21YVZBF .............................. 77
PC851XJ0000F................................. 70
PQ070XNAHZPH..............................45
PQ2
PC3SF23YVZSF .............................. 77
PC852XJ0000F................................. 70
PQ070XNB1ZPH...............................45
PQ200WN3MZPH ............................ 46
PC3SG11YIZ0F................................ 76
PC853XJ0000F................................. 70
PQ070XZ01ZPH ...............................45
PQ200WNA1ZPH............................. 46
PQ070XZ02ZPH ...............................46
PQ20RX05J00H ............................... 42
PC3SH11YFZAF .............................. 76
PC9
PQ070XZ1HZPH...............................46
PQ20RX11J00H ............................... 42
PC3SH13YFZAF .............................. 76
PC900V0NSZXF............................... 73
PQ070XZ5MZPH series....................45
PQ20VZ11J00H ............................... 46
PC3SH21YFZBF .............................. 77
PC901V0NSZXF............................... 73
PQ07VR5MAPH series .....................45
PQ20VZ51J00H ............................... 46
PC3ST11NSZAF .............................. 76
PC910L0NSZ0F................................ 73
PC3SG21YIZ0F................................ 77
PQ20WZ11J00H .............................. 46
PC911L0NSZ0F................................ 73
PQ1
PQ20WZ51J00H .............................. 46
PC912L0NSZ0F................................ 73
PQ150RWA2SZH..............................42
PQ2CF1J0000H ............................... 49
PC4
PC923L0NSZ0F................................ 74
PQ150VB01FZH ...............................42
PQ2Lxxx2MSPQ .............................. 44
PC400J00000F................................. 72
PC924L0NSZ0F................................ 74
PQ150VB02FZH ...............................42
PC401J00000F................................. 72
PC925L0NSZ0F................................ 74
PQ15RW08J00H...............................42
PQ3
PC410L0NIP0F ................................ 72
PC928J00000F ................................. 74
PQ15RW11J00H...............................42
PQ30RV11J00H ............................... 42
PC410S0NIP0F ................................ 72
PC929J00000F ................................. 74
PQ15RW21J00H...............................42
PQ30RV21J00H ............................... 42
PC411L0NIP0F ................................ 72
PC942J00000F ................................. 74
PQ1CG2032FZH...............................49
PQ30RV31J00H ............................... 42
PC411S0NIP0F ................................ 72
PC956L0NSZ0F................................ 73
PQ1CG2032RZH ..............................49
PQ3DZ13J000H ............................... 45
PC412S0NIP0F ................................ 72
PC957L0NSZ0F................................ 74
PQ1CG21H2FZH ..............................49
PQ3DZ53J000H ............................... 45
PQ1CG21H2RZH..............................49
PQ3RD083J00H............................... 42
PC3ST21NSZBF .............................. 77
PC451J00000F................................. 68
PC456L0NIP0F ................................ 72
PD
PQ1CG3032FZH...............................49
PQ3RD13J000H............................... 42
PC457L0NIP0F ................................ 73
PD100MC0MP .................................. 94
PQ1CG3032RZH ..............................49
PQ3RD23J000H............................... 42
PC457S0NIP0F ................................ 73
PD100MF0MP .................................. 94
PQ1CG38M2FZH..............................49
PQ3RF23J000H ............................... 42
PC4D10SNIP0F ............................... 72
PD101SC0SS0F ............................... 95
PQ1CG38M2RZH .............................49
PQ3RF33J000H ............................... 42
PC4H510NIP0F................................ 69
PD30CMC31MZ................................ 95
PQ1CG41H2FZH ..............................49
PC4H520NIP0F................................ 69
PD3122FE000F ................................ 94
PQ1CG41H2RZH..............................49
PQ5
PC4SD11NTZBF .............................. 76
PD410PI2E00F ................................. 94
PQ1CX12H2ZPQ ..............................48
PQ5CB11X1AP ................................ 48
PC4SD11NTZCF.............................. 76
PD411PI2E00F ................................. 94
PQ1CX22H2ZPQ ..............................48
PQ5EV3J0000H ............................... 43
PC4SD21NTZCF.............................. 77
PD412PI2E00F ................................. 94
PQ1CX41H2ZPQ ..............................48
PQ5EV5J0000H ............................... 43
PC4SD21NTZDF.............................. 77
PD413PI2E00F ................................. 94
PQ1CY1032ZPH...............................48
PQ5EV7J0000H ............................... 43
PC4SF11YVZAF .............................. 76
PD49PIE0000F ................................. 94
PQ1CYxx3HZPH series ....................48
PC4SF11YVZBF .............................. 76
PD60T............................................... 94
PQ1CYxx3LZPH series.....................48
PQ6
PQ1CZ21H2ZPH...............................48
PQ6CB11X1AP ........................... 48/51
PQ0
PQ1CZ38M2ZPH series ...................48
PQ6CB11X1CP ........................... 48/51
PQ015YZ01ZPH ............................... 46
PQ1CZ41H2ZPH...............................48
PQ6CU11X1APQ ........................ 48/51
PC7
PQ015YZ5MZPH .............................. 46
PQ1DX095MZPQ..............................47
PQ6CU12X2APQ ............................. 48
PC713V0NSZXF .............................. 71
PQ033ES1MXPQ ............................. 43
PQ1DX125MZPQ..............................47
PQ6RD083J00H............................... 42
PC714V0NSZXF .............................. 71
PQ033ES3MXPQ ............................. 43
PQ1KAxx3MZPH series....................44
PC715V0NSZXF .............................. 71
PQ035ZM02ZPH .............................. 46
PQ1Kxx3M2ZPH series ....................44
PQ7
PC724V0NSZXF .............................. 71
PQ035ZN01ZPH............................... 46
PQ1LAX95MSPQ..............................44
PQ7L2010BP............................... 48/51
PC725V0NSZXF .............................. 71
PQ035ZN1HZPH .............................. 46
PQ1LAxx3MSPQ...............................44
PQ7RV4J0000H ............................... 42
PC4SF21YVZBF .............................. 77
PC4SF21YVZCF .............................. 77
PQ050ES1MXPQ ............................. 43
PQ1LAxx5MSP series.......................44
PC8
PQ050ES3MXPQ ............................. 43
PQ1Lxx3M2SPQ...............................44
PQx
PC81100NSZ0F ............................... 70
PQ05VY053ZPH............................... 47
PQ1MGX38MSPQ ............................44
PQxxDZ11J00H series ..................... 45
PC8141xNSZ0F ............................... 70
PQ05VY3H3ZPH .............................. 47
PQ1MGxx8MSPQ .............................44
PQxxDZ51J00H series ..................... 45
PC814XJ0000F ................................ 70
PQ070VK01FZH ............................... 42
PQ1MX55M2SPQ .............................44
PQxxRA11J00H series..................... 42
PC81510NSZ0F ............................... 70
PQ070VK02FZH ............................... 42
PQ1Mxx5M2SPQ..............................44
PQxxRD08J00H series..................... 42
PC815XJ0000F ................................ 70
PQ070XF01SZH ............................... 42
PQ1Nxx3MxSPQ...............................44
PQxxRD11J00H series..................... 42
147
E_index.fm Page 148 Friday, July 20, 2007 3:20 PM
INDEX
INDEX
RJ23S3BD0ET.............................16/20
S202S15F......................................... 80
PQxxRF11J00H series ..................... 42
PT
RJ23S3BE0BT .............................16/20
S202SE1F ........................................ 81
PQxxRF21J00H series ..................... 42
PT100MC0MP .................................. 93
RJ23S3CD0ET.............................16/20
S202SE2F ........................................ 81
PQxxRH11J00H series..................... 42
PT100MF0MP................................... 93
RJ23S3CE0BT.............................16/20
S202T01F......................................... 80
PQxxxDNA1ZPH series.................... 45
PT100MF1MP................................... 93
RJ23T3BB0ET .............................16/20
S202T02F......................................... 80
PQxxxDZ01ZPH series .................... 45
PT200MC0NP................................... 93
RJ23T3BC0BT .............................16/20
S208T01F......................................... 80
PQxxxEF01SZH series..................... 42
PT202MR0MP1 ................................ 93
RJ23T3CB0ET .............................16/20
S208T02F......................................... 80
PQxxxEF02SZH series..................... 42
PT380 ............................................... 93
RJ23T3CC0BT.............................16/20
S212S01F......................................... 80
PQxxxEH01ZPH............................... 47
PT380F ............................................. 93
RJ23U3BA0ET.............................16/20
S216S01F......................................... 80
PQxxxEH02ZPH............................... 47
PT381 ............................................... 93
RJ23U3BC0BT.............................16/20
S216S02F......................................... 80
PQxxxEN01ZPH series .................... 45
PT381F ............................................. 93
RJ23U3CA0ET.............................16/20
S216SE1F ........................................ 81
PQxxxENA1ZPH series.................... 45
PT4800E0000F................................. 93
RJ23U3CC0BT.............................16/20
S216SE2F ........................................ 81
PQxxxENA1ZPH series.................... 45
PT4800FE000F................................. 93
RJ23V3BA0BT .............................16/20
S2S3000F......................................... 76
PQxxxENAHZPH series ................... 45
PT480E00000F................................. 93
RJ23V3CA0BT.............................16/20
S2S4000F......................................... 77
PQxxxEZ01ZPH series..................... 45
PT480FE0000F................................. 93
RJ2411AA0PB ........................17/21/22
S2S5A00F ........................................ 76
PQxxxEZ02ZPH series..................... 45
PT4810E0000F................................. 93
RJ2411AB0PB ..............17/21/22/23/24
PQxxxEZ1HZPH series .................... 45
PT4810FJE00F................................. 93
RJ2411BA0PB ........................17/21/22
VA
PQxxxEZ5MZPH series.................... 45
PT481E0000F................................... 93
RJ2411BB0PB ..............17/21/22/23/24
VA1H1ED5265................................ 126
PQxxxFZ01ZPH series..................... 45
PT481FE0000F................................. 93
RJ2411CA0PB ..................................21
VA1J5JF7007 ................................. 126
PQxxxFZ5MZPH series.................... 45
PT483F1E000F................................. 93
RJ2421AB0PB ..............17/21/22/23/24
VA1K5ED5255................................ 126
PQxxxGM02ZPH .............................. 45
PT4850FE000F................................. 93
RJ2421BB0PB ..............17/21/22/23/24
VA1R5JF7002................................. 125
PQxxxGN01ZPH series.................... 45
PT491FE0000F................................. 93
RJ2451AA0PB ..............17/21/22/23/24
VA1T1ED5065................................ 126
PQxxxGN1HZPH series ................... 45
PT493FE0000F................................. 93
RJ2451BA0PB ..............17/21/22/23/24
VA1Y2ED1401................................ 127
PQxxxRDA1SZH series.................... 42
PT501 ............................................... 93
RJ2461AA0PB ..............17/21/22/23/24
VA1Y2UF2307................................ 127
PQxxxRDA2SZH series.................... 42
PT510 ............................................... 93
RJ2461BA0PB ..............17/21/22/23/24
VA1Y2UF2312................................ 127
PQxxxY053ZPH ............................... 47
PT550 ............................................... 93
PQxxxY3H3ZPH............................... 47
PT550F ............................................. 93
RW
PT600T ............................................. 93
RW-4020 ...........................................34
PT601T ............................................. 93
RW-4040 ...........................................34
PR23MF11NSZF .............................. 79
RB
S1
VT1Y5ED211.................................. 128
PR26MF11NSZF .............................. 79
RB5P0010M2............................... 29/53
S101S05F .........................................80
VT1Y5JB201 .................................. 128
PR26MF12NSZF .............................. 79
RB5P0020M2............................... 29/53
S101S06F .........................................80
VT1Y5JF201................................... 128
PR26MF21NSZF .............................. 79
RB5P0050M2............................... 29/53
S101S16F .........................................80
VT1Y5UF201.................................. 128
PR29MF11NSZF .............................. 79
RB5P0060M2............................... 29/53
S102S01F .........................................80
VT2W5CD551 ................................ 127
PR29MF12NSZF .............................. 79
RB5P006AM2 .............................. 29/53
S102S02F .........................................80
PR29MF21NSZF .............................. 79
RB5P0070M................................. 29/53
S102S11F .........................................80
PR31MA11NTZF .............................. 79
RB5P0090M................................. 29/53
S102S12F .........................................80
PQxxRD21J00H series..................... 42
PR
VA35JZ9904 ................................... 129
PR22MA11NTZF .............................. 79
VT
VT1Y5CD201 ................................. 128
PR32MA11NTZF .............................. 79
S102T01F..........................................80
PR33MF51NSZF .............................. 79
RJ
S102T02F..........................................80
PR36MF12NSZF .............................. 79
RJ21V3BC0ET............................. 16/20
S108T01F..........................................80
PR36MF21NSZF .............................. 79
RJ21W3BB0ET............................ 16/20
S108T02F..........................................80
PR36MF22NSZF .............................. 79
RJ21W3BC0ET............................ 16/20
S112S01F .........................................80
PR36MF51NSZF .............................. 79
RJ21Y3BA0ET............................. 16/20
S116S01F .........................................80
PR39MF11NSZF .............................. 79
RJ2311AA0PB ......... 16/17/21/22/23/24
S116S02F .........................................80
PR39MF12NSZF .............................. 79
RJ2311BA0PB .............. 16/21/22/23/24
PR39MF21NSZF .............................. 79
RJ2321AA0PB .............. 16/21/22/23/24
S2
PR39MF22NSZF .............................. 79
RJ2321BA0PB .............. 16/21/22/23/24
S201S06F .........................................80
PR39MF51NSZF .............................. 79
RJ2351AA0BB .............. 16/21/22/23/24
S202S01F .........................................80
PR3BMF11NSZF.............................. 79
RJ2351BA0AB .............. 16/21/22/23/24
S202S02F .........................................80
PR3BMF21NSZF.............................. 79
RJ2361AA0BB .............. 16/21/22/23/24
S202S11F .........................................81
RJ2361BA0AB .............. 16/21/22/23/24
148
VA35JZ9910 ................................... 129
S202S12F .........................................81
Specifications are subject to change without notice.
All screen images are simulated.
22-22, NAGAIKE-CHO, ABENO-KU, OSAKA 545-8522, JAPAN
EUROPE
ASIA
SHARP MICROELECTRONICS OF
THE AMERICAS
North American Head Office
U.S.A
SHARP MICROELECTRONICS EUROPE
a division of Sharp Electronics (Europe) GmbH
European Head Office
SHARP ELECTRONICS (SHANGHAI) CO., LTD.
Microelectronics Sales & Marketing Division
5700 NW Pacific Rim Boulevard
Camas, WA 98607 USA
PHONE: +1-360-834-2500
FAX:
+1-360-834-8903
http://www.sharpsma.com
Sonninstrasse 3, 20097, Hamburg, Germany
PHONE: +49-1805-073507
FAX: +49-40-2376-2232
http://www.sharpsme.com
Registered Address
Germany:
Munich Office
Western Area
No. 273, De Bao Road, Xin Development BLDG
58 Wai Gao Qiao Free Trade Zone, Shanghai
200131, P.R. China
Landsberger Strasse 398, 81241 Munich,
Germany
PHONE: +49-89-54 6842 0
1980 Zanker Road,
San Jose, CA 95112
PHONE: +1-408-436-4900
FAX:
+1-408-436-0924
5901 Bolsa Ave.
Huntington Beach, CA 92647
PHONE: +1-714-903-4600
FAX:
+1-714-903-0295
Beijing Office
France:
Paris Office
Room 1905, Lian He Building, No. 20
Chao Wai Da Road, Chao Yang DIST
Beijing 100020, P.R. China
PHONE: +86-10-65886598
FAX:
+86-10-65880773
1 Rue Raoul Follereau Bussy Saint Georges
F-77608 Marne la Vallee Cedex 3,France
PHONE: +33-1 6476 22 22
FAX:
+33-1 6476 22 23
Eastern Area
SHARP-ROXY (HONG KONG) LTD.
Italy:
Milano Office
85 W. Algonquin Road, Suite 280
Arlington Heights, IL 60005
PHONE: +1-847-258-2750
FAX:
+1-847-439-2479
8911 Capitol of Texas Hwy. Suite 3130
Austin, TX 78759
PHONE: +1-512-349-7262
FAX:
+1-512-349-7002
3001 West Big Beaver Road, Suite 722
Troy, MI 48084
PHONE: +1-248-458-1527
FAX:
+1-248-458-6255
200 Wheeler Rd.,
Burlington, MA 01803
PHONE: +1-781-270-7979
FAX:
+1-781-229-9117
8000 Regency Parkway, Suite 280
Cary, NC 27518
PHONE: +1-919-460-0695
FAX:
+1-919-460-0795
16F-1602, King Tower, 28 Xin Jin Qiao Road,
Pudong DIST, Shanghai 201206 P.R. China
PHONE: +86-21-5854-7710/21-5834-6056
FAX:
+86-21-5030-4510/21-5834-6057
http://ses.sharpmicro.com
Device Sales Division, 17/F, Admiralty Centre,
Tower 1, 18 Harcourt Road, Hong Kong
PHONE: +852-28229311
FAX:
+852-28660779
http://srh.sharpmicro.com
Centro Direzionale Colleoni
Palazzo Taurus Ingresso 2
20041 Agrate Brianza, Milano, Italy
PHONE: +39-039-689-99 46
FAX:
+39-039-689-99 48
Shenzhen Representative Office
U.K.:
London Office
Venture House, 2 Arlington Square,
Downshire Way, Bracknell, Berkshire, RG12 1WA,
United Kingdom
PHONE: +44-1344-86 99 22
FAX:
+44-1344-36 09 03
Sweden:
Nordic Office
Box 14098 16714 Bromma Stockholm,Sweden
PHONE: +46-8634-3600
FAX:
+46-8634-3620
Room 602-603, 6/F, International Chamber of
Commerce Tower, 128 Fuhua Rd. 3, CBD, Futian
District, Shenzhen
PHONE: +86-755-88313505
FAX:
+86-755-88313515
SHARP ELECTRONIC COMPONENTS
(TAIWAN) CORPORATION
8F-A, No. 16, Sec. 4, Nanking E. Rd.,
Taipei, Taiwan
PHONE: +886-2-2577-7341
FAX:
+886-2-2577-7326/2-2577-7328
SHARP ELECTRONICS (SINGAPORE) PTE., LTD.
491B River Valley Road, #09-02/03/04
Valley Point, Singapore 248373
PHONE: +65-63042500
FAX:
+65-63042598
http://www.sesl-sharp.com
SHARP ELECTRONIC COMPONENTS (KOREA)
CORPORATION
5F, Jeil Pharm B/D, 745-5, Banpo 1-dong,
Seocho-ku, Seoul 137-810 Korea
PHONE: +82-2-711-5813
FAX:
+82-2-711-5819
051
The following facilities of Sharp Corporation have
been certified under the ISO 14001 international
standard for environmental management systems.
In our products and manufacturing processes, we
are actively engaged in environmental preservation
efforts.
Facility
Headquarters and Associated Companies Group
Katsuragi Works
Large-Scale IC Group (Fukuyama)
Nara Plant
Advanced Development and Planning Center
Mie Factory
Electronic Components (Elecom Group) Mihara Plant
AVC Liquid Crystal Display Group
Communication Systems Group Hiroshima Plant
Appliance Systems Group
Audio-Visual Systems Group Tochigi Plant
Certificate No.
EC97J1037
EC99J2006
EC99J2016
EC99J2021
EC99J2038
EC99J2051
EC03J0180
EC04J0284
JQA-EM5312
JQA-EM5554
JQA-EM0339
Registration Date
June 24, 1997
June 25, 1996
September 24, 1996
September 24, 1996
December 3, 1996
January 28, 1997
November 17, 2003
October 12, 2004
April 14, 2006
November 10, 2006
February 26, 1999
The following facilities of Sharp Corporation have been certified
under the ISO 9001:2000 international standard for quality
management systems.
The following facility of Sharp Corporation has been certified
as a manufacturer under the IEC Quality Assessment System
for Electronic Components.
Applicable standards: ISO 9001:2000 and JIS Q 9001:2000
Certifying organization: Reliability Center for Electronic Components of Japan (RCJ)
Facility
Compound Semiconductor Systems Division
Certificate No.
RCJ-94M-23J
The following facility of Sharp Corporation has been certified
under the ISO 9001:2000 international standard for quality
management systems.
SHARP CORPORATION
REGISTERED TO ISO 9001
CERTIFICATE NO.A7887
Certifying organization: IL Inc. [JAB certified]
Facility
Compound Semiconductor Systems Division
Certificate No.
A7887
Distributed by
Certifying organization: Japan Quality Assurance Organization (JAQ) [JAB certified]
Facility
Certificate No.
Mobile Liquid Crystal Display Group
JQA-QM3776
AVC Liquid Crystal Display Group
JQA-QMA11778
Large-Scale IC Group
JQA-QM8688
The contents of this catalog are current as of June, 2007.
This brochure uses recycled paper and soyoil ink
approved by the American Soybean Association.
Ref. No. HT9A4D
SHARP CORP. July 2007 H2.3 Printed in Japan